DE3773761D1 - Umladevorrichtung fuer wafer. - Google Patents

Umladevorrichtung fuer wafer.

Info

Publication number
DE3773761D1
DE3773761D1 DE8787108515T DE3773761T DE3773761D1 DE 3773761 D1 DE3773761 D1 DE 3773761D1 DE 8787108515 T DE8787108515 T DE 8787108515T DE 3773761 T DE3773761 T DE 3773761T DE 3773761 D1 DE3773761 D1 DE 3773761D1
Authority
DE
Germany
Prior art keywords
wafer
loading device
loading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787108515T
Other languages
English (en)
Inventor
Taturo Fujitsu Limite Kawabata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3773761D1 publication Critical patent/DE3773761D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138—Wafers positioned vertically within cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE8787108515T 1986-06-26 1987-06-12 Umladevorrichtung fuer wafer. Expired - Fee Related DE3773761D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61150323A JPS636857A (ja) 1986-06-26 1986-06-26 ウエ−ハ移し替え装置

Publications (1)

Publication Number Publication Date
DE3773761D1 true DE3773761D1 (de) 1991-11-21

Family

ID=15494508

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787108515T Expired - Fee Related DE3773761D1 (de) 1986-06-26 1987-06-12 Umladevorrichtung fuer wafer.

Country Status (5)

Country Link
US (1) US4744715A (de)
EP (1) EP0250990B1 (de)
JP (1) JPS636857A (de)
KR (1) KR900004442B1 (de)
DE (1) DE3773761D1 (de)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3637880C2 (de) * 1986-11-06 1994-09-01 Meissner & Wurst Transportierbares Behältnis zur Handhabung von Halbleiterelementen während ihrer Herstellung sowie Verfahren zur partikelfreien Übergabe von Produkten
US4955775A (en) * 1987-12-12 1990-09-11 Tel Sagami Limited Semiconductor wafer treating apparatus
FR2624839B1 (fr) * 1987-12-22 1990-06-01 Recif Sa Appareil pour le transfert horizontal de plaquettes de silicium notamment
US4856957A (en) * 1988-01-11 1989-08-15 Mactronix, Inc. Semiconductor wafer transfer apparatus with back-to-back positioning and separation
JP3006714B2 (ja) * 1988-12-02 2000-02-07 東京エレクトロン株式会社 縦型基板移載装置及び縦型熱処理装置並びに縦型熱処理装置における基板移載方法
US4927313A (en) * 1989-02-21 1990-05-22 Westinghouse Electric Corp. Nuclear fuel pellet sintering boat unloading apparatus and method
FR2656599B1 (fr) * 1989-12-29 1992-03-27 Commissariat Energie Atomique Dispositif de rangement d'objets plats dans une cassette avec rayonnages intermediaires.
KR940003241B1 (ko) * 1991-05-23 1994-04-16 금성일렉트론 주식회사 To-220 반도체 제조기의 리드프레임 자동 공급장치
US5246528A (en) * 1991-05-31 1993-09-21 Shin-Etsu Handotai Co., Ltd. Automatic wafer etching method and apparatus
US5299901A (en) * 1992-04-16 1994-04-05 Texas Instruments Incorporated Wafer transfer machine
TW245823B (de) * 1992-10-05 1995-04-21 Tokyo Electron Co Ltd
JP2812642B2 (ja) * 1993-07-01 1998-10-22 三菱電機株式会社 ウエハ整列機
US5766824A (en) * 1993-07-16 1998-06-16 Semiconductor Systems, Inc. Method and apparatus for curing photoresist
EP0634699A1 (de) * 1993-07-16 1995-01-18 Semiconductor Systems, Inc. Gruppiertes fotolithografisches System
US5443348A (en) * 1993-07-16 1995-08-22 Semiconductor Systems, Inc. Cassette input/output unit for semiconductor processing system
US5570987A (en) * 1993-12-14 1996-11-05 W. L. Gore & Associates, Inc. Semiconductor wafer transport container
WO1995030239A2 (en) * 1994-04-28 1995-11-09 Semitool, Incorporated Semiconductor processing system with wafer container docking and loading station
US6833035B1 (en) * 1994-04-28 2004-12-21 Semitool, Inc. Semiconductor processing system with wafer container docking and loading station
US6712577B2 (en) * 1994-04-28 2004-03-30 Semitool, Inc. Automated semiconductor processing system
US5544421A (en) * 1994-04-28 1996-08-13 Semitool, Inc. Semiconductor wafer processing system
US5525024A (en) * 1994-08-17 1996-06-11 Applied Materials, Inc. Cassette loader having compound translational motion
US5713711A (en) * 1995-01-17 1998-02-03 Bye/Oasis Multiple interface door for wafer storage and handling container
US5658123A (en) * 1995-09-15 1997-08-19 Advanced Micro Devices, Inc. Container-less transfer of semiconductor wafers through a barrier between fabrication areas
DE19535617A1 (de) * 1995-09-25 1997-03-27 Siemens Ag System zum Transport von Testboards
US6036426A (en) * 1996-01-26 2000-03-14 Creative Design Corporation Wafer handling method and apparatus
US6942738B1 (en) 1996-07-15 2005-09-13 Semitool, Inc. Automated semiconductor processing system
US6723174B2 (en) 1996-03-26 2004-04-20 Semitool, Inc. Automated semiconductor processing system
TW331550B (en) * 1996-08-14 1998-05-11 Tokyo Electron Co Ltd The cassette receiving room
TW353772B (en) * 1996-09-09 1999-03-01 Tokyo Electron Ltd Workpiece relaying apparatus
JPH10139159A (ja) * 1996-11-13 1998-05-26 Tokyo Electron Ltd カセットチャンバ及びカセット搬入搬出機構
US6157866A (en) * 1997-06-19 2000-12-05 Advanced Micro Devices, Inc. Automated material handling system for a manufacturing facility divided into separate fabrication areas
US6183186B1 (en) 1997-08-29 2001-02-06 Daitron, Inc. Wafer handling system and method
US5915910A (en) * 1997-08-29 1999-06-29 Daitron, Inc. Semiconductor wafer transfer method and apparatus
JP4274601B2 (ja) * 1998-07-08 2009-06-10 昌之 都田 基体の移載装置及びその操作方法
GB2343436A (en) * 1998-11-03 2000-05-10 Garbuio Spa Unloading open top containers by tipping
DE60033056D1 (de) * 1999-12-02 2007-03-08 Asyst Technologies Wafer fördersystem
EP1332349A4 (de) * 2000-07-07 2008-12-17 Semitool Inc Automatisiertes verarbeitungssystem
FR2835337B1 (fr) * 2002-01-29 2004-08-20 Recif Sa Procede et dispositif d'identification de caracteres inscrits sur une plaque de semi-conducteur comportant au moins une marque d'orientation
DE102007018634B8 (de) * 2007-04-19 2008-11-27 Siemens Ag Vorrichtung und Verfahren zum Entladen eines Behälters
EP2194012B1 (de) * 2008-12-04 2012-07-25 Ingenieursbureau Moderniek B.V. Vorrichtung zum Entladen des Inhalts eines Behälters
CN102969262B (zh) * 2012-12-07 2017-03-01 上海集成电路研发中心有限公司 硅片倒片装置
US20150101290A1 (en) * 2013-10-16 2015-04-16 Gt Crystal Systems, Llc Transporting product from a product cartridge

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3949891A (en) * 1974-07-22 1976-04-13 Micro Glass Inc. Semiconductor wafer transfer device
CA1049662A (en) * 1977-01-25 1979-02-27 Michael J. E. Gillissie Apparatus and method for transferring semiconductor wafers
DE47132T1 (de) * 1980-09-02 1983-01-20 Heraeus Quarzschmelze Gmbh, 6450 Hanau Verfahren und geraet zum ueberfuehren von gegenstaenden zwischen traggliedern.
JPS59101847A (ja) * 1982-12-01 1984-06-12 Seiko Instr & Electronics Ltd 半導体ウエハの受取，受渡し装置
GB2138775B (en) * 1983-04-25 1987-02-04 Ruska Instr Corp Transferring e.g. semi-conductor wafers between carriers
US4603897A (en) * 1983-05-20 1986-08-05 Poconics International, Inc. Vacuum pickup apparatus
JPS59220445A (ja) * 1983-05-20 1984-12-11 バリアン・アソシエイツ・インコ−ポレイテツド 基底を通る入路を有するカセツトトロリ−
GB2156582A (en) * 1984-03-29 1985-10-09 Perkin Elmer Corp Small part transport system
DE3508516A1 (de) * 1985-03-09 1986-09-11 Wolfgang 6108 Weiterstadt Köhler Vorrichtung zum transportieren einer platte im reinraum

Also Published As

Publication number Publication date
KR900004442B1 (ko) 1990-06-25
EP0250990A1 (de) 1988-01-07
EP0250990B1 (de) 1991-10-16
JPS636857A (ja) 1988-01-12
US4744715A (en) 1988-05-17
KR880001047A (ko) 1988-03-31
JPH0355983B2 (de) 1991-08-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee