CA1049662A - Apparatus and method for transferring semiconductor wafers - Google Patents
Apparatus and method for transferring semiconductor wafersInfo
- Publication number
- CA1049662A CA1049662A CA270,412A CA270412A CA1049662A CA 1049662 A CA1049662 A CA 1049662A CA 270412 A CA270412 A CA 270412A CA 1049662 A CA1049662 A CA 1049662A
- Authority
- CA
- Canada
- Prior art keywords
- holder
- wafers
- boat
- rod
- etch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
Abstract
APPARATUS AND METHOD FOR TRANSFERRING
SEMICONDUCTOR WAFERS
Abstract of the Disclosure A modified etch boat acts as a transfer device for transferring wafers, in bulk. An etch boat has a longitudinal hole through one wall near the top edge, the hole periphery extending into Vee grooves in the etch boat. With wafers in the grooves, a rod inserted through the hole prevents wafers from falling out. With wafers in a storage box, the modified etch boat is positioned on the storage box, the whole inverted, and then the rod inserted after the wafers have transferred. The etch boat can then be inverted over a furnace boat, for example. After positioning on the furnace boat, with the wafers lifted slightly, the rod is removed and then the etch boat lifted off. The reverse operation is used to transfer from a furnace boat.
j
SEMICONDUCTOR WAFERS
Abstract of the Disclosure A modified etch boat acts as a transfer device for transferring wafers, in bulk. An etch boat has a longitudinal hole through one wall near the top edge, the hole periphery extending into Vee grooves in the etch boat. With wafers in the grooves, a rod inserted through the hole prevents wafers from falling out. With wafers in a storage box, the modified etch boat is positioned on the storage box, the whole inverted, and then the rod inserted after the wafers have transferred. The etch boat can then be inverted over a furnace boat, for example. After positioning on the furnace boat, with the wafers lifted slightly, the rod is removed and then the etch boat lifted off. The reverse operation is used to transfer from a furnace boat.
j
Description
~o~9~
This invention relates to apparatus for transferring semiconductor wafers, from one holder to another, and to a method of transfer using such apparatus.
In the processing, and storage, of semiconductor wafers, they have to be transferred back and forth between etch boats to furnace boats, and possibly to and from storage boxes. It is essential that absolute cleanliness be observed to avoid contamination and toward this end it is important to handle the wafers as little as possible - indeed handling, except with special implements, is to be avoided.
Also, wafers are treated in bulk, to reduce costs and to obtain a reasonable throughput. It is therefore ; desirable that the transfer of wafers be in bulk, to the extent: that one batch of wafers to be transferred at one time.
It has been proposed to use a transfer cassette to which the wafers are transferred, for example from a storage box or etch boat, the wafers then being transferred from the transfer cassette to, for example, a furnace boat. A transfer cassette is used to transfer wafers from a furnace boat back to an etch boat. During such transfers edge chipping can occur. Also, ; alignment between the various items is difficult. Movement can occur during turning over of cassette and boat, and, with 3" wafers, the apparatus is di-fficult to hold.
In accordance with the present invention, an etch boat is modified to form a holder and to accept a transversely extending rod or tube, inserted aFter wafers are in the boat~ which retains the wafers in position. The holder or etch boat is then turned over, and positioned over a furnace boat, the wafers fitting in slots or grooves in the furnace boat, and the rod or tube then removed - allowing removal of the etch boat. To return the wafers to the holder or etch boat, ::
' ' : . .: ' 9ti62 it is positioned over the furnace boat holding the wafers.
The rod or tube inserted and the holder or etch boat lifted of-f. The rod or tube, when in position, always retains the wafers in the holder or etch boat.
The invention will be readily understood by the following description in conjunction with the accompanying drawings, in which:-Figure 1 is a perspective view of an etchboat in accordance with the present invention, Figure 2 is a cross-section on the line II-II
of Figure 1, with rod in position;
Figure 3 is a similar cross-section to that of Figure 2, but with the etch boat turned upside down and wafers positioned in a furnace boat, Figure 4 is a similar cross-section to that of Figure 2, but with a storage box positioned on the etch boat, Figure 5 is a cross-section similar to that of Figur~ 4, illustrating the transfer of wafers from etch boat to storage box.
~-~ 20 As illustrated in Figure 1, an etch boat 10, for example molded of a plastic material such as polytetra-fluoroethylene (Teflon TM) to resist etchants, is in the form of a trough, open at the bottom and with parallel sides, the sides having a plurality of Vee shaped grooves 11 formed in the inner surfaces thereof. The grooves 11 are dimensioned to hold wafers, a wafer in each groove. Externally, the etch boat 10 has a flat top surface l2. The external shape may vary, but normally the boat is provided with a flat base to the sides, with a foot 13 at each corner. An end wall 14 connects the sides of the boat at one end and a bar 15 connects the sides at the other end. In use, wafers are placed i n the etch boat ~ . - . . , ~ ~ ~9 ~ 6 Z
and the whole inserte(l into the etch chamber.
The etch boat 10, can be a conventional boat, modified by the boring of a hole 16 longitudinally of the boat, breaking through into the Vee grooves 11 at a position above the maximum diameter of the wafers - as seen in Figure 2. A
rod or tube - not shown in Figure 1, is inserted into the hole 16.
Figure 2 illustrates the position of wafers 17 in the etch boat 10 and a rod 18 in the hole 16. As will be 10 seen, the rod 18, which can also be a tube, projects into ~ ~;
the grooves 11 at one side, just clear of the wafers 17.
For one particular transfer operation, transfer of wafers to a furnace boat, the rod 18 is inserted, as in Figure 2, and then the etch boat 10 inverted and positioned over a furnace boat, usually of quartz. This is illustrated in Figure 3, the quartz furnace boat shown at 20.
On inversion of the etch boat 10 the wafers 17 drop down a very small amount until they contact the rod 18. The etch boat is positioned over the furnace boat which has a series of transverse grooves or slots 21. The grooves 21 are Vee shaped looking in a direction parallel to the longitudinal axis of the boat, as seen in Figure 3, and are also of Vee shaped cross-section when viewed normal to the longitudinal axis.
This both centers and holds the wafers 17.
As the etch boat 10 is lowered onto the furnace ~ -boat 20, the wafers 17 enter the slots 21 and eventually are lifted slightly. The rod 18 is then removed and the etch boat lifted up virtually, leaving the wafers 17 standing in the furnace boat. ;
~emoval of the wafers from the furnace boat is the reverse of the above - positioning the etch boat over the wafers, insertion of the rod 18 and lifting the etch boat up and then turning over.
The operation of transferring wafers to a furnace boat and from a furnace boat is very quick and easy. The particular cross-sectional form of the grooves 11 and slots 21 provides for easy alignment. Edge chipping is avoided and no contamination From handling occurs.
The invention is also applicable to the transfer of wafers to and from other items, such as for example, storage boxes. Figures 4 and 5 illustrate such a transfer. In Figure 4, the wafers 17 are shown in the etch boat 10. The rod 18 is shown inserted although this is not essential. The storage box 25 is positioned on top of the boat 10 with the grooves 11 of the boat 10 aligned with similar grooves 26 in the storage box 25. The whole assembly is turned sideways, the rod 18 removed and then the assembly turned slightly farther until the storage box 25 is lower than the etch boat 10, as illustrated in Figure 5. The wafers 17 then roll or slide from the etch boat 10 into the storage box 25.
Wafers can be transferred from a storage box to an etch boat by the reverse of the above. The etch boat is aligned on top of the storage boat and then the whole rotated until the storage box is slightly higher than the etch boat, when the wafers will move down into the etch boat. The wafers can then be processed in the etch boat or transferred to, for example, a furnace boat. The use of the rod 18 occurs, as described previously. Thus the etch boat - 10 can also be used as a transfer device. Thus there is provided an arrangement for extremely easy and simple transferring wafers, with the minimum of apparatus, particularly without any additional items other than those actually used in processing, except for the rod 18.
, . . ~.
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104~
Alignment between the etch boat and other items can be by sight, as for example between etch boat and furnace boat, or small projections on the etch boat can be aligned with recesses in the other item, for example the storage box, as illustrated at 27 and 28 respectively in Figures 4 and 5.
The hole 16 is positioned in the wall of the etch boat such that when the rod 18 is inserted it overlaps ~ ~
the wafers 17 in all cases, even if it should happen that the ~:.
flat 30 - normally formed on wafers to provide orientation -: 10 should be at the side where the wafers is in the etch boat.
The actual steps carried out in using the ~ :
etch boat, as described above~ are illustrative only and VariatiDnS in a particular sequence of steps, and in the steps themselves, can occur, depending upon intentions and require~
ments.
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This invention relates to apparatus for transferring semiconductor wafers, from one holder to another, and to a method of transfer using such apparatus.
In the processing, and storage, of semiconductor wafers, they have to be transferred back and forth between etch boats to furnace boats, and possibly to and from storage boxes. It is essential that absolute cleanliness be observed to avoid contamination and toward this end it is important to handle the wafers as little as possible - indeed handling, except with special implements, is to be avoided.
Also, wafers are treated in bulk, to reduce costs and to obtain a reasonable throughput. It is therefore ; desirable that the transfer of wafers be in bulk, to the extent: that one batch of wafers to be transferred at one time.
It has been proposed to use a transfer cassette to which the wafers are transferred, for example from a storage box or etch boat, the wafers then being transferred from the transfer cassette to, for example, a furnace boat. A transfer cassette is used to transfer wafers from a furnace boat back to an etch boat. During such transfers edge chipping can occur. Also, ; alignment between the various items is difficult. Movement can occur during turning over of cassette and boat, and, with 3" wafers, the apparatus is di-fficult to hold.
In accordance with the present invention, an etch boat is modified to form a holder and to accept a transversely extending rod or tube, inserted aFter wafers are in the boat~ which retains the wafers in position. The holder or etch boat is then turned over, and positioned over a furnace boat, the wafers fitting in slots or grooves in the furnace boat, and the rod or tube then removed - allowing removal of the etch boat. To return the wafers to the holder or etch boat, ::
' ' : . .: ' 9ti62 it is positioned over the furnace boat holding the wafers.
The rod or tube inserted and the holder or etch boat lifted of-f. The rod or tube, when in position, always retains the wafers in the holder or etch boat.
The invention will be readily understood by the following description in conjunction with the accompanying drawings, in which:-Figure 1 is a perspective view of an etchboat in accordance with the present invention, Figure 2 is a cross-section on the line II-II
of Figure 1, with rod in position;
Figure 3 is a similar cross-section to that of Figure 2, but with the etch boat turned upside down and wafers positioned in a furnace boat, Figure 4 is a similar cross-section to that of Figure 2, but with a storage box positioned on the etch boat, Figure 5 is a cross-section similar to that of Figur~ 4, illustrating the transfer of wafers from etch boat to storage box.
~-~ 20 As illustrated in Figure 1, an etch boat 10, for example molded of a plastic material such as polytetra-fluoroethylene (Teflon TM) to resist etchants, is in the form of a trough, open at the bottom and with parallel sides, the sides having a plurality of Vee shaped grooves 11 formed in the inner surfaces thereof. The grooves 11 are dimensioned to hold wafers, a wafer in each groove. Externally, the etch boat 10 has a flat top surface l2. The external shape may vary, but normally the boat is provided with a flat base to the sides, with a foot 13 at each corner. An end wall 14 connects the sides of the boat at one end and a bar 15 connects the sides at the other end. In use, wafers are placed i n the etch boat ~ . - . . , ~ ~ ~9 ~ 6 Z
and the whole inserte(l into the etch chamber.
The etch boat 10, can be a conventional boat, modified by the boring of a hole 16 longitudinally of the boat, breaking through into the Vee grooves 11 at a position above the maximum diameter of the wafers - as seen in Figure 2. A
rod or tube - not shown in Figure 1, is inserted into the hole 16.
Figure 2 illustrates the position of wafers 17 in the etch boat 10 and a rod 18 in the hole 16. As will be 10 seen, the rod 18, which can also be a tube, projects into ~ ~;
the grooves 11 at one side, just clear of the wafers 17.
For one particular transfer operation, transfer of wafers to a furnace boat, the rod 18 is inserted, as in Figure 2, and then the etch boat 10 inverted and positioned over a furnace boat, usually of quartz. This is illustrated in Figure 3, the quartz furnace boat shown at 20.
On inversion of the etch boat 10 the wafers 17 drop down a very small amount until they contact the rod 18. The etch boat is positioned over the furnace boat which has a series of transverse grooves or slots 21. The grooves 21 are Vee shaped looking in a direction parallel to the longitudinal axis of the boat, as seen in Figure 3, and are also of Vee shaped cross-section when viewed normal to the longitudinal axis.
This both centers and holds the wafers 17.
As the etch boat 10 is lowered onto the furnace ~ -boat 20, the wafers 17 enter the slots 21 and eventually are lifted slightly. The rod 18 is then removed and the etch boat lifted up virtually, leaving the wafers 17 standing in the furnace boat. ;
~emoval of the wafers from the furnace boat is the reverse of the above - positioning the etch boat over the wafers, insertion of the rod 18 and lifting the etch boat up and then turning over.
The operation of transferring wafers to a furnace boat and from a furnace boat is very quick and easy. The particular cross-sectional form of the grooves 11 and slots 21 provides for easy alignment. Edge chipping is avoided and no contamination From handling occurs.
The invention is also applicable to the transfer of wafers to and from other items, such as for example, storage boxes. Figures 4 and 5 illustrate such a transfer. In Figure 4, the wafers 17 are shown in the etch boat 10. The rod 18 is shown inserted although this is not essential. The storage box 25 is positioned on top of the boat 10 with the grooves 11 of the boat 10 aligned with similar grooves 26 in the storage box 25. The whole assembly is turned sideways, the rod 18 removed and then the assembly turned slightly farther until the storage box 25 is lower than the etch boat 10, as illustrated in Figure 5. The wafers 17 then roll or slide from the etch boat 10 into the storage box 25.
Wafers can be transferred from a storage box to an etch boat by the reverse of the above. The etch boat is aligned on top of the storage boat and then the whole rotated until the storage box is slightly higher than the etch boat, when the wafers will move down into the etch boat. The wafers can then be processed in the etch boat or transferred to, for example, a furnace boat. The use of the rod 18 occurs, as described previously. Thus the etch boat - 10 can also be used as a transfer device. Thus there is provided an arrangement for extremely easy and simple transferring wafers, with the minimum of apparatus, particularly without any additional items other than those actually used in processing, except for the rod 18.
, . . ~.
.
~, . . ...................................... .
104~
Alignment between the etch boat and other items can be by sight, as for example between etch boat and furnace boat, or small projections on the etch boat can be aligned with recesses in the other item, for example the storage box, as illustrated at 27 and 28 respectively in Figures 4 and 5.
The hole 16 is positioned in the wall of the etch boat such that when the rod 18 is inserted it overlaps ~ ~
the wafers 17 in all cases, even if it should happen that the ~:.
flat 30 - normally formed on wafers to provide orientation -: 10 should be at the side where the wafers is in the etch boat.
The actual steps carried out in using the ~ :
etch boat, as described above~ are illustrative only and VariatiDnS in a particular sequence of steps, and in the steps themselves, can occur, depending upon intentions and require~
ments.
`.;" ~ ~ .
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.,' ". ~'.
.
