DE3650057T2 - System für Vakuumbehandlung. - Google Patents
System für Vakuumbehandlung.Info
- Publication number
- DE3650057T2 DE3650057T2 DE19863650057 DE3650057T DE3650057T2 DE 3650057 T2 DE3650057 T2 DE 3650057T2 DE 19863650057 DE19863650057 DE 19863650057 DE 3650057 T DE3650057 T DE 3650057T DE 3650057 T2 DE3650057 T2 DE 3650057T2
- Authority
- DE
- Germany
- Prior art keywords
- vacuum
- carrier
- transport arm
- disk
- wafer carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009489 vacuum treatment Methods 0.000 title description 2
- 235000012431 wafers Nutrition 0.000 claims description 86
- 238000000034 method Methods 0.000 claims description 80
- 239000002245 particle Substances 0.000 claims description 80
- 239000004065 semiconductor Substances 0.000 claims description 29
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000000605 extraction Methods 0.000 claims 2
- 230000001419 dependent effect Effects 0.000 claims 1
- 230000008569 process Effects 0.000 description 73
- 239000007789 gas Substances 0.000 description 29
- 230000008901 benefit Effects 0.000 description 19
- 230000033001 locomotion Effects 0.000 description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 239000000969 carrier Substances 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 239000010453 quartz Substances 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 7
- 238000001020 plasma etching Methods 0.000 description 7
- 239000001307 helium Substances 0.000 description 6
- 229910052734 helium Inorganic materials 0.000 description 6
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 238000005299 abrasion Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000011065 in-situ storage Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 238000010926 purge Methods 0.000 description 3
- 230000000284 resting effect Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000005653 Brownian motion process Effects 0.000 description 1
- 229920004943 Delrin® Polymers 0.000 description 1
- 229910000639 Spring steel Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005537 brownian motion Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000012840 feeding operation Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 150000002371 helium Chemical class 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
- Physical Vapour Deposition (AREA)
- Manipulator (AREA)
- ing And Chemical Polishing (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Specific Conveyance Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US79070885A | 1985-10-24 | 1985-10-24 | |
| US06/790,924 US4687542A (en) | 1985-10-24 | 1985-10-24 | Vacuum processing system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3650057D1 DE3650057D1 (de) | 1994-10-13 |
| DE3650057T2 true DE3650057T2 (de) | 1995-02-16 |
Family
ID=27121066
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19863650057 Expired - Fee Related DE3650057T2 (de) | 1985-10-24 | 1986-10-17 | System für Vakuumbehandlung. |
| DE19863650710 Expired - Fee Related DE3650710T2 (de) | 1985-10-24 | 1986-10-17 | System und Methode für Vakuum-Behandlung |
| DE19863650697 Expired - Fee Related DE3650697T2 (de) | 1985-10-24 | 1986-10-17 | Wafertransferarm und Wafertransfermethode |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19863650710 Expired - Fee Related DE3650710T2 (de) | 1985-10-24 | 1986-10-17 | System und Methode für Vakuum-Behandlung |
| DE19863650697 Expired - Fee Related DE3650697T2 (de) | 1985-10-24 | 1986-10-17 | Wafertransferarm und Wafertransfermethode |
Country Status (3)
| Country | Link |
|---|---|
| EP (3) | EP0555890B1 (enExample) |
| JP (5) | JPS62181440A (enExample) |
| DE (3) | DE3650057T2 (enExample) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4917556A (en) * | 1986-04-28 | 1990-04-17 | Varian Associates, Inc. | Modular wafer transport and processing system |
| GB2194500B (en) * | 1986-07-04 | 1991-01-23 | Canon Kk | A wafer handling apparatus |
| EP0303030A1 (en) * | 1987-07-16 | 1989-02-15 | Texas Instruments Incorporated | Processing apparatus and method |
| JPS6428912A (en) * | 1987-07-24 | 1989-01-31 | Hitachi Electr Eng | Wafer handling device |
| DE3735449A1 (de) * | 1987-10-20 | 1989-05-03 | Convac Gmbh | Fertigungssystem fuer halbleitersubstrate |
| JP2926593B2 (ja) * | 1988-02-12 | 1999-07-28 | 東京エレクトロン株式会社 | 基板処理装置及びレジスト処理装置及び基板処理方法及びレジスト処理方法 |
| US4949783A (en) * | 1988-05-18 | 1990-08-21 | Veeco Instruments, Inc. | Substrate transport and cooling apparatus and method for same |
| IL86514A0 (enExample) * | 1988-05-26 | 1988-11-15 | ||
| DE3822598C2 (de) * | 1988-07-04 | 1997-09-04 | Siemens Ag | Justieranordnung und Verfahren zum Justieren einer Greifvorrichtung eines Roboterarms zum Handhaben einer Halbleiterscheibe |
| EP0367423A3 (en) * | 1988-10-31 | 1991-01-09 | Eaton Corporation | Vacuum deposition system |
| JP2528962B2 (ja) * | 1989-02-27 | 1996-08-28 | 株式会社日立製作所 | 試料処理方法及び装置 |
| US6989228B2 (en) | 1989-02-27 | 2006-01-24 | Hitachi, Ltd | Method and apparatus for processing samples |
| US5868854A (en) * | 1989-02-27 | 1999-02-09 | Hitachi, Ltd. | Method and apparatus for processing samples |
| US6077788A (en) * | 1989-02-27 | 2000-06-20 | Hitachi, Ltd. | Method and apparatus for processing samples |
| NL8901630A (nl) * | 1989-06-28 | 1991-01-16 | Philips Nv | Vacuuem systeem. |
| JP2767142B2 (ja) * | 1989-10-18 | 1998-06-18 | 東京エレクトロン株式会社 | 真空処理装置用ユニット |
| JP2525284B2 (ja) * | 1990-10-22 | 1996-08-14 | ティーディーケイ株式会社 | クリ―ン搬送方法及び装置 |
| JPH05251408A (ja) * | 1992-03-06 | 1993-09-28 | Ebara Corp | 半導体ウェーハのエッチング装置 |
| US5398481A (en) * | 1992-05-19 | 1995-03-21 | Ebara Corporation | Vacuum processing system |
| EP0596536A1 (en) * | 1992-11-06 | 1994-05-11 | Applied Materials, Inc. | Transport system and method of using same |
| KR100303075B1 (ko) * | 1992-11-06 | 2001-11-30 | 조셉 제이. 스위니 | 집적회로 웨이퍼 이송 방법 및 장치 |
| US5643366A (en) * | 1994-01-31 | 1997-07-01 | Applied Materials, Inc. | Wafer handling within a vacuum chamber using vacuum |
| GB2320135A (en) * | 1996-12-04 | 1998-06-10 | Smiths Industries Plc | Semiconductor wafer processing apparatus |
| JP3850951B2 (ja) * | 1997-05-15 | 2006-11-29 | 東京エレクトロン株式会社 | 基板搬送装置及び基板搬送方法 |
| CN100423179C (zh) | 2002-06-21 | 2008-10-01 | 应用材料股份有限公司 | 用于真空处理系统的传送处理室 |
| US7258520B2 (en) | 2002-08-31 | 2007-08-21 | Applied Materials, Inc. | Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing |
| US6955197B2 (en) | 2002-08-31 | 2005-10-18 | Applied Materials, Inc. | Substrate carrier having door latching and substrate clamping mechanisms |
| US20050167554A1 (en) | 2003-11-13 | 2005-08-04 | Rice Michael R. | Kinematic pin with shear member and substrate carrier for use therewith |
| DE10359464A1 (de) * | 2003-12-17 | 2005-07-28 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zum Erzeugen von insbesondere EUV-Strahlung und/oder weicher Röntgenstrahlung |
| US7720558B2 (en) | 2004-09-04 | 2010-05-18 | Applied Materials, Inc. | Methods and apparatus for mapping carrier contents |
| CN101370616B (zh) | 2006-01-11 | 2011-04-27 | 应用材料股份有限公司 | 一种基材载件、一种装载端口以及一种清洗基材载件的方法 |
| US7849889B2 (en) * | 2006-05-31 | 2010-12-14 | Philip Morris Usa Inc. | Applicator wheel for filling cavities with metered amounts of particulate material |
| JP5329854B2 (ja) | 2008-06-25 | 2013-10-30 | ティアック株式会社 | 光ディスク装置及びこれを備える光ディスク処理システム |
| JP5329853B2 (ja) | 2008-06-25 | 2013-10-30 | ティアック株式会社 | 光ディスク装置及びこれを備える光ディスク処理システム |
| WO2011142000A1 (ja) | 2010-05-11 | 2011-11-17 | トヨタ自動車株式会社 | 車両用シフト制御装置 |
| KR102139673B1 (ko) * | 2013-07-04 | 2020-07-31 | 엘지디스플레이 주식회사 | 평판표시장치 제조용 장비 및 그의 동작방법 |
| JP2017204608A (ja) * | 2016-05-13 | 2017-11-16 | 信越ポリマー株式会社 | 基板収納容器 |
| WO2021014675A1 (ja) * | 2019-07-22 | 2021-01-28 | 株式会社アルバック | 真空処理装置 |
| CN113728422B (zh) * | 2020-03-24 | 2024-01-09 | 株式会社日立高新技术 | 真空处理装置 |
| JP7617745B2 (ja) * | 2021-01-05 | 2025-01-20 | 東京エレクトロン株式会社 | プロセスモジュール、基板処理システムおよび処理方法 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5337546U (enExample) * | 1976-09-06 | 1978-04-01 | ||
| JPS5337456U (enExample) * | 1976-09-07 | 1978-04-01 | ||
| US4181161A (en) * | 1977-02-02 | 1980-01-01 | Balzers Aktiengesellschaft Fur Hochvakuumtechnik Und Dunne Schichten | Method of producing a high vacuum in a container |
| JPS5480086A (en) * | 1977-12-09 | 1979-06-26 | Hitachi Ltd | Mask aligner |
| US4293249A (en) * | 1980-03-03 | 1981-10-06 | Texas Instruments Incorporated | Material handling system and method for manufacturing line |
| JPS5730341A (en) * | 1980-07-30 | 1982-02-18 | Anelva Corp | Substrate processing device |
| JPS5739914A (en) * | 1980-08-25 | 1982-03-05 | Shimizu Construction Co Ltd | Method of controlling moisture of high slump concrete |
| JPS57113245A (en) * | 1980-12-29 | 1982-07-14 | Fujitsu Ltd | Sample conveying method into vacuum device |
| US4433951A (en) * | 1981-02-13 | 1984-02-28 | Lam Research Corporation | Modular loadlock |
| JPS57145321A (en) * | 1981-03-03 | 1982-09-08 | Nec Corp | Dry etching device |
| JPS57149748A (en) * | 1981-03-12 | 1982-09-16 | Anelva Corp | Treating device for substrate |
| US4466766A (en) * | 1981-05-20 | 1984-08-21 | Ruska Instrument Corporation | Transfer apparatus |
| JPS57194531A (en) * | 1981-05-26 | 1982-11-30 | Toshiba Corp | Electron beam transfer device |
| JPS58292U (ja) * | 1981-06-26 | 1983-01-05 | 同和機器工業株式会社 | 冷却兼冷凍装置 |
| JPS58127341A (ja) * | 1982-01-25 | 1983-07-29 | Hitachi Ltd | 自動ウエハハンドリング装置 |
| JPS58170028A (ja) * | 1982-03-31 | 1983-10-06 | Fujitsu Ltd | 真空処理装置 |
| DE3214256A1 (de) * | 1982-04-17 | 1983-10-20 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Vorrichtung zur handhabung eines substrates |
| JPS58204347A (ja) * | 1982-05-24 | 1983-11-29 | Nippon Jido Seigyo Kk | パタ−ンの欠陥検査装置に用いる被検体の自動装填装置 |
| DE3219502C2 (de) * | 1982-05-25 | 1990-04-19 | Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar | Vorrichtung zum automatischen Transport scheibenförmiger Objekte |
| JPS5956739A (ja) * | 1982-09-27 | 1984-04-02 | Ulvac Corp | ウエハ装填装置 |
| JPS5994435A (ja) * | 1982-11-20 | 1984-05-31 | Tokuda Seisakusho Ltd | 真空処理装置 |
| JPS59186326A (ja) * | 1983-04-06 | 1984-10-23 | Hitachi Ltd | プラズマ処理装置 |
| JPS59208837A (ja) * | 1983-05-13 | 1984-11-27 | Nec Kyushu Ltd | プラズマエツチング装置 |
| US4534695A (en) * | 1983-05-23 | 1985-08-13 | Eaton Corporation | Wafer transport system |
| JPS6020515A (ja) * | 1983-07-14 | 1985-02-01 | Ulvac Corp | 真空処理装置 |
| JPS6054449A (ja) * | 1983-09-05 | 1985-03-28 | Toshiba Corp | 半導体ウエハ搬送治具 |
| DE3483828D1 (de) * | 1983-09-28 | 1991-02-07 | Hewlett Packard Co | Verarbeitungssystem fuer integrierte schaltkreise. |
| JPS60102744A (ja) * | 1983-11-09 | 1985-06-06 | Hitachi Ltd | 真空処理装置 |
| US4584045A (en) * | 1984-02-21 | 1986-04-22 | Plasma-Therm, Inc. | Apparatus for conveying a semiconductor wafer |
| JPS60175411A (ja) * | 1984-02-22 | 1985-09-09 | Hitachi Ltd | 半導体薄膜の製造方法及びその製造装置 |
-
1986
- 1986-10-17 DE DE19863650057 patent/DE3650057T2/de not_active Expired - Fee Related
- 1986-10-17 EP EP93106892A patent/EP0555890B1/en not_active Expired - Lifetime
- 1986-10-17 DE DE19863650710 patent/DE3650710T2/de not_active Expired - Fee Related
- 1986-10-17 EP EP86114386A patent/EP0219826B1/en not_active Expired - Lifetime
- 1986-10-17 EP EP93106893A patent/EP0555891B1/en not_active Expired - Lifetime
- 1986-10-17 DE DE19863650697 patent/DE3650697T2/de not_active Expired - Fee Related
- 1986-10-24 JP JP61253518A patent/JPS62181440A/ja active Granted
- 1986-10-24 JP JP5-99635A patent/JPH0658932B2/ja not_active Expired - Lifetime
-
1991
- 1991-05-07 JP JP10134791A patent/JPH04226049A/ja active Pending
-
1993
- 1993-03-08 JP JP5046733A patent/JP2693352B2/ja not_active Expired - Fee Related
- 1993-03-08 JP JP5-46734A patent/JPH0658931B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0555891B1 (en) | 1999-01-20 |
| EP0219826A2 (en) | 1987-04-29 |
| JPH0658931B1 (enExample) | 1994-08-03 |
| JPS62181440A (ja) | 1987-08-08 |
| JPH04226049A (ja) | 1992-08-14 |
| EP0555891A3 (en) | 1993-09-15 |
| DE3650697T2 (de) | 1999-04-15 |
| DE3650697D1 (de) | 1998-10-08 |
| DE3650710T2 (de) | 1999-08-19 |
| JP2693352B2 (ja) | 1997-12-24 |
| EP0555890A3 (en) | 1993-09-15 |
| EP0555890B1 (en) | 1998-09-02 |
| EP0219826B1 (en) | 1994-09-07 |
| JPH0629369A (ja) | 1994-02-04 |
| DE3650057D1 (de) | 1994-10-13 |
| EP0219826A3 (en) | 1989-07-26 |
| JPH0658932B2 (ja) | 1994-08-03 |
| JPH0645425A (ja) | 1994-02-18 |
| JPH0658931B2 (ja) | 1994-08-03 |
| EP0555890A2 (en) | 1993-08-18 |
| JPH0658932B1 (enExample) | 1994-08-03 |
| JPH0556859B2 (enExample) | 1993-08-20 |
| EP0555891A2 (en) | 1993-08-18 |
| JPH0640517A (ja) | 1994-02-15 |
| DE3650710D1 (de) | 1999-03-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |