DE60131763D1 - Material aus kupferlegierung für elektronik oder elektronische bauteile - Google Patents

Material aus kupferlegierung für elektronik oder elektronische bauteile

Info

Publication number
DE60131763D1
DE60131763D1 DE60131763T DE60131763T DE60131763D1 DE 60131763 D1 DE60131763 D1 DE 60131763D1 DE 60131763 T DE60131763 T DE 60131763T DE 60131763 T DE60131763 T DE 60131763T DE 60131763 D1 DE60131763 D1 DE 60131763D1
Authority
DE
Germany
Prior art keywords
electronics
materials
electronic components
copper alloy
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60131763T
Other languages
English (en)
Other versions
DE60131763T2 (de
Inventor
Takayuki Usami
Takao Hirai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Application granted granted Critical
Publication of DE60131763D1 publication Critical patent/DE60131763D1/de
Publication of DE60131763T2 publication Critical patent/DE60131763T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12889—Au-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12993—Surface feature [e.g., rough, mirror]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Contacts (AREA)
  • Non-Insulated Conductors (AREA)
  • Electroplating Methods And Accessories (AREA)
DE60131763T 2000-07-25 2001-05-24 Material aus kupferlegierung für elektronik oder elektronische bauteile Expired - Lifetime DE60131763T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000224425 2000-07-25
JP2000224425A JP3520034B2 (ja) 2000-07-25 2000-07-25 電子電気機器部品用銅合金材
PCT/JP2001/004351 WO2002008479A1 (fr) 2000-07-25 2001-05-24 Materiau en alliage de cuivre destine a des pieces de materiel electronique ou electrique

Publications (2)

Publication Number Publication Date
DE60131763D1 true DE60131763D1 (de) 2008-01-17
DE60131763T2 DE60131763T2 (de) 2008-10-30

Family

ID=18718391

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60131763T Expired - Lifetime DE60131763T2 (de) 2000-07-25 2001-05-24 Material aus kupferlegierung für elektronik oder elektronische bauteile

Country Status (8)

