FR3122803B1 - Boitier comportant une paroi composite integrant au moins un conduit de refroidissement - Google Patents
Boitier comportant une paroi composite integrant au moins un conduit de refroidissement Download PDFInfo
- Publication number
- FR3122803B1 FR3122803B1 FR2104913A FR2104913A FR3122803B1 FR 3122803 B1 FR3122803 B1 FR 3122803B1 FR 2104913 A FR2104913 A FR 2104913A FR 2104913 A FR2104913 A FR 2104913A FR 3122803 B1 FR3122803 B1 FR 3122803B1
- Authority
- FR
- France
- Prior art keywords
- composite wall
- housing
- cooling duct
- heat transfer
- transfer device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002131 composite material Substances 0.000 title abstract 3
- 229920000049 Carbon (fiber) Polymers 0.000 abstract 1
- 239000004917 carbon fiber Substances 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 239000012809 cooling fluid Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 229920001169 thermoplastic Polymers 0.000 abstract 1
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
- 239000004416 thermosoftening plastic Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
- H05K7/20672—Liquid coolant with phase change, e.g. heat pipes within sub-racks for removing heat from electronic boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20627—Liquid coolant without phase change
- H05K7/20636—Liquid coolant without phase change within sub-racks for removing heat from electronic boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Aviation & Aerospace Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
L'invention porte sur un boîtier (10) comportant: - au moins une paroi composite (12) comportant des fibres de carbone (15) tissées ou tressées recouvertes par une résine (16) thermoplastique ou thermodurcissable, - une carte électronique (18) portant des composants électroniques (19), et - un dispositif de transfert de chaleur (24) ayant au moins une portion disposée en regard d'un composant électronique (19) à refroidir de la carte électronique (18), ledit dispositif de transfert de chaleur (24) étant inséré à l'intérieur de la paroi composite (12), - le dispositif de transfert de chaleur (24) comportant au moins un conduit de refroidissement (25) contenant un fluide de refroidissement. Figure 3
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR2104913A FR3122803B1 (fr) | 2021-05-10 | 2021-05-10 | Boitier comportant une paroi composite integrant au moins un conduit de refroidissement |
US17/738,905 US20220361370A1 (en) | 2021-05-10 | 2022-05-06 | Housing comprising a composite wall integrating at least one cooling conduit |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR2104913A FR3122803B1 (fr) | 2021-05-10 | 2021-05-10 | Boitier comportant une paroi composite integrant au moins un conduit de refroidissement |
FR2104913 | 2021-05-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3122803A1 FR3122803A1 (fr) | 2022-11-11 |
FR3122803B1 true FR3122803B1 (fr) | 2023-07-21 |
Family
ID=77180115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR2104913A Active FR3122803B1 (fr) | 2021-05-10 | 2021-05-10 | Boitier comportant une paroi composite integrant au moins un conduit de refroidissement |
Country Status (2)
Country | Link |
---|---|
US (1) | US20220361370A1 (fr) |
FR (1) | FR3122803B1 (fr) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2803166B1 (fr) * | 1999-12-28 | 2002-05-31 | Thomson Csf Sextant | Module electronique a haut pouvoir de refroidissement |
JP3726152B2 (ja) * | 2000-10-13 | 2005-12-14 | 富士重工業株式会社 | 複合材表皮熱輸送パネルおよびそれを適用したハニカムパネル |
FR2969379B1 (fr) * | 2010-12-17 | 2013-02-15 | Thales Sa | Refroidissement d'un equipement electronique |
FR3008921B1 (fr) * | 2013-07-23 | 2015-12-25 | Safran | Piece en materiau composite avec portion de conductivite thermique et electrique et procede de fabrication d'une telle piece |
TWI565373B (zh) * | 2014-09-29 | 2017-01-01 | 先豐通訊股份有限公司 | 相變化導熱式之電路板模組及其電路板結構 |
US9750127B2 (en) * | 2015-12-04 | 2017-08-29 | General Electric Company | Circuit card assembly including heat transfer assembly and method of manufacturing such |
FR3091140B1 (fr) | 2018-12-19 | 2020-12-11 | Safran Electronics & Defense | Boîtier comportant un dispositif de transfert de chaleur a base de picots metalliques inseres dans une paroi du boitier |
US11324143B2 (en) * | 2019-12-30 | 2022-05-03 | GM Cruise Holdings, LLC | Embedded and immersed heat pipes in automated driving system computers |
-
2021
- 2021-05-10 FR FR2104913A patent/FR3122803B1/fr active Active
-
2022
- 2022-05-06 US US17/738,905 patent/US20220361370A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
FR3122803A1 (fr) | 2022-11-11 |
US20220361370A1 (en) | 2022-11-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 2 |
|
PLSC | Publication of the preliminary search report |
Effective date: 20221111 |
|
PLFP | Fee payment |
Year of fee payment: 3 |
|
PLFP | Fee payment |
Year of fee payment: 4 |