NO20011708L - Harpiksstöpt enhet som inneholder en elektronisk kretskomponent - Google Patents

Harpiksstöpt enhet som inneholder en elektronisk kretskomponent

Info

Publication number
NO20011708L
NO20011708L NO20011708A NO20011708A NO20011708L NO 20011708 L NO20011708 L NO 20011708L NO 20011708 A NO20011708 A NO 20011708A NO 20011708 A NO20011708 A NO 20011708A NO 20011708 L NO20011708 L NO 20011708L
Authority
NO
Norway
Prior art keywords
electronic circuit
circuit component
unit containing
resin cast
cast unit
Prior art date
Application number
NO20011708A
Other languages
English (en)
Other versions
NO20011708D0 (no
Inventor
Hiroshi Ono
Shigeyoshi Yoshida
Original Assignee
Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokin Corp filed Critical Tokin Corp
Publication of NO20011708D0 publication Critical patent/NO20011708D0/no
Publication of NO20011708L publication Critical patent/NO20011708L/no

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Magnetic Films (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
NO20011708A 2000-04-04 2001-04-04 Harpiksstöpt enhet som inneholder en elektronisk kretskomponent NO20011708L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000102378A JP4398056B2 (ja) 2000-04-04 2000-04-04 樹脂モールド体

Publications (2)

Publication Number Publication Date
NO20011708D0 NO20011708D0 (no) 2001-04-04
NO20011708L true NO20011708L (no) 2001-10-05

Family

ID=18616274

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20011708A NO20011708L (no) 2000-04-04 2001-04-04 Harpiksstöpt enhet som inneholder en elektronisk kretskomponent

Country Status (7)

Country Link
US (1) US6495927B2 (no)
EP (1) EP1143518A1 (no)
JP (1) JP4398056B2 (no)
KR (1) KR20010095273A (no)
CN (1) CN1316778A (no)
NO (1) NO20011708L (no)
TW (1) TW504829B (no)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO20011677L (no) * 2000-04-04 2001-10-05 Tokin Corp Elektronisk komponent for demping av höy frekvens og forbindelsesledning for komponenten
US6967390B2 (en) * 2003-02-13 2005-11-22 Freescale Semiconductor, Inc. Electronic component and method of manufacturing same
FR2852190B1 (fr) * 2003-03-03 2005-09-23 Procede de fabrication d'un composant ou d'un module electronique et composant ou module correspondant
US7968978B2 (en) * 2007-06-14 2011-06-28 Raytheon Company Microwave integrated circuit package and method for forming such package
KR100877551B1 (ko) * 2008-05-30 2009-01-07 윤점채 전자파 차폐 기능을 갖는 반도체 패키지, 그 제조방법 및 지그
EP2393113A4 (en) * 2009-01-28 2013-04-24 Hitachi Metals Ltd SEMICONDUCTOR DEVICE AND POWER CIRCUIT
US9426914B2 (en) * 2012-05-17 2016-08-23 Intel Corporation Film insert molding for device manufacture
WO2015057209A1 (en) * 2013-10-15 2015-04-23 Intel Corporation Magnetic shielded integrated circuit package
US9818518B2 (en) 2016-03-31 2017-11-14 Tdk Corporation Composite magnetic sealing material
US9881877B2 (en) 2016-03-31 2018-01-30 Tdk Corporation Electronic circuit package using composite magnetic sealing material
US10242954B2 (en) * 2016-12-01 2019-03-26 Tdk Corporation Electronic circuit package having high composite shielding effect
US9972579B1 (en) * 2016-11-16 2018-05-15 Tdk Corporation Composite magnetic sealing material and electronic circuit package using the same
US10403582B2 (en) 2017-06-23 2019-09-03 Tdk Corporation Electronic circuit package using composite magnetic sealing material

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0323654A (ja) * 1989-06-21 1991-01-31 Mitsubishi Electric Corp 樹脂封止形半導体装置
JP2530051B2 (ja) * 1990-07-24 1996-09-04 株式会社東芝 半導体集積回路装置
US5370766A (en) * 1993-08-16 1994-12-06 California Micro Devices Methods for fabrication of thin film inductors, inductor networks and integration with other passive and active devices
FI117224B (fi) * 1994-01-20 2006-07-31 Nec Tokin Corp Sähkömagneettinen häiriönpoistokappale, ja sitä soveltavat elektroninen laite ja hybridimikropiirielementti
US5639989A (en) * 1994-04-19 1997-06-17 Motorola Inc. Shielded electronic component assembly and method for making the same
EP0897256B1 (en) * 1996-04-24 2004-01-28 Okamura, Susumu Semiconductor device
JP3608063B2 (ja) * 1996-08-23 2005-01-05 Ｎｅｃトーキン株式会社 Ｅｍｉ対策部品及びそれを備えた能動素子

Also Published As

Publication number Publication date
EP1143518A1 (en) 2001-10-10
KR20010095273A (ko) 2001-11-03
JP4398056B2 (ja) 2010-01-13
JP2001284498A (ja) 2001-10-12
CN1316778A (zh) 2001-10-10
US20010035579A1 (en) 2001-11-01
TW504829B (en) 2002-10-01
US6495927B2 (en) 2002-12-17
NO20011708D0 (no) 2001-04-04

Similar Documents

Publication Publication Date Title
DE69911078D1 (de) Elektronische Komponenten
DE50100936D1 (de) Abgeschirmte, elektronische Schaltung
DE60131036D1 (de) Ein NOT-Schaltkreis
DE60131315D1 (de) Beatmungskreislauf-Komponenten
DE60135963D1 (de) Mehrschichtelektronikbauteil
DE50212657D1 (de) Elektronische Baugruppe
DE50110258D1 (de) Elektronische ausgangsstufe
DE50115792D1 (de) Elektronische baugruppe
DE60220053D1 (de) Schaltkreis
DE60024042D1 (de) Stossfeste elektronische Schaltung
DE60233667D1 (de) Elektronische kamera
DE60131485D1 (de) Leiterplatte
NO20011708L (no) Harpiksstöpt enhet som inneholder en elektronisk kretskomponent
DE10291003D2 (de) Mehrschichtige Leiterplatte
DE60220816D1 (de) Fahrzeugmontierte elektronische vorrichtung
DE60119194D1 (de) Leiterplattenanordnung
NO20031338L (no) Starterkrets
NO20011707D0 (no) Kretskort som omfatter granulær magnetisk film
DE60137310D1 (de) Leiterplatte
DE60101059D1 (de) Gehäuse für eine elektronische Einheit
ATE290469T1 (de) Verbindungsschaltkreis
DE50208227D1 (de) Elektronische Vorrichtung
DE60212222D1 (de) Elektronische Bauteile-Bestückungsvorrichtung
DE60211628D1 (de) Zusammengesetzte elektronische bauteile
GB2371411B (en) Circuit board mount

Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application