Country Link
US (3) US20020127133A1 (de)
EP (1) EP1325964B1 (de)
JP (1) JP3520034B2 (de)
KR (1) KR100519850B1 (de)
CN (1) CN1183263C (de)
DE (1) DE60131763T2 (de)
TW (1) TWI225519B (de)
WO (1) WO2002008479A1 (de)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3520034B2 (ja) * 2000-07-25 2004-04-19 古河電気工業株式会社 電子電気機器部品用銅合金材
JP3520046B2 (ja) 2000-12-15 2004-04-19 古河電気工業株式会社 高強度銅合金
US7090732B2 (en) 2000-12-15 2006-08-15 The Furukawa Electric, Co., Ltd. High-mechanical strength copper alloy
JP4584692B2 (ja) * 2004-11-30 2010-11-24 株式会社神戸製鋼所 曲げ加工性に優れた高強度銅合金板およびその製造方法
JP2006286604A (ja) * 2005-03-07 2006-10-19 Furukawa Electric Co Ltd:The 配線接続器具用金属材
JP4494258B2 (ja) 2005-03-11 2010-06-30 三菱電機株式会社 銅合金およびその製造方法
US8317948B2 (en) * 2005-03-24 2012-11-27 Jx Nippon Mining & Metals Corporation Copper alloy for electronic materials
WO2006109801A1 (ja) * 2005-04-12 2006-10-19 Sumitomo Metal Industries, Ltd. 銅合金およびその製造方法
JP5306591B2 (ja) * 2005-12-07 2013-10-02 古河電気工業株式会社 配線用電線導体、配線用電線、及びそれらの製造方法
JP4986499B2 (ja) * 2006-04-26 2012-07-25 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ合金すずめっき条の製造方法
ES2362346T3 (es) * 2006-06-30 2011-07-01 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Placas conductoras para elementos de célula de combustible.
US20080190523A1 (en) * 2007-02-13 2008-08-14 Weilin Gao Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
EP1967596B1 (de) * 2007-02-13 2010-06-16 Dowa Metaltech Co., Ltd. Cu-Ni-Si-basiertes Kupferlegierungsfolienmaterial und Herstellungsverfahren dafür
JP5170881B2 (ja) * 2007-03-26 2013-03-27 古河電気工業株式会社 電気・電子機器用銅合金材およびその製造方法
CN101541987B (zh) * 2007-09-28 2011-01-26 Jx日矿日石金属株式会社 电子材料用Cu-Ni-Si-Co系铜合金及其制造方法
CN101809177B (zh) * 2007-10-03 2011-09-07 古河电气工业株式会社 电气电子部件用铜合金板材
EP2221390B1 (de) * 2007-11-01 2014-06-18 The Furukawa Electric Co., Ltd. Verfahren zur herstellung eines kupferlegierungsbleches mit hervorragender festigkeit, biegebearbeitbarkeit und spannungsrelaxationsresistenz
US20100316879A1 (en) * 2008-02-08 2010-12-16 Kuniteru Mihara Copper alloy material for electric/electronic components
CN101946014A (zh) 2008-02-18 2011-01-12 古河电气工业株式会社 铜合金材料
KR101114147B1 (ko) * 2008-03-31 2012-03-13 후루카와 덴키 고교 가부시키가이샤 전기전자기기용 동합금 재료 및 전기전자부품
JP2010018885A (ja) * 2008-06-12 2010-01-28 Furukawa Electric Co Ltd:The 電解銅皮膜、その製造方法及び銅電解皮膜製造用の銅電解液
CN101440444B (zh) * 2008-12-02 2010-05-12 路达(厦门)工业有限公司 无铅易切削高锌硅黄铜合金及其制造方法
JP4708485B2 (ja) * 2009-03-31 2011-06-22 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
JP5476149B2 (ja) * 2010-02-10 2014-04-23 株式会社神戸製鋼所 強度異方性が小さく曲げ加工性に優れた銅合金
WO2011125153A1 (ja) * 2010-04-02 2011-10-13 Jx日鉱日石金属株式会社 電子材料用Ｃｕ－Ｎｉ－Ｓｉ系合金
WO2012160684A1 (ja) * 2011-05-25 2012-11-29 三菱伸銅株式会社 深絞り加工性に優れたＣｕ－Ｎｉ－Ｓｉ系銅合金板及びその製造方法
KR20140025607A (ko) 2011-08-04 2014-03-04 가부시키가이샤 고베 세이코쇼 구리 합금
JP5827090B2 (ja) * 2011-09-29 2015-12-02 三菱伸銅株式会社 導電性、耐熱性及び曲げ加工性に優れたＣｕ−Ｆｅ−Ｐ系銅合金板及びその製造方法
JP5610643B2 (ja) * 2012-03-28 2014-10-22 Jx日鉱日石金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系銅合金条及びその製造方法
WO2014016934A1 (ja) * 2012-07-26 2014-01-30 三菱電機株式会社 銅合金及びその製造方法
JP5501495B1 (ja) * 2013-03-18 2014-05-21 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子
JP6166414B1 (ja) * 2016-03-30 2017-07-19 株式会社神戸製鋼所 ベーパチャンバー用銅又は銅合金条
RU2618955C1 (ru) * 2016-07-11 2017-05-11 Юлия Алексеевна Щепочкина Сплав на основе меди
JP6302009B2 (ja) * 2016-07-12 2018-03-28 古河電気工業株式会社 銅合金圧延材及びその製造方法並びに電気電子部品
CN106222480A (zh) * 2016-08-29 2016-12-14 芜湖楚江合金铜材有限公司 一种环保的高耐磨铜线及其加工工艺
CN106119596A (zh) * 2016-08-30 2016-11-16 芜湖楚江合金铜材有限公司 一种环保无铅高性能的铜合金线材及其加工工艺
RU2629403C1 (ru) * 2016-12-06 2017-08-29 Юлия Алексеевна Щепочкина Спеченный сплав на основе меди
MX2017001955A (es) * 2017-02-10 2018-08-09 Nac De Cobre S A De C V Aleaciones de cobre bajas en plomo.
JP7296757B2 (ja) * 2019-03-28 2023-06-23 Ｊｘ金属株式会社 銅合金、伸銅品及び電子機器部品

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Also Published As

Publication number Publication date
JP2002038228A (ja) 2002-02-06
KR100519850B1 (ko) 2005-10-07
JP3520034B2 (ja) 2004-04-19
TWI225519B (en) 2004-12-21
EP1325964A4 (de) 2003-07-30
DE60131763T2 (de) 2008-10-30
CN1183263C (zh) 2005-01-05
US20020127133A1 (en) 2002-09-12
WO2002008479A1 (fr) 2002-01-31
US20030165708A1 (en) 2003-09-04
EP1325964B1 (de) 2007-12-05
US7172662B2 (en) 2007-02-06
CN1366556A (zh) 2002-08-28
US20050208323A1 (en) 2005-09-22
KR20020040677A (ko) 2002-05-30
EP1325964A1 (de) 2003-07-09

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