DE1143493T1 - Sublimationsanwachse von Siliziumkarbidkristallen - Google Patents

Sublimationsanwachse von Siliziumkarbidkristallen

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Publication number
DE1143493T1
DE1143493T1 DE1143493T DE01201980T DE1143493T1 DE 1143493 T1 DE1143493 T1 DE 1143493T1 DE 1143493 T DE1143493 T DE 1143493T DE 01201980 T DE01201980 T DE 01201980T DE 1143493 T1 DE1143493 T1 DE 1143493T1
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Prior art keywords
starting powder
seed crystal
temperature
growth
maintaining
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Pending
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DE1143493T
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English (en)
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DE20101980U1 (de
Inventor
Calvin H. Carter Jr.
Robert F. Davis
Charles Eric Hunter
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North Carolina State University
University of California
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North Carolina State University
University of California
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Application filed by North Carolina State University, University of California filed Critical North Carolina State University
Publication of DE1143493T1 publication Critical patent/DE1143493T1/de
Pending legal-status Critical Current

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Classifications

    • H01L21/