DE3650057T2 - System für Vakuumbehandlung. - Google Patents

System für Vakuumbehandlung.

Info

Publication number
DE3650057T2
DE3650057T2 DE19863650057 DE3650057T DE3650057T2 DE 3650057 T2 DE3650057 T2 DE 3650057T2 DE 19863650057 DE19863650057 DE 19863650057 DE 3650057 T DE3650057 T DE 3650057T DE 3650057 T2 DE3650057 T2 DE 3650057T2
Authority
DE
Germany
Prior art keywords
treatment system
vacuum treatment
vacuum
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19863650057
Other languages
English (en)
Other versions
DE3650057D1 (de
Inventor
Cecil Davis
Timothy A Wooldridge
Duane E Carter
John E Spencer
Robert Matthews
Randall C Hildenbrand
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/790,924 external-priority patent/US4687542A/en
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of DE3650057D1 publication Critical patent/DE3650057D1/de
Application granted granted Critical
Publication of DE3650057T2 publication Critical patent/DE3650057T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
DE19863650057 1985-10-24 1986-10-17 System für Vakuumbehandlung. Expired - Fee Related DE3650057T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US79070885A 1985-10-24 1985-10-24
US06/790,924 US4687542A (en) 1985-10-24 1985-10-24 Vacuum processing system

Publications (2)

Publication Number Publication Date
DE3650057D1 DE3650057D1 (de) 1994-10-13
DE3650057T2 true DE3650057T2 (de) 1995-02-16

Family

ID=27121066

Family Applications (3)

Application Number Title Priority Date Filing Date
DE19863650057 Expired - Fee Related DE3650057T2 (de) 1985-10-24 1986-10-17 System für Vakuumbehandlung.
DE19863650710 Expired - Fee Related DE3650710T2 (de) 1985-10-24 1986-10-17 System und Methode für Vakuum-Behandlung
DE19863650697 Expired - Fee Related DE3650697T2 (de) 1985-10-24 1986-10-17 Wafertransferarm und Wafertransfermethode

Family Applications After (2)

Application Number Title Priority Date Filing Date
DE19863650710 Expired - Fee Related DE3650710T2 (de) 1985-10-24 1986-10-17 System und Methode für Vakuum-Behandlung
DE19863650697 Expired - Fee Related DE3650697T2 (de) 1985-10-24 1986-10-17 Wafertransferarm und Wafertransfermethode

Country Status (3)

Country Link
EP (3) EP0555890B1 (de)
JP (5) JPS62181440A (de)
DE (3) DE3650057T2 (de)

Families Citing this family (39)

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US4917556A (en) * 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
GB2194500B (en) * 1986-07-04 1991-01-23 Canon Kk A wafer handling apparatus
EP0303030A1 (de) * 1987-07-16 1989-02-15 Texas Instruments Incorporated Behandlungsapparat und -verfahren
JPS6428912A (en) * 1987-07-24 1989-01-31 Hitachi Electr Eng Wafer handling device
DE3735449A1 (de) * 1987-10-20 1989-05-03 Convac Gmbh Fertigungssystem fuer halbleitersubstrate
JP2926593B2 (ja) * 1988-02-12 1999-07-28 東京エレクトロン株式会社 基板処理装置及びレジスト処理装置及び基板処理方法及びレジスト処理方法
US4949783A (en) * 1988-05-18 1990-08-21 Veeco Instruments, Inc. Substrate transport and cooling apparatus and method for same
IL86514A0 (de) * 1988-05-26 1988-11-15
DE3822598C2 (de) * 1988-07-04 1997-09-04 Siemens Ag Justieranordnung und Verfahren zum Justieren einer Greifvorrichtung eines Roboterarms zum Handhaben einer Halbleiterscheibe
EP0367423A3 (de) * 1988-10-31 1991-01-09 Eaton Corporation Vakuumablagerungsvorrichtung
JP2528962B2 (ja) * 1989-02-27 1996-08-28 株式会社日立製作所 試料処理方法及び装置
US5868854A (en) 1989-02-27 1999-02-09 Hitachi, Ltd. Method and apparatus for processing samples
US6077788A (en) * 1989-02-27 2000-06-20 Hitachi, Ltd. Method and apparatus for processing samples
US6989228B2 (en) 1989-02-27 2006-01-24 Hitachi, Ltd Method and apparatus for processing samples
NL8901630A (nl) * 1989-06-28 1991-01-16 Philips Nv Vacuuem systeem.
JP2767142B2 (ja) * 1989-10-18 1998-06-18 東京エレクトロン株式会社 真空処理装置用ユニット
JP2525284B2 (ja) * 1990-10-22 1996-08-14 ティーディーケイ株式会社 クリ―ン搬送方法及び装置
JPH05251408A (ja) * 1992-03-06 1993-09-28 Ebara Corp 半導体ウェーハのエッチング装置
US5398481A (en) * 1992-05-19 1995-03-21 Ebara Corporation Vacuum processing system
KR100303075B1 (ko) * 1992-11-06 2001-11-30 조셉 제이. 스위니 집적회로 웨이퍼 이송 방법 및 장치
EP0596537A1 (de) * 1992-11-06 1994-05-11 Applied Materials, Inc. Ladungsschleuse mit Mikroumgebung und Methode zur Kupplung von einem Mikroumgebungsbehälter mit einer Prozesskammer
US5643366A (en) * 1994-01-31 1997-07-01 Applied Materials, Inc. Wafer handling within a vacuum chamber using vacuum
GB2320135A (en) * 1996-12-04 1998-06-10 Smiths Industries Plc Semiconductor wafer processing apparatus
JP3850951B2 (ja) * 1997-05-15 2006-11-29 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法
TWI294155B (en) 2002-06-21 2008-03-01 Applied Materials Inc Transfer chamber for vacuum processing system
US6955197B2 (en) 2002-08-31 2005-10-18 Applied Materials, Inc. Substrate carrier having door latching and substrate clamping mechanisms
US7258520B2 (en) 2002-08-31 2007-08-21 Applied Materials, Inc. Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing
US20050167554A1 (en) 2003-11-13 2005-08-04 Rice Michael R. Kinematic pin with shear member and substrate carrier for use therewith
DE10359464A1 (de) * 2003-12-17 2005-07-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zum Erzeugen von insbesondere EUV-Strahlung und/oder weicher Röntgenstrahlung
US7720558B2 (en) 2004-09-04 2010-05-18 Applied Materials, Inc. Methods and apparatus for mapping carrier contents
KR20080087880A (ko) 2006-01-11 2008-10-01 어플라이드 머티어리얼스, 인코포레이티드 기판 캐리어 세정 방법 및 장치
US7849889B2 (en) * 2006-05-31 2010-12-14 Philip Morris Usa Inc. Applicator wheel for filling cavities with metered amounts of particulate material
JP5329854B2 (ja) 2008-06-25 2013-10-30 ティアック株式会社 光ディスク装置及びこれを備える光ディスク処理システム
JP5329853B2 (ja) 2008-06-25 2013-10-30 ティアック株式会社 光ディスク装置及びこれを備える光ディスク処理システム
JP5382211B2 (ja) 2010-05-11 2014-01-08 トヨタ自動車株式会社 車両用シフト制御装置
KR102139673B1 (ko) * 2013-07-04 2020-07-31 엘지디스플레이 주식회사 평판표시장치 제조용 장비 및 그의 동작방법
JP2017204608A (ja) * 2016-05-13 2017-11-16 信越ポリマー株式会社 基板収納容器
WO2021014675A1 (ja) * 2019-07-22 2021-01-28 株式会社アルバック 真空処理装置
KR102515863B1 (ko) * 2020-03-24 2023-03-31 주식회사 히타치하이테크 진공 처리 장치

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JPS5337546U (de) * 1976-09-06 1978-04-01
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US4181161A (en) * 1977-02-02 1980-01-01 Balzers Aktiengesellschaft Fur Hochvakuumtechnik Und Dunne Schichten Method of producing a high vacuum in a container
JPS5480086A (en) * 1977-12-09 1979-06-26 Hitachi Ltd Mask aligner
US4293249A (en) * 1980-03-03 1981-10-06 Texas Instruments Incorporated Material handling system and method for manufacturing line
JPS5730341A (en) * 1980-07-30 1982-02-18 Anelva Corp Substrate processing device
JPS5739914A (en) * 1980-08-25 1982-03-05 Shimizu Construction Co Ltd Method of controlling moisture of high slump concrete
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US4433951A (en) * 1981-02-13 1984-02-28 Lam Research Corporation Modular loadlock
JPS57145321A (en) * 1981-03-03 1982-09-08 Nec Corp Dry etching device
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US4466766A (en) * 1981-05-20 1984-08-21 Ruska Instrument Corporation Transfer apparatus
JPS57194531A (en) * 1981-05-26 1982-11-30 Toshiba Corp Electron beam transfer device
JPS58292U (ja) * 1981-06-26 1983-01-05 同和機器工業株式会社 冷却兼冷凍装置
JPS58127341A (ja) * 1982-01-25 1983-07-29 Hitachi Ltd 自動ウエハハンドリング装置
JPS58170028A (ja) * 1982-03-31 1983-10-06 Fujitsu Ltd 真空処理装置
DE3214256A1 (de) * 1982-04-17 1983-10-20 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Vorrichtung zur handhabung eines substrates
JPS58204347A (ja) * 1982-05-24 1983-11-29 Nippon Jido Seigyo Kk パタ−ンの欠陥検査装置に用いる被検体の自動装填装置
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JPS6054449A (ja) * 1983-09-05 1985-03-28 Toshiba Corp 半導体ウエハ搬送治具
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JPS60175411A (ja) * 1984-02-22 1985-09-09 Hitachi Ltd 半導体薄膜の製造方法及びその製造装置

Also Published As

Publication number Publication date
JP2693352B2 (ja) 1997-12-24
JPH0645425A (ja) 1994-02-18
EP0555890B1 (de) 1998-09-02
DE3650697T2 (de) 1999-04-15
DE3650057D1 (de) 1994-10-13
DE3650710D1 (de) 1999-03-04
EP0555890A3 (de) 1993-09-15
JPH0556859B2 (de) 1993-08-20
JPH04226049A (ja) 1992-08-14
EP0219826B1 (de) 1994-09-07
EP0555891A2 (de) 1993-08-18
DE3650697D1 (de) 1998-10-08
JPH0658932B1 (de) 1994-08-03
EP0555891A3 (de) 1993-09-15
JPH0640517A (ja) 1994-02-15
EP0555891B1 (de) 1999-01-20
JPH0658931B1 (de) 1994-08-03
JPS62181440A (ja) 1987-08-08
DE3650710T2 (de) 1999-08-19
EP0555890A2 (de) 1993-08-18
JPH0629369A (ja) 1994-02-04
EP0219826A3 (en) 1989-07-26
EP0219826A2 (de) 1987-04-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee