JP2007268654A - 基板保持装置、研磨装置、および研磨方法 - Google Patents
基板保持装置、研磨装置、および研磨方法 Download PDFInfo
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- JP2007268654A JP2007268654A JP2006097296A JP2006097296A JP2007268654A JP 2007268654 A JP2007268654 A JP 2007268654A JP 2006097296 A JP2006097296 A JP 2006097296A JP 2006097296 A JP2006097296 A JP 2006097296A JP 2007268654 A JP2007268654 A JP 2007268654A
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- Prior art keywords
- polishing
- ring
- substrate
- top ring
- retainer ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
【解決手段】トップリング1は、ウェハを保持してウェハを研磨パッド101に押圧するトップリング本体2と、トップリング本体2の外周部に設けられ、研磨パッド101を押圧するリテーナリング3とを備えている。リテーナリング3は、磁性体からなるピストン406と、ピストン406に当接する面に磁石420を有するリング部材408とを備えている。
【選択図】図2
Description
2 トップリング本体
3 リテーナリング
11 トップリングシャフト
100 研磨テーブル
101 研磨パッド
314 弾性膜
360 センター室
361 リプル室
362 アウター室
363 エッジ室
400 シリンダ
402 保持部材
404 弾性膜
406 ピストン
408 リング部材
410 リテーナ圧力室
420 磁石
432 カムリフタ
430 軸
434 レンチ穴
436 凹部
438 ボール
501 トップリング
502 測定板
504 ローラ
506 変位センサ
508 演算部
Claims (8)
- 基板を保持して該基板を研磨面に押圧するトップリング本体と、前記トップリング本体の外周部に設けられ、前記研磨面を押圧するリテーナリングとを有する基板保持装置であって、
前記リテーナリングは、
磁性体からなる第1の部材と、
前記第1の部材に当接する面に磁石を有する第2の部材と、
を備えたことを特徴とする基板保持装置。 - 前記第1の部材は、前記第2の部材を前記研磨面に押圧するピストンであることを特徴とする請求項1に記載の基板保持装置。
- 前記第2の部材は、前記第1の部材を前記研磨面に押圧するピストンであることを特徴とする請求項1に記載の基板保持装置。
- 前記第1の部材は、回転により前記第2の部材を該第1の部材から引き離すカム機構を備えたことを特徴とする請求項1から3のいずれか一項に記載の基板保持装置。
- 前記第2の部材は、回転により前記第1の部材を該第2の部材から引き離すカム機構を備えたことを特徴とする請求項1から3のいずれか一項に記載の基板保持装置。
- 研磨面を有する研磨パッドと、基板を保持して前記研磨面に基板を押圧して該基板を研磨するトップリング本体と、前記トップリング本体の外周部に設けられ、前記研磨面を押圧するリテーナリングとを有する研磨装置であって、
前記リテーナリングの少なくとも2つの位置での高さを検出するセンサと、
前記センサにより検出された高さから前記リテーナリングの傾きを算出する演算部と、
を備えたことを特徴とする研磨装置。 - 前記少なくとも2つの位置は、前記研磨面の回転方向の上流側と下流側であることを特徴とする請求項6に記載の研磨装置。
- トップリング本体の外周部に設けられたリテーナリングにより基板の外周部を保持するとともに研磨面を押圧しつつ、前記トップリング本体により前記基板を前記研磨面に押圧して該基板を研磨する研磨方法であって、
前記リテーナリングの傾きを測定し、前記リテーナリングの傾きが所定の閾値を超えた場合に、外部に警報を発する、あるいは研磨を中止する、あるいは予め設定した研磨条件に変更することを特徴とする研磨方法。
Priority Applications (17)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006097296A JP4814677B2 (ja) | 2006-03-31 | 2006-03-31 | 基板保持装置および研磨装置 |
US11/730,142 US7967665B2 (en) | 2006-03-31 | 2007-03-29 | Substrate holding apparatus, polishing apparatus, and polishing method |
CN200710089026.8A CN101045286B (zh) | 2006-03-31 | 2007-03-29 | 基底夹持装置、抛光装置及抛光方法 |
TW105121725A TWI617389B (zh) | 2006-03-31 | 2007-03-30 | 下環構件 |
EP07006746A EP1839812B1 (en) | 2006-03-31 | 2007-03-30 | Substrate holding apparatus |
KR1020070031293A KR101081415B1 (ko) | 2006-03-31 | 2007-03-30 | 기판홀딩장치, 폴리싱장치 및 리테이너링 |
DE602007001549T DE602007001549D1 (de) | 2006-03-31 | 2007-03-30 | Substrathaltevorrichtung |
TW102115579A TWI571357B (zh) | 2006-03-31 | 2007-03-30 | 拋光裝置及拋光方法 |
TW096111195A TWI397454B (zh) | 2006-03-31 | 2007-03-30 | 基板固持裝置、拋光裝置及拋光方法 |
EP08017248A EP2000259B1 (en) | 2006-03-31 | 2007-03-30 | Substrate holding apparatus, polishing apparatus, and polishing method |
JP2008187568A JP4814916B2 (ja) | 2006-03-31 | 2008-07-18 | リテーナリング |
