DE3767362D1 - Wafer-traeger fuer halbleiterbauteilerzeugung. - Google Patents

Wafer-traeger fuer halbleiterbauteilerzeugung.

Info

Publication number
DE3767362D1
DE3767362D1 DE8787107139T DE3767362T DE3767362D1 DE 3767362 D1 DE3767362 D1 DE 3767362D1 DE 8787107139 T DE8787107139 T DE 8787107139T DE 3767362 T DE3767362 T DE 3767362T DE 3767362 D1 DE3767362 D1 DE 3767362D1
Authority
DE
Germany
Prior art keywords
semiconductor component
wafer support
component production
production
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787107139T
Other languages
English (en)
Inventor
Akira Machida
Akira Abiru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3767362D1 publication Critical patent/DE3767362D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02Storage devices
    • B65G1/04Storage devices mechanical
    • B65G1/0471Storage devices mechanical with access from beneath
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/14Wafer cassette transporting
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S55/00Gas separation
    • Y10S55/18Work bench
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S55/00Gas separation
    • Y10S55/29Air curtains

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Packaging Frangible Articles (AREA)
DE8787107139T 1986-05-19 1987-05-18 Wafer-traeger fuer halbleiterbauteilerzeugung. Expired - Fee Related DE3767362D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61115391A JPH0736418B2 (ja) 1986-05-19 1986-05-19 ウエーハキャリア

Publications (1)

Publication Number Publication Date
DE3767362D1 true DE3767362D1 (de) 1991-02-21

Family

ID=14661386

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787107139T Expired - Fee Related DE3767362D1 (de) 1986-05-19 1987-05-18 Wafer-traeger fuer halbleiterbauteilerzeugung.

Country Status (5)

Country Link
US (1) US4770680A (de)
EP (1) EP0246587B1 (de)
JP (1) JPH0736418B2 (de)
KR (1) KR900004050B1 (de)
DE (1) DE3767362D1 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3637880C2 (de) * 1986-11-06 1994-09-01 Meissner & Wurst Transportierbares Behältnis zur Handhabung von Halbleiterelementen während ihrer Herstellung sowie Verfahren zur partikelfreien Übergabe von Produkten
US4934920A (en) * 1987-06-17 1990-06-19 Mitsubishi Denki Kabushiki Kaisha Apparatus for producing semiconductor device
US4927438A (en) * 1987-12-01 1990-05-22 Varian Associates, Inc. Horizontal laminar air flow work station
EP0319145A3 (de) * 1987-12-01 1991-05-29 Varian Associates, Inc. Arbeitsplatz mit horizontaler wirbelfreier Luftströmung
JPH01240291A (ja) * 1988-03-22 1989-09-25 Texas Instr Japan Ltd ロボット
JPH0451544A (ja) * 1990-06-19 1992-02-20 Fujitsu Ltd ウエハ収納器
US5238503A (en) * 1991-04-09 1993-08-24 International Business Machines Corporation Device for decontaminating a semiconductor wafer container
US5380503A (en) * 1992-03-13 1995-01-10 Ebara Research Co., Ltd. Stocker
FR2697000B1 (fr) * 1992-10-16 1994-11-25 Commissariat Energie Atomique Boîte plate de confinement d'un objet plat sous atmosphère spéciale.
DE4310149C2 (de) * 1993-03-29 1996-05-02 Jenoptik Jena Gmbh Einrichtung zur Handhabung von scheibenförmigen Objekten in einer Handhabungsebene eines lokalen Reinraumes
US5570987A (en) * 1993-12-14 1996-11-05 W. L. Gore & Associates, Inc. Semiconductor wafer transport container
US5713711A (en) * 1995-01-17 1998-02-03 Bye/Oasis Multiple interface door for wafer storage and handling container
US5833726A (en) * 1995-05-26 1998-11-10 Extraction System, Inc. Storing substrates between process steps within a processing facility
US5910727A (en) * 1995-11-30 1999-06-08 Tokyo Electron Limited Electrical inspecting apparatus with ventilation system
US5843196A (en) * 1997-01-21 1998-12-01 International Business Machines Corporation Ultra-clean transport carrier
KR100576758B1 (ko) * 1997-11-28 2006-05-03 가부시키가이샤 에바라 세이사꾸쇼 반도체기판용 반송박스
US6284020B1 (en) * 1997-12-02 2001-09-04 Kabushiki Kaisha Toshiba Method of maintaining cleanliness of substrates and box for accommodating substrates
US6521007B1 (en) 1997-12-03 2003-02-18 Ebara Corporation Clean box
JP3916380B2 (ja) * 1999-07-06 2007-05-16 株式会社荏原製作所 基板搬送容器待機ステーション
JP3998386B2 (ja) * 2000-01-26 2007-10-24 三菱電機株式会社 液晶表示装置の製造装置および液晶表示装置の製造方法
JP3871508B2 (ja) 2000-11-15 2007-01-24 株式会社荏原製作所 基板搬送容器の給電装置
JP2002313867A (ja) * 2001-02-09 2002-10-25 Toshiba Corp 半導体装置の製造方法
JP2002299427A (ja) * 2001-03-29 2002-10-11 Mitsubishi Electric Corp 基板カセット、基板汚染防止装置および半導体装置の製造方法
US6875282B2 (en) 2001-05-17 2005-04-05 Ebara Corporation Substrate transport container
DE10254762A1 (de) * 2002-11-22 2004-06-09 Transcoject Gesellschaft für medizinische Geräte mbH & Co. KG Verfahren zur Herstellung und/oder Handhabung eines hochreinen Gegenstandes
JP4597137B2 (ja) * 2004-09-27 2010-12-15 三菱電機株式会社 半導体製造装置および半導体製造方法
US20080156679A1 (en) * 2006-12-08 2008-07-03 Bonora Anthony C Environmental isolation system for flat panel displays
US20090016862A1 (en) * 2007-07-12 2009-01-15 Gould Richard H Method and apparatus for providing flat panel display environmental isolation
CN103502508B (zh) 2010-12-30 2016-04-27 维易科仪器公司 使用承载器扩展的晶圆加工
CN102364668B (zh) * 2011-10-28 2014-08-13 北京太阳能电力研究院有限公司 硅片料盒以及硅片上料装置
KR102249316B1 (ko) 2014-08-18 2021-05-07 삼성전자주식회사 웨이퍼 캐리어
JP2016219620A (ja) * 2015-05-21 2016-12-22 ルネサスエレクトロニクス株式会社 半導体装置の製造方法およびそれに用いられるfoup

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3534862A (en) * 1968-09-13 1970-10-20 Rca Corp Semiconductor wafer transporting jig
DE2133877A1 (de) * 1971-07-07 1973-01-18 Siemens Ag Anordnung zum eindiffundieren von dotierstoffen in halbleiterscheiben
US4018183A (en) * 1973-11-15 1977-04-19 U.S. Philips Corporation Apparatus for treating a plurality of semiconductor slices to a reacting gas current
US4098923A (en) * 1976-06-07 1978-07-04 Motorola, Inc. Pyrolytic deposition of silicon dioxide on semiconductors using a shrouded boat
JPS5320867A (en) * 1976-08-11 1978-02-25 Hitachi Ltd Housing and conveying machine of articles
US4037830A (en) * 1976-09-07 1977-07-26 International Business Machines Corporation Wafer handler
US4232063A (en) * 1978-11-14 1980-11-04 Applied Materials, Inc. Chemical vapor deposition reactor and process
US4228902A (en) * 1979-02-21 1980-10-21 Kasper Instruments, Inc. Carrier for semiconductive wafers
JPS55134239A (en) * 1979-04-04 1980-10-18 Toshiba Corp Clean box
US4256229A (en) * 1979-09-17 1981-03-17 Rockwell International Corporation Boat for wafer processing
JPS57141928A (en) * 1981-01-15 1982-09-02 Fluoroware Inc Wafer treating container
US4412849A (en) * 1981-04-09 1983-11-01 Klenzaids Engineers Private Limited Method and apparatus for control of gas-borne particulates
JPS5939019A (ja) * 1982-08-27 1984-03-03 Hitachi Ltd クリ−ン保管箱
JPS5969919A (ja) * 1982-10-15 1984-04-20 Yamato Scient Co Ltd クリ−ンベンチの風速制御装置
JPS59172713A (ja) * 1983-03-22 1984-09-29 Nec Corp 可搬型清浄容器
JPS60206017A (ja) * 1984-03-30 1985-10-17 Toshiba Corp 清浄搬送システム
US4582020A (en) * 1984-05-04 1986-04-15 Anicon, Inc. Chemical vapor deposition wafer boat
JPS6162740A (ja) * 1984-09-03 1986-03-31 Sanki Eng Co Ltd クリ−ントンネル送風清浄装置
US4666429A (en) * 1986-02-26 1987-05-19 Intelligent Medicine, Inc. Infusion device having improved valving apparatus

Also Published As

Publication number Publication date
KR900004050B1 (en) 1990-06-09
EP0246587B1 (de) 1991-01-16
EP0246587A1 (de) 1987-11-25
US4770680A (en) 1988-09-13
JPH0736418B2 (ja) 1995-04-19
KR870011668A (ko) 1987-12-26
JPS62269334A (ja) 1987-11-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee