JPS58144022A - Sheet material transfer jig - Google Patents
Sheet material transfer jigInfo
- Publication number
- JPS58144022A JPS58144022A JP2605882A JP2605882A JPS58144022A JP S58144022 A JPS58144022 A JP S58144022A JP 2605882 A JP2605882 A JP 2605882A JP 2605882 A JP2605882 A JP 2605882A JP S58144022 A JPS58144022 A JP S58144022A
- Authority
- JP
- Japan
- Prior art keywords
- cartridge
- stage
- arm
- plate
- slider
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
- H01L21/6779—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks the workpieces being stored in a carrier, involving loading and unloading
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Stacking Of Articles And Auxiliary Devices (AREA)
- Pile Receivers (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は板状物移換治具、特に半導体薄板（ウェハ）Ｖ
カー） ＩＪッジ間で移し換える移換治具に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a plate-shaped object transfer jig, particularly a semiconductor thin plate (wafer) V
(car) Concerning a transfer jig for transferring between IJ edges.
半導体装置の製造においては、ウェハＫ１１ｌｉ次各処
理を加えて所望の回路素子を形成する。ウェハはカート
リッジに並べて挿入されて取り扱われるが、保管運搬の
場合忙は汚染を防止するために窓のないカートリッジが
用いられ、エツチング、洗浄等には処理液等の流通を図
るために窓が多くかつ処理液に対して強い耐薬品性材質
からなるカー −トリッジが用いられている。In manufacturing semiconductor devices, the wafer K11li is subjected to various subsequent processes to form desired circuit elements. Wafers are inserted and handled side by side in cartridges, but for storage and transportation, cartridges without windows are used to prevent contamination, and for etching, cleaning, etc., cartridges are often equipped with windows to allow the flow of processing solutions, etc. In addition, a cartridge made of a chemically resistant material that is strong against the processing liquid is used.
このため、ウェハプロセスではウェハを充填した充填カ
ートリッジから空カートリッジにウェハを移し換える作
業が必要となり、従来は充填カートリッジの収容口に空
カートリッジの収容口を重ね合せた後、−緒に裏返、１
−″′Ｃウェハをその自重で空カートリッジに落下移動
させている。For this reason, in the wafer process, it is necessary to transfer wafers from a filled cartridge filled with wafers to an empty cartridge.
-'''C The wafer is dropped and moved into the empty cartridge by its own weight.
しかし、この方法はウェハを自重落下によって充填カー
トリッジから空カートリッジに移ｔ、換えるため、落下
時の衝撃によって割れたり、欠けたりしてウェハの損傷
が激ｔ７い欠点がある。However, this method has the drawback that the wafer is transferred from a filled cartridge to an empty cartridge by falling under its own weight, and the wafer is seriously damaged by cracking or chipping due to the impact of the fall.
また、ウェハ移換装置として自動機があるが、装置が大
樹りで高価である。Additionally, automatic machines are available as wafer transfer equipment, but the equipment is large and expensive.
したか９１、本発明の目的は充填カートリッジから空カ
ートリッジへの板状物の移し換え時に板状物が損傷し難
い簡便でかつ安価な板状物移換治具を提供することにあ
る。However, it is an object of the present invention to provide a simple and inexpensive plate-like object transfer jig in which the plate-like object is not easily damaged when transferring the plate-like object from a filled cartridge to an empty cartridge.
このような目的を達成するために本発明は、板状物を収
容した充填カートリッジから空カートリッジに板状物を
移し換える移換治具であって、前記カートリッジは一面
の収容口から板状物を挿入収容するとともに背面には押
出用孔を設けた構造として２くとともに、前記充填カー
トリッジと空力−トリッレをそれぞれ収容口を密着対面
させた状態で位置決め＊＊するステージと、このステー
ジに摺動自在に取り付けられるアームを有するスライダ
とからなり、前記スライダは前進操作によってアームの
先端を充填カートリッジの背中の押出用孔に突入して充
填カートリッジ内の板状物を空カートリッジに押し込む
ように構成されてなるものであって、以下実施例により
本発明を説゛明する。In order to achieve such an object, the present invention provides a transfer jig for transferring a plate-like object from a filled cartridge containing a plate-like object to an empty cartridge, wherein the cartridge transfers the plate-like object from a storage opening on one side. In addition to having a structure in which the filling cartridge and the aerodynamic trille are inserted and accommodated and an extrusion hole is provided on the back side, there is also a stage for positioning the filling cartridge and the aerodynamic trille with their respective accommodation openings closely facing each other, and a stage that slides onto this stage. and a slider having an arm that can be freely attached, and the slider is configured such that when the slider is moved forward, the tip of the arm enters the extrusion hole on the back of the filled cartridge to push the plate-like object in the filled cartridge into the empty cartridge. The present invention will be explained below with reference to Examples.
第１図は本発明の一実施例によるウェハ移換治は同じく
断面図である。FIG. 1 is a sectional view of a wafer transfer device according to an embodiment of the present invention.
このウェハ移換治具は、箱構造のステージ１と、このス
テージｌ内に摺動部２を有するとともにステージｌ上に
アーム３を突出させるスライダ４と、からなり、アーム
３の前進側のステージ１上にはアーム３の前進方向に沿
って充填カートリッジ載置ボジシ璽ン５．空カートリッ
ジ載置ポジショジ６が設けられている。カートリッジ７
は第１図に示すように、収容口８から平行状態で多数の
ウェハ９ｖ収容する構造となっている。ウェハ９はカー
トリッジ７の内側壁面に設けた溝（図示せず）Ｋｌ対の
周縁を挿入することによって収容される。This wafer transfer jig consists of a box-structured stage 1, a slider 4 having a sliding part 2 inside the stage 1, and projecting an arm 3 onto the stage 1, and a stage on the forward side of the arm 3. 1, there is a filling cartridge mounting body 5. along the forward direction of the arm 3. An empty cartridge mounting position 6 is provided. Cartridge 7
As shown in FIG. 1, the structure is such that a large number of wafers 9v are accommodated in parallel from an accommodation opening 8. The wafer 9 is accommodated by inserting the periphery of a pair of grooves (not shown) Kl provided in the inner wall surface of the cartridge 7.
充填カートリッジ載置ポジシーン５および空カートリッ
ジ載置ボジシ１ン６にはそれぞれ４本の位置決めビンｌ
Ｏが設けられ、それぞれカー） ＋７ンジ７を位置決め
する。カートリッジ７の一面は第２図で示すように、工
学形となっていることから中央線の両端部をそれぞれ１
対の位置決めビン１０で案内し１位置決めする。この際
、充填カートリッジ１１と空カートリッジ１２の収容口
は密着対面するようになる。さらに、カートリッジ７の
収容口８に対峙する背面には押出用孔１３が収容される
全ウェハに対面して設けられている。There are four positioning bins in each of the filled cartridge mounting position 5 and the empty cartridge mounting position 1 6.
O is provided to position the car) +7 and 7, respectively. As shown in Figure 2, one side of the cartridge 7 has an engineering shape, so both ends of the center line are
It is guided by a pair of positioning bins 10 and one position is determined. At this time, the storage openings of the filled cartridge 11 and the empty cartridge 12 come to closely face each other. Furthermore, extrusion holes 13 are provided on the back surface of the cartridge 7 facing the storage opening 8 so as to face all the wafers to be stored therein.
−万、ステージ１の内部にはアーム３の前進方向に沿っ
又２本のガイド棒１４が配設されるとともに、これらガ
イド棒１４には摺動可能な摺動体１５が挿嵌され摺動部
２が形作られている。前記摺動体１５はガイド棒】４の
両端を支持するマウンティングブレー）１６．１７によ
ってその前進および後進を停止されるようｋなっている
。- Two guide rods 14 are disposed inside the stage 1 along the forward direction of the arm 3, and a sliding body 15 that can slide is inserted into these guide rods 14 to form a sliding portion. 2 is formed. The sliding body 15 is stopped from moving forward or backward by mounting brakes 16 and 17 that support both ends of the guide rod 4.
他方、摺動体１５の後端には支柱１８が垂設されている
。この支柱はステージ１の上板１９に設けた長孔２０内
に突入し℃ステージ上に突出し℃いる。この支柱１８Ｖ
Ｃはアーム３゛い前進方向に延在する２本の支片２１と
、後進方向に延在する１本の握り２２とが設けられてい
る。２本の支片２１の先端は樹脂製の押出片２３の後面
に固足されている。押出片２３は脆弱なウエノ・９を損
傷し７かいように、また耐薬品性、耐摩耗性の優れた四
ふっ化エチレンによって形作られている。また、曲面は
ウェハ９の周縁に対応するように、窪んだ曲面からなり
押出面２４”ｌ’形作っている。そして、支柱１８．支
片２１．握り２２．押出片２３によってアーム３１に形
作っている。On the other hand, a column 18 is vertically provided at the rear end of the sliding body 15. This column enters into a long hole 20 provided in the upper plate 19 of the stage 1 and protrudes above the °C stage. This pillar 18V
The arm C is provided with two branch pieces 21 extending in the forward direction and one grip 22 extending in the backward direction. The tips of the two branch pieces 21 are fixed to the rear surface of the extruded piece 23 made of resin. The extruded piece 23 is made of polytetrafluoroethylene, which has excellent chemical resistance and abrasion resistance, so as not to damage the fragile urethane 9. The curved surface is a concave curved surface corresponding to the periphery of the wafer 9, and is formed into an extruded surface 24''l'. There is.
このようなウェハ移換治具にあっては、掘り２２’ｔ’
掴んでアーム３を後退させた状態で、充填カートリッジ
載置ボジシ曹ン５上にウェハ９を充填した充填カートリ
ッジ１１’Ｖ載置するとともに、空力−） ＩＪッジ載
載置ボン７１７６士空の空カートリッジ１２）ｋ載置し
た後、掘り２２′・二′掴んでアーム３を前進させ、先
端の押出片２３の押出面２４で充填カートリッジｌｌ内
の全ウニ／％９の一周縁を押し、空カートリツジ１２内
にウェハ９ｖ押し込む。その後、アーム３ｖ後退させて
、押出片２３を空となったカートリッジ７の押出用孔１
３から抜き出［７、ウェハの移１２換え作業を終了する
。In such a wafer transfer jig, the digging 22't'
With the arm 3 grasped and retracted, the filling cartridge 11'V filled with wafers 9 is placed on the filling cartridge placement cylinder 5, and the aerodynamic force is applied to the IJ mounting cylinder 7176. After placing the empty cartridge 12) k, grab the diggers 22' and 2' and move the arm 3 forward, pushing the extrusion surface 24 of the extrusion piece 23 at the tip to press one circumferential edge of all sea urchins/%9 in the filled cartridge 11, Push 9v of wafers into the empty cartridge 12. After that, the arm 3v is moved backward, and the extrusion piece 23 is inserted into the extrusion hole 1 of the empty cartridge 7.
3 [7, 12 wafer transfer work is completed.
このような実施例によれば、ウェハ９はアーム３の前進
動作によって充填カートリッジ１１の溝をスライドして
空のカートリッジに移り、今まで空であったカートリッ
ジ７の溝をスライドし℃カートリッジ７＆′ｃ移る。ま
た、アーム３の前進速度は手加減で所望程度に簡単Ｋｉ
４！ｉできる。このため、ウェハ９には大きな衝撃は加
わらず、従来のよっなウェハ９の欠け１割れは生じない
。このため、欠けによって生じた微細片の再付着もなく
なり、シ薔−ト不艮も発生しなくなる。According to such an embodiment, the wafer 9 slides in the groove of the filled cartridge 11 by the forward movement of the arm 3 and is transferred to the empty cartridge, and then slides in the groove of the cartridge 7, which has been empty until now, and moves to the cartridge 7 &'. c move. Also, the forward speed of the arm 3 can be adjusted easily to the desired degree by adjusting the speed of the arm 3.
4! I can. Therefore, no large impact is applied to the wafer 9, and the wafer 9 is not chipped or broken as in the conventional case. For this reason, there is no reattachment of minute pieces caused by chipping, and no sheet discoloration occurs.
また、この実施例の構造は簡素であることから、取り扱
いが容易で簡便であるとともに、製作コストも安価とな
る。Furthermore, since the structure of this embodiment is simple, it is easy and convenient to handle, and the manufacturing cost is low.
なお、本発明は前記実施例に限定されない。すなわち、
スライダの摺動部の構造も他の構造でもよい。また、被
移換物は他の板状物でもよい。Note that the present invention is not limited to the above embodiments. That is,
The structure of the sliding portion of the slider may also be other structure. Further, the object to be transferred may be another plate-like object.
以上のように、本発明によれば、充填カートリッジから
空カートリッジへの板状物の移し換え時に板状物を損傷
させることがなく、かつ簡便で安価な板状物移換治具を
提供することができる。As described above, according to the present invention, it is possible to provide a simple and inexpensive plate-like object transfer jig that does not damage the plate-like object when transferring the plate-like object from a filled cartridge to an empty cartridge. be able to.
第１図は本発明の一実施例によるウェハ移換治具を示す
斜視図、第２図は同じく平面図、第３図は同じく断面図
である。
１・・・ステージ、２・・・摺動部、３・・・アーム、
４・・・スライダ、５・・・充填カートリッジ載置ポジ
ション、６・・・空カートリッジ載置ボジシ１ノ、７・
・・カートリッジ、８・・・収容口、９・・・ウェハ、
１３・・・押出用孔、２０・・・長孔、２２・・・掘り
、２３・・・押出片。FIG. 1 is a perspective view showing a wafer transfer jig according to an embodiment of the present invention, FIG. 2 is a plan view, and FIG. 3 is a sectional view. 1... Stage, 2... Sliding part, 3... Arm,
4...Slider, 5...Filled cartridge mounting position, 6...Empty cartridge mounting position 1, 7.
...Cartridge, 8...Accommodation port, 9...Wafer,
13... Extrusion hole, 20... Long hole, 22... Digging, 23... Extrusion piece.
Claims (1)
トリッジに板状物を移し換える移換治具であって、前記
カートリッジは一面の収容口から板状物を挿入収容する
とともに背面には押出用孔を設けた構造としておくとと
もに、前記充填カートリッジと空力−） ＩＪッジをそ
れぞれ収容口を密着対面させた状態で位置決め載置する
ステージと、このステージに摺動自在に取り付けられる
アームを有するスライダとからなり、前記スライダは前
進操作によ？てアームの先ｎＡを充填カートリッジの背
中の押出用孔に突入して充填カートリッジ内の板状物を
空カートリッジに押し込むように構成されていることを
特徴とする板状物移換治具。1. Filling car containing plate-like objects) This is a transfer jig for transferring plate-like objects from an IJ to an empty cartridge, and the cartridge accommodates the plate-like objects inserted through the accommodation opening on one side, and also has a slot on the back side. has a structure with an extrusion hole, and also includes a stage for positioning and mounting the filling cartridge and the aerodynamic IJ jig with their respective storage openings closely facing each other, and an arm that is slidably attached to this stage. and a slider having a forward motion. A plate-like object transferring jig characterized in that the tip nA of the arm is inserted into an extrusion hole on the back of a filled cartridge to push the plate-like object inside the filled cartridge into an empty cartridge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2605882A JPS58144022A (en) | 1982-02-22 | 1982-02-22 | Sheet material transfer jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2605882A JPS58144022A (en) | 1982-02-22 | 1982-02-22 | Sheet material transfer jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58144022A true JPS58144022A (en) | 1983-08-27 |
Family
ID=12183075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2605882A Pending JPS58144022A (en) | 1982-02-22 | 1982-02-22 | Sheet material transfer jig |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58144022A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5382128A (en) * | 1993-03-03 | 1995-01-17 | Takahashi; Kiyoshi | Wafer transfer device |
| US5730575A (en) * | 1996-04-11 | 1998-03-24 | Micron Technology, Inc. | Convertible wafer transfer machine |
| US5871209A (en) * | 1996-03-01 | 1999-02-16 | Currency Systems International, Inc. | Cassette based document handling system |
| US5975836A (en) * | 1997-03-26 | 1999-11-02 | Lucent Technologies Inc. | Apparatus for visually reading semiconductor wafer identification indicia |
| US6309166B1 (en) * | 1997-10-17 | 2001-10-30 | Olympus Optical Co., Ltd. | Wafer transfer device |
| US6961639B2 (en) | 2002-01-29 | 2005-11-01 | Recif, Societe Anonyme | Apparatus and process for identification of characters inscribed on a semiconductor wafer containing an orientation mark |
| US7108476B2 (en) | 1998-05-05 | 2006-09-19 | Recif Technologies Sas | Method and device for changing a semiconductor wafer position |
| JP2008055919A (en) * | 2006-08-29 | 2008-03-13 | Mazda Motor Corp | Vehicle radiator support device |
-
1982
- 1982-02-22 JP JP2605882A patent/JPS58144022A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5382128A (en) * | 1993-03-03 | 1995-01-17 | Takahashi; Kiyoshi | Wafer transfer device |
| US5871209A (en) * | 1996-03-01 | 1999-02-16 | Currency Systems International, Inc. | Cassette based document handling system |
| US5730575A (en) * | 1996-04-11 | 1998-03-24 | Micron Technology, Inc. | Convertible wafer transfer machine |
| US6368044B1 (en) * | 1996-04-11 | 2002-04-09 | Micron Technology, Inc. | Convertible wafer transfer machine |
| US5975836A (en) * | 1997-03-26 | 1999-11-02 | Lucent Technologies Inc. | Apparatus for visually reading semiconductor wafer identification indicia |
| US6309166B1 (en) * | 1997-10-17 | 2001-10-30 | Olympus Optical Co., Ltd. | Wafer transfer device |
| US7108476B2 (en) | 1998-05-05 | 2006-09-19 | Recif Technologies Sas | Method and device for changing a semiconductor wafer position |
| US6961639B2 (en) | 2002-01-29 | 2005-11-01 | Recif, Societe Anonyme | Apparatus and process for identification of characters inscribed on a semiconductor wafer containing an orientation mark |
| JP2008055919A (en) * | 2006-08-29 | 2008-03-13 | Mazda Motor Corp | Vehicle radiator support device |
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