DE3786701D1 - Silizium-packungen fuer leistungshalbleiteranordnungen. - Google Patents

Silizium-packungen fuer leistungshalbleiteranordnungen.

Info

Publication number
DE3786701D1
DE3786701D1 DE8787106854T DE3786701T DE3786701D1 DE 3786701 D1 DE3786701 D1 DE 3786701D1 DE 8787106854 T DE8787106854 T DE 8787106854T DE 3786701 T DE3786701 T DE 3786701T DE 3786701 D1 DE3786701 D1 DE 3786701D1
Authority
DE
Germany
Prior art keywords
performance semiconductor
semiconductor arrangements
packings
silicon
silicon packings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787106854T
Other languages
English (en)
Other versions
DE3786701T2 (de
Inventor
Homer Hopson Ii Glascock
Fadel Abdel-Aziz Selim
Harold Frank Webster
David Leonard Mueller
Constantine Alois Neugebauer
Dante Edmond Piccone
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE3786701D1 publication Critical patent/DE3786701D1/de
Application granted granted Critical
Publication of DE3786701T2 publication Critical patent/DE3786701T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE87106854T 1986-05-16 1987-05-12 Silizium-Packungen für Leistungshalbleiteranordnungen. Expired - Fee Related DE3786701T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/863,761 US4745455A (en) 1986-05-16 1986-05-16 Silicon packages for power semiconductor devices

Publications (2)

Publication Number Publication Date
DE3786701D1 true DE3786701D1 (de) 1993-09-02
DE3786701T2 DE3786701T2 (de) 1994-01-05

Family

ID=25341730

Family Applications (1)

Application Number Title Priority Date Filing Date
DE87106854T Expired - Fee Related DE3786701T2 (de) 1986-05-16 1987-05-12 Silizium-Packungen für Leistungshalbleiteranordnungen.

Country Status (4)

Country Link
US (1) US4745455A (de)
EP (1) EP0246539B1 (de)
JP (1) JP2526245B2 (de)
DE (1) DE3786701T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4905075A (en) * 1986-05-05 1990-02-27 General Electric Company Hermetic semiconductor enclosure
US5133795A (en) * 1986-11-04 1992-07-28 General Electric Company Method of making a silicon package for a power semiconductor device
US4890156A (en) * 1987-03-13 1989-12-26 Motorola Inc. Multichip IC module having coplanar dice and substrate
KR970007840B1 (ko) * 1987-06-26 1997-05-17 미다 가쓰시게 반도체 장치
US5034044A (en) * 1988-05-11 1991-07-23 General Electric Company Method of bonding a silicon package for a power semiconductor device
US5209390A (en) * 1989-07-03 1993-05-11 General Electric Company Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
US5412247A (en) * 1989-07-28 1995-05-02 The Charles Stark Draper Laboratory, Inc. Protection and packaging system for semiconductor devices
US5223741A (en) * 1989-09-01 1993-06-29 Tactical Fabs, Inc. Package for an integrated circuit structure
US5754403A (en) * 1989-09-29 1998-05-19 Texas Instruments Incorporated Constraining core for surface mount technology
GB9014491D0 (en) * 1990-06-29 1990-08-22 Digital Equipment Int Mounting silicon chips
DE4040753A1 (de) * 1990-12-19 1992-06-25 Siemens Ag Leistungshalbleiterbauelement
US6867499B1 (en) 1999-09-30 2005-03-15 Skyworks Solutions, Inc. Semiconductor packaging
JP3675364B2 (ja) * 2001-05-30 2005-07-27 ソニー株式会社 半導体装置用基板その製造方法および半導体装置
TWM317648U (en) * 2007-01-04 2007-08-21 Lingsen Precision Ind Ltd Package structure reducing noise interference
EP3382753A1 (de) * 2017-03-30 2018-10-03 Siemens Aktiengesellschaft Isolation für eine mehrlagige elektrische schaltung und verfahren zur herstellung einer isolation

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3354258A (en) * 1965-07-21 1967-11-21 Hughes Aircraft Co Package for semiconductor devices and method of making same
DE1808666B2 (de) * 1967-11-15 1972-07-27 Mitsubishi Denki K.K., Tokio Halbleiterelement
GB1311659A (en) * 1969-07-30 1973-03-28 Secr Defence Electrical device substrates
DE2014289A1 (de) * 1970-03-25 1971-10-14 Semikron Gleichrichterbau Scheibenförmiges Halbleiterbauele ment und Verfahren zu seiner Herstellung
US3643136A (en) * 1970-05-22 1972-02-15 Gen Electric Glass passivated double beveled semiconductor device with partially spaced preform
DE2364728A1 (de) * 1973-12-27 1975-07-03 Licentia Gmbh Scheibenfoermiges halbleiterbauelement grosser leistungsfaehigkeit mit kunststoffummantelung
US3925808A (en) * 1974-08-08 1975-12-09 Westinghouse Electric Corp Silicon semiconductor device with stress-free electrodes
US3996602A (en) * 1975-08-14 1976-12-07 General Instrument Corporation Passivated and encapsulated semiconductors and method of making same
JPS6043016B2 (ja) * 1979-08-31 1985-09-26 株式会社東芝 半導体装置
DE2937049A1 (de) * 1979-09-13 1981-04-02 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungs-halbleiterbauelement
JPS57166052A (en) * 1981-04-06 1982-10-13 Mitsubishi Electric Corp Semiconductor device
JPS59208759A (ja) * 1983-05-12 1984-11-27 Hitachi Ltd 半導体装置
US4630096A (en) * 1984-05-30 1986-12-16 Motorola, Inc. High density IC module assembly

Also Published As

Publication number Publication date
EP0246539A2 (de) 1987-11-25
DE3786701T2 (de) 1994-01-05
JPS62291052A (ja) 1987-12-17
JP2526245B2 (ja) 1996-08-21
EP0246539A3 (en) 1989-01-18
US4745455A (en) 1988-05-17
EP0246539B1 (de) 1993-07-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee