DE69909252D1 - Bestückungsvorrichtung für elektronische bauteile - Google Patents

Bestückungsvorrichtung für elektronische bauteile

Info

Publication number
DE69909252D1
DE69909252D1 DE69909252T DE69909252T DE69909252D1 DE 69909252 D1 DE69909252 D1 DE 69909252D1 DE 69909252 T DE69909252 T DE 69909252T DE 69909252 T DE69909252 T DE 69909252T DE 69909252 D1 DE69909252 D1 DE 69909252D1
Authority
DE
Germany
Prior art keywords
electronic components
assembly device
assembly
electronic
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69909252T
Other languages
English (en)
Other versions
DE69909252T2 (de
Inventor
Yasutaka Tsuboi
Kazuyuki Nakano
Shozo Fukuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69909252D1 publication Critical patent/DE69909252D1/de
Publication of DE69909252T2 publication Critical patent/DE69909252T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
DE69909252T 1998-02-27 1999-02-26 Bestückungsvorrichtung für elektronische bauteile Expired - Lifetime DE69909252T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP4786598 1998-02-27
JP4786598 1998-02-27
JP33391498 1998-11-25
JP33391498A JP3668383B2 (ja) 1998-02-27 1998-11-25 電子部品実装装置
PCT/JP1999/000904 WO1999044409A1 (en) 1998-02-27 1999-02-26 Electronic component mounting apparatus

Publications (2)

Publication Number Publication Date
DE69909252D1 true DE69909252D1 (de) 2003-08-07
DE69909252T2 DE69909252T2 (de) 2004-05-27

Family

ID=26388070

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69909252T Expired - Lifetime DE69909252T2 (de) 1998-02-27 1999-02-26 Bestückungsvorrichtung für elektronische bauteile

Country Status (6)

Country Link
US (1) US6542238B1 (de)
EP (1) EP1057389B1 (de)
JP (1) JP3668383B2 (de)
CN (1) CN1291422A (de)
DE (1) DE69909252T2 (de)
WO (1) WO1999044409A1 (de)

