CN101308711B - 多层结构异方向导电膜及其制备方法 - Google Patents
多层结构异方向导电膜及其制备方法 Download PDFInfo
- Publication number
- CN101308711B CN101308711B CN2008100668953A CN200810066895A CN101308711B CN 101308711 B CN101308711 B CN 101308711B CN 2008100668953 A CN2008100668953 A CN 2008100668953A CN 200810066895 A CN200810066895 A CN 200810066895A CN 101308711 B CN101308711 B CN 101308711B
- Authority
- CN
- China
- Prior art keywords
- hot melt
- temperature hot
- layer
- conducting particles
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title description 2
- 239000002245 particle Substances 0.000 claims abstract description 45
- 229920005989 resin Polymers 0.000 claims abstract description 38
- 239000011347 resin Substances 0.000 claims abstract description 38
- 229920001971 elastomer Polymers 0.000 claims abstract description 34
- 239000000178 monomer Substances 0.000 claims abstract description 25
- 239000011248 coating agent Substances 0.000 claims abstract description 22
- 238000000576 coating method Methods 0.000 claims abstract description 22
- 239000012943 hotmelt Substances 0.000 claims abstract description 22
- 239000000806 elastomer Substances 0.000 claims abstract description 15
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000203 mixture Substances 0.000 claims abstract description 7
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000001035 drying Methods 0.000 claims abstract description 3
- 239000000126 substance Substances 0.000 claims abstract description 3
- 229920001577 copolymer Polymers 0.000 claims description 18
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 17
- 238000006243 chemical reaction Methods 0.000 claims description 16
- -1 acrylic acid diethyl alcohol ester Chemical class 0.000 claims description 15
- INKDAKMSOSCDGL-UHFFFAOYSA-N [O].OC1=CC=CC=C1 Chemical compound [O].OC1=CC=CC=C1 INKDAKMSOSCDGL-UHFFFAOYSA-N 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims description 6
- 239000004843 novolac epoxy resin Substances 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- FUZZWVXGSFPDMH-UHFFFAOYSA-N n-hexanoic acid Natural products CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 239000012948 isocyanate Substances 0.000 claims description 3
- 150000002513 isocyanates Chemical class 0.000 claims description 3
- 239000010410 layer Substances 0.000 abstract description 30
- 239000004593 Epoxy Substances 0.000 abstract description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract 3
- 239000011247 coating layer Substances 0.000 abstract 2
- RWXMAAYKJDQVTF-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl prop-2-enoate Chemical compound OCCOCCOC(=O)C=C RWXMAAYKJDQVTF-UHFFFAOYSA-N 0.000 abstract 1
- VRICPVXYTCCWOE-UHFFFAOYSA-N [O]OC1=CC=CC=C1 Chemical compound [O]OC1=CC=CC=C1 VRICPVXYTCCWOE-UHFFFAOYSA-N 0.000 abstract 1
- 229920000800 acrylic rubber Polymers 0.000 abstract 1
- 229920003986 novolac Polymers 0.000 abstract 1
- 230000000704 physical effect Effects 0.000 abstract 1
- 229920000058 polyacrylate Polymers 0.000 abstract 1
- 238000011282 treatment Methods 0.000 abstract 1
- 238000003756 stirring Methods 0.000 description 36
- 239000012046 mixed solvent Substances 0.000 description 17
- 238000005096 rolling process Methods 0.000 description 14
- 238000002360 preparation method Methods 0.000 description 11
- 238000009413 insulation Methods 0.000 description 8
- 229920006267 polyester film Polymers 0.000 description 8
- 238000003860 storage Methods 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 6
- 238000012797 qualification Methods 0.000 description 6
- 238000004381 surface treatment Methods 0.000 description 6
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229920001195 polyisoprene Polymers 0.000 description 5
- 239000007787 solid Substances 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000007306 functionalization reaction Methods 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000003254 anti-foaming effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/254—Polymeric or resinous material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31909—Next to second addition polymer from unsaturated monomers
- Y10T428/31924—Including polyene monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31909—Next to second addition polymer from unsaturated monomers
- Y10T428/31928—Ester, halide or nitrile of addition polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
本发明公开一种具有功能性多层结构异方向导电膜，包括单体涂敷层、固化层、低温热熔性树脂层和导电粒子层，各层依次经涂布干燥而成；其中单体涂敷层包括：丙烯酸丁酯、丙烯酸甲酯、丙烯酸二乙醇酯、2-乙基过已酸四甲基丁酯的混合体；固化层包括长链咪唑衍生物；低温热熔性树脂层包括：酚氧、酚醛环氧树脂、丙烯酸酯橡胶、丙烯酸酯橡胶和丁苯橡胶混合弹性体；导电粒子层包括：直径3μm±0.05或3.25μm±0.05或3.50μm±0.05或3.75μm±0.05或4μm±0.05的导电粒子及低温热熔性微包树脂层。其化学性能、物理性能、电性能能满足0.18-0.13微米芯片与高密度COF线路邦定及封装连接要求。
Description
技术领域：
本发明是一种具有功能性多层结构异方向导电膜(ACAF)及其制备方法，属于共聚合物树脂制备。
技术背景：
随着电子器件的小型化、轻薄化，微细电路之间连接及微小器件与精密电路的搭载连接需求大大增加了对功能化连接材料的需求。对连接材料的功能化要求也越来越高，例如：要求使微细配线能与芯片直接搭载或绑定，要求连接材料在高密度组装上具有很大灵活性。异方向导电膜(ACF)就是由此应运而生的。目前，ACF总市场规模已经超过200多亿，成为LCD支持社会发展的一个重大要素。
在目前ACF开发中，一般采用异性导电胶膜(ACF)，线距和线宽在100微米左右，TAP、COG使用不同粘合剂树脂和偶联剂及硅粉填料，如JP03129607，JP08325543，JP0931419等。还有一些描述ACF的文献中叙述的制备方法是先在一个薄膜上刻上小坑，放上导电微球再涂胶，形成胶膜，如CN99807810.7，US5240761，US4113981，US5180888，US5240761，US4737112等。
高密度布线化、高速化连接、薄型组装化的需求都冀望集中于无打孔、无焊接先端组件上。而现有ACF的线宽在100微米左右已不能满足要求。因此，在芯片与玻璃基板芯片与高密度FPC及COF中带有功能性多层结构异方向导电膜ACAF具有一定的重要性，如何选择最佳工艺方法，最佳材料配制，形成性能优异、成本低廉与半导芯片技术同步的ACAF是重要的技术课题。开发功能性多层结构ACAF有利于LCD市场更加扩大化。
虽然在现有技术中，ACF中也有多层和两层ACF，但它是采用分层粘胶剂方式，如JP2001171033，第一层第二层用比例不同的树脂进行涂胶形成胶膜；又如在特许200178511中，则是进行涂胶四次，一层是多层异方导电接着剂，二层是绝缘层，三层是异方导电接着剂，四层是绝缘层，形成多层异方向导电膜(ACF)。这种工艺仍不能达到10微米的线宽和线距水平。
发明内容：
本发明的目的是为了解决微线宽线距(如0.18微米)芯片与高密度COF绑定与封装问题，能使10微米微细电极空间保证很高的绝缘性。
为了实现上述目的，本发明提出一种具有功能性多层结构异方向导电膜(ACAF)及其制造方法，该ACAF包括单体涂敷层、固化层、低温热熔性树脂层和导电粒子层，各层按导电粒子层、低温热熔性树脂层、固化层、单体涂敷层的次序依次经涂布干燥而成；其中单体涂敷层包括：由丙烯酸丁酯、丙烯酸甲酯、丙烯酸二乙醇酯、2-乙基过己酸四甲基丁酯制备得到的共聚合物；固化层包括长链咪唑衍生物；低温热熔性树脂层包括下述物质反应得到的聚合物：酚氧、酚醛环氧树脂、丙烯酸酯橡胶以及丙烯酸酯橡胶和丁苯橡胶混合弹性体；导电粒子层包括：直径3.00μm±0.05、3.25μm±0.05、3.50μm±0.05、3.75μm±0.05或4.00μm±0.05的导电粒子及包覆该粒子的低温热熔性微包树脂层。
本发明中导电粒子可以采用米克罗珀尔(商标号)AV导电粒子。
本发明所述低温热熔性树脂层中各成份的具体物质及含量为：酚氧为YP-70，重量份为10-30；酚醛环氧树脂为F-55、F-51或F-44重量份为10-20；丙烯酸酯橡胶体积密度0.48±0.1g/cc，挥发性＜1.0％，Tg-30℃，溶液粘度(mpa S25℃5000-10000)；丙烯酸酯橡胶重量份为10-20；混合弹性体中的丁苯橡胶弹性体为SBR1502，生胶门尼粘度ML100℃(1+4)45-55，300％定伸mpa(35分)14.1-18.6，拉伸强度mpa(35分)＞23.7，扯断伸长率％(35分)＞415，混合弹性体的重量份为5-10，长链咪唑衍生物由2，4-二氨基-6-[-2-十一烷基咪唑基(1)]-乙基顺式三唪、1-氰乙基-2-十一烷基-偏苯三酸咪唑盐、异氰酸酯衍生物反应得到，重量份为0.75-5。
导电粒子含量为每500份导电膜总重量中包含30-40重量份粒子。
混合溶剂可以采用甲苯/乙酸乙酯(重量比4∶6)，配成固含量为20wt％-40wt％溶液。
本发明所述单体是调整ACAF表面涂层稠性，根据不同芯片CHIP调整柔软度，硬度以及预压固化时间的快和慢，该共聚物可依据单体成分组合，耐性因子适合用于其它树脂溶液聚合，因具有分子量分布范围小、低聚物残留物和不纯物少的特长，通过引入官能基，与异氰酸酯、环氧并用，改善粘结性，提高ACAF膜强度耐溶剂性及耐湿性，防起泡，所述单体为丙烯酸丁酯，丙烯酸甲酯，丙烯酸乙醇酯，2-乙基过己酸四甲基丁酯(引发剂)，重量比根据芯片要求比例为7∶3∶2∶1。
本发明所述长链咪唑衍生物，是通过2，4-二氨基-6-[-2-十一烷基咪唑基(1)-乙基顺式三唪与1-氰乙基-2-十一烷基-编苯三酸咪唑盐，重量比1∶1进行反应3小时，取反应产物30重量份加温至50℃加入甲苯-2，4-二异氰酸酯0.8重量份和混合溶剂60重量份，反应时间为5小时，得到长链咪唑衍生物。因含长碳链已具备潜伏性，有长贮存期，通过微包伏可具有在一定温度一定时间快速固化的功能。
本发明所述弹性体是丙烯酸酯橡胶和丁苯橡胶(SBR1502)按重量比10∶5混合后再按重量比例＝1∶0.2∶0.3通过物理方法混合微量偏碱性补强剂白炭黑、硅烷偶联剂季铵盐，进行混炼来提高弹性体热老化性能，丙烯酸酯橡胶是作为丙烯酸冲击改性剂提高冲击强度，高热稳定性和耐气候性，其优良的可加工性、坚硬度和保持力，使ACAF树脂具有低弹性率将应力缓冲的同时提高粘度，增加导电粒子在加入树脂溶液中介面影响使导电粒子均匀分布。
本发明工艺过程采用悬浊聚合法制造共聚合物。按上述配方在反应器加入处理好的酚氧、酚醛环氧树脂、混合溶剂的溶液搅拌溶解再加入弹性体混合树脂，在搅拌装置混合搅拌，加入丙烯酸酯橡胶、混合溶剂溶解搅拌，等待聚合物粘度自然缩小一定范围到不再聚合时即得到低温热熔性树脂层涂布用备用物。
再按上述配方加长链咪唑衍生物，在搅拌装置搅拌，通过搅拌装置点数法搅拌后得到固化层涂布用备用物。
按上述配方在反应器加入单体混合溶液，在引发剂2-乙基过己酸四甲基丁酯引发下制备共聚合物再搅拌消泡，得到单体层涂布用备用物。
再用米克罗珀尔AV导电粒子和低温热熔性微包树脂，制备导电粒子层涂布用备用物。
然后依次进行分层涂布，涂布温度100℃-135℃，通过8分钟时间将全部四层涂布到表面处理的乳白聚酯薄膜上，用分离膜隔离进行收卷，分切，复卷，收卷得到ACAF。
本发明ACAF搅拌装置是采用自己发明三动多自由度搅拌装置(申请专利号200310111757)装置设置捕捉定位搅拌，根据聚合物粘度分散导电粒子平均分布粒度，可以自动点数测定粘度，能使聚合物热熔性树脂、弹性体树脂、单体混合溶液、导电粒子悬糊分布均匀，能在ACAF表面层形成稠面层，得到满足具有功能性多层结构ACAF连接材料。
本发明的多层结构异方向异电膜可实现液晶驱动IC直接连接高密度FPC线路接合安装，使COF、TAB、COG芯片集成化、小型化，芯片焊脚在0.18微米线距线宽，有着高完好率，树脂热固化收缩、定位偏位、线路短路、芯片损伤能满足要求，是一种微电子封装与绑定、功能连接制备技术。
本多层结构ACAF能使显示器、半导体、CHIP与FPC基板间的接线宽度和线距在10微米水平，作为低温可连接材料，存在无铅环保等优点，成为调整环境型的组装材料的先驱；将使IC卡、高频率领域的检测、遥感射频电子标签更加功能化、便捷化。
本ACAF与导线间的连接，其电阻接续就成为突起电极与电路的连接，可在很大程度上减小所需电极接触面面积，而在微小的突起电极上可捕捉到足够的导电粒子来保证导通，并且确保各电极的绝缘性，对于细间距连接，分离了粘接、绝缘和导电功能。在异方向导电构成与突起电极的导电粒子数量成正比，ACAF多结构的异方导电膜其粘接层与导电粒子层处于分层状态，而分离了粘接、绝缘及导电功能，与其它ACF相比起来，导电粒子效率高，电极捕捉率很高，电极空间流出的导电粒子很少，因ACAF在芯片与基板间热膨胀系数之差，所产生的机械内应力，可利用树脂低弹性率将内应力缓冲的同时提高粘度，使连接的灵敏度高，无需打孔，无铅无卤素，无焊料，可用作多层组件。
实施方式：
下面通过具体的实施例作进一步描述。
本发明共聚合物基本配方如下：(重量配比)
酚氧YP-70树脂10-30份
酚醛F-55、F-51或F-44环氧树脂10-20份
丙烯酸酯橡胶10-20份
橡胶弹性体树脂5-10份
长链咪唑衍生物0.75-5份
单体每500份总重量中包含5-10份
导电粒子每500份总重量中包含30-40份
混合溶剂，甲苯/乙酸乙酯(4∶6重量比)配成固含量为20％-40％的溶液。
导电粒子加入溶液密度1.2g/cm3
溶液粘度5000-10000(mpa S 25℃)
实施例1
将酚氧YP-70重量20份加入混合溶剂200份，在反应盆搅拌溶解再加入酚醛混合树脂15份，等搅拌完全溶解后，加入橡胶弹性混合树脂5份，继续搅拌溶解，加入丙烯酸酯橡胶20份，混合溶剂200份溶解搅拌，备用。
在反应盆加入3份长链咪唑衍生物，进行加热温度50℃搅拌2小时后备用。
按待备共聚合物重量比，再制备5μm导电粒子30份，将低温热熔性微包树脂通过搅拌装置点数法搅拌后再加入导电粒子备用。
以及制备混合单体溶液10份(共聚合物10％计)备用。
上述各备用物分别是通过三动多自由度搅拌装置，搅拌均匀。
然后进行逐层涂布表面处理的乳白聚酯薄膜上，涂布温度100-130-120℃，时间6-8分钟，收卷到表面处理乳白聚酯薄膜上进行分切，复卷收卷宽0.03mm-0.015mm宽，长50米/卷ACAF。
根据同上基本配方得到分切后FOG系列ACAF：
型号：DBL SOFG200产品FOG
厚度：20μm
长度：50/100m/roll
宽度：1.5mm
导电粒子材质：表面镀金粒子
导电粒子密度：48 10k/mm3
最小间距能力：50 pitch
预压条件：
温度85℃±5℃
压力：1.2mpa
时间：2秒
本压条件：
温度：187℃
压力：0.13mPa
时间：18秒
获得满足FOG结果：
导通阻抗：1.2Ω
绝缘阻抗：1012
接合强度：60N/m
储存时间：7月/-10-5℃
合格率：99％
实施例2
将酚氧YP-70重量20份加入混合溶剂200份，在反应盆搅拌溶解再加入酚醛混合树脂15份，等搅拌完全溶解后，加入橡胶弹性混合树脂5份，继续搅拌溶解，加入丙烯酸酯橡胶20份，混合溶剂200份溶解搅拌，备用。
在反应盆中加入3份咪唑衍生物，进行加热温度50℃搅拌2小时后备用。
按待备共聚合物重量比，再制备4μm导电粒子30份，利用低温热熔性微包树脂包覆备用。
以及制备混合单体溶液10份(共聚合物20％计)备用。
上述各备用物分别通过三动多自由度搅拌装置，搅拌均匀。
然后进行逐层涂布，涂布温度100-130-120℃，时间6-8分钟，收卷到表面处理乳白聚酯薄膜上进行分切，复卷收卷宽0.03mm-0.015mm宽，长50米/卷ACAF。
根据同上基本配方调整单体溶液得到分切后COF系列ACAF。
型号：DBL-40CT产品COF
厚度：23μm
长度：50/100m/roll
宽度：1.5-6mm
导电粒子大小：4μm
导电粒子密度：130 10k/mm3
最小间距能力：30pitch
预压条件：
温度85℃±5℃
压力：1mpa
时间：5秒
本压条件：
温度：205℃
压力：50mPa
时间：16秒
获得满足COF要求结果：
导通阻抗：＞0.2Ω
绝缘阻抗：1012
接合强度：60N/m
储存时间：6月/-10-5℃
合格率：99％
实施例3
将酚氧YP-70重量20份加入混合溶剂200份，在反应盆搅拌溶解再加入酚醛混合树脂1 5份，等搅拌完全溶解后，加入橡胶弹性混合树脂5份，继续搅拌溶解，加入丙烯酸酯橡胶20份，混合溶剂200份溶解搅拌，备用。
在反应盆中加入3份咪唑衍生物，进行加热温度50℃搅拌2小时后备用。
按待备共聚合物重量比，再制备3μm导电粒子30份，利用低温热熔性微包树脂包覆备用。
以及制备混合单体溶液10份(共聚合物30％计)备用。
上述各备用物分别通过三动多自由度搅拌装置，搅拌均匀。
然后进行逐层涂布，涂布温度100-130-120℃，时间6-8分钟，收卷到表面处理乳白聚酯薄膜上进行分切，复卷收卷宽0.03mm-0.015mm宽，长50米/卷ACAF。
根据同上基本配方调整单体溶液得到分切后COG系列ACAF。
型号：DBL-30CG产品COG
厚度：30μm
长度：50/100m/roll
宽度：1.5mm
导电粒子大小：3μm
导电粒子密度：180 10k/mm3
最小间距能力：15μm-20μm
预压条件：
温度80℃±5℃
压力：1mpa
时间：3秒
本压条件：
温度：210℃
压力：60mPa
时间：19秒
获得满足COG要求结果：
导通阻抗：＞0.1Ω
绝缘阻抗：1012
接合强度：60N/m
储存时间：5月/-10-5℃
合格率：99％
比较例1
将酚氧YP-70重量20份加入混合溶剂200份，在反应盆搅拌溶解再加入酚醛混合树脂15份，搅拌溶解，加入丙烯酸脂橡胶20份，混合溶剂200份溶解搅拌，备用。
在反应盆中加入3份咪唑衍生物，进行加热温度50℃搅拌2小时后备用。
按待备共聚合物重量比，再制备5μm导电粒子30份，利用低温热熔性微包树脂包覆备用。
以及制备混合单体溶液10份(共聚合物10％计)备用。
上述备用物分别通过三动多自由度搅拌装置，搅拌均匀。
然后逐层进行涂布，涂布温度100-130-120℃，时间6-8分钟，收卷到表面处理乳白聚酯薄膜上进行分切，复卷收卷宽0.03mm-0.015mm宽，长50米/卷ACAF。
在以上基本配方中去除丁苯橡胶弹性体，调整单体溶液得到分切后FOG系列ACAF。
型号：DBL SOFG200产品FOG
厚度：20μm
长度：50/100m/roll
宽度：1.5mm
导电粒子材质：导金
导电粒子密度：48 10k/mm3
最小间距能力：50 pitch
预压条件：
温度85℃±5℃
压力：1.2mpa
时间：2秒
本压条件：
温度：187℃
压力：0.13mPa
时间：18秒
获得结果：
导通阻抗：1.0Ω
绝缘阻抗：1011
接合强度：30N/m
储存时间：5月/-10-5℃
合格率：30％
比较例2
将酚氧YP-70重量20份加入混合溶剂200份，在反应盆搅拌溶解再加入酚醛混合树脂15份，等搅拌完全溶解后，加入橡胶弹性混合树脂5份，继续搅拌溶解，加入丙烯酸酯橡胶20份，混合溶剂200份溶解搅拌备用。
在反应盆中加入3份咪唑衍生物，进行加热温度50℃搅拌2小时后备用。
按待备共聚合物重量比，再制备4μm导电粒子30份，利用低温热熔性微包树脂包覆备用。
上述各备用物通过三动多自由度搅拌装置，搅拌均匀。
然后逐层进行涂布，涂布温度100-130-120℃，时间6-8分钟，收卷到表面处理乳白聚酯薄膜上进行分切，复卷收卷宽0.03mm-0.015mm宽，长50米/卷ACAF。
在以上基本配方中去除单体溶液，得到分切后COF系列ACAF。
型号：DBL-40CT产品COF
厚度：23μm
长度：50/100m/roll
宽度：1.5-6mm
导电粒子大小：4 μm
导电粒子密度：130 10k/mm3
最小间距能力：30 pitch
预压条件：
温度85℃±5℃
压力：1mpa
时间：5秒
本压条件：
温度：205℃
压力：1mPa
时间：5秒
获得COF结果：
导通阻抗：＞0.7Ω
绝缘阻抗：108
接合强度：40N/m
储存时间：5月/-10-5℃
合格率： 90％
比较例3
将酚氧YP-70重量20份加入混合溶剂200份，在反应盆搅拌溶解再加入酚醛混合树脂15份，等搅拌完全溶解后，加入橡胶弹性混合树脂5份，继续搅拌溶解，加入混合溶剂200份溶解搅拌备用。
在反应盆中加入3份咪唑衍生物，进行加热温度50℃搅拌2小时后备用。
按待备共聚合物重量比，再制备3μm导电粒子30份，利用低温热熔性微包树脂包覆备用。
以及制备混合单体溶液10份(共聚合物30％计)备用。
上述各备用物分别通过三动多自由度搅拌装置，搅拌均匀。
然后逐层进行涂布，涂布温度100-130-120℃，时间6-8分钟，收卷到表面处理乳白聚酯薄膜上进行分切，复卷收卷宽0.03mm-0.015mm宽，长50米/卷ACAF。
在以上基本配方中去除丙烯酸酯橡胶，调整单体溶液得到分切后COG系列ACAF。
型号：DBL-30CG产品COG
厚度：30μm
长度：50/100m/roll
宽度：1.5mm
导电粒子大小：3μm
导电粒子密度：180 10k/mm3
最小间距能力：15μm-20μm
预压条件：
温度85℃±5℃
压力：1mpa
时间：3秒
本压条件：
温度：210℃
压力：60mPa
时间：19秒
获得COG结果：
导通阻抗：＞0.1Ω
绝缘阻抗：1011
接合强度：10N/m
储存时间：7天/-10-5℃
合格率：0
Claims (3)
1.一种具有功能性多层结构异方向导电膜，其特征是：包括单体涂敷层、固化层、低温热熔性树脂层和导电粒子层，各层按导电粒子层、低温热熔性树脂层、固化层、单体涂敷层的次序依次经涂布干燥而成；其中单体涂敷层涂布用备用物包括：由丙烯酸丁酯、丙烯酸甲酯、丙烯酸二乙醇酯、2-乙基过己酸四甲基丁酯制备得到的共聚合物；固化层涂布用备用物包括长链咪唑衍生物；低温热熔性树脂层涂布用备用物包括下述物质反应得到的聚合物：酚氧、酚醛环氧树脂、丙烯酸酯橡胶以及丙烯酸酯橡胶和丁苯橡胶混合弹性体；导电粒子层涂布用备用物包括：直径3.00μm±0.05、3.25μm±0.05、3.50μm±0.05、3.75μm±0.05或4.00μm±0.05的导电粒子及包覆该粒子的低温热熔性微包树脂层。
2.如权利要求1所述的具有功能性多层结构异方向导电膜，其特征是：所述低温热熔性树脂层中各成份的具体物质及含量为：
酚氧为YP-70，重量份为10-30；
酚醛环氧树脂为F-55、F-51或F-44，重量份为10-20；
丙烯酸酯橡胶体积密度0.48±0.1g/cc，挥发性＜1.0％，Tg-30℃，重量份为10-20；
混合弹性体中的丁苯橡胶弹性体为SBR1502，混合弹性体的重量份为5-10；
所述固化层中的长链咪唑衍生物由2，4-二氨基-6-[-2-十一烷基咪唑基(1)]-乙基顺式三唪、1-氰乙基-2-十一烷基-偏苯三酸咪唑盐、异氰酸酯衍生物反应得到，重量份为0.75-5。
3.如权利要求1或2所述的具有功能性多层结构异方向导电膜，其特征是：所述导电粒子含量为每500份导电膜总重量中包含30-40重量份粒子。
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100668953A CN101308711B (zh) | 2008-04-29 | 2008-04-29 | 多层结构异方向导电膜及其制备方法 |
| US12/137,868 US8241750B2 (en) | 2008-04-29 | 2008-06-12 | Functional multilayer anisotropic conductive adhesive laminate |
| US13/547,075 US8420177B2 (en) | 2008-04-29 | 2012-07-12 | Method for preparing functional multilayer anisotropic conductive adhesive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100668953A CN101308711B (zh) | 2008-04-29 | 2008-04-29 | 多层结构异方向导电膜及其制备方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101308711A CN101308711A (zh) | 2008-11-19 |
| CN101308711B true CN101308711B (zh) | 2010-11-10 |
Family
ID=40125093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100668953A Expired - Fee Related CN101308711B (zh) | 2008-04-29 | 2008-04-29 | 多层结构异方向导电膜及其制备方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US8241750B2 (zh) |
| CN (1) | CN101308711B (zh) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8518304B1 (en) | 2003-03-31 | 2013-08-27 | The Research Foundation Of State University Of New York | Nano-structure enhancements for anisotropic conductive material and thermal interposers |
| US8063315B2 (en) | 2005-10-06 | 2011-11-22 | Endicott Interconnect Technologies, Inc. | Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate |
| KR101138799B1 (ko) * | 2009-08-20 | 2012-04-24 | 제일모직주식회사 | 이방 도전성 필름용 조성물 |
| KR101594483B1 (ko) * | 2013-10-18 | 2016-02-16 | 제일모직주식회사 | 인체에 무해한 이방 도전성 필름용 조성물, 이방 도전성 필름, 및 상기 필름에 의해 접속된 디스플레이 장치 |
| TWI508258B (zh) * | 2013-12-19 | 2015-11-11 | 矽品精密工業股份有限公司 | 半導體封裝件及其製法 |
| CN109755144A (zh) * | 2017-11-07 | 2019-05-14 | 山东浪潮华光光电子股份有限公司 | 一种提高GaN基LED芯片外观良率的测试方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4113981A (en) | 1974-08-14 | 1978-09-12 | Kabushiki Kaisha Seikosha | Electrically conductive adhesive connecting arrays of conductors |
| US4737112A (en) | 1986-09-05 | 1988-04-12 | American Telephone And Telegraph Company, At&T Bell Laboratories | Anisotropically conductive composite medium |
| US5240761A (en) * | 1988-08-29 | 1993-08-31 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive tape |
| US5180888A (en) | 1989-08-10 | 1993-01-19 | Casio Computer Co., Ltd. | Conductive bonding agent and a conductive connecting method |
| JPH03129607A (ja) | 1989-10-14 | 1991-06-03 | Sony Chem Corp | 異方性導電膜 |
| JPH08325543A (ja) | 1995-06-05 | 1996-12-10 | Soken Chem & Eng Co Ltd | 異方導電性接着剤 |
| JP2905121B2 (ja) | 1995-07-19 | 1999-06-14 | ソニーケミカル株式会社 | 異方性導電接着フィルム |
| JP3678547B2 (ja) | 1997-07-24 | 2005-08-03 | ソニーケミカル株式会社 | 多層異方導電性接着剤およびその製造方法 |
| US20010008169A1 (en) * | 1998-06-30 | 2001-07-19 | 3M Innovative Properties Company | Fine pitch anisotropic conductive adhesive |
| JP3680669B2 (ja) | 1999-12-17 | 2005-08-10 | ソニーケミカル株式会社 | 多層異方性導電膜積層体 |
| US6699351B2 (en) * | 2000-03-24 | 2004-03-02 | 3M Innovative Properties Company | Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it |
| JPWO2004034147A1 (ja) * | 2002-10-08 | 2006-02-09 | 日立化成工業株式会社 | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板 |
| CN1605381A (zh) * | 2003-10-09 | 2005-04-13 | 深圳丹邦科技有限公司 | 三动多自由度搅拌装置 |
| JP2008537338A (ja) * | 2005-04-11 | 2008-09-11 | スリーエム イノベイティブ プロパティズ カンパニー | 導電性物品の接続方法、及び当該接続方法により接続された部品を備えた電気又は電子構成要素 |
| KR100673778B1 (ko) * | 2005-08-19 | 2007-01-24 | 제일모직주식회사 | 저온 속경화형 이방성 도전 필름용 조성물, 그로부터제조된 이방성 도전 필름 및 그 제조방법 |
