DE60012868D1 - Schaltungsplatte für Hochspannungseinsatz - Google Patents

Schaltungsplatte für Hochspannungseinsatz

Info

Publication number
DE60012868D1
DE60012868D1 DE60012868T DE60012868T DE60012868D1 DE 60012868 D1 DE60012868 D1 DE 60012868D1 DE 60012868 T DE60012868 T DE 60012868T DE 60012868 T DE60012868 T DE 60012868T DE 60012868 D1 DE60012868 D1 DE 60012868D1
Authority
DE
Germany
Prior art keywords
circuit board
high voltage
voltage use
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60012868T
Other languages
English (en)
Other versions
DE60012868T2 (de
Inventor
Junpei Kusukawa
Ryozo Takeuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE60012868D1 publication Critical patent/DE60012868D1/de
Application granted granted Critical
Publication of DE60012868T2 publication Critical patent/DE60012868T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/105—Using an electrical field; Special methods of applying an electric potential
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE60012868T 1999-12-20 2000-09-04 Schaltungsplatte für Hochspannungseinsatz Expired - Fee Related DE60012868T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP36035799A JP3849381B2 (ja) 1999-12-20 1999-12-20 絶縁回路基板の製造方法
JP36035799 1999-12-20

Publications (2)

Publication Number Publication Date
DE60012868D1 true DE60012868D1 (de) 2004-09-16
DE60012868T2 DE60012868T2 (de) 2005-08-18

Family

ID=18469062

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60012868T Expired - Fee Related DE60012868T2 (de) 1999-12-20 2000-09-04 Schaltungsplatte für Hochspannungseinsatz

Country Status (5)

Country Link
US (1) US6504110B1 (de)
EP (1) EP1111970B1 (de)
JP (1) JP3849381B2 (de)
DE (1) DE60012868T2 (de)
RU (1) RU2199794C2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10158185B4 (de) * 2000-12-20 2005-08-11 Semikron Elektronik Gmbh Leistungshalbleitermodul mit hoher Isolationsfestigkeit
JP4391391B2 (ja) * 2004-11-12 2009-12-24 大日本印刷株式会社 放射線検出器の製造方法
JP5542399B2 (ja) 2009-09-30 2014-07-09 株式会社日立製作所 絶縁回路基板およびそれを用いたパワー半導体装置、又はインバータモジュール
JP5829139B2 (ja) * 2012-02-03 2015-12-09 日東電工株式会社 配線回路基板およびその製造方法ならびに接続端子
JP2014120728A (ja) * 2012-12-19 2014-06-30 Fuji Electric Co Ltd 半導体装置およびその製造方法
JP6152681B2 (ja) * 2013-03-28 2017-06-28 三菱マテリアル株式会社 パワーモジュール用基板およびその製造方法
US9586279B2 (en) 2013-09-17 2017-03-07 Kangmin Hsia Method and system of surface polishing
JP6500565B2 (ja) * 2015-04-01 2019-04-17 富士電機株式会社 半導体モジュール
JP6898203B2 (ja) * 2017-10-27 2021-07-07 株式会社 日立パワーデバイス パワー半導体モジュール
JP6965706B2 (ja) * 2017-11-29 2021-11-10 三菱電機株式会社 半導体モジュール、その製造方法及び電力変換装置
JP7283038B2 (ja) * 2018-08-03 2023-05-30 富士電機株式会社 積層基板の製造方法、半導体モジュールの製造方法、並びに、積層基板、半導体モジュール
DE102020132808B4 (de) * 2020-12-09 2023-03-09 Schweizer Electronic Aktiengesellschaft Leiterplattenmodul, Leiterplatte, Kühlkörper und Wärmeleitelement
DE102021000469A1 (de) * 2021-01-30 2022-08-04 Rolls-Royce Deutschland Ltd & Co Kg Elektronische Vorrichtung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4129243A (en) * 1975-07-30 1978-12-12 General Electric Company Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof
US4630355A (en) * 1985-03-08 1986-12-23 Energy Conversion Devices, Inc. Electric circuits having repairable circuit lines and method of making the same
JPH0777989B2 (ja) * 1989-01-25 1995-08-23 同和鉱業株式会社 セラミックスと金属の接合体の製造法
US5340617A (en) * 1992-08-18 1994-08-23 International Business Machines Corporation Electrostatic patterning of multi-layer module lamina
JP3491414B2 (ja) * 1995-11-08 2004-01-26 三菱電機株式会社 回路基板
US5834321A (en) * 1995-12-18 1998-11-10 General Electric Company Low noise address line repair method for thin film imager devices

Also Published As

Publication number Publication date
EP1111970A2 (de) 2001-06-27
EP1111970B1 (de) 2004-08-11
US6504110B1 (en) 2003-01-07
EP1111970A3 (de) 2003-03-12
JP2001177054A (ja) 2001-06-29
RU2199794C2 (ru) 2003-02-27
DE60012868T2 (de) 2005-08-18
JP3849381B2 (ja) 2006-11-22

Similar Documents

Publication Publication Date Title
DE69942293D1 (de) Schaltkreis für Referenz-Spannungsversorgung
DE69938585D1 (de) Integrierte schaltungsanordnung
DE60128499D1 (de) Stromversorgungsgerät für elektronische Einheit
DE60043603D1 (de) Verbinder für gedruckte Leiterplatten
DE69922080D1 (de) Flexibele Schaltung
DE60039569D1 (de) Gedruckte Leiterplatte
DE60038839D1 (de) Schutzschaltung für Hochspannungsschalter
DE69909375D1 (de) Integrierte Schaltungsanordnung
DE60131485D1 (de) Leiterplatte
DE60012868D1 (de) Schaltungsplatte für Hochspannungseinsatz
DE60115593D1 (de) Referenzspannungserzeugungsschaltung
DE50010444D1 (de) Platine
DE59900215D1 (de) Referenzspannung-Erzeugungsschaltung
DE60026391D1 (de) Steckdose für elektronische Bauteile
DE60137310D1 (de) Leiterplatte
DK26798A (da) Elektrisk kredsløb
DE69912101D1 (de) Schaltungsanordnung
DE69939157D1 (de) Gedruckte Leiterplatte
DE60028934D1 (de) Schaltungsanordnung
DE60034971D1 (de) Fassung für elektronische Bauteile
DE59913873D1 (de) Fuselatch-Schaltung
ID29998A (id) Sirkuit pengubah frekuensi sinkron
DE59903853D1 (de) Elektronische schaltungsanordnung
DE60135761D1 (de) Versorgung für elektronische schaltkreise
DE59914352D1 (de) Referenzspannungsschaltung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee