JPH04142758A - Semiconductor substrate housing carrier - Google Patents
Semiconductor substrate housing carrierInfo
- Publication number
- JPH04142758A JPH04142758A JP2266783A JP26678390A JPH04142758A JP H04142758 A JPH04142758 A JP H04142758A JP 2266783 A JP2266783 A JP 2266783A JP 26678390 A JP26678390 A JP 26678390A JP H04142758 A JPH04142758 A JP H04142758A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- slot
- slots
- carrier
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 48
- 239000000758 substrate Substances 0.000 title claims abstract description 47
- 230000000694 effects Effects 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 239000012050 conventional carrier Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体基板収納用キャリアに関し、特に半導体
集積回路製造工程で使用する半導体基板収納用キャリア
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a carrier for storing semiconductor substrates, and particularly to a carrier for storing semiconductor substrates used in a semiconductor integrated circuit manufacturing process.
従来の半導体基板収納用キャリアは、複数のスロットが
半導体基板収納用キャリア本体と一体に形成され、固定
された状態になっている。そして、半導体基板は各スロ
ットに一枚ずつ収納される。半導体基板の収納されたス
ロットは、半導体基板収納用キャリアと一体化している
為、可動ではない。この為、各スロットに収納された半
導体基板を個別に観察したり移動したりする場合は、半
導体基板収納用キャリアのスロットに納められた半導体
基板を、ビンセットあるいは真空ビンセットによって取
り出す必要がある。In a conventional semiconductor substrate storage carrier, a plurality of slots are formed integrally with the semiconductor substrate storage carrier body and are in a fixed state. Then, one semiconductor substrate is stored in each slot. The slot in which the semiconductor substrate is stored is not movable because it is integrated with the semiconductor substrate storage carrier. Therefore, if you want to individually observe or move the semiconductor substrates stored in each slot, it is necessary to take out the semiconductor substrates stored in the slots of the semiconductor substrate storage carrier using a bin set or a vacuum bin set. .
この従来の半導体基板収納用キャリアでは、度収納した
半導体基板を観察しようとする場合は、ピンセットある
いは真空ピンセットを用いて半導体基板を半導体基板収
納用キャリアから取り出すという方法をとらざるを得な
い。この場合、半導体基板の落下及び接触等により、半
導体基板の割れ、欠け、傷が発生し易いという問題点が
あった。In this conventional carrier for storing semiconductor substrates, when it is desired to observe a semiconductor substrate that has been stored, it is necessary to use tweezers or vacuum tweezers to take out the semiconductor substrate from the carrier for storing semiconductor substrates. In this case, there is a problem in that the semiconductor substrate is likely to be cracked, chipped, or scratched due to dropping or contact with the semiconductor substrate.
本発明の半導体基板収納用キャリアは、キャリア本体の
内側に複数のスロット部ガイド溝を水平に対向配置し、
このガイド溝にはまる複数のコの字型のスロット部を設
け、各スロット部は内側に半導体基板を乗せる対向溝を
有し前記キャリア本体に出し入れ可能とした構造を有す
る。The carrier for storing semiconductor substrates of the present invention has a plurality of slot portion guide grooves arranged horizontally and oppositely inside the carrier body,
A plurality of U-shaped slot portions are provided to fit into the guide groove, and each slot portion has an opposing groove on the inside for placing a semiconductor substrate, and has a structure that allows the carrier body to be inserted into and removed from the carrier body.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の実施例１の半導体基板収納用キャリア
の斜視図である。第２図は第１図の水平断面図である。FIG. 1 is a perspective view of a carrier for storing semiconductor substrates according to a first embodiment of the present invention. FIG. 2 is a horizontal sectional view of FIG. 1.
半導体基板収納用キャリア本体１には、図に示す様に左
右一対のレール状のスロット部ガイド３がスロット部２
と同数分だけ備えられている。コの字型に形成されたス
ロット部２には、スロット部ガイド３にはまる溝が設け
られており、スロット部２の一端に設けられたスロット
部取手４をつかみ水平に引き出す事ができる。スロット
部２には半導体基板を収納する溝か対向配置され、半導
体基板が収納されている状態で、スロット部ガイド３に
沿って水平に引き出す事が可能である。通常はスロット
部２は半導体基板収納キャリア本体１に収納されており
、スロット部２の背面に取り付けられた磁性体が半導体
基板収納キャリア本体１内部の金属面に吸着し固定され
ている。第３図は本発明の実施例２の半導体基板収納用
キャリアの斜視図である。第４図は第３図の水平断面図
である。本実施例では、各スロット部２の半導体基板収
納溝の下面が上面に比べ広くなっている為、半導体基板
を乗せたときにより安定度が高くなり、半導体基板が多
少欠けていても問題無く支える事が可能である。また、
半導体基板を乗せたときの安定性が良い為、半導体基板
を乗せた状態でスロット部２を引き抜き、そのまま持ち
運びが可能となる。この為、ピンセット及び真空ピンセ
ット等を使用する必要が無くなる。As shown in the figure, in the carrier body 1 for storing semiconductor substrates, a pair of left and right rail-shaped slot portion guides 3 are provided in the slot portion 2.
The same number of units are provided. The U-shaped slot portion 2 is provided with a groove into which the slot portion guide 3 fits, and the slot portion handle 4 provided at one end of the slot portion 2 can be grasped and pulled out horizontally. A groove for accommodating a semiconductor substrate is disposed facing the slot portion 2, and it is possible to horizontally pull out the semiconductor substrate along the slot portion guide 3 while the semiconductor substrate is accommodated therein. Normally, the slot portion 2 is housed in the semiconductor substrate storage carrier body 1, and a magnetic material attached to the back surface of the slot portion 2 is attracted and fixed to a metal surface inside the semiconductor substrate storage carrier body 1. FIG. 3 is a perspective view of a carrier for storing semiconductor substrates according to a second embodiment of the present invention. FIG. 4 is a horizontal sectional view of FIG. 3. In this embodiment, since the lower surface of the semiconductor substrate storage groove of each slot portion 2 is wider than the upper surface, the stability when the semiconductor substrate is placed is higher, and even if the semiconductor substrate is slightly chipped, it can be supported without any problem. things are possible. Also,
Since the device has good stability when a semiconductor substrate is placed on it, it is possible to pull out the slot portion 2 with the semiconductor substrate placed thereon and carry it as is. Therefore, there is no need to use tweezers, vacuum tweezers, etc.
以上説明した様に本発明は、半導体基板収納用キャリア
から半導体基板を収納した状態でスロット部を引き抜く
事が可能な為、半導体基板収納用キャリア内の特定の半
導体基板を取り出したり移動させたい場合に、ピンセッ
ト及び真空ピンセットを使用しなくても良い。この為、
半導体基板の割れや欠けが減少するという効果がある。As explained above, the present invention allows the slot portion to be pulled out from the semiconductor substrate storage carrier with the semiconductor substrate stored therein, so when a specific semiconductor substrate in the semiconductor substrate storage carrier is desired to be taken out or moved. There is no need to use tweezers or vacuum tweezers. For this reason,
This has the effect of reducing cracks and chips in the semiconductor substrate.
第１図は本発明の実施例１の斜視図、第２図は第１図の
水平断面図、第３図は本発明の実施例２の斜視図、第４
図は第３図の水平断面図である。
１・・・半導体基板収納用キャリア本体、２・・・スロ
ット部、３・・・スロット部ガイド、４・・・スロット
部取手、５・・・磁性体。FIG. 1 is a perspective view of Embodiment 1 of the present invention, FIG. 2 is a horizontal sectional view of FIG. 1, FIG. 3 is a perspective view of Embodiment 2 of the present invention, and FIG.
The figure is a horizontal sectional view of FIG. 3. DESCRIPTION OF SYMBOLS 1... Carrier main body for semiconductor board storage, 2... Slot part, 3... Slot part guide, 4... Slot part handle, 5... Magnetic material.