-
2008
- 2008-04-29 CN CN2008100668953A patent/CN101308711B/zh not_active Expired - Fee Related
- 2008-06-12 US US12/137,868 patent/US8241750B2/en active Active
-
2012
- 2012-07-12 US US13/547,075 patent/US8420177B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US8241750B2 (en) | 2012-08-14 |
| US20090269574A1 (en) | 2009-10-29 |
| US8420177B2 (en) | 2013-04-16 |
| US20120276284A1 (en) | 2012-11-01 |
| CN101308711A (zh) | 2008-11-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100671312B1 (ko) | 배선단자 접속용 필름 | |
| CN101308711B (zh) | 多层结构异方向导电膜及其制备方法 | |
| JP3885896B2 (ja) | 補修可能な電極接続用接着剤組成物および該組成物からなる電極接続用接続部材 | |
| KR100827535B1 (ko) | 실란 변성 에폭시 수지를 사용하는 이방 도전성 접착제조성물 및 이를 이용한 접착필름 | |
| WO2001015505A1 (en) | Wiring-connecting material and process for producing circuit board with the same | |
| CN102850982A (zh) | 粘接剂组合物和使用该组合物的电路连接膜，以及电路部件的连接方法和电路连接体 | |
| JP5337034B2 (ja) | 接着剤及び接合体 | |
| US8766443B2 (en) | Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device bonded by the same | |
| CN103351838A (zh) | 粘接剂组合物、连接结构体、连接结构体的制造方法以及粘接剂组合物的应用 | |
| JP4872949B2 (ja) | 回路接続材料及びそれを用いた回路部材の接続構造 | |
| KR20130057151A (ko) | 이방 전도성 조성물 및 필름 | |
| US20070298241A1 (en) | Multi-layered anisotropic conduction action film and preparing method thereof | |
| JP2002327162A (ja) | 異方導電性接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 | |
| JPH09143252A (ja) | 回路用接続部材 | |
| JP3947532B2 (ja) | 異方導電性接着剤フィルム | |
| US9263372B2 (en) | Anisotropic conductive film and semiconductor device | |
| JP4730215B2 (ja) | 異方導電性接着剤フィルム | |
| JP2009001661A (ja) | 接着剤及び接合体 | |
| CN110461982B (zh) | 粘接剂组合物及结构体 | |
| KR100756799B1 (ko) | 용융점이 서로 다른 두 가지 이상의 경화제를 포함하는 이방 도전성 접착제용 조성물 | |
| JP4055583B2 (ja) | 回路接続用接着剤組成物、これを用いた回路端子の接続方法及び回路端子の接続構造 | |
| JP2009161684A (ja) | 回路接続用接着剤組成物、この接着剤組成物用いた回路部材の接続構造及び回路部材の接続方法 | |
| KR100776131B1 (ko) | 열가소성 수지를 이용한 복층 구조의 이방 도전성 접착필름 | |
| JP4491873B2 (ja) | 異方性導電フィルム | |
| JP5868823B2 (ja) | 異方導電フィルム |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20090327 Address after: Guangdong province Shenzhen city Nanshan District high tech Industrial Park North Lang mountain road danbang Technology Building Post encoding: 518052 Applicant after: Shenzhen Danbang Investment Co.,Ltd. Address before: Guangdong city of Shenzhen province high tech Industrial Park North Long Hill Road danbang Technology Building Post encoding: 518052 Applicant before: Liu Ping |
|
| ASS | Succession or assignment of patent right |
Owner name: DANBANG INVESTMENT CO., LTD., SHENZHEN CITY Free format text: FORMER OWNER: LIU PING Effective date: 20090327 |
|
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN DIANBANG SCIENCE + TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SHENZHEN DANBANG INVESTMENT GROUP CO.,LTD. Effective date: 20091002 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20091002 Address after: Guangdong province Shenzhen city Nanshan District high tech Industrial Park North Lang mountain road danbang Technology Building Post encoding: 518052 Applicant after: SHENZHEN DIANBOND TECHNOLOGY Co.,Ltd. Address before: Guangdong province Shenzhen city Nanshan District high tech Industrial Park North Lang mountain road danbang Technology Building Post encoding: 518052 Applicant before: SHENZHEN DANBANG INVESTMENT GROUP Co.,Ltd. |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: GUANGDONG DONGBANG TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SHENZHEN DIANBANG SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20110513 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518052 DANBANG TECHNOLOGY BUILDING, LANGSHAN 1ST ROAD, NORTH AREA, HIGH-TECH. INDUSTRIAL PARK, NANSHAN DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE TO: 523808 AREA C, BEIBU INDUSTRIAL CITY, SONGSHANHU SCIENCE + TECHNOLOGY INDUSTRIAL PARK, DONGGUAN CITY, GUANGDONG |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20110513 Address after: 523808, industrial zone, Songshan Industrial Park, Songshan District, Guangdong, Dongguan Patentee after: GUANG DONG DONGBOND TECHNOLOGY Co.,Ltd. Address before: 518052 Guangdong city of Shenzhen province Nanshan District high tech Industrial Park North Lang mountain road danbang Technology Building Patentee before: SHENZHEN DIANBOND TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211008 Address after: 518000 northwest 2nd floor, 5th floor and 6th floor, danbang science and technology building, Langshan 1st Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN DIANBOND TECHNOLOGY Co.,Ltd. Address before: 523808 Zone C, northern industrial city, Songshanhu science and Technology Industrial Park, Dongguan City, Guangdong Province Patentee before: GUANG DONG DONGBOND TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220805 Address after: 523000 Songshan Lake Science and Technology Industrial Park, Dongguan City, Guangdong Province Patentee after: GUANG DONG DONGBOND TECHNOLOGY Co.,Ltd. Address before: 518000 northwest 2nd floor, 5th floor and 6th floor, danbang science and technology building, Langshan 1st Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN DIANBOND TECHNOLOGY Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101110 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |