DE69918631D1 - Flipchip-Metallisierung für eine elektronische Baugruppe - Google Patents

Flipchip-Metallisierung für eine elektronische Baugruppe

Info

Publication number
DE69918631D1
DE69918631D1 DE69918631T DE69918631T DE69918631D1 DE 69918631 D1 DE69918631 D1 DE 69918631D1 DE 69918631 T DE69918631 T DE 69918631T DE 69918631 T DE69918631 T DE 69918631T DE 69918631 D1 DE69918631 D1 DE 69918631D1
Authority
DE
Germany
Prior art keywords
flipchip
metallization
electronic assembly
electronic
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69918631T
Other languages
English (en)
Other versions
DE69918631T2 (de
Inventor
Yinon Degani
Jeffrey Alan Gregus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia of America Corp
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Application granted granted Critical
Publication of DE69918631D1 publication Critical patent/DE69918631D1/de
Publication of DE69918631T2 publication Critical patent/DE69918631T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69918631T 1998-10-14 1999-10-05 Flipchip-Metallisierung für eine elektronische Baugruppe Expired - Lifetime DE69918631T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US172467 1988-03-24
US09/172,467 US6130141A (en) 1998-10-14 1998-10-14 Flip chip metallization

Publications (2)

Publication Number Publication Date
DE69918631D1 true DE69918631D1 (de) 2004-08-19
DE69918631T2 DE69918631T2 (de) 2005-08-11

Family

ID=22627814

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69918631T Expired - Lifetime DE69918631T2 (de) 1998-10-14 1999-10-05 Flipchip-Metallisierung für eine elektronische Baugruppe

Country Status (7)

Country Link
US (2) US6130141A (de)
EP (1) EP0994507B1 (de)
JP (1) JP3554685B2 (de)
KR (1) KR100654823B1 (de)
DE (1) DE69918631T2 (de)
SG (1) SG93844A1 (de)
TW (1) TW457602B (de)

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EP0994507A2 (de) 2000-04-19
DE69918631T2 (de) 2005-08-11
EP0994507A3 (de) 2000-08-16
TW457602B (en) 2001-10-01
JP3554685B2 (ja) 2004-08-18
KR20000028968A (ko) 2000-05-25
JP2000124265A (ja) 2000-04-28
EP0994507B1 (de) 2004-07-14
KR100654823B1 (ko) 2006-12-08
SG93844A1 (en) 2003-01-21
US6597069B1 (en) 2003-07-22

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