US12/222,908 US8100739B2 (en) | 2006-03-31 | 2008-08-19 | Substrate holding apparatus, polishing apparatus, and polishing method |
US12/222,909 US8267746B2 (en) | 2006-03-31 | 2008-08-19 | Substrate holding apparatus, polishing apparatus, and polishing method |
JP2010254656A JP5200088B2 (ja) | 2006-03-31 | 2010-11-15 | 研磨装置および研磨方法 |
KR1020110000369A KR101106202B1 (ko) | 2006-03-31 | 2011-01-04 | 폴리싱장치, 폴리싱방법, 리테이너링 및 탄성 멤브레인 |
KR1020110126033A KR101203915B1 (ko) | 2006-03-31 | 2011-11-29 | 탄성 멤브레인 |
US13/587,371 US8485866B2 (en) | 2006-03-31 | 2012-08-16 | Substrate holding apparatus, polishing apparatus, and polishing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006097296A JP4814677B2 (ja) | 2006-03-31 | 2006-03-31 | 基板保持装置および研磨装置 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
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JP2008187568A Division JP4814916B2 (ja) | 2006-03-31 | 2008-07-18 | リテーナリング |
JP2010254656A Division JP5200088B2 (ja) | 2006-03-31 | 2010-11-15 | 研磨装置および研磨方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007268654A true JP2007268654A (ja) | 2007-10-18 |
JP2007268654A5 JP2007268654A5 (ja) | 2008-09-04 |
JP4814677B2 JP4814677B2 (ja) | 2011-11-16 |
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Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
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JP2006097296A Active JP4814677B2 (ja) | 2006-03-31 | 2006-03-31 | 基板保持装置および研磨装置 |
JP2008187568A Active JP4814916B2 (ja) | 2006-03-31 | 2008-07-18 | リテーナリング |
JP2010254656A Active JP5200088B2 (ja) | 2006-03-31 | 2010-11-15 | 研磨装置および研磨方法 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
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JP2008187568A Active JP4814916B2 (ja) | 2006-03-31 | 2008-07-18 | リテーナリング |
JP2010254656A Active JP5200088B2 (ja) | 2006-03-31 | 2010-11-15 | 研磨装置および研磨方法 |
Country Status (7)
Country | Link |
---|---|
US (4) | US7967665B2 (ja) |
EP (2) | EP2000259B1 (ja) |
JP (3) | JP4814677B2 (ja) |
KR (3) | KR101081415B1 (ja) |
CN (1) | CN101045286B (ja) |
DE (1) | DE602007001549D1 (ja) |
TW (3) | TWI571357B (ja) |
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JP2009131946A (ja) * | 2007-10-29 | 2009-06-18 | Ebara Corp | 研磨装置 |
WO2010021297A1 (en) * | 2008-08-21 | 2010-02-25 | Ebara Corporation | Method and apparatus for polishing a substrate |
JP2012518904A (ja) * | 2009-02-25 | 2012-08-16 | グリーンスペック カンパニー、インコーポレイテッド | シリコン・ベアー・ウエハー研磨装置用キャリア・ヘッド |
US8357029B2 (en) | 2008-02-13 | 2013-01-22 | Ebara Corporation | Polishing apparatus |
US9662764B2 (en) | 2012-01-31 | 2017-05-30 | Ebara Corporation | Substrate holder, polishing apparatus, and polishing method |
JP2018176414A (ja) * | 2017-04-12 | 2018-11-15 | 株式会社荏原製作所 | 弾性膜、基板保持装置、及び研磨装置 |
JP2020104200A (ja) * | 2018-12-27 | 2020-07-09 | 株式会社荏原製作所 | 研磨装置および静止リングの傾きを制御する方法 |
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