JP2008279596A - リテーナリング - Google Patents
リテーナリング Download PDFInfo
- Publication number
- JP2008279596A JP2008279596A JP2008187568A JP2008187568A JP2008279596A JP 2008279596 A JP2008279596 A JP 2008279596A JP 2008187568 A JP2008187568 A JP 2008187568A JP 2008187568 A JP2008187568 A JP 2008187568A JP 2008279596 A JP2008279596 A JP 2008279596A
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- Prior art keywords
- ring
- retainer ring
- polishing
- flow path
- retainer
- Prior art date
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- 238000003825 pressing Methods 0.000 claims abstract description 25
- 238000005498 polishing Methods 0.000 claims description 90
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 239000000696 magnetic material Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 abstract description 16
- 239000004065 semiconductor Substances 0.000 description 31
- 239000010408 film Substances 0.000 description 29
- 238000006073 displacement reaction Methods 0.000 description 17
- 239000012530 fluid Substances 0.000 description 9
- 238000005192 partition Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 229920001971 elastomer Polymers 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 229920002943 EPDM rubber Polymers 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920003225 polyurethane elastomer Polymers 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
【解決手段】リング部材408と、研磨対象物Wの研磨時にリング部材408を下方に押圧して研磨パッドの研磨面に接触させる押圧部400,402,404,406,410と、磁力によってリング部材を押圧部に固定する磁石420を有する。
【選択図】図2
Description
2 トップリング本体
3 リテーナリング
11 トップリングシャフト
100 研磨テーブル
101 研磨パッド
314 弾性膜
360 センター室
361 リプル室
362 アウター室
363 エッジ室
400 シリンダ
402 保持部材
404 弾性膜
406 ピストン
408 リング部材
410 リテーナ圧力室
420 磁石
432 カムリフタ
430 軸
434 レンチ穴
436 凹部
438 ボール
501 トップリング
502 測定板
504 ローラ
506 変位センサ
508 演算部
Claims (11)
- リング部材と、
研磨対象物の研磨時に前記リング部材を下方に押圧して研磨パッドの研磨面に接触させる押圧部と、
磁力によって前記リング部材を前記押圧部に固定する磁石を有することを特徴とするリテーナリング。 - 前記リング部材と前記押圧部とが弾性膜を介して固定されることを特徴とする請求項1記載のリテーナリング。
- 研磨対象物を研磨する際に用いられるリテーナリングであって、外周部に測定板が取り付けられていることを特徴とするリテーナリング。
- 研磨パッドに接触する面を有するリング部材と該リング部材を押圧する押圧部とを備え、前記リング部材は弾性膜を介して前記押圧部に固定されることを特徴とするリテーナリング。
- リテーナリングの軸を中心として回転可能な複数のカムリフタが設けられていることを特徴とする請求項1乃至4のいずれか1項に記載のリテーナリング。
- 磁性体からなる第1の部材と、前記第1の部材に当接する面に磁石を有する第2の部材を有し、
前記第2の部材は、前記第1の部材を該第2の部材から引き離すカム機構を有することを特徴とするリテーナリング。 - 磁性体からなる第1の部材と、前記第1の部材に当接する面に磁石を有する第2の部材を有し、
前記第1の部材は、前記第2の部材を該第1の部材から引き離すカム機構を有することを特徴とするリテーナリング。 - 前記第1の部材は、前記第2の部材を研磨面に押圧するためのピストンであることを特徴とする請求項6又は7記載のリテーナリング。
- 前記第2の部材は、前記第1の部材を研磨面に押圧するピストンであることを特徴とする請求項6又は7記載のリテーナリング。
- 前記カム機構には、リテーナリングの軸を中心として回転可能な複数のカムリフタが備えられ、該カムリフタは軸の軸心からの半径が一様でない形状であることを特徴とする請求項8又は9記載のリテーナリング。
- 前記リテーナリングは測定板を更に備えたことを特徴とする請求項1、2、4、5、6、7、8、9又は10に記載のリテーナリング。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008187568A JP4814916B2 (ja) | 2006-03-31 | 2008-07-18 | リテーナリング |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006097296A JP4814677B2 (ja) | 2006-03-31 | 2006-03-31 | 基板保持装置および研磨装置 |
JP2008187568A JP4814916B2 (ja) | 2006-03-31 | 2008-07-18 | リテーナリング |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006097296A Division JP4814677B2 (ja) | 2006-03-31 | 2006-03-31 | 基板保持装置および研磨装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008279596A true JP2008279596A (ja) | 2008-11-20 |
JP4814916B2 JP4814916B2 (ja) | 2011-11-16 |
Family
ID=37986414
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006097296A Active JP4814677B2 (ja) | 2006-03-31 | 2006-03-31 | 基板保持装置および研磨装置 |
JP2008187568A Active JP4814916B2 (ja) | 2006-03-31 | 2008-07-18 | リテーナリング |
JP2010254656A Active JP5200088B2 (ja) | 2006-03-31 | 2010-11-15 | 研磨装置および研磨方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006097296A Active JP4814677B2 (ja) | 2006-03-31 | 2006-03-31 | 基板保持装置および研磨装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010254656A Active JP5200088B2 (ja) | 2006-03-31 | 2010-11-15 | 研磨装置および研磨方法 |
Country Status (7)
Country | Link |
---|---|
US (4) | US7967665B2 (ja) |
EP (2) | EP1839812B1 (ja) |
JP (3) | JP4814677B2 (ja) |
KR (3) | KR101081415B1 (ja) |
CN (1) | CN101045286B (ja) |
DE (1) | DE602007001549D1 (ja) |
TW (3) | TWI397454B (ja) |
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JP4814677B2 (ja) * | 2006-03-31 | 2011-11-16 | 株式会社荏原製作所 | 基板保持装置および研磨装置 |
US7727055B2 (en) | 2006-11-22 | 2010-06-01 | Applied Materials, Inc. | Flexible membrane for carrier head |
US7575504B2 (en) | 2006-11-22 | 2009-08-18 | Applied Materials, Inc. | Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly |
US7654888B2 (en) | 2006-11-22 | 2010-02-02 | Applied Materials, Inc. | Carrier head with retaining ring and carrier ring |
JP5464820B2 (ja) * | 2007-10-29 | 2014-04-09 | 株式会社荏原製作所 | 研磨装置 |
JP5199691B2 (ja) | 2008-02-13 | 2013-05-15 | 株式会社荏原製作所 | 研磨装置 |
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