DE69827304D1 - Elektronische baugruppe mit kühlelementen für elektronische bauelemente - Google Patents

Elektronische baugruppe mit kühlelementen für elektronische bauelemente

Info

Publication number
DE69827304D1
DE69827304D1 DE69827304T DE69827304T DE69827304D1 DE 69827304 D1 DE69827304 D1 DE 69827304D1 DE 69827304 T DE69827304 T DE 69827304T DE 69827304 T DE69827304 T DE 69827304T DE 69827304 D1 DE69827304 D1 DE 69827304D1
Authority
DE
Germany
Prior art keywords
electronic
cooling elements
assembly
electronic components
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69827304T
Other languages
English (en)
Other versions
DE69827304T2 (de
Inventor
Jean-Pierre Vittet
Jean-Francois Goumaz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Acqiris SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acqiris SA filed Critical Acqiris SA
Publication of DE69827304D1 publication Critical patent/DE69827304D1/de
Application granted granted Critical
Publication of DE69827304T2 publication Critical patent/DE69827304T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1461—Slidable card holders; Card stiffeners; Control or display means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE69827304T 1998-12-30 1998-12-30 Elektronische baugruppe mit kühlelementen für elektronische bauelemente Expired - Fee Related DE69827304T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CH1998/000563 WO2000041448A1 (fr) 1998-12-30 1998-12-30 Module electronique comportant des elements de refroidissement de composants electroniques

Publications (2)

Publication Number Publication Date
DE69827304D1 true DE69827304D1 (de) 2004-12-02
DE69827304T2 DE69827304T2 (de) 2005-11-03

Family

ID=4551384

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69827304T Expired - Fee Related DE69827304T2 (de) 1998-12-30 1998-12-30 Elektronische baugruppe mit kühlelementen für elektronische bauelemente

Country Status (4)

Country Link
US (1) US6504722B2 (de)
EP (1) EP1142460B1 (de)
DE (1) DE69827304T2 (de)
WO (1) WO2000041448A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6683787B1 (en) * 2002-02-14 2004-01-27 Mercury Computer Systems, Inc. Circuit board assembly with integrated air plenum chamber using self-aligning heat sinks
US6879486B1 (en) 2002-02-14 2005-04-12 Mercury Computer Systems, Inc. Central inlet circuit board assembly
US6759588B1 (en) 2002-02-14 2004-07-06 Mercury Computer Systems, Inc. Circuit board assembly with a combination thermal, shock, vibration, and/or electromagnetic compatibility cover
US6781831B1 (en) 2002-02-14 2004-08-24 Mercury Computer Systems, Inc. Card-cage with integrated control and shaping of flow resistance curve for multiple plenum chambers
US6697255B1 (en) * 2002-02-14 2004-02-24 Mercury Computer Systems, Inc. Circuit board assembly with integrated shaping and control of flow resistance curve
US6690575B1 (en) * 2002-02-14 2004-02-10 Mercury Computer Systems, Inc. Digital data processor chassis with flow balanced air intake into multiple circuit board assemblies
US6771507B1 (en) * 2003-01-31 2004-08-03 Hewlett-Packard Development Company, L.P. Power module for multi-chip printed circuit boards
DE10319984B4 (de) * 2003-05-05 2009-09-03 Qimonda Ag Vorrichtung zum Kühlen von Speichermodulen
US7126826B1 (en) * 2004-10-06 2006-10-24 Nvidia Corporation Quick-connect thermal solution for computer hardware testing
US7502229B2 (en) 2004-10-15 2009-03-10 Alcatel Lucent Heat dissipation system for multiple integrated circuits mounted on a printed circuit board
US7289331B2 (en) * 2005-03-30 2007-10-30 International Business Machines Corporation Interposable heat sink for adjacent memory modules
JP2006278941A (ja) * 2005-03-30 2006-10-12 Fujitsu Ltd 放熱装置及びプラグインユニット
US7277291B2 (en) * 2005-08-08 2007-10-02 Verifone Holdings, Inc. Thermal transfer device
TWI334204B (en) * 2006-12-07 2010-12-01 Nanya Technology Corp Package device
US7474532B1 (en) * 2007-08-30 2009-01-06 International Business Machines Corporation Heat sink restraints for calibrated mating pressure and shock absorption
US7796384B2 (en) * 2008-08-27 2010-09-14 Honeywell International Inc. Hybrid chassis cooling system
US9521782B2 (en) 2014-06-26 2016-12-13 General Electric Company Systems and methods for passive cooling of components within electrical devices
US10736218B1 (en) * 2019-06-10 2020-08-04 Mellanox Technologies, Ltd. Networking cards with increased thermal performance
US11140780B2 (en) * 2019-06-10 2021-10-05 Mellanox Technologies, Ltd. Networking cards with increased performance
US11776876B2 (en) 2021-01-25 2023-10-03 International Business Machines Corporation Distributing heatsink load across a processor module with separable input/output (I/O) connectors

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60126853A (ja) * 1983-12-14 1985-07-06 Hitachi Ltd 半導体デバイス冷却装置
US4639829A (en) * 1984-06-29 1987-01-27 International Business Machines Corporation Thermal conduction disc-chip cooling enhancement means
US4748495A (en) * 1985-08-08 1988-05-31 Dypax Systems Corporation High density multi-chip interconnection and cooling package
US4665467A (en) * 1986-02-18 1987-05-12 Ncr Corporation Heat transfer mounting device
US4753287A (en) * 1986-10-24 1988-06-28 Bicc Plc Circuit board installation
US5005638A (en) * 1988-10-31 1991-04-09 International Business Machines Corporation Thermal conduction module with barrel shaped piston for improved heat transfer
EP0597425B1 (de) * 1992-11-09 1998-09-16 Nec Corporation Struktur zur Kühlung einer integrierten Schaltung
JPH06349989A (ja) * 1992-12-21 1994-12-22 Internatl Business Mach Corp <Ibm> 熱伝達冷却装置
US5940266A (en) * 1997-10-14 1999-08-17 International Business Machines Corporation Bi-directional cooling arrangement for use with an electronic component enclosure
US6214647B1 (en) * 1998-09-23 2001-04-10 International Business Machines Corporation Method for bonding heatsink to multiple-height chip
US5999407A (en) * 1998-10-22 1999-12-07 Lockheed Martin Corp. Electronic module with conductively heat-sunk components
TW437980U (en) * 1999-06-09 2001-05-28 Twinhead Int Corp Shockproof apparatus for notebook computer module

Also Published As

Publication number Publication date
DE69827304T2 (de) 2005-11-03
US20010046121A1 (en) 2001-11-29
EP1142460B1 (de) 2004-10-27
EP1142460A1 (de) 2001-10-10
WO2000041448A1 (fr) 2000-07-13
US6504722B2 (en) 2003-01-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D.STAATES , US

8328 Change in the person/name/address of the agent

Representative=s name: SCHOPPE, ZIMMERMANN, STOECKELER & ZINKLER, 82049 P

8339 Ceased/non-payment of the annual fee