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US7874487B2 (en) 2005-10-24 2011-01-25 Cognex Technology And Investment Corporation Integrated illumination assembly for symbology reader
US7823789B2 (en) * 2004-12-21 2010-11-02 Cognex Technology And Investment Corporation Low profile illumination for direct part mark readers
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US8845114B2 (en) * 2007-02-21 2014-09-30 Panasonic Corporation Lighting device for image capturing in electronic component mounting apparatus
JP2008205226A (ja) * 2007-02-21 2008-09-04 Matsushita Electric Ind Co Ltd 電子部品実装用装置における撮像用の照明装置
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JP5192220B2 (ja) * 2007-11-30 2013-05-08 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP2009135267A (ja) * 2007-11-30 2009-06-18 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置
US8284305B2 (en) 2008-11-26 2012-10-09 Parata Systems, Llc System and method for acquiring images
US8345989B1 (en) 2009-02-16 2013-01-01 Parata Systems, Llc Illumination station for use in pharmaceutical identification system and methods therefor
JP5240137B2 (ja) * 2009-09-10 2013-07-17 株式会社デンソーウェーブ 光学的情報読取装置
JP5703561B2 (ja) * 2009-12-29 2015-04-22 オムロン株式会社 照明装置および照明装置の製造方法
JP2011233674A (ja) * 2010-04-27 2011-11-17 Hitachi High-Tech Instruments Co Ltd 電子部品装着方法及びその装置
US8922641B2 (en) * 2011-06-29 2014-12-30 The Procter & Gamble Company System and method for inspecting components of hygienic articles
US10498933B2 (en) 2011-11-22 2019-12-03 Cognex Corporation Camera system with exchangeable illumination assembly
US11366284B2 (en) 2011-11-22 2022-06-21 Cognex Corporation Vision system camera with mount for multiple lens types and lens module for the same
US8947590B2 (en) 2011-11-22 2015-02-03 Cognex Corporation Vision system camera with mount for multiple lens types
AT513747B1 (de) 2013-02-28 2014-07-15 Mikroelektronik Ges Mit Beschränkter Haftung Ab Bestückungsverfahren für Schaltungsträger und Schaltungsträger
DE102013211090A1 (de) * 2013-06-14 2014-12-18 Robert Bosch Gmbh Erfassungssystem zum Erfassen einer Lötverbindung
DE102015212910A1 (de) * 2015-07-09 2017-01-12 Sac Sirius Advanced Cybernetics Gmbh Vorrichtung zur Beleuchtung von Gegenständen
DE102015118788A1 (de) * 2015-11-03 2017-05-04 TRüTZSCHLER GMBH & CO. KG Beleuchtungseinheit für eine Vorrichtung zur Fremdteilerkennung für die Spinnereivorbereitung
US9983455B2 (en) * 2015-12-22 2018-05-29 Amazon Technologies, Inc. Electronic device stack assembly
JP6655779B2 (ja) * 2016-03-07 2020-02-26 パナソニックＩｐマネジメント株式会社 電子部品実装装置における撮像用の照明装置および電子部品実装装置
JP2017198612A (ja) * 2016-04-28 2017-11-02 キヤノン株式会社 検査装置、検査システム、および物品製造方法
WO2017208389A1 (ja) * 2016-06-01 2017-12-07 富士機械製造株式会社 画像処理装置、ワーク移載装置及び画像処理方法
DE102016124612A1 (de) * 2016-12-16 2018-06-21 Carl Zeiss Microscopy Gmbh Segmentierte Optik für ein Beleuchtungsmodul zur winkelselektiven Beleuchtung
JP6954925B2 (ja) * 2017-01-06 2021-10-27 株式会社Ｆｕｊｉ 部品実装機の撮像用照明装置
WO2018134862A1 (ja) * 2017-01-17 2018-07-26 ヤマハ発動機株式会社 撮像装置及びこれを用いた表面実装機
JP6860440B2 (ja) * 2017-07-20 2021-04-14 日本メクトロン株式会社 基板位置認識装置、位置認識加工装置および基板製造方法
JP6974211B2 (ja) * 2018-02-23 2021-12-01 株式会社Fuji 部品装着機
JP6973205B2 (ja) * 2018-03-15 2021-11-24 オムロン株式会社 画像処理システム、画像処理装置、画像処理プログラム
JP7108045B2 (ja) * 2018-10-04 2022-07-27 株式会社Fuji 部品撮像用カメラ及び部品実装機
DE102018221825B4 (de) * 2018-12-14 2020-06-25 Carl Zeiss Industrielle Messtechnik Gmbh Beleuchtungseinrichtung für eine Kamera oder einen optischen Sensor
JP2020138396A (ja) * 2019-02-27 2020-09-03 西研グラフィックス株式会社 画像認識装置及び刷版加工装置
JP7333710B2 (ja) * 2019-05-28 2023-08-25 東京エレクトロン株式会社 接合装置及び接合方法
WO2021019611A1 (ja) * 2019-07-26 2021-02-04 株式会社Ｆｕｊｉ 照明ユニット
CN114128418B (zh) * 2019-07-26 2023-10-20 株式会社富士 检查装置
JP7311608B2 (ja) * 2019-07-26 2023-07-19 株式会社Fuji 対基板作業システム
CN112255830B (zh) * 2020-10-23 2021-11-02 深圳市华星光电半导体显示技术有限公司 激光感应面板及其制作方法、显示装置

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Also Published As

Publication number Publication date
CN1291422A (zh) 2001-04-11
US6542238B1 (en) 2003-04-01
DE69909252T2 (de) 2004-05-27
WO1999044409A1 (en) 1999-09-02
JP3668383B2 (ja) 2005-07-06
JPH11312898A (ja) 1999-11-09
EP1057389A1 (de) 2000-12-06
EP1057389B1 (de) 2003-07-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)