Claims (1)
ロット部ガイド溝を水平に対向配置し、このガイド溝に
はまる複数のコの字型のスロット部を設け、各スロット
部は内側に半導体基板を乗せる対向溝を有し前記キャリ
ア本体に出し入れ可能としたことを特徴とする半導体基
板収納用キャリア。A plurality of slot guide grooves are arranged horizontally and opposite each other on the inside of the carrier body that houses the semiconductor substrate, and a plurality of U-shaped slots that fit into the guide grooves are provided, and a semiconductor substrate is placed inside each slot. A carrier for storing semiconductor substrates, characterized in that it has opposing grooves and can be inserted into and removed from the carrier body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2266783A JPH04142758A (en) | 1990-10-04 | 1990-10-04 | Semiconductor substrate housing carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2266783A JPH04142758A (en) | 1990-10-04 | 1990-10-04 | Semiconductor substrate housing carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04142758A true JPH04142758A (en) | 1992-05-15 |
Family
ID=17435631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2266783A Pending JPH04142758A (en) | 1990-10-04 | 1990-10-04 | Semiconductor substrate housing carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04142758A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100245834B1 (en) * | 1996-07-03 | 2000-03-02 | 오오다 데쓰로 | Board rack and method for manufacturing the same |
| WO2010136568A1 (en) * | 2009-05-29 | 2010-12-02 | Schmid Technology Systems Gmbh | Device and method for stacking or transporting a plurality of flat substrates |
| CN103560103A (en) * | 2013-10-30 | 2014-02-05 | 武汉新芯集成电路制造有限公司 | Conveying device and method for safely conveying wafer to FOUP |
| JP6322741B1 (en) * | 2017-01-20 | 2018-05-09 | ▲き▼邦科技股▲分▼有限公司 | Wafer cassette |
-
1990
- 1990-10-04 JP JP2266783A patent/JPH04142758A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100245834B1 (en) * | 1996-07-03 | 2000-03-02 | 오오다 데쓰로 | Board rack and method for manufacturing the same |
| WO2010136568A1 (en) * | 2009-05-29 | 2010-12-02 | Schmid Technology Systems Gmbh | Device and method for stacking or transporting a plurality of flat substrates |
| US8337134B2 (en) | 2009-05-29 | 2012-12-25 | Schmid Technology Systems Gmbh | Device and method for stacking and/or conveying a plurality of flat substrates |
| CN103560103A (en) * | 2013-10-30 | 2014-02-05 | 武汉新芯集成电路制造有限公司 | Conveying device and method for safely conveying wafer to FOUP |
| JP6322741B1 (en) * | 2017-01-20 | 2018-05-09 | ▲き▼邦科技股▲分▼有限公司 | Wafer cassette |
| CN108336005A (en) * | 2017-01-20 | 2018-07-27 | 颀邦科技股份有限公司 | Wafer boat structure |
| US10242899B2 (en) | 2017-01-20 | 2019-03-26 | Chipbond Technology Corporation | Wafer cassette |
| TWI658980B (en) * | 2017-01-20 | 2019-05-11 | Chipbond Technology Corporation | Wafer cassette |
| CN108336005B (en) * | 2017-01-20 | 2020-06-16 | 颀邦科技股份有限公司 | Wafer boat structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6109677A (en) | Apparatus for handling and transporting plate like substrates | |
| JP4182521B2 (en) | Equipment for temporary loading, detention and unloading of containers | |
| TW201044487A (en) | Systems and methods for handling wafers | |
| WO2005044694A8 (en) | Tray for carrying substrate | |
| US4762353A (en) | Flexible carrier for semiconductor wafer cassettes | |
| JPH04142758A (en) | Semiconductor substrate housing carrier | |
| KR100874610B1 (en) | Semiconductor pick up apparatus and method of using the same | |
| JPH04144150A (en) | Cassette handling device | |
| US3700100A (en) | Package | |
| JP2002270683A (en) | Magazine case for semiconductor wafer | |
| US6058676A (en) | Lid guide for electronic devices | |
| JP2002093877A (en) | Semiconductor manufacturing device | |
| CA1049662A (en) | Apparatus and method for transferring semiconductor wafers | |
| JP2000040736A (en) | Wafer housing device | |
| JP3616552B2 (en) | Coin battery storage tray | |
| JPH0964162A (en) | Support container for thin plate | |
| WO1999013495A3 (en) | Sealed cabinet for storage of semiconductor wafers | |
| JPH08222622A (en) | Wafer carrier | |
| US6264404B1 (en) | System and method for hydrodynamic loading and unloading of objects into and out of substantially touchless hydrodynamic transport systems | |
| JP2504286B2 (en) | Electronic component chip storage cassette | |
| JP4405105B2 (en) | Seal member holder | |
| JP2514030Y2 (en) | Chip tray | |
| JPS6239821B2 (en) | ||
| JPH0528043U (en) | Wafer holding plate storage container | |
| JPH11199044A (en) | Semiconductor wafer carrier and semiconductor wafer conveying method |