DE69710714T2 - Elektronische bauteile bestückungsvorrichtung - Google Patents

Elektronische bauteile bestückungsvorrichtung

Info

Publication number
DE69710714T2
DE69710714T2 DE69710714T DE69710714T DE69710714T2 DE 69710714 T2 DE69710714 T2 DE 69710714T2 DE 69710714 T DE69710714 T DE 69710714T DE 69710714 T DE69710714 T DE 69710714T DE 69710714 T2 DE69710714 T2 DE 69710714T2
Authority
DE
Germany
Prior art keywords
electronic component
assembly device
component assembly
electronic
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69710714T
Other languages
English (en)
Other versions
DE69710714D1 (de
Inventor
Eiichi Hachiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69710714D1 publication Critical patent/DE69710714D1/de
Application granted granted Critical
Publication of DE69710714T2 publication Critical patent/DE69710714T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
DE69710714T 1996-04-23 1997-04-22 Elektronische bauteile bestückungsvorrichtung Expired - Lifetime DE69710714T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10074496 1996-04-23
PCT/JP1997/001385 WO1997040657A1 (en) 1996-04-23 1997-04-22 Electronic component mounting apparatus

Publications (2)

Publication Number Publication Date
DE69710714D1 DE69710714D1 (de) 2002-04-04
DE69710714T2 true DE69710714T2 (de) 2002-10-24

Family

ID=14282066

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69710714T Expired - Lifetime DE69710714T2 (de) 1996-04-23 1997-04-22 Elektronische bauteile bestückungsvorrichtung

Country Status (6)

Country Link
US (1) US6144452A (de)
EP (1) EP0897657B1 (de)
KR (1) KR100318875B1 (de)
CN (1) CN1095624C (de)
DE (1) DE69710714T2 (de)
WO (1) WO1997040657A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8164625B2 (en) 2005-06-25 2012-04-24 Modi Modular Digits Gmbh Device and method for visually recording two-dimensional or three-dimensional objects

Families Citing this family (43)

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GB2321133B (en) * 1998-02-12 1999-02-24 Motorola Bv Component assembler
SG108814A1 (en) * 1998-02-27 2005-02-28 Matsushita Electric Ind Co Ltd Component recognizing method and apparatus
US6222629B1 (en) * 1999-06-10 2001-04-24 Pmj Automec Oyj Procedure and system for inspecting a component with leads to determine its fitness for assembly
US6229608B1 (en) * 1999-06-10 2001-05-08 Pmj Automec Oyj Procedure and system for inspecting a component with leads to determine its fitness for assembly
JP2001053496A (ja) * 1999-08-06 2001-02-23 Matsushita Electric Ind Co Ltd 電子部品実装方法
DE10011046A1 (de) * 2000-03-07 2001-10-04 Omron Electronics Mfg Of Germa Verfahren zum Erfassen von Abständen von Objekten mittels eines Triangulations-Sensors und Triangulations-Sensor zum Durchführen des Verfahrens
JP2002172575A (ja) * 2000-12-07 2002-06-18 Fanuc Ltd 教示装置
US7523848B2 (en) * 2001-07-24 2009-04-28 Kulicke And Soffa Industries, Inc. Method and apparatus for measuring the size of free air balls on a wire bonder
US6705507B2 (en) * 2001-07-24 2004-03-16 Kulicke & Soffa Investments, Inc. Die attach system and process using cornercube offset tool
US7527186B2 (en) * 2001-07-24 2009-05-05 Kulicke And Soffa Industries, Inc. Method and apparatus for mapping a position of a capillary tool tip using a prism
KR100752309B1 (ko) * 2001-07-31 2007-08-29 주식회사 포스코 분사범위 조정이 가능한 고압수 분사장치
JP2003058601A (ja) * 2001-08-14 2003-02-28 Matsushita Electric Ind Co Ltd 画像処理装置用教示データの配送方法及びシステム
KR100412272B1 (ko) * 2001-11-21 2003-12-31 미래산업 주식회사 부품의 편평도 검사 장치 및 그 방법
JP4304239B2 (ja) * 2002-06-04 2009-07-29 富士機械製造株式会社 電子部品の実装方法
DE60321350D1 (de) * 2002-08-08 2008-07-10 Matsushita Electric Ind Co Ltd Vorrichtung und verfahren zum ermitteln ob ein bauelemententräger gut ist, und maschine und verfahren zur montage eines elektronischen bauteils
JP4408682B2 (ja) * 2003-10-31 2010-02-03 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP4417779B2 (ja) * 2004-05-31 2010-02-17 株式会社日立ハイテクインスツルメンツ 電子部品装着装置及び電子部品装着方法
CN101091426B (zh) * 2005-03-29 2011-05-18 松下电器产业株式会社 元件形状描绘方法和元件贴装方法
DE102005023705A1 (de) * 2005-05-23 2006-11-30 Siemens Ag Sensor und Sensorsystem zur optischen Erfassung von Objekten, Bestückkopf, Verfahren zur Bestimmung der Höhenposition eines Bauelements
KR100842357B1 (ko) * 2007-05-08 2008-07-01 미래산업 주식회사 모션 프로파일을 이용한 표면실장기 및 그 구동방법
US8553080B2 (en) * 2007-08-28 2013-10-08 Panasonic Corporation Component placement apparatus
NL1036851C2 (nl) * 2009-04-14 2010-10-18 Assembléon B V Inrichting geschikt voor het plaatsen van een component op een substraat alsmede een dergelijke werkwijze.
CN102641821A (zh) * 2011-02-17 2012-08-22 一诠精密工业股份有限公司 用于黏着光学透镜的点胶机
KR101317580B1 (ko) * 2012-04-30 2013-10-11 주식회사 현대케피코 자동차의 엔진제어유닛 커넥터 이종품 체크 유닛
KR101435971B1 (ko) * 2012-05-22 2014-09-02 주식회사 고영테크놀러지 부품 라이브러리 획득 시스템 및 부품 라이브러리 생성방법
US9491411B2 (en) 2013-07-25 2016-11-08 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
US9015928B2 (en) 2013-07-25 2015-04-28 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting apparatus
US9332230B2 (en) 2013-07-25 2016-05-03 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
JP6152169B2 (ja) * 2013-08-09 2017-06-21 富士機械製造株式会社 電子部品装着機が用いるデータを表示する装置
US10524401B2 (en) 2014-03-27 2019-12-31 Fuji Corporation Component mounting device
JP6373984B2 (ja) * 2014-06-03 2018-08-15 株式会社Ｆｕｊｉ ばら部品供給装置、ばら部品供給方法
WO2016051602A1 (ja) * 2014-10-03 2016-04-07 富士機械製造株式会社 部品装着システムおよび部品装着装置の異常停止診断方法
DE102014117369B3 (de) * 2014-11-26 2016-02-11 Asm Assembly Systems Gmbh & Co. Kg Datenaustausch an einem Bestückkopf eines Bestückautomaten
CN108401414B (zh) * 2015-06-19 2020-12-11 雅马哈发动机株式会社 元件安装装置和元件安装方法
US10932401B2 (en) * 2015-07-23 2021-02-23 Fuji Corporation Component mounting machine
CH711570B1 (de) * 2015-09-28 2019-02-15 Besi Switzerland Ag Vorrichtung für die Montage von Bauelementen auf einem Substrat.
CN106622879A (zh) * 2016-11-30 2017-05-10 江苏正桥影像科技股份有限公司 刮胶机及镜头粘胶方法
CN107278119B (zh) * 2017-08-14 2023-04-25 常州汇邦电子有限公司 电路板原件插装辅助装置及插装方法
JP7135418B2 (ja) * 2018-05-11 2022-09-13 スミダコーポレーション株式会社 平坦度検出方法、平坦度検出装置及び平坦度検出プログラム
JP7253914B2 (ja) * 2018-12-26 2023-04-07 Juki株式会社 電子部品実装システム
JP7314608B2 (ja) * 2019-05-10 2023-07-26 スミダコーポレーション株式会社 電子部品評価方法、電子部品評価装置及び電子部品評価プログラム
CN111645424A (zh) * 2020-06-15 2020-09-11 蔡怀峰 墨盒头配板方法
CN111660674A (zh) * 2020-06-15 2020-09-15 蔡怀峰 墨盒头配板装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0417736B1 (de) * 1989-09-12 1994-11-30 Matsushita Electric Industrial Co., Ltd. System zur optischen Inspektion von Bedingungen von Teilen, die auf einem Substrat angebracht sind
JP2554431B2 (ja) * 1992-11-05 1996-11-13 ヤマハ発動機株式会社 実装機の部品吸着状態検出装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8164625B2 (en) 2005-06-25 2012-04-24 Modi Modular Digits Gmbh Device and method for visually recording two-dimensional or three-dimensional objects
DE102005029901B4 (de) 2005-06-25 2022-10-06 Modi Modular Digits Gmbh Vorrichtung und Verfahren zum visuellen Erfassen von flächigen oder räumlichen Objekten

Also Published As

Publication number Publication date
WO1997040657A1 (en) 1997-10-30
EP0897657B1 (de) 2002-02-27
CN1095624C (zh) 2002-12-04
DE69710714D1 (de) 2002-04-04
CN1216674A (zh) 1999-05-12
KR100318875B1 (ko) 2002-02-19
EP0897657A1 (de) 1999-02-24
KR20000010618A (ko) 2000-02-25
US6144452A (en) 2000-11-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)