DE3685709D1 - Substratstruktur zur herstellung einer halbleiterverbundanordnung. - Google Patents
Substratstruktur zur herstellung einer halbleiterverbundanordnung.Info
- Publication number
- DE3685709D1 DE3685709D1 DE8686113185T DE3685709T DE3685709D1 DE 3685709 D1 DE3685709 D1 DE 3685709D1 DE 8686113185 T DE8686113185 T DE 8686113185T DE 3685709 T DE3685709 T DE 3685709T DE 3685709 D1 DE3685709 D1 DE 3685709D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- substrate structure
- connector arrangement
- semiconductor connector
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76294—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using selective deposition of single crystal silicon, i.e. SEG techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
- H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
- H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
- H01L21/76275—Vertical isolation by bonding techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
- H01L21/76278—Vertical isolation by selective deposition of single crystal silicon, i.e. SEG techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
- H01L21/76286—Lateral isolation by refilling of trenches with polycristalline material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/012—Bonding, e.g. electrostatic for strain gauges
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/135—Removal of substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Element Separation (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60214853A JPS6276645A (ja) | 1985-09-30 | 1985-09-30 | 複合半導体結晶体構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3685709D1 true DE3685709D1 (de) | 1992-07-23 |
DE3685709T2 DE3685709T2 (de) | 1993-01-28 |
Family
ID=16662628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686113185T Expired - Lifetime DE3685709T2 (de) | 1985-09-30 | 1986-09-25 | Substratstruktur zur herstellung einer halbleiterverbundanordnung. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4948748A (de) |
EP (1) | EP0217288B1 (de) |
JP (1) | JPS6276645A (de) |
DE (1) | DE3685709T2 (de) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5138422A (en) * | 1987-10-27 | 1992-08-11 | Nippondenso Co., Ltd. | Semiconductor device which includes multiple isolated semiconductor segments on one chip |
JPH01125858A (ja) * | 1987-11-10 | 1989-05-18 | Fujitsu Ltd | 半導体装置およびその製造方法 |
JPH01179342A (ja) * | 1988-01-05 | 1989-07-17 | Toshiba Corp | 複合半導体結晶体 |
US5332920A (en) * | 1988-02-08 | 1994-07-26 | Kabushiki Kaisha Toshiba | Dielectrically isolated high and low voltage substrate regions |
US5049968A (en) * | 1988-02-08 | 1991-09-17 | Kabushiki Kaisha Toshiba | Dielectrically isolated substrate and semiconductor device using the same |
JP2788269B2 (ja) * | 1988-02-08 | 1998-08-20 | 株式会社東芝 | 半導体装置およびその製造方法 |
JP2685819B2 (ja) * | 1988-03-31 | 1997-12-03 | 株式会社東芝 | 誘電体分離半導体基板とその製造方法 |
JP2763107B2 (ja) * | 1988-05-30 | 1998-06-11 | 株式会社東芝 | 誘電体分離半導体基板およびその製造方法 |
US4910164A (en) * | 1988-07-27 | 1990-03-20 | Texas Instruments Incorporated | Method of making planarized heterostructures using selective epitaxial growth |
US4989063A (en) * | 1988-12-09 | 1991-01-29 | The United States Of America As Represented By The Secretary Of The Air Force | Hybrid wafer scale microcircuit integration |
JPH0775243B2 (ja) * | 1989-02-22 | 1995-08-09 | 株式会社東芝 | 半導体装置の製造方法 |
US4908328A (en) * | 1989-06-06 | 1990-03-13 | National Semiconductor Corporation | High voltage power IC process |
JPH0824162B2 (ja) * | 1989-07-10 | 1996-03-06 | 日本電装株式会社 | 半導体装置およびその製造方法 |
JPH0636414B2 (ja) * | 1989-08-17 | 1994-05-11 | 信越半導体株式会社 | 半導体素子形成用基板の製造方法 |
US5034343A (en) * | 1990-03-08 | 1991-07-23 | Harris Corporation | Manufacturing ultra-thin wafer using a handle wafer |
US5091330A (en) * | 1990-12-28 | 1992-02-25 | Motorola, Inc. | Method of fabricating a dielectric isolated area |
JP3111500B2 (ja) * | 1991-05-09 | 2000-11-20 | 富士電機株式会社 | 誘電体分離ウエハの製造方法 |
JP2799254B2 (ja) * | 1991-07-11 | 1998-09-17 | 三菱電機株式会社 | 半導体装置の製造方法 |
FR2687008B1 (fr) * | 1992-02-05 | 2001-06-22 | Patrick Launay | Procede de fabrication de structures actives et dispositifs semiconducteurs ainsi obtenus. |
DE4204004A1 (de) * | 1992-02-12 | 1993-08-19 | Daimler Benz Ag | Verfahren zur herstellung einer halbleiterstruktur mit vertikalen und lateralen halbleiterbauelementen und nach dem verfahren hergestellte halbleiterstruktur |
JP3014012B2 (ja) * | 1992-03-19 | 2000-02-28 | 日本電気株式会社 | 半導体装置の製造方法 |
JP2796012B2 (ja) * | 1992-05-06 | 1998-09-10 | 株式会社東芝 | 半導体装置及びその製造方法 |
US5260233A (en) * | 1992-11-06 | 1993-11-09 | International Business Machines Corporation | Semiconductor device and wafer structure having a planar buried interconnect by wafer bonding |
JP2526786B2 (ja) * | 1993-05-22 | 1996-08-21 | 日本電気株式会社 | 半導体装置及びその製造方法 |
JPH1027893A (ja) * | 1993-10-29 | 1998-01-27 | Amer Fib Inc | 電荷シンク又は電位ウェルとして設けられた絶縁層の下の基板内に電気的に結合され別に形成されたドープされた領域を有するsoiウエーハ上に設けられた集積回路(ic)装置 |
JP2773611B2 (ja) * | 1993-11-17 | 1998-07-09 | 株式会社デンソー | 絶縁物分離半導体装置 |
DE69329999T2 (de) * | 1993-12-29 | 2001-09-13 | Cons Ric Microelettronica | Verfahren zur Herstellung integrierter Schaltungen, insbesondere intelligenter Leistungsanordnungen |
US5468674A (en) * | 1994-06-08 | 1995-11-21 | The United States Of America As Represented By The Secretary Of The Navy | Method for forming low and high minority carrier lifetime layers in a single semiconductor structure |
DE4423067C2 (de) * | 1994-07-01 | 1996-05-09 | Daimler Benz Ag | Verfahren zum Herstellen eines isolierten Halbleitersubstrats |
JP2624186B2 (ja) * | 1994-07-29 | 1997-06-25 | 日本電気株式会社 | 貼り合わせシリコン基板の製造方法 |
US5643821A (en) * | 1994-11-09 | 1997-07-01 | Harris Corporation | Method for making ohmic contact to lightly doped islands from a silicide buried layer and applications |
US6015980A (en) * | 1996-03-08 | 2000-01-18 | The Regents Of The University Of California | Metal layered semiconductor laser |
US5977604A (en) * | 1996-03-08 | 1999-11-02 | The Regents Of The University Of California | Buried layer in a semiconductor formed by bonding |
JP2917919B2 (ja) * | 1996-06-20 | 1999-07-12 | 日本電気株式会社 | 半導体基板およびその製造方法、並びに半導体素子 |
US6271070B2 (en) * | 1997-12-25 | 2001-08-07 | Matsushita Electronics Corporation | Method of manufacturing semiconductor device |
TW502458B (en) | 1999-06-09 | 2002-09-11 | Toshiba Corp | Bonding type semiconductor substrate, semiconductor light emission element and manufacturing method thereof |
JP4322453B2 (ja) * | 2001-09-27 | 2009-09-02 | 株式会社東芝 | 半導体装置およびその製造方法 |
JP2003203967A (ja) * | 2001-12-28 | 2003-07-18 | Toshiba Corp | 部分soiウェーハの製造方法、半導体装置及びその製造方法 |
JP4489366B2 (ja) * | 2003-03-17 | 2010-06-23 | 株式会社日立製作所 | 半導体装置 |
JP2005244020A (ja) * | 2004-02-27 | 2005-09-08 | Toshiba Corp | 半導体装置及びその製造方法 |
TWI401749B (zh) * | 2004-12-27 | 2013-07-11 | Third Dimension 3D Sc Inc | 用於高電壓超接面終止之方法 |
EP1873821B1 (de) | 2006-06-27 | 2015-11-11 | STMicroelectronics Srl | SOI Anordnung mit durch eine epitaktische Abscheidung hergestellten vergrabenen Kontakten |
JP2008087636A (ja) * | 2006-10-02 | 2008-04-17 | Calsonic Kansei Corp | 空調装置 |
US10153300B2 (en) * | 2016-02-05 | 2018-12-11 | Taiwan Semiconductor Manufacturing Company Limited | Semiconductor device including a high-electron-mobility transistor (HEMT) and method for manufacturing the same |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4139401A (en) * | 1963-12-04 | 1979-02-13 | Rockwell International Corporation | Method of producing electrically isolated semiconductor devices on common crystalline substrate |
JPS5222984B2 (de) * | 1972-09-06 | 1977-06-21 | ||
US4184172A (en) * | 1976-12-06 | 1980-01-15 | Massachusetts Institute Of Technology | Dielectric isolation using shallow oxide and polycrystalline silicon |
JPS5789247A (en) * | 1980-11-25 | 1982-06-03 | Hitachi Ltd | Semiconductor device |
US4473598A (en) * | 1982-06-30 | 1984-09-25 | International Business Machines Corporation | Method of filling trenches with silicon and structures |
US4501060A (en) * | 1983-01-24 | 1985-02-26 | At&T Bell Laboratories | Dielectrically isolated semiconductor devices |
US4507158A (en) * | 1983-08-12 | 1985-03-26 | Hewlett-Packard Co. | Trench isolated transistors in semiconductor films |
US4444620A (en) * | 1983-09-12 | 1984-04-24 | Bell Telephone Laboratories, Incorporated | Growth of oriented single crystal semiconductor on insulator |
JPS60113455A (ja) * | 1983-11-24 | 1985-06-19 | Hitachi Ltd | 半導体集積回路装置 |
JPH0669064B2 (ja) * | 1984-03-23 | 1994-08-31 | 日本電気株式会社 | 半導体装置の素子分離方法 |
JPH0671043B2 (ja) * | 1984-08-31 | 1994-09-07 | 株式会社東芝 | シリコン結晶体構造の製造方法 |
US4593458A (en) * | 1984-11-02 | 1986-06-10 | General Electric Company | Fabrication of integrated circuit with complementary, dielectrically-isolated, high voltage semiconductor devices |
US4601779A (en) * | 1985-06-24 | 1986-07-22 | International Business Machines Corporation | Method of producing a thin silicon-on-insulator layer |
US4829018A (en) * | 1986-06-27 | 1989-05-09 | Wahlstrom Sven E | Multilevel integrated circuits employing fused oxide layers |
JPS6412543A (en) * | 1987-07-07 | 1989-01-17 | Toshiba Corp | Manufacture of semiconductor device |
-
1985
- 1985-09-30 JP JP60214853A patent/JPS6276645A/ja active Pending
-
1986
- 1986-09-25 DE DE8686113185T patent/DE3685709T2/de not_active Expired - Lifetime
- 1986-09-25 EP EP86113185A patent/EP0217288B1/de not_active Expired - Lifetime
-
1989
- 1989-08-21 US US07/396,792 patent/US4948748A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4948748A (en) | 1990-08-14 |
JPS6276645A (ja) | 1987-04-08 |
EP0217288A2 (de) | 1987-04-08 |
EP0217288B1 (de) | 1992-06-17 |
DE3685709T2 (de) | 1993-01-28 |
EP0217288A3 (en) | 1988-05-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) |