JPS58127341A - 自動ウエハハンドリング装置 - Google Patents

自動ウエハハンドリング装置

Info

Publication number
JPS58127341A
JPS58127341A JP890682A JP890682A JPS58127341A JP S58127341 A JPS58127341 A JP S58127341A JP 890682 A JP890682 A JP 890682A JP 890682 A JP890682 A JP 890682A JP S58127341 A JPS58127341 A JP S58127341A
Authority
JP
Japan
Prior art keywords
wafer
absorbing
absorbed
head
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP890682A
Other languages
English (en)
Inventor
Yukio Murakawa
幸雄 村川
Keiichi Nagasaki
恵一 長崎
Akira Yoshida
明 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi High Tech Corp
Original Assignee
Hitachi Ltd
Hitachi Electronics Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Ltd
Priority to JP890682A priority Critical patent/JPS58127341A/ja
Publication of JPS58127341A publication Critical patent/JPS58127341A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 本発明は自動フェノ・ノ・ンドリング装置に閤するもの
である。
従来、タトえばＩＣ（集積ｖｕａ＞やＬ８Ｉ（大規模集
積回路）の製造過１１に用いられるＣＶＤ（化学蒸着）
装置においてウェーを反応炉に出入れする場合、作業者
がウェハなカセットからｌ教ずつ真空ビンセットで吸着
して出し入れしていた。
そのため、ウェハにゴミ等の異物が付着したり、ウェハ
に割れや欠けが生じるおそれがある上に。
作業能率も低下していた。
したがって、本発明の目的は、前記従来技術の欠点を解
消し、ウェハに員物を付着させｉことなく、能率的にハ
ンドリングできる自動クエハノーンドリング装置を提供
するととにある。
この目的を達成するため、本発明は、処理部へのクエへ
の出入れをすべて自動的に行うウェハ吸着ヘッド部とウ
ェハ搬送部とを備えてなるものである。
以下１本発明をＩＩＩＩＫ示す一実施例にしたがって詳
細に説明する。
第１１１１は本発明による自動ウェハハンドリング装置
の一実施例の水子ＷＩ１ｍｌ！Ｉ、第２１Ｉはその正画
図、第３図はその要部の拡大平ｍｇ、第４図は要部の拡
大正ｍ１ｉａである。
本実施偶において、クエへＫＣＶＤＪ６１１を施こす反
応炉ｌは開閉蓋２を有している。この反応炉１の中にウ
ェハを供給するための四−ダ用歇着ヘッド３と、反応炉
１かもＣＶＤＪｌ＆運済みのウェハを取り出すアンシー
ダ用吸着ヘッド４とは、それぞれのハンドリングアーム
５，６により互いに９０度の角度で配置され【いる、こ
れらの吸着ヘッド３．４は水平方向に９０度謡動できる
上に、反応炉１の方向に水平移動でｔ、また上下動も可
能となっている。
ローダ用吸着ヘッド３へのクエ／１の搬送のためローダ
用のウェハ搬入ベルト７がＷＲけられ、このローダ用搬
送ベルト７はウェハをローダ偏カートリッジ８からロー
ダ用吸着ヘッド３までＩＩｉ！する。
一方、アンローダ用吸着ヘッド４により反応炉１から取
り出されたクエＩ・をアン痒−ダ儒カートリッジ１０ま
で搬出するため、アンローダ用のウェハ搬出ベルト９が
前記搬入ベルト７と平行に設けられ【いる。
カートリッジ８　、１０＃）８々は第４１１に示すよう
に１つずつエレベータ１１１Ｃより昇降可能となってい
る。
なお、誇−９）１２は−−ダ、１３はアン寥−ダ、１４
はダミーローダカートリッジ％　１５に１／ミーアンロ
ーダカートリツジでｈる。
次に、本実施例の作用について説明する。ＣｖＤｌ＆理
されるウェハは各賞−ダ側カートリッジｌＯからウェハ
搬入ベル）７により１枚ずつ搬入され、反応炉１の１Ｉ
ＩＩＩＩ蓋２は開かれる。
このとｔ１吸着ヘッド３，４およびノ・ンドリングアー
ム５．６は第３ＷＪの二点鎖線位置から実線位置まで反
応炉１万肉Ｋ１１１進し、ｐ−ダ用吸着ヘッド３は搬入
されて来たウェハを真！！！吸着できる状１１１になる
と共に、アンルーダ用吸着ヘッド４は、開閉蓋２を開い
た反応炉ｌ内の試料台１６上のＣＶＤ処運済みのウェハ
を真！！ＩＩ：着ｔきる状態となる。
この状態で両歌着ヘッド３，４でそれぞれウェハを真空
吸着した後１両歌着ヘッド３．４を第３−の位置から反
時計方向に９０度だけ水平方向に１動させると、田−ダ
用吸着へラド３は反応炉１内の試料台１６０上に来ると
共に、アンー−ダ眉獣着ヘッド４は反応炉１から取り出
したフェノ１をクエハＩＩ！声ベルト９に手渡すことの
できる位置に来る。したがって、この位置で◆吸着ヘッ
ド３゜４の真空吸着力を解重すると、吸着ヘッド３で吸
着されていたウェハは試料台１６の上に置かれ、かつ吸
着ヘッド４で吸着されていたウェハはウェハ搬出ベル）
９に手渡され、該ウェハ搬送ベルト９でアンｎ−ダ傭カ
ートリッジ１０にＩｌ出される。
このような反応炉１へのウェハの供給と取出しは１回の
処理牧数分だｌ＃９返される。
このようにして、所定歇歇のウェハの供給および取出し
が完了した贅、吸着ヘッド３．４およびハンドリングア
ーム５，６は第３５１の二点鎖線位置（右側）まで同図
の右方肉Ｅｌ！遍し、反応炉１のＭｌ！！［２が閉じら
れ、反応炉ｌ内では各試料台１６上に供給されたクエへ
のＣＶＤｊ＆［が行われ。
さらにその処理済みのクエへの取出しと、新しいウニへ
の供給が行われる。
したがつて、杢ａｍ例においては、ｔ工への搬入からＣ
ＶＤ処聰を騒て搬出に至る一切の作業が自動的に行われ
るので、作ｌＩ者はカートリッジの搬入と取出しを行う
だけでよく、作ＩＩ能率が非常に良い上に、クエへへの
異物の付着やウェハの割れや欠は等も防止できる。
また、！イ；ン等でフェノ１をカートリッジからカート
リッジに記憶させることにより、クエ／′−のパッチ管
理、ａット管運も容易に行５ことかで會る。
以上Ｉ！明したように１本発＠によれば、フェノ１のハ
ンドリングは自動的に行われるので１作ｌＩ能率が大幅
に向上する上に、異物のｇＩ＆生およびウェハへの付着
、ウェハの割れや欠は等−防止できる。
ｇｗの簡単なｓｉ鳴 第ｉｍｌは本発明による自動クエパノ１ンドリング装置
の一実施例の水平断ｌｌ１Ｉ！、第２８１はその正面−
、ｍｓ図はその要部の拡大平−図、第４図は要部の拡大
正ＩＩ＠である。
１・・・反応炉、２・ＩＩＩＭＩＩ、３・・・ローダ用
吸着ヘッド、４・・・アンローダ用吸着ヘッド、５．１
・・／（ンドリングアーム、７−４エノＳ１１人ヘルド
、魯・・・−一ダ側カートリッジ、９・・・クエＩ・搬
出ベルト、１０・・・アンルータ側カーＦリッジ、１６
・・・試料台。
代理人　弁理士　薄　１）利　幸

Claims (1)

    【特許請求の範囲】
  1. ウェハな処理部に供給する第１のウェハ吸着ヘッドおよ
    びウェハを処ＩＩｓから取り出す第２のウェハ吸着ヘッ
    ドを所定の角度で揺動可能に配置したウェハ吸着ヘッド
    部と、前記フェノ１ｒＩｋ着ヘッドＩＩＫウェハを搬入
    しかつ麹層を終えたウニＩ・を前記ウェハ吸着部から搬
    出するウェハ搬送部とを備えた自動ウェハハンドリング
    装置。
JP890682A 1982-01-25 1982-01-25 自動ウエハハンドリング装置 Pending JPS58127341A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP890682A JPS58127341A (ja) 1982-01-25 1982-01-25 自動ウエハハンドリング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP890682A JPS58127341A (ja) 1982-01-25 1982-01-25 自動ウエハハンドリング装置

Publications (1)

Publication Number Publication Date
JPS58127341A true JPS58127341A (ja) 1983-07-29

Family

ID=11705710

Family Applications (1)

Application Number Title Priority Date Filing Date
JP890682A Pending JPS58127341A (ja) 1982-01-25 1982-01-25 自動ウエハハンドリング装置

Country Status (1)

Country Link
JP (1) JPS58127341A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62214178A (ja) * 1986-03-13 1987-09-19 Hitachi Electronics Eng Co Ltd 気相反応装置
EP0339132A2 (de) * 1988-02-24 1989-11-02 Balzers Aktiengesellschaft Vorrichtung zum Speichern von Objekten unter Vakuum
JPH0640517A (ja) * 1985-10-24 1994-02-15 Texas Instr Inc <Ti> ウェーハ移送方法及び集積回路ステーション

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5456356A (en) * 1977-10-14 1979-05-07 Hitachi Ltd Dicing device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5456356A (en) * 1977-10-14 1979-05-07 Hitachi Ltd Dicing device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0640517A (ja) * 1985-10-24 1994-02-15 Texas Instr Inc <Ti> ウェーハ移送方法及び集積回路ステーション
JPS62214178A (ja) * 1986-03-13 1987-09-19 Hitachi Electronics Eng Co Ltd 気相反応装置
EP0339132A2 (de) * 1988-02-24 1989-11-02 Balzers Aktiengesellschaft Vorrichtung zum Speichern von Objekten unter Vakuum
EP0339132A3 (de) * 1988-02-24 1990-07-04 Balzers Aktiengesellschaft Vorrichtung zum Speichern von Objekten unter Vakuum

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