DE602007001549D1 - Substrathaltevorrichtung - Google Patents

Substrathaltevorrichtung

Info

Publication number
DE602007001549D1
DE602007001549D1 DE602007001549T DE602007001549T DE602007001549D1 DE 602007001549 D1 DE602007001549 D1 DE 602007001549D1 DE 602007001549 T DE602007001549 T DE 602007001549T DE 602007001549 T DE602007001549 T DE 602007001549T DE 602007001549 D1 DE602007001549 D1 DE 602007001549D1
Authority
DE
Germany
Prior art keywords
substrate holder
holder
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007001549T
Other languages
English (en)
Inventor
Hozumi Yasuda
Tetsuji Togawa
Osamu Nabeya
Kenichiro Saito
Makoto Fukushima
Tomoshi Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of DE602007001549D1 publication Critical patent/DE602007001549D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
DE602007001549T 2006-03-31 2007-03-30 Substrathaltevorrichtung Active DE602007001549D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006097296A JP4814677B2 (ja) 2006-03-31 2006-03-31 基板保持装置および研磨装置

Publications (1)

Publication Number Publication Date
DE602007001549D1 true DE602007001549D1 (de) 2009-08-27

Family

ID=37986414

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007001549T Active DE602007001549D1 (de) 2006-03-31 2007-03-30 Substrathaltevorrichtung

Country Status (7)

Country Link
US (4) US7967665B2 (de)
EP (2) EP1839812B1 (de)
JP (3) JP4814677B2 (de)
KR (3) KR101081415B1 (de)
CN (1) CN101045286B (de)
DE (1) DE602007001549D1 (de)
TW (3) TWI617389B (de)

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JP6941046B2 (ja) * 2017-12-20 2021-09-29 株式会社荏原製作所 研磨ヘッドおよび研磨装置
JP7049984B2 (ja) 2018-12-27 2022-04-07 株式会社荏原製作所 研磨装置および静止リングの傾きを制御する方法
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JP7339811B2 (ja) * 2019-08-27 2023-09-06 株式会社荏原製作所 リテーナリングに局所荷重を伝達するローラーの異常検出方法および研磨装置
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Also Published As

Publication number Publication date
CN101045286A (zh) 2007-10-03
JP4814677B2 (ja) 2011-11-16
TW201639661A (zh) 2016-11-16
EP1839812B1 (de) 2009-07-15
JP4814916B2 (ja) 2011-11-16
KR20110016970A (ko) 2011-02-18
EP2000259B1 (de) 2012-12-26
US8267746B2 (en) 2012-09-18
KR101203915B1 (ko) 2012-11-23
KR20070098696A (ko) 2007-10-05
KR101081415B1 (ko) 2011-11-08
TW201332711A (zh) 2013-08-16
US7967665B2 (en) 2011-06-28
KR101106202B1 (ko) 2012-01-20
US20080318492A1 (en) 2008-12-25
US8485866B2 (en) 2013-07-16
US20070232193A1 (en) 2007-10-04
JP5200088B2 (ja) 2013-05-15
TW200800483A (en) 2008-01-01
EP2000259A2 (de) 2008-12-10
EP2000259A3 (de) 2009-09-02
US20080318499A1 (en) 2008-12-25
US20120309277A1 (en) 2012-12-06
JP2011062812A (ja) 2011-03-31
KR20120002563A (ko) 2012-01-06
JP2008279596A (ja) 2008-11-20
TWI397454B (zh) 2013-06-01
EP1839812A3 (de) 2008-01-02
JP2007268654A (ja) 2007-10-18
CN101045286B (zh) 2015-11-25
US8100739B2 (en) 2012-01-24
TWI617389B (zh) 2018-03-11
TWI571357B (zh) 2017-02-21
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