DE3686383D1 - Versiegelungsstruktur fuer halbleiterbauelement. - Google Patents
Versiegelungsstruktur fuer halbleiterbauelement.Info
- Publication number
- DE3686383D1 DE3686383D1 DE8686113076T DE3686383T DE3686383D1 DE 3686383 D1 DE3686383 D1 DE 3686383D1 DE 8686113076 T DE8686113076 T DE 8686113076T DE 3686383 T DE3686383 T DE 3686383T DE 3686383 D1 DE3686383 D1 DE 3686383D1
- Authority
- DE
- Germany
- Prior art keywords
- sealing structure
- semiconductor components
- semiconductor
- components
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21527785 | 1985-09-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3686383D1 true DE3686383D1 (de) | 1992-09-17 |
DE3686383T2 DE3686383T2 (de) | 1993-01-07 |
Family
ID=16669646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686113076T Expired - Lifetime DE3686383T2 (de) | 1985-09-27 | 1986-09-23 | Versiegelungsstruktur fuer halbleiterbauelement. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4812897A (de) |
EP (1) | EP0216352B1 (de) |
JP (1) | JPH07120733B2 (de) |
DE (1) | DE3686383T2 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4887148A (en) * | 1988-07-15 | 1989-12-12 | Advanced Micro Devices, Inc. | Pin grid array package structure |
GB8825201D0 (en) * | 1988-10-27 | 1988-11-30 | Dow Corning Sa | Cavity packages |
US5258647A (en) * | 1989-07-03 | 1993-11-02 | General Electric Company | Electronic systems disposed in a high force environment |
NO911774D0 (no) * | 1991-05-06 | 1991-05-06 | Sensonor As | Anordning ved innkapsling av et funksjonsorgan, samt fremgangsmaate for fremstilling av samme. |
JP2927081B2 (ja) * | 1991-10-30 | 1999-07-28 | 株式会社デンソー | 樹脂封止型半導体装置 |
IT1259370B (it) * | 1992-03-27 | 1996-03-12 | Marelli Autronica | Unita' elettronica, particolarmente per il controllo di funzioni di un motore a combustione interna |
US5323150A (en) * | 1992-06-11 | 1994-06-21 | Micron Technology, Inc. | Method for reducing conductive and convective heat loss from the battery in an RFID tag or other battery-powered devices |
EP0620591A1 (de) * | 1993-04-12 | 1994-10-19 | Delco Electronics Corporation | Silikonverkapselung einer Flipclipanordnung |
US6081028A (en) * | 1994-03-29 | 2000-06-27 | Sun Microsystems, Inc. | Thermal management enhancements for cavity packages |
US6020219A (en) * | 1994-06-16 | 2000-02-01 | Lucent Technologies Inc. | Method of packaging fragile devices with a gel medium confined by a rim member |
JP3353526B2 (ja) * | 1995-03-23 | 2002-12-03 | 株式会社デンソー | 半導体パッケージ及びその製造方法 |
US5767447A (en) * | 1995-12-05 | 1998-06-16 | Lucent Technologies Inc. | Electronic device package enclosed by pliant medium laterally confined by a plastic rim member |
EP0778616A3 (de) * | 1995-12-05 | 1999-03-31 | Lucent Technologies Inc. | Verfahren zum Verpacken von Anordnungen mit einem Gel, begrenzt durch ein Randelement |
JP3223246B2 (ja) * | 1997-07-25 | 2001-10-29 | 東レ・ダウコーニング・シリコーン株式会社 | 半導体装置 |
JP3741855B2 (ja) * | 1998-02-25 | 2006-02-01 | 信越化学工業株式会社 | 半導体素子パッケージの製造方法及びこれに使用するオルガノポリシロキサン組成物 |
US6621173B1 (en) | 1998-07-23 | 2003-09-16 | Dow Corning Toray Silicone Co., Ltd. | Semiconductor device having an adhesive and a sealant |
US6822868B2 (en) * | 2002-02-26 | 2004-11-23 | Delphi Technologies, Inc. | Heat sink with integrated electronics |
US20080115772A1 (en) * | 2006-11-21 | 2008-05-22 | Ti Group Automotive Systems, L.L.C. | Fluid encapsulant for protecting electronics |
US20120085170A1 (en) * | 2010-10-07 | 2012-04-12 | Letterneau James C | Shock Resistant Mounting for High G Shock Accelerometer |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3020260A (en) * | 1960-08-18 | 1962-02-06 | Dow Corning | Organosiloxane potting compound |
US3436366A (en) * | 1965-12-17 | 1969-04-01 | Gen Electric | Silicone potting compositions comprising mixtures of organopolysiloxanes containing vinyl groups |
GB1397181A (en) * | 1973-01-16 | 1975-06-11 | Lucas Electrical Co Ltd | Film circuit assemblies |
CA1081411A (en) * | 1975-12-24 | 1980-07-15 | Philipp W.H. Schuessler | Method for hermetically sealing an electronic circuit package |
US4143456A (en) * | 1976-06-28 | 1979-03-13 | Citizen Watch Commpany Ltd. | Semiconductor device insulation method |
JPS5321771A (en) * | 1976-08-11 | 1978-02-28 | Sharp Kk | Electronic parts mounting structure |
US4163072A (en) * | 1977-06-07 | 1979-07-31 | Bell Telephone Laboratories, Incorporated | Encapsulation of circuits |
JPS5623759A (en) * | 1979-08-01 | 1981-03-06 | Hitachi Ltd | Resin-sealed semiconductor device and manufacture thereof |
US4374967A (en) * | 1981-07-06 | 1983-02-22 | Dow Corning Corporation | Low temperature silicone gel |
JPS5810841A (ja) * | 1981-07-13 | 1983-01-21 | Mitsubishi Electric Corp | 樹脂封止形半導体装置 |
JPS59181627A (ja) * | 1983-03-31 | 1984-10-16 | Toshiba Corp | 半導体装置の製造方法 |
JPS6096456A (ja) * | 1983-11-01 | 1985-05-30 | 住友ベークライト株式会社 | 軟質塩化ビニル系樹脂−シリコ−ン複合成形物及びその製造方法 |
JPS60157241A (ja) * | 1984-01-26 | 1985-08-17 | Mitsubishi Electric Corp | 半導体装置 |
-
1986
- 1986-09-16 JP JP61217490A patent/JPH07120733B2/ja not_active Expired - Lifetime
- 1986-09-23 DE DE8686113076T patent/DE3686383T2/de not_active Expired - Lifetime
- 1986-09-23 EP EP86113076A patent/EP0216352B1/de not_active Expired - Lifetime
-
1987
- 1987-09-01 US US07/093,159 patent/US4812897A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0216352A2 (de) | 1987-04-01 |
EP0216352B1 (de) | 1992-08-12 |
DE3686383T2 (de) | 1993-01-07 |
EP0216352A3 (en) | 1989-04-26 |
JPH07120733B2 (ja) | 1995-12-20 |
JPS62149157A (ja) | 1987-07-03 |
US4812897A (en) | 1989-03-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) |