DE69933255D1 - Bleche aus Kupferlegierung für Elektronikbauteile - Google Patents

Bleche aus Kupferlegierung für Elektronikbauteile

Info

Publication number
DE69933255D1
DE69933255D1 DE69933255T DE69933255T DE69933255D1 DE 69933255 D1 DE69933255 D1 DE 69933255D1 DE 69933255 T DE69933255 T DE 69933255T DE 69933255 T DE69933255 T DE 69933255T DE 69933255 D1 DE69933255 D1 DE 69933255D1
Authority
DE
Germany
Prior art keywords
electronic components
copper alloy
alloy sheets
sheets
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69933255T
Other languages
English (en)
Other versions
DE69933255T2 (de
Inventor
Tetsuzo Ogura
Takashi Hamamoto
Masahiro Kawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Application granted granted Critical
Publication of DE69933255D1 publication Critical patent/DE69933255D1/de
Publication of DE69933255T2 publication Critical patent/DE69933255T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Switch Cases, Indication, And Locking (AREA)
DE69933255T 1998-03-26 1999-03-15 Kupferlegierungsblech für elektronische Teile Expired - Lifetime DE69933255T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP10000798 1998-03-26
JP10000798 1998-03-26
JP26755798A JP3739214B2 (ja) 1998-03-26 1998-09-22 電子部品用銅合金板
JP26755798 1998-09-22

Publications (2)

Publication Number Publication Date
DE69933255D1 true DE69933255D1 (de) 2006-11-02
DE69933255T2 DE69933255T2 (de) 2007-09-06

Family

ID=26441108

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69933255T Expired - Lifetime DE69933255T2 (de) 1998-03-26 1999-03-15 Kupferlegierungsblech für elektronische Teile

Country Status (5)

Country Link
US (1) US6334915B1 (de)
EP (1) EP0949343B1 (de)
JP (1) JP3739214B2 (de)
KR (1) KR100336173B1 (de)
DE (1) DE69933255T2 (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004501595A (ja) * 2000-04-14 2004-01-15 ローベルト　ボツシユ　ゲゼルシヤフト　ミツト　ベシユレンクテル　ハフツング 回転電気機械
JP3520034B2 (ja) 2000-07-25 2004-04-19 古河電気工業株式会社 電子電気機器部品用銅合金材
KR100366843B1 (ko) * 2000-10-09 2003-01-09 한국카파매트리얼 주식회사 동합금 및 그의 제조방법
US7090732B2 (en) 2000-12-15 2006-08-15 The Furukawa Electric, Co., Ltd. High-mechanical strength copper alloy
JP3520046B2 (ja) 2000-12-15 2004-04-19 古河電気工業株式会社 高強度銅合金
JP4729680B2 (ja) * 2000-12-18 2011-07-20 Ｄｏｗａメタルテック株式会社 プレス打ち抜き性に優れた銅基合金
US7220306B2 (en) * 2002-03-08 2007-05-22 Sakata Ink Corp. Treated pigment, use thereof, and compound for treating pigment
WO2003076672A1 (fr) * 2002-03-12 2003-09-18 The Furukawa Electric Co., Ltd. Fil en alliage de cuivre extremement conducteur et resistant a la relaxation a l'effort
CN1327016C (zh) * 2002-05-14 2007-07-18 同和矿业株式会社 具有改善的冲压冲制性能的铜基合金及其制备方法
US7182823B2 (en) * 2002-07-05 2007-02-27 Olin Corporation Copper alloy containing cobalt, nickel and silicon
AU2003236001A1 (en) * 2002-09-09 2004-03-29 Sambo Copper Alloy Co., Ltd. High-strength copper alloy
JP4809602B2 (ja) * 2004-05-27 2011-11-09 古河電気工業株式会社 銅合金
JP4566020B2 (ja) * 2005-02-14 2010-10-20 株式会社神戸製鋼所 異方性の小さい電気電子部品用銅合金板
WO2006093140A1 (ja) * 2005-02-28 2006-09-08 The Furukawa Electric Co., Ltd. 銅合金
JP4247922B2 (ja) * 2006-09-12 2009-04-02 古河電気工業株式会社 電気・電子機器用銅合金板材およびその製造方法
US20080190523A1 (en) * 2007-02-13 2008-08-14 Weilin Gao Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
EP1967596B1 (de) * 2007-02-13 2010-06-16 Dowa Metaltech Co., Ltd. Cu-Ni-Si-basiertes Kupferlegierungsfolienmaterial und Herstellungsverfahren dafür
JP4357536B2 (ja) * 2007-02-16 2009-11-04 株式会社神戸製鋼所 強度と成形性に優れる電気電子部品用銅合金板
JP5170881B2 (ja) * 2007-03-26 2013-03-27 古河電気工業株式会社 電気・電子機器用銅合金材およびその製造方法
US8287669B2 (en) 2007-05-31 2012-10-16 The Furukawa Electric Co., Ltd. Copper alloy for electric and electronic equipments
JP4981748B2 (ja) * 2007-05-31 2012-07-25 古河電気工業株式会社 電気・電子機器用銅合金
US20110038753A1 (en) * 2007-11-05 2011-02-17 Hiroshi Kaneko Copper alloy sheet material
US20100316879A1 (en) 2008-02-08 2010-12-16 Kuniteru Mihara Copper alloy material for electric/electronic components
WO2010016428A1 (ja) * 2008-08-05 2010-02-11 古河電気工業株式会社 電気・電子部品用銅合金材
JP4563495B1 (ja) * 2009-04-27 2010-10-13 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
EP2508633A4 (de) 2009-12-02 2014-07-23 Furukawa Electric Co Ltd Kupferlegierungsfolie und herstellungsverfahren dafür
KR101419147B1 (ko) 2009-12-02 2014-07-11 후루카와 덴키 고교 가부시키가이샤 구리합금 판재 및 그 제조방법
WO2011125153A1 (ja) * 2010-04-02 2011-10-13 Jx日鉱日石金属株式会社 電子材料用Ｃｕ－Ｎｉ－Ｓｉ系合金
US9159985B2 (en) * 2011-05-27 2015-10-13 Ostuka Techno Corporation Circuit breaker and battery pack including the same
RU2458169C1 (ru) * 2011-08-31 2012-08-10 Юлия Алексеевна Щепочкина Сплав
JP5773929B2 (ja) 2012-03-28 2015-09-02 株式会社神戸製鋼所 曲げ加工性及び耐応力緩和特性に優れる電気電子部品用銅合金板
JP5427971B1 (ja) * 2013-03-25 2014-02-26 Ｊｘ日鉱日石金属株式会社 導電性及び曲げたわみ係数に優れる銅合金板
JP6223057B2 (ja) * 2013-08-13 2017-11-01 Ｊｘ金属株式会社 導電性及び曲げたわみ係数に優れる銅合金板
CN104831113B (zh) * 2015-06-03 2017-05-10 洛阳奥瑞特铜业有限公司 一种铜镁硅合金及其制备方法和结晶器
KR101792153B1 (ko) 2016-05-16 2017-10-31 엘에스전선 주식회사 내굴곡성 및 유연성이 우수한 열선 케이블
JP6440760B2 (ja) * 2017-03-21 2018-12-19 Ｊｘ金属株式会社 プレス加工後の寸法精度を改善した銅合金条
CN108285988B (zh) * 2018-01-31 2019-10-18 宁波博威合金材料股份有限公司 析出强化型铜合金及其应用

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692192A (en) * 1984-10-30 1987-09-08 Ngk Insulators, Ltd. Electroconductive spring material
US4594221A (en) * 1985-04-26 1986-06-10 Olin Corporation Multipurpose copper alloys with moderate conductivity and high strength
JPS6411933A (en) * 1987-07-03 1989-01-17 Kobe Steel Ltd Copper alloy having excellent hot workability and its production
JPH0266130A (ja) 1988-08-29 1990-03-06 Mitsubishi Shindoh Co Ltd 打抜金型摩耗の少ない端子・コネクタ用Ｃｕ合金
JPH03236432A (ja) 1990-02-14 1991-10-22 Furukawa Electric Co Ltd:The カセットテープ部材
JP2724903B2 (ja) * 1990-05-23 1998-03-09 矢崎総業 株式会社 耐屈曲性に優れた導電用高力銅合金
JP2756021B2 (ja) * 1990-06-14 1998-05-25 株式会社神戸製鋼所 電気抵抗の定質量温度係数が小さい銅合金
JP2834593B2 (ja) * 1990-06-25 1998-12-09 株式会社神戸製鋼所 ベアボンディング用リードフレーム材料
JPH0499839A (ja) 1990-08-14 1992-03-31 Nikko Kyodo Co Ltd 通電材料
JPH04231443A (ja) * 1990-12-27 1992-08-20 Nikko Kyodo Co Ltd 通電材料
JP2503793B2 (ja) * 1991-03-01 1996-06-05 三菱伸銅株式会社 打抜金型の摩耗抑制効果を有する電気電子部品用Ｃｕ合金板材
JPH088056B2 (ja) * 1992-01-20 1996-01-29 株式会社神戸製鋼所 ヒューズ端子材用銅合金
JP2797846B2 (ja) * 1992-06-11 1998-09-17 三菱伸銅株式会社 樹脂封止型半導体装置のＣｕ合金製リードフレーム材
JP3275377B2 (ja) * 1992-07-28 2002-04-15 三菱伸銅株式会社 微細組織を有する電気電子部品用Ｃｕ合金板材
JP3236432B2 (ja) 1993-11-30 2001-12-10 三菱電機株式会社 道路交通信号制御装置

Also Published As

Publication number Publication date
JPH11335756A (ja) 1999-12-07
EP0949343B1 (de) 2006-09-20
KR100336173B1 (ko) 2002-05-09
DE69933255T2 (de) 2007-09-06
US6334915B1 (en) 2002-01-01
KR19990078298A (ko) 1999-10-25
JP3739214B2 (ja) 2006-01-25
EP0949343A1 (de) 1999-10-13

Similar Documents

Publication Publication Date Title
DE69933255D1 (de) Bleche aus Kupferlegierung für Elektronikbauteile
DE60131763D1 (de) Material aus kupferlegierung für elektronik oder elektronische bauteile
DE69929636D1 (de) Gehäuse für elektronisches Bauelement
DE69937413D1 (de) Wärmesenke für elektronisches Bauteil
DE60045143D1 (de) Kühlvorrichtung für elektronisches Bauelement
DE69840585D1 (de) Bleifreie Automatenkupferlegierung
DE69838586D1 (de) Lötelement für gedruckte leiterplatten
DE19983799T1 (de) Einfaches Gehäuse für elektronische Komponenten
DE69927498D1 (de) Pektine aus aloe
DE69925880D1 (de) Verbindungsverfahren für Leiterplatte
DE60043603D1 (de) Verbinder für gedruckte Leiterplatten
DE69909252D1 (de) Bestückungsvorrichtung für elektronische bauteile
DE69903305D1 (de) Anisotrop leitender klebstoff für feinen kontaktabstand
DE69833582D1 (de) Automatenlegierung auf Kupferbasis
DE60125269D1 (de) Steckverbinder für flexible Leiterplatten
DE69814376D1 (de) Elektronisches Endgerät
DE69938997D1 (de) Bauteil für die Oberflächenmontage
FR2774397B1 (fr) Alliage fer-cobalt
DE69910451D1 (de) Kontaktmechanismus für elektronisches Überlastrelais
DE69923391D1 (de) Zusammengesetzter Schalter für ein elektronisches Gerät
DE10191266D2 (de) Gehäusebaugruppe für ein elektronisches Bauteil
DE69902383D1 (de) Hartlotlegierungen auf kobalt-chrom-palladium-basis
DE69902098D1 (de) Kontaktmechanismus für elektronisches überlastrelais
DE19681566T1 (de) Kupferlegierungsfolien für flexible Stromwege
DE69915410D1 (de) Zwei-Standard-Schnittstellenschaltung für serielle Verbindung

Legal Events

Date Code Title Description
8381 Inventor (new situation)

Inventor name: OGURA, TETSUZO, SHIMONOSEKI-SHI, YAMAGUCHI, 57, JP

Inventor name: HAMAMOTO, TAKASHI, SHIMONOSEKI-SHI, YAMAGUCHI,, JP

Inventor name: KAWAGUCHI, MASAHIRO, SHIMONOSEKI-SHI, YAMAGUCH, JP

8364 No opposition during term of opposition