DE69903305D1 - Anisotrop leitender klebstoff für feinen kontaktabstand - Google Patents

Anisotrop leitender klebstoff für feinen kontaktabstand

Info

Publication number
DE69903305D1
DE69903305D1 DE69903305T DE69903305T DE69903305D1 DE 69903305 D1 DE69903305 D1 DE 69903305D1 DE 69903305 T DE69903305 T DE 69903305T DE 69903305 T DE69903305 T DE 69903305T DE 69903305 D1 DE69903305 D1 DE 69903305D1
Authority
DE
Germany
Prior art keywords
anisotrop
conductive adhesive
fine contacts
contacts
fine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69903305T
Other languages
English (en)
Inventor
Glen Connell
S Carpenter
B Hogerton
H Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Application granted granted Critical
Publication of DE69903305D1 publication Critical patent/DE69903305D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/109—Embedding of laminae within face of additional laminae
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y10T156/1093—All laminae planar and face to face with covering of discrete laminae with additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372—Particulate matter
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372—Particulate matter
    • Y10T428/24413—Metal or metal compound
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24628—Nonplanar uniform thickness material
    • Y10T428/24669—Aligned or parallel nonplanarities
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24628—Nonplanar uniform thickness material
    • Y10T428/24669—Aligned or parallel nonplanarities
    • Y10T428/24678—Waffle-form

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
DE69903305T 1998-06-30 1999-01-08 Anisotrop leitender klebstoff für feinen kontaktabstand Expired - Lifetime DE69903305D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/108,158 US20010008169A1 (en) 1998-06-30 1998-06-30 Fine pitch anisotropic conductive adhesive
PCT/US1999/000460 WO2000000563A1 (en) 1998-06-30 1999-01-08 Fine pitch anisotropic conductive adhesive

Publications (1)

Publication Number Publication Date
DE69903305D1 true DE69903305D1 (de) 2002-11-07

Family

ID=22320625

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69903305T Expired - Lifetime DE69903305D1 (de) 1998-06-30 1999-01-08 Anisotrop leitender klebstoff für feinen kontaktabstand

Country Status (8)

Country Link
US (1) US20010008169A1 (de)
EP (1) EP1093503B1 (de)
JP (1) JP2002519473A (de)
KR (1) KR20010053298A (de)
CN (1) CN1307625A (de)
AU (1) AU2454199A (de)
DE (1) DE69903305D1 (de)
WO (1) WO2000000563A1 (de)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
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US6858253B2 (en) 2001-05-31 2005-02-22 3M Innovative Properties Company Method of making dimensionally stable composite article
JPWO2003003798A1 (ja) * 2001-06-29 2004-10-21 東レエンジニアリング株式会社 異方導電性接着剤を用いた接合方法
EP1467945A2 (de) 2002-01-18 2004-10-20 Avery Dennison Corporation Bedeckte mikrokammerstrukturen
US6809280B2 (en) * 2002-05-02 2004-10-26 3M Innovative Properties Company Pressure activated switch and touch panel
US7678443B2 (en) 2003-05-16 2010-03-16 3M Innovative Properties Company Complex microstructure film
KR100709640B1 (ko) * 2003-12-04 2007-04-24 아사히 가세이 일렉트로닉스 가부시끼가이샤 이방 도전성 접착 시트 및 접속 구조체
TWI299502B (en) * 2004-01-05 2008-08-01 Au Optronics Corp Conductive material with a laminated structure
US7468199B2 (en) * 2004-12-23 2008-12-23 3M Innovative Properties Company Adhesive membrane for force switches and sensors
US7260999B2 (en) 2004-12-23 2007-08-28 3M Innovative Properties Company Force sensing membrane
JP4993877B2 (ja) * 2005-06-03 2012-08-08 旭化成イーマテリアルズ株式会社 異方導電性接着シート及び微細接続構造体
US8802214B2 (en) * 2005-06-13 2014-08-12 Trillion Science, Inc. Non-random array anisotropic conductive film (ACF) and manufacturing processes
US20060280912A1 (en) * 2005-06-13 2006-12-14 Rong-Chang Liang Non-random array anisotropic conductive film (ACF) and manufacturing processes
US7509881B2 (en) 2005-07-29 2009-03-31 3M Innovative Properties Company Interdigital force switches and sensors
US7923488B2 (en) * 2006-10-16 2011-04-12 Trillion Science, Inc. Epoxy compositions
US8852689B2 (en) 2007-05-29 2014-10-07 Innova Dynamics, Inc. Surfaces having particles and related methods
CN101308711B (zh) * 2008-04-29 2010-11-10 深圳典邦科技有限公司 多层结构异方向导电膜及其制备方法
CN102326233B (zh) * 2008-12-31 2013-11-20 3M创新有限公司 制备设备元件的方法以及所得的元件和设备
WO2010117102A1 (ko) * 2009-04-09 2010-10-14 서강대학교 산학협력단 콜로이드 입자들을 단결정들로 정렬하는 방법
DE102009043132B4 (de) * 2009-09-17 2014-02-20 Technische Universität Dresden Vorrichtung für eine definierte Positionierung von faden- oder rohrförmigen elektrostriktiven, ferroelektrischen oder piezokeramischen Elementen für die Herstellung von aktorisch und/oder sensorisch wirksamen Elementen
DE102011075009B4 (de) * 2011-04-29 2019-11-14 Continental Automotive Gmbh Auf einem Träger angeordnete Kontaktfläche zur Verbindung mit einer auf einem weiteren Träger angeordneten Gegenkontaktfläche
JP5838321B2 (ja) * 2011-05-27 2016-01-06 パナソニックＩｐマネジメント株式会社 太陽電池モジュールの製造方法
US9475963B2 (en) 2011-09-15 2016-10-25 Trillion Science, Inc. Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes
US9102851B2 (en) * 2011-09-15 2015-08-11 Trillion Science, Inc. Microcavity carrier belt and method of manufacture
JP5445558B2 (ja) * 2011-10-24 2014-03-19 デクセリアルズ株式会社 異方導電性接着シート及び接続方法
KR101729867B1 (ko) * 2012-08-01 2017-04-24 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름의 제조 방법, 이방성 도전 필름, 및 접속 구조체
JP6024621B2 (ja) * 2012-08-24 2016-11-16 デクセリアルズ株式会社 異方性導電フィルムの製造方法及び異方性導電フィルム
WO2014034741A1 (ja) * 2012-08-29 2014-03-06 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
JP6151412B2 (ja) * 2012-09-18 2017-06-21 デクセリアルズ株式会社 異方性導電フィルム、異方性導電フィルムの製造方法、接続体の製造方法、及び接続方法
US20140205851A1 (en) * 2013-01-23 2014-07-24 Ravindranath V. Mahajan Magnetic contacts for electronics applications
US9352539B2 (en) 2013-03-12 2016-05-31 Trillion Science, Inc. Microcavity carrier with image enhancement for laser ablation
JP6289831B2 (ja) * 2013-07-29 2018-03-07 デクセリアルズ株式会社 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法
JP2014062257A (ja) * 2013-11-05 2014-04-10 Dexerials Corp 異方導電性接着シート及び接続方法
JP6661969B2 (ja) * 2014-10-28 2020-03-11 デクセリアルズ株式会社 異方性導電フィルム及び接続構造体
JP6707835B2 (ja) 2014-10-28 2020-06-10 デクセリアルズ株式会社 異方性導電フィルム
JP6743365B2 (ja) * 2014-10-28 2020-08-19 デクセリアルズ株式会社 異方性導電フィルム
JP6476747B2 (ja) * 2014-10-28 2019-03-06 デクセリアルズ株式会社 異方性導電フィルム及び接続構造体
JP6750205B2 (ja) * 2014-10-31 2020-09-02 デクセリアルズ株式会社 異方性導電フィルム
TWI785642B (zh) * 2014-11-17 2022-12-01 日商迪睿合股份有限公司 異向性導電膜及連接構造體
KR102018042B1 (ko) 2015-03-20 2019-09-04 데쿠세리아루즈 가부시키가이샤 이방 도전성 필름 및 접속 구조체
WO2016182586A1 (en) * 2015-05-14 2016-11-17 Trillion Science, Inc. Improved fixed array acfs with multi-tier partially embedded particle morphology and their manufacturing processes
ITUB20155111A1 (it) * 2015-11-04 2017-05-04 St Microelectronics Srl Dispositivo a semiconduttore e relativo procedimento
KR102535557B1 (ko) * 2016-03-07 2023-05-24 삼성디스플레이 주식회사 표시 장치 및 전자 디바이스
WO2017191781A1 (ja) * 2016-05-05 2017-11-09 デクセリアルズ株式会社 異方性導電フィルム
WO2017191772A1 (ja) 2016-05-05 2017-11-09 デクセリアルズ株式会社 フィラー配置フィルム
JP7119288B2 (ja) * 2016-05-05 2022-08-17 デクセリアルズ株式会社 フィラー配置フィルム
JP7274811B2 (ja) 2016-05-05 2023-05-17 デクセリアルズ株式会社 異方性導電フィルム
CN107914435B (zh) * 2016-10-10 2019-10-29 昆山雅森电子材料科技有限公司 一种多层异向导电胶膜及其制作方法
JP7035370B2 (ja) 2016-10-31 2022-03-15 デクセリアルズ株式会社 フィラー含有フィルム
WO2018079303A1 (ja) * 2016-10-31 2018-05-03 デクセリアルズ株式会社 フィラー含有フィルム
WO2018205127A1 (en) * 2017-05-09 2018-11-15 3M Innovative Properties Company Electrically conductive adhesive
CN107452438B (zh) 2017-07-27 2019-10-11 京东方科技集团股份有限公司 一种各向异性导电胶带及胶带卷、绑定结构及显示装置
JP2019029135A (ja) * 2017-07-27 2019-02-21 日立化成株式会社 異方性導電フィルム及びその製造方法、並びに接続構造体及びその製造方法
JP7062389B2 (ja) * 2017-08-23 2022-05-06 デクセリアルズ株式会社 異方性導電フィルム
TWI742163B (zh) * 2017-09-25 2021-10-11 優顯科技股份有限公司 對目標電路基板形成預導電陣列之方法、應用前述方法於目標電路基板形成導電結構之製程、目標電路基板之預導電陣列、以及目標電路基板之導電結構陣列
JP7321792B2 (ja) * 2019-06-26 2023-08-07 株式会社ジャパンディスプレイ 異方性導電膜及び表示装置
CN112111975B (zh) * 2020-09-21 2023-01-24 福建锐信新材料科技有限公司 贴附式环保合成革的制备工艺
KR20240049589A (ko) * 2021-09-29 2024-04-16 데쿠세리아루즈 가부시키가이샤 접속 필름의 제조 방법
WO2023054259A1 (ja) * 2021-09-29 2023-04-06 デクセリアルズ株式会社 フィラー含有フィルム
CN116120873A (zh) * 2021-11-15 2023-05-16 华为技术有限公司 颗粒的排列方法、各向异性功能胶膜的制造方法、功能性颗粒及其制造方法
WO2023189416A1 (ja) * 2022-03-31 2023-10-05 デクセリアルズ株式会社 導電フィルム、接続構造体及びその製造方法

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Publication number Priority date Publication date Assignee Title
AU612771B2 (en) * 1988-02-26 1991-07-18 Minnesota Mining And Manufacturing Company Electrically conductive pressure-sensitive adhesive tape
US5240761A (en) * 1988-08-29 1993-08-31 Minnesota Mining And Manufacturing Company Electrically conductive adhesive tape
DE69617738T2 (de) * 1995-09-25 2002-09-26 Minnesota Mining And Mfg. Co., Saint Paul Elektronischer zusammenbau mit klebstoff aus semikristallinem copolymer

Also Published As

Publication number Publication date
AU2454199A (en) 2000-01-17
KR20010053298A (ko) 2001-06-25
EP1093503A1 (de) 2001-04-25
US20010008169A1 (en) 2001-07-19
CN1307625A (zh) 2001-08-08
WO2000000563A1 (en) 2000-01-06
EP1093503B1 (de) 2002-10-02
JP2002519473A (ja) 2002-07-02

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