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Claims (9)
EXCLUSIVE PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS
FOLLOWS:-
1. Apparatus for transferring semiconductor wafers, comprising:-a holder of trough shaped cross-section, having a base and top, and sides extending longitudinally of the holder;
a plurality of Vee shaped grooves in an inner surface of each of said sides, said grooves adjacent to each other and spaced in a parallel array along the holder, for reception of a semiconductor wafer in each groove, and a hole extending longitudinally through the holder at one side thereof, the hole near the top surface at said side, the periphery of the hole extending into said grooves, the arrangement such that a rod inserted in the hole extends over the periphery of wafers positioned in said grooves to retain said wafers therein.
a plurality of Vee shaped grooves in an inner surface of each of said sides, said grooves adjacent to each other and spaced in a parallel array along the holder, for reception of a semiconductor wafer in each groove, and a hole extending longitudinally through the holder at one side thereof, the hole near the top surface at said side, the periphery of the hole extending into said grooves, the arrangement such that a rod inserted in the hole extends over the periphery of wafers positioned in said grooves to retain said wafers therein.
2. Apparatus as claimed in claim 1, said trough having an open base.
3. Apparatus as claimed in claim 2, said holder an etch boat and having a flat base surface to each of said sides.
4. Apparatus as claimed in claim 1, including locating means on said top surfaces, for cooperation with locating means on other holders.
5. Apparatus as claimed in claim 1, said top surfaces being flat.
6. A method of transferring semiconductor wafers, comprising:-providing a holder of trough shaped cross-section having a plurality of Vee shaped grooves therein and a hole extending longitudinally of the holder adjacent a top surface, the periphery of said hole extending into said grooves;
positioning a plurality of wafers in said grooves in said holder, a wafer in each groove, and inserting a rod through said hole to retain said wafers in said holder in an inverted position.
positioning a plurality of wafers in said grooves in said holder, a wafer in each groove, and inserting a rod through said hole to retain said wafers in said holder in an inverted position.
7. A method as claimed in claim 6, said wafers initially positioned in a further holder, including positioning said holder over said further holder, inverting said holder and further holder to transfer said wafers from said further holder to said holder, inserting said rod and removing said further holder, inverting said holder and wafers over a third holder for said wafers, and removing said rod.
8. A method as claimed in claim 7, said wafers entering Vee shaped grooves in said third holder and lifting said wafers clear of said rod prior to removing said rod, including lifting said holder clear of said third holder and wafers after removing said rod.
9. A method as claimed in claim 6, said wafers positioned in a further holder, including positioning said holder over said further holder, the wafers extending up into said holder, the peripheries of said wafers above said hole, inserting said rod, and lifting said holder and wafer from said further holder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA270,412A CA1049662A (en) | 1977-01-25 | 1977-01-25 | Apparatus and method for transferring semiconductor wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA270,412A CA1049662A (en) | 1977-01-25 | 1977-01-25 | Apparatus and method for transferring semiconductor wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1049662A true CA1049662A (en) | 1979-02-27 |
Family
ID=4107812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA270,412A Expired CA1049662A (en) | 1977-01-25 | 1977-01-25 | Apparatus and method for transferring semiconductor wafers |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA1049662A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0250990A1 (en) * | 1986-06-26 | 1988-01-07 | Fujitsu Limited | Wafer transfer apparatus |
| EP1480256A2 (en) * | 1995-06-26 | 2004-11-24 | Miraial Co., Ltd. | Thin-plate supporting container |
| CN110921277A (en) * | 2019-12-25 | 2020-03-27 | 曾玲 | Rewinding device and rewinding method |
-
1977
- 1977-01-25 CA CA270,412A patent/CA1049662A/en not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0250990A1 (en) * | 1986-06-26 | 1988-01-07 | Fujitsu Limited | Wafer transfer apparatus |
| US4744715A (en) * | 1986-06-26 | 1988-05-17 | Fujitsu Limited | Wafer transfer apparatus |
| EP1480256A2 (en) * | 1995-06-26 | 2004-11-24 | Miraial Co., Ltd. | Thin-plate supporting container |
| EP1480256A3 (en) * | 1995-06-26 | 2004-12-15 | Miraial Co., Ltd. | Thin-plate supporting container |
| CN110921277A (en) * | 2019-12-25 | 2020-03-27 | 曾玲 | Rewinding device and rewinding method |
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