DE3750558T2 - Transfersystem für Halbleiterscheiben. - Google Patents
Transfersystem für Halbleiterscheiben.Info
- Publication number
- DE3750558T2 DE3750558T2 DE3750558T DE3750558T DE3750558T2 DE 3750558 T2 DE3750558 T2 DE 3750558T2 DE 3750558 T DE3750558 T DE 3750558T DE 3750558 T DE3750558 T DE 3750558T DE 3750558 T2 DE3750558 T2 DE 3750558T2
- Authority
- DE
- Germany
- Prior art keywords
- transfer system
- semiconductor wafers
- wafers
- semiconductor
- transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US85681486A | 1986-04-28 | 1986-04-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3750558D1 DE3750558D1 (de) | 1994-10-27 |
DE3750558T2 true DE3750558T2 (de) | 1995-02-02 |
Family
ID=25324567
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3750558T Expired - Fee Related DE3750558T2 (de) | 1986-04-28 | 1987-04-28 | Transfersystem für Halbleiterscheiben. |
DE3752234T Expired - Fee Related DE3752234T2 (de) | 1986-04-28 | 1987-04-28 | Transfersystem für Halbleiterscheibe |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3752234T Expired - Fee Related DE3752234T2 (de) | 1986-04-28 | 1987-04-28 | Transfersystem für Halbleiterscheibe |
Country Status (4)
Country | Link |
---|---|
EP (2) | EP0556865B1 (de) |
JP (1) | JPS6323332A (de) |
KR (1) | KR100309932B1 (de) |
DE (2) | DE3750558T2 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2194500B (en) * | 1986-07-04 | 1991-01-23 | Canon Kk | A wafer handling apparatus |
US4775281A (en) * | 1986-12-02 | 1988-10-04 | Teradyne, Inc. | Apparatus and method for loading and unloading wafers |
DE3827343A1 (de) * | 1988-08-12 | 1990-02-15 | Leybold Ag | Vorrichtung nach dem karussel-prinzip zum beschichten von substraten |
JP2926213B2 (ja) * | 1988-02-12 | 1999-07-28 | 東京エレクトロン株式会社 | 基板処理装置 |
JPH0210727A (ja) * | 1988-06-28 | 1990-01-16 | Naoetsu Denshi Kogyo Kk | 半導体ウエハの分割方法および装置 |
DE68927146T2 (de) * | 1988-09-30 | 1997-02-06 | Canon Kk | Transportvorrichtung für Substrate |
US5277539A (en) * | 1988-09-30 | 1994-01-11 | Canon Kabushiki Kaisha | Substrate conveying apparatus |
DE4310149C2 (de) * | 1993-03-29 | 1996-05-02 | Jenoptik Jena Gmbh | Einrichtung zur Handhabung von scheibenförmigen Objekten in einer Handhabungsebene eines lokalen Reinraumes |
US6152070A (en) | 1996-11-18 | 2000-11-28 | Applied Materials, Inc. | Tandem process chamber |
US5902088A (en) * | 1996-11-18 | 1999-05-11 | Applied Materials, Inc. | Single loadlock chamber with wafer cooling function |
US6491491B1 (en) * | 1997-10-30 | 2002-12-10 | Sankyo Seiki Mfg. Co., Ltd. | Articulated robot |
US6257827B1 (en) * | 1997-12-01 | 2001-07-10 | Brooks Automation Inc. | Apparatus and method for transporting substrates |
US6719516B2 (en) | 1998-09-28 | 2004-04-13 | Applied Materials, Inc. | Single wafer load lock with internal wafer transport |
GB2347784B (en) * | 1999-03-11 | 2004-02-11 | Applied Materials Inc | Scanning wheel for ion implantation process chamber |
US6577923B1 (en) * | 1999-12-23 | 2003-06-10 | Applied Materials, Inc. | Apparatus and method for robotic alignment of substrates |
US7720558B2 (en) | 2004-09-04 | 2010-05-18 | Applied Materials, Inc. | Methods and apparatus for mapping carrier contents |
JP5132904B2 (ja) * | 2006-09-05 | 2013-01-30 | 東京エレクトロン株式会社 | 基板位置決め方法,基板位置検出方法,基板回収方法及び基板位置ずれ補正装置 |
KR100989930B1 (ko) | 2008-06-16 | 2010-10-29 | 김은환 | 웨이퍼 홀딩장치 및 웨이퍼 검사를 위한 구동장치 그리고이의 구동방법 |
JP2011161629A (ja) * | 2011-06-03 | 2011-08-25 | Kawasaki Heavy Ind Ltd | 基板搬送ロボット |
JP2012035408A (ja) * | 2011-11-09 | 2012-02-23 | Kawasaki Heavy Ind Ltd | 基板搬送ロボット |
CN110867407B (zh) * | 2019-11-20 | 2023-04-18 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | 扩散工艺篮具内成组硅片托起机构的梳齿状托架制作方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3401568A (en) * | 1966-08-17 | 1968-09-17 | Leland F. Blatt | Carriage drive mechanism |
US4208159A (en) * | 1977-07-18 | 1980-06-17 | Tokyo Ohka Kogyo Kabushiki Kaisha | Apparatus for the treatment of a wafer by plasma reaction |
JPS57145326A (en) * | 1980-12-29 | 1982-09-08 | Censor Patent Versuch | Method and device for forming pattern on wafer by photosensing semiconductor wafer |
US4433951A (en) * | 1981-02-13 | 1984-02-28 | Lam Research Corporation | Modular loadlock |
JPS5864043A (ja) * | 1981-10-13 | 1983-04-16 | Nippon Telegr & Teleph Corp <Ntt> | 円板形状体の位置決め装置 |
US4457664A (en) * | 1982-03-22 | 1984-07-03 | Ade Corporation | Wafer alignment station |
US4458152A (en) * | 1982-05-10 | 1984-07-03 | Siltec Corporation | Precision specular proximity detector and article handing apparatus employing same |
DE3219502C2 (de) * | 1982-05-25 | 1990-04-19 | Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar | Vorrichtung zum automatischen Transport scheibenförmiger Objekte |
JPS59124589A (ja) * | 1982-12-28 | 1984-07-18 | 株式会社東芝 | 産業用ロボツト |
JPS59125627A (ja) * | 1983-01-07 | 1984-07-20 | Toshiba Corp | ウエハ外周座標測定装置 |
WO1984003196A1 (en) * | 1983-02-14 | 1984-08-16 | Brooks Ass | Articulated arm transfer device |
EP0129731A1 (de) * | 1983-06-15 | 1985-01-02 | The Perkin-Elmer Corporation | Anordnung zur Behandlung von Halbleiterplättchen |
JPS60109242A (ja) * | 1983-11-18 | 1985-06-14 | Hitachi Ltd | 半導体ウエハの搬送、位置決め方法および装置 |
JPS60163742U (ja) * | 1983-12-22 | 1985-10-30 | 東京エレクトロン株式会社 | 半導体ウエハプロ−バ |
US4553069A (en) * | 1984-01-05 | 1985-11-12 | General Ionex Corporation | Wafer holding apparatus for ion implantation |
US4584045A (en) * | 1984-02-21 | 1986-04-22 | Plasma-Therm, Inc. | Apparatus for conveying a semiconductor wafer |
GB2157078B (en) * | 1984-03-30 | 1987-09-30 | Perkin Elmer Corp | Wafer alignment apparatus |
JPS6122642A (ja) * | 1984-07-10 | 1986-01-31 | Ulvac Corp | ウエハ搬送装置 |
US4657618A (en) * | 1984-10-22 | 1987-04-14 | Texas Instruments Incorporated | Powered load lock electrode/substrate assembly including robot arm, optimized for plasma process uniformity and rate |
JPS61226287A (ja) * | 1985-03-07 | 1986-10-08 | エプシロン テクノロジー インコーポレーテツド | 加工品を取扱うたぬの装置および方法 |
JPS61263123A (ja) * | 1985-05-16 | 1986-11-21 | Canon Inc | ステップアンドリピート露光方法 |
-
1987
- 1987-04-28 KR KR1019870004071A patent/KR100309932B1/ko not_active IP Right Cessation
- 1987-04-28 JP JP62103468A patent/JPS6323332A/ja active Granted
- 1987-04-28 DE DE3750558T patent/DE3750558T2/de not_active Expired - Fee Related
- 1987-04-28 EP EP93102766A patent/EP0556865B1/de not_active Expired - Lifetime
- 1987-04-28 DE DE3752234T patent/DE3752234T2/de not_active Expired - Fee Related
- 1987-04-28 EP EP87303748A patent/EP0244202B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR100309932B1 (ko) | 2001-12-15 |
JPH0458184B2 (de) | 1992-09-16 |
DE3752234T2 (de) | 1999-05-12 |
JPS6323332A (ja) | 1988-01-30 |
EP0244202B1 (de) | 1994-09-21 |
EP0244202A2 (de) | 1987-11-04 |
EP0556865A1 (de) | 1993-08-25 |
EP0244202A3 (en) | 1990-09-05 |
DE3750558D1 (de) | 1994-10-27 |
DE3752234D1 (de) | 1998-12-24 |
KR870010617A (ko) | 1987-11-30 |
EP0556865B1 (de) | 1998-11-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.(N. |
|
8339 | Ceased/non-payment of the annual fee |