JP5838321B2 - 太陽電池モジュールの製造方法 - Google Patents
太陽電池モジュールの製造方法 Download PDFInfo
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- JP5838321B2 JP5838321B2 JP2011118759A JP2011118759A JP5838321B2 JP 5838321 B2 JP5838321 B2 JP 5838321B2 JP 2011118759 A JP2011118759 A JP 2011118759A JP 2011118759 A JP2011118759 A JP 2011118759A JP 5838321 B2 JP5838321 B2 JP 5838321B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 229920005989 resin Polymers 0.000 claims description 96
- 239000011347 resin Substances 0.000 claims description 96
- 239000003566 sealing material Substances 0.000 claims description 72
- 239000000853 adhesive Substances 0.000 claims description 41
- 230000001070 adhesive effect Effects 0.000 claims description 41
- 230000009477 glass transition Effects 0.000 claims description 25
- 238000002844 melting Methods 0.000 claims description 23
- 230000008018 melting Effects 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 18
- 238000010030 laminating Methods 0.000 claims description 9
- 238000003475 lamination Methods 0.000 claims description 8
- 229920005672 polyolefin resin Polymers 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 150000003949 imides Chemical class 0.000 claims description 2
- 229920000554 ionomer Polymers 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims 1
- 229920000178 Acrylic resin Polymers 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- 239000000806 elastomer Substances 0.000 claims 1
- 229920005990 polystyrene resin Polymers 0.000 claims 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims 1
- 239000000463 material Substances 0.000 description 32
- 239000010408 film Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 9
- 239000008393 encapsulating agent Substances 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000010248 power generation Methods 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Photovoltaic Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
(太陽電池モジュール1の構成)
図1は、第1の実施形態に係る太陽電池モジュール1の略図的平面図である。図2は、図1の線II−IIにおける略図的断面図である。図3は、図1の線III−IIIにおける略図的断面図である。
次に、図4を主として参照しながら、太陽電池モジュール1の製造方法の一例について説明する。
図5は、第2の実施形態に係る太陽電池モジュール1aのx方向及びz方向に沿った略図的断面図である。
本実験例では、非架橋性の封止材14として、融点が120℃のポリエチレン(PE)を用いて上記実施形態に係る太陽電池モジュール1と実質的に同様の構成を有する太陽電池モジュールを作製した。なお、表1に示すように、樹脂接着剤15のガラス転移温度(TMA法により測定した値)を120℃〜150℃の範囲とした。
裏面保護部材13の中央部に50mm角のヒーターを置き、裏面保護部材13と接する封止材部14の温度が140℃になるまで加熱し、30分間保持した後に室温(25℃)まで冷却する工程を1サイクルとして10サイクル行った後の太陽電池10から配線材11がずれる発生率を求めた。
2…太陽電池ストリング
10…太陽電池
10a…受光面
10b…裏面
11…配線材
12…受光面保護部材
13…裏面保護部材
14…封止材
14a…第1の封止材部
14b…第2の封止材部
15…樹脂接着剤
21…第1の樹脂シート
22…第2の樹脂シート
23…積層体
Claims (5)
- 非架橋性樹脂を含む封止材と、前記封止材中に配された太陽電池ストリングとを備え、前記太陽電池ストリングが、複数の太陽電池と、前記複数の太陽電池を電気的に接続している配線材と、前記配線材と前記太陽電池とを接続している樹脂接着剤とを有する太陽電池モジュールの製造方法であって、
前記封止材の一部を構成するための第1の樹脂シートと、前記太陽電池ストリングと、前記封止材の他の一部を構成するための第2の樹脂シートとをこの順番で積層して積層体を作製する工程と、
前記積層体をラミネートすることにより前記第1及び第2の樹脂シートから前記樹脂接着剤のガラス転移温度より融点の低い前記非架橋性樹脂を含む封止材を構成し、前記太陽電池モジュールを得る工程と、
を備え、
前記積層体のラミネート時の前記封止材の温度を前記樹脂接着剤のガラス転移温度より低い温度でラミネートを行う、太陽電池モジュールの製造方法。 - 前記第1及び第2の樹脂シートのうちの少なくとも一方として、非架橋性樹脂を含む樹脂シートを用いる、請求項1に記載の太陽電池モジュールの製造方法。
- 前記樹脂接着剤は、エポキシ、アクリル、フェノール、ウレタン、及びイミドからなる群から選ばれた少なくともひとつの樹脂を含み、
前記封止材が、ポリオレフィン系樹脂、アイオノマー系樹脂、アクリル系樹脂、ポリスチレン系樹脂、ウレタン系樹脂及びエラストマー系樹脂からなる群から選ばれた少なくともひとつの非架橋性樹脂を含む、請求項1または2に記載の太陽電池モジュールの製造方法。 - 前記樹脂接着剤のガラス転移温度が前記封止材の融点よりも10℃以上高い、請求項1〜3のいずれか一項に記載の太陽電池モジュールの製造方法。
- 前記樹脂接着剤のガラス転移温度が140℃以上である、請求項1〜4のいずれか一項に記載の太陽電池モジュールの製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011118759A JP5838321B2 (ja) | 2011-05-27 | 2011-05-27 | 太陽電池モジュールの製造方法 |
PCT/JP2012/056892 WO2012165003A1 (ja) | 2011-05-27 | 2012-03-16 | 太陽電池モジュール及びその製造方法 |
EP12791968.6A EP2717328B1 (en) | 2011-05-27 | 2012-03-16 | Manufacturing method for a solar modul |
CN201280027127.1A CN103597610B (zh) | 2011-05-27 | 2012-03-16 | 太阳能电池组件及其制造方法 |
US14/082,602 US20140069487A1 (en) | 2011-05-27 | 2013-11-18 | Solar module and manufacturing method therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011118759A JP5838321B2 (ja) | 2011-05-27 | 2011-05-27 | 太陽電池モジュールの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012248654A JP2012248654A (ja) | 2012-12-13 |
JP5838321B2 true JP5838321B2 (ja) | 2016-01-06 |
Family
ID=47258869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011118759A Active JP5838321B2 (ja) | 2011-05-27 | 2011-05-27 | 太陽電池モジュールの製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20140069487A1 (ja) |
EP (1) | EP2717328B1 (ja) |
JP (1) | JP5838321B2 (ja) |
CN (1) | CN103597610B (ja) |
WO (1) | WO2012165003A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106206767B (zh) * | 2014-10-31 | 2019-01-11 | 比亚迪股份有限公司 | 太阳能电池单元、电池片阵列、电池组件及其制备方法 |
TW201909435A (zh) * | 2017-07-20 | 2019-03-01 | 財團法人工業技術研究院 | 太陽能光電模組 |
JP2021034659A (ja) * | 2019-08-28 | 2021-03-01 | パナソニック株式会社 | 太陽電池モジュール |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06334207A (ja) * | 1993-05-27 | 1994-12-02 | Canon Inc | 太陽電池モジュール |
US20010008169A1 (en) * | 1998-06-30 | 2001-07-19 | 3M Innovative Properties Company | Fine pitch anisotropic conductive adhesive |
JP2000349313A (ja) * | 1999-06-08 | 2000-12-15 | Kanegafuchi Chem Ind Co Ltd | 太陽電池モジュールの封止部材及び封止方法 |
AU770820B2 (en) * | 1999-06-08 | 2004-03-04 | Kaneka Corporation | Method of encapsulating a photovoltaic module by an encapsulating material and the photovoltaic module |
EP1560272B1 (en) * | 2004-01-29 | 2016-04-27 | Panasonic Intellectual Property Management Co., Ltd. | Solar cell module |
US8299350B2 (en) * | 2007-08-02 | 2012-10-30 | Sanyo Electric Co., Ltd. | Solar cell module and method for manufacturing the same |
JP5288790B2 (ja) * | 2007-08-02 | 2013-09-11 | 三洋電機株式会社 | 太陽電池モジュール及びその製造方法 |
JP5484663B2 (ja) * | 2007-09-25 | 2014-05-07 | 三洋電機株式会社 | 太陽電池モジュールの製造方法 |
KR101403282B1 (ko) * | 2007-10-05 | 2014-06-02 | 히타치가세이가부시끼가이샤 | 접착제 조성물 및 이것을 이용한 회로 접속 재료, 및 회로 부재의 접속 방법 및 회로 접속체 |
JPWO2009107804A1 (ja) * | 2008-02-28 | 2011-07-07 | 三洋電機株式会社 | 太陽電池モジュール |
JP2010024416A (ja) * | 2008-07-24 | 2010-02-04 | Sumitomo Electric Ind Ltd | 電極接続用接着剤 |
US20100065105A1 (en) * | 2008-09-12 | 2010-03-18 | Francois Andre Koran | Thin Film Photovoltaic Module Having a Contoured Substrate |
JP5436901B2 (ja) | 2009-03-23 | 2014-03-05 | 三洋電機株式会社 | 太陽電池モジュールの製造方法 |
JP5506295B2 (ja) * | 2009-08-28 | 2014-05-28 | 京セラ株式会社 | 太陽電池モジュールおよびその製造方法 |
JP2011054663A (ja) * | 2009-08-31 | 2011-03-17 | Sanyo Electric Co Ltd | 太陽電池モジュール |
-
2011
- 2011-05-27 JP JP2011118759A patent/JP5838321B2/ja active Active
-
2012
- 2012-03-16 CN CN201280027127.1A patent/CN103597610B/zh active Active
- 2012-03-16 EP EP12791968.6A patent/EP2717328B1/en active Active
- 2012-03-16 WO PCT/JP2012/056892 patent/WO2012165003A1/ja unknown
-
2013
- 2013-11-18 US US14/082,602 patent/US20140069487A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN103597610A (zh) | 2014-02-19 |
JP2012248654A (ja) | 2012-12-13 |
EP2717328B1 (en) | 2020-10-07 |
EP2717328A4 (en) | 2015-06-10 |
EP2717328A1 (en) | 2014-04-09 |
US20140069487A1 (en) | 2014-03-13 |
WO2012165003A1 (ja) | 2012-12-06 |
CN103597610B (zh) | 2016-01-20 |
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