DE60004269D1 - Elektronische baugruppe mit hohem kühlungsvermögen - Google Patents

Elektronische baugruppe mit hohem kühlungsvermögen

Info

Publication number
DE60004269D1
DE60004269D1 DE60004269T DE60004269T DE60004269D1 DE 60004269 D1 DE60004269 D1 DE 60004269D1 DE 60004269 T DE60004269 T DE 60004269T DE 60004269 T DE60004269 T DE 60004269T DE 60004269 D1 DE60004269 D1 DE 60004269D1
Authority
DE
Germany
Prior art keywords
cooling capacity
electronic assembly
high cooling
electronic
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60004269T
Other languages
English (en)
Other versions
DE60004269T2 (de
Inventor
Claude Sarno
Georges Moulin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales Avionics SAS
Original Assignee
Thales Avionics SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales Avionics SAS filed Critical Thales Avionics SAS
Application granted granted Critical
Publication of DE60004269D1 publication Critical patent/DE60004269D1/de
Publication of DE60004269T2 publication Critical patent/DE60004269T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
DE60004269T 1999-12-28 2000-12-28 Elektronische baugruppe mit hohem kühlungsvermögen Expired - Lifetime DE60004269T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9916594 1999-12-28
FR9916594A FR2803166B1 (fr) 1999-12-28 1999-12-28 Module electronique a haut pouvoir de refroidissement
PCT/FR2000/003718 WO2001049092A1 (fr) 1999-12-28 2000-12-28 Module electronique a haut pouvoir de refroidissement

Publications (2)

Publication Number Publication Date
DE60004269D1 true DE60004269D1 (de) 2003-09-04
DE60004269T2 DE60004269T2 (de) 2004-05-27

Family

ID=9553927

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60004269T Expired - Lifetime DE60004269T2 (de) 1999-12-28 2000-12-28 Elektronische baugruppe mit hohem kühlungsvermögen

Country Status (6)

Country Link
US (1) US6661664B2 (de)
EP (1) EP1243169B1 (de)
AU (1) AU3029801A (de)
DE (1) DE60004269T2 (de)
FR (1) FR2803166B1 (de)
WO (1) WO2001049092A1 (de)

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DE20115659U1 (de) * 2001-09-24 2002-02-14 Trw Automotive Electron & Comp Gehäuse für ein elektronisches Steuergerät in Fahrzeugen
US6762939B2 (en) * 2002-02-20 2004-07-13 Intel Corporation Thermal solution for a mezzanine card
US6765793B2 (en) * 2002-08-30 2004-07-20 Themis Corporation Ruggedized electronics enclosure
FR2845821B1 (fr) 2002-10-11 2005-12-02 Thales Sa Substrat electronique d'un module electronique a trois dimensions a fort pouvoir de dissipation thermique et module electronique
FR2852676B1 (fr) * 2003-03-18 2017-10-06 Centre Nat De La Rech Scient (C N R S ) Procede et dispositif pour la production de froid rapide et de forte puissance
US7145774B2 (en) * 2003-12-29 2006-12-05 Intel Corporation Backside cooling apparatus for modular platforms
KR100590548B1 (ko) * 2004-03-03 2006-06-19 삼성전자주식회사 광검출 장치
US7408775B2 (en) * 2004-10-19 2008-08-05 Honeywell International Inc. Electrical module and support therefor with integrated cooling
US20070041160A1 (en) * 2005-08-19 2007-02-22 Kehret William E Thermal management for a ruggedized electronics enclosure
FR2898462B1 (fr) * 2006-03-08 2020-02-07 Thales Drain thermique pour carte electronique comportant des elements en graphite
WO2008033870A2 (en) 2006-09-11 2008-03-20 Lumexis Corporation Fiber-to-the-seat (ftts) fiber distribution system
US7391610B2 (en) * 2006-09-29 2008-06-24 Rockwell Automation Technologies, Inc. Thermal cooling of industrial electronic module by conductive structure
US8010991B2 (en) * 2007-01-29 2011-08-30 Cisco Technology, Inc. Policy resolution in an entitlement management system
JP4824624B2 (ja) * 2007-05-15 2011-11-30 株式会社リコー 熱移動部材、熱移動機構及び情報処理装置
US8459053B2 (en) 2007-10-08 2013-06-11 Emerson Climate Technologies, Inc. Variable speed compressor protection system and method
FR2933968B1 (fr) * 2008-07-18 2010-09-10 Thales Sa Dispositif electronique comportant des composants electroniques et au moins une interface a base de nanotubes et procede de fabrication
US20100051227A1 (en) * 2008-08-29 2010-03-04 Anbudurai Kuppuswamy Thermal energy storage
US8382516B2 (en) * 2008-10-02 2013-02-26 Thales Avionics, Inc. Adaptable configuration plug in a vehicle entertainment system
CA2666014C (en) 2009-05-15 2016-08-16 Ruggedcom Inc. Open frame electronic chassis for enclosed modules
US7768783B1 (en) * 2009-06-16 2010-08-03 Microsoft Corporation Electronic module cooling
US8222541B2 (en) * 2009-06-19 2012-07-17 General Electric Company Avionics chassis
US8059409B2 (en) 2009-06-19 2011-11-15 General Electric Company Avionics chassis
US8023267B2 (en) * 2009-06-19 2011-09-20 General Electric Company Avionics chassis
US7911796B2 (en) * 2009-06-19 2011-03-22 General Electric Company Avionics chassis
US8659990B2 (en) 2009-08-06 2014-02-25 Lumexis Corporation Serial networking fiber-to-the-seat inflight entertainment system
WO2011020071A1 (en) 2009-08-14 2011-02-17 Lumexis Corp. Video display unit docking assembly for fiber-to-the-screen inflight entertainment system
WO2011022708A1 (en) 2009-08-20 2011-02-24 Lumexis Corp. Serial networking fiber optic inflight entertainment system network configuration
FR2953361B1 (fr) * 2009-12-01 2012-08-03 Airbus Operations Sas Cabinet pour equipement avionique
FR2956557B1 (fr) * 2010-02-18 2013-01-04 Airbus Operations Sas Module electronique et ensemble electronique comportant un tel module
US8427828B2 (en) * 2010-07-20 2013-04-23 Themis Computer Printed circuit board module enclosure and apparatus using same
US8542490B2 (en) 2011-06-16 2013-09-24 Hamilton Sundstrand Corporation Vertically mounted multi-hybrid module and heat sink
EP2727445A4 (de) * 2011-06-28 2015-04-15 Ericsson Telefon Ab L M Elektronische vorrichtung mit wärmeableitstruktur
US8995131B2 (en) 2011-08-29 2015-03-31 Aerovironment, Inc. Heat transfer system for aircraft structures
US9756764B2 (en) 2011-08-29 2017-09-05 Aerovironment, Inc. Thermal management system for an aircraft avionics bay
FR2981824B1 (fr) * 2011-10-20 2014-10-31 Airbus Operations Sas Equipement avionique
FR3017936B1 (fr) 2014-02-21 2019-03-15 Thales Systeme de regulation thermique d'au moins un module electronique embarque a bord d'un aeronef
US10182515B2 (en) * 2014-05-02 2019-01-15 The Boeing Company Conduction cooled module
JP6392015B2 (ja) * 2014-07-18 2018-09-19 株式会社東芝 電子機器
US10209009B2 (en) 2016-06-21 2019-02-19 General Electric Company Heat exchanger including passageways
CA3070742A1 (en) * 2016-07-29 2018-02-01 Adc Technologies Inc. Fanless rail cooled electronics apparatus
US9974157B2 (en) * 2016-08-15 2018-05-15 General Electric Company Circuit card cartridge for an electronic system
FR3062246A1 (fr) * 2017-01-24 2018-07-27 Zodiac Aero Electric Boitier de distribution de puissance electrique pour un aeronef
US10542640B1 (en) * 2018-09-27 2020-01-21 Hewlett Packard Enterprise Development Lp Liquid chamber housings
CN110113900B (zh) * 2019-05-22 2020-11-10 温州乐控节能科技有限公司 一种超伺服控制器
US11206743B2 (en) 2019-07-25 2021-12-21 Emerson Climate Technolgies, Inc. Electronics enclosure with heat-transfer element
RU196433U1 (ru) * 2019-11-06 2020-02-28 Акционерное общество "Концерн "Созвездие" Устройство тепловой защиты для тепловыделяющих элетрорадио изделий
FR3122803B1 (fr) * 2021-05-10 2023-07-21 Safran Electronics & Defense Boitier comportant une paroi composite integrant au moins un conduit de refroidissement

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4366526A (en) * 1980-10-03 1982-12-28 Grumman Aerospace Corporation Heat-pipe cooled electronic circuit card
JPS607154A (ja) * 1983-06-24 1985-01-14 Mitsubishi Electric Corp 電子部品の冷却装置
GB2145290A (en) * 1983-08-10 1985-03-20 Smiths Industries Plc Cooling avionics circuit modules
US5077637A (en) * 1989-09-25 1991-12-31 The Charles Stark Draper Lab., Inc. Solid state directional thermal cable
US5003429A (en) * 1990-07-09 1991-03-26 International Business Machines Corporation Electronic assembly with enhanced heat sinking
US5161092A (en) * 1991-07-02 1992-11-03 Hughes Aircraft Company Circuit card assembly conduction converter
EP0608418B1 (de) * 1992-05-20 1998-11-04 Seiko Epson Corporation Kassette für eine elektronische vorrichtung
GB9218233D0 (en) * 1992-08-27 1992-10-14 Dsk Technology International L Cooling of electronics equipment
US5390734A (en) * 1993-05-28 1995-02-21 Lytron Incorporated Heat sink
SE505163C2 (sv) * 1996-02-21 1997-07-07 Ericsson Telefon Ab L M Värmeledande anordning
US5991155A (en) * 1996-12-13 1999-11-23 Mitsubishi Denki Kabushiki Kaisha Heat sink assembly including flexible heat spreader sheet
FR2783392B1 (fr) 1998-09-15 2000-12-08 Sextant Avionique Dispositif de connexion pour un ensemble de structures modulaires porte-cartes electroniques et rack equipe d'un tel dispositif, accueillant un tel ensemble
US6175501B1 (en) * 1998-12-31 2001-01-16 Lucent Technologies Inc. Method and arrangement for cooling an electronic assembly
US6166908A (en) * 1999-10-01 2000-12-26 Intel Corporation Integrated circuit cartridge

Also Published As

Publication number Publication date
US6661664B2 (en) 2003-12-09
DE60004269T2 (de) 2004-05-27
WO2001049092A1 (fr) 2001-07-05
FR2803166B1 (fr) 2002-05-31
AU3029801A (en) 2001-07-09
EP1243169A1 (de) 2002-09-25
FR2803166A1 (fr) 2001-06-29
US20020172010A1 (en) 2002-11-21
EP1243169B1 (de) 2003-07-30

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