DE3786070D1 - Umhuellte halbleiteranordnung. - Google Patents
Umhuellte halbleiteranordnung.Info
- Publication number
- DE3786070D1 DE3786070D1 DE8787311419T DE3786070T DE3786070D1 DE 3786070 D1 DE3786070 D1 DE 3786070D1 DE 8787311419 T DE8787311419 T DE 8787311419T DE 3786070 T DE3786070 T DE 3786070T DE 3786070 D1 DE3786070 D1 DE 3786070D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor arrangement
- coated semiconductor
- coated
- arrangement
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31375486 | 1986-12-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3786070D1 true DE3786070D1 (de) | 1993-07-08 |
DE3786070T2 DE3786070T2 (de) | 1994-01-05 |
Family
ID=18045132
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE87311419T Expired - Lifetime DE3786070T2 (de) | 1986-12-26 | 1987-12-23 | Umhüllte Halbleiteranordnung. |
Country Status (3)
Country | Link |
---|---|
US (1) | US4855807A (de) |
EP (1) | EP0273725B1 (de) |
DE (1) | DE3786070T2 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0350758A (ja) * | 1989-07-18 | 1991-03-05 | Toshiba Corp | 樹脂封止型半導体装置 |
US5021864A (en) * | 1989-09-05 | 1991-06-04 | Micron Technology, Inc. | Die-mounting paddle for mechanical stress reduction in plastic IC packages |
JP2585830B2 (ja) * | 1990-03-28 | 1997-02-26 | 株式会社東芝 | 樹脂封止型半導体装置及びその製造方法 |
JP2890662B2 (ja) * | 1990-04-25 | 1999-05-17 | ソニー株式会社 | 樹脂封止型半導体装置の製造方法とそれに用いるリードフレーム |
US5122858A (en) * | 1990-09-10 | 1992-06-16 | Olin Corporation | Lead frame having polymer coated surface portions |
JP3078860B2 (ja) * | 1991-02-18 | 2000-08-21 | 株式会社デンソー | 金属部材の樹脂インサート成形方法 |
US5214846A (en) * | 1991-04-24 | 1993-06-01 | Sony Corporation | Packaging of semiconductor chips |
US5210375A (en) * | 1991-06-28 | 1993-05-11 | Vlsi Technology, Inc. | Electronic device package--carrier assembly ready to be mounted onto a substrate |
US5550323A (en) * | 1991-08-28 | 1996-08-27 | Lsi Logic Corporation | Mounting of electronic devices |
JPH05144982A (ja) * | 1991-11-19 | 1993-06-11 | Nippon Precision Circuits Kk | 集積回路装置 |
US5512710A (en) * | 1992-08-21 | 1996-04-30 | Cts Corporation | Multilayer package with second layer via test connections |
US5686698A (en) * | 1994-06-30 | 1997-11-11 | Motorola, Inc. | Package for electrical components having a molded structure with a port extending into the molded structure |
US6831352B1 (en) * | 1998-10-22 | 2004-12-14 | Azimuth Industrial Company, Inc. | Semiconductor package for high frequency performance |
US6589820B1 (en) | 2000-06-16 | 2003-07-08 | Micron Technology, Inc. | Method and apparatus for packaging a microelectronic die |
US6610924B1 (en) * | 2000-07-25 | 2003-08-26 | Advanced Semiconductor Engineering, Inc. | Semiconductor package |
US6483044B1 (en) * | 2000-08-23 | 2002-11-19 | Micron Technology, Inc. | Interconnecting substrates for electrical coupling of microelectronic components |
US6979595B1 (en) * | 2000-08-24 | 2005-12-27 | Micron Technology, Inc. | Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices |
US6838760B1 (en) * | 2000-08-28 | 2005-01-04 | Micron Technology, Inc. | Packaged microelectronic devices with interconnecting units |
TW525274B (en) * | 2001-03-05 | 2003-03-21 | Samsung Electronics Co Ltd | Ultra thin semiconductor package having different thickness of die pad and leads, and method for manufacturing the same |
US20040113240A1 (en) | 2002-10-11 | 2004-06-17 | Wolfgang Hauser | An electronic component with a leadframe |
US20080052878A1 (en) * | 2006-08-31 | 2008-03-06 | Lewis Jeffrey C | Fastener Clip with Seal |
US7833456B2 (en) | 2007-02-23 | 2010-11-16 | Micron Technology, Inc. | Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece |
DE102007019096B4 (de) * | 2007-04-23 | 2015-03-12 | Continental Automotive Gmbh | Elektronikgehäuse |
GB0714034D0 (en) * | 2007-07-18 | 2007-08-29 | Deepstream Technologies Ltd | Improvements in and relating to manufacture of electrical circuits for electrical components |
US11744020B2 (en) * | 2021-11-30 | 2023-08-29 | Texas Instruments Incorporated | Mechanically bridged SMD interconnects for electronic devices |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL189379C (nl) * | 1977-05-05 | 1993-03-16 | Richardus Henricus Johannes Fi | Werkwijze voor inkapselen van micro-elektronische elementen. |
JPS5577160A (en) * | 1978-12-07 | 1980-06-10 | Nec Corp | Semiconductor device |
JPS5879739A (ja) * | 1981-11-05 | 1983-05-13 | Toshiba Corp | 半導体外囲器 |
JPS59208764A (ja) * | 1983-05-12 | 1984-11-27 | Clarion Co Ltd | 半導体装置 |
JPS6129157A (ja) * | 1984-07-19 | 1986-02-10 | Seiko Epson Corp | 半導体装置 |
JPS61184855A (ja) * | 1985-02-13 | 1986-08-18 | Oki Electric Ind Co Ltd | 樹脂封止形半導体装置 |
JPS61191055A (ja) * | 1985-02-20 | 1986-08-25 | Toshiba Corp | 樹脂封止型半導体装置 |
JPH0642483B2 (ja) * | 1985-03-13 | 1994-06-01 | 松下電子工業株式会社 | 金属配線層の形成方法 |
JPS6242548A (ja) * | 1985-08-20 | 1987-02-24 | Fujitsu Ltd | 半導体装置 |
JPS61166052A (ja) * | 1986-01-20 | 1986-07-26 | Hitachi Ltd | 樹脂モールド半導体デバイス |
-
1987
- 1987-12-18 US US07/134,708 patent/US4855807A/en not_active Expired - Lifetime
- 1987-12-23 DE DE87311419T patent/DE3786070T2/de not_active Expired - Lifetime
- 1987-12-23 EP EP87311419A patent/EP0273725B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE3786070T2 (de) | 1994-01-05 |
EP0273725A3 (en) | 1988-08-31 |
EP0273725A2 (de) | 1988-07-06 |
EP0273725B1 (de) | 1993-06-02 |
US4855807A (en) | 1989-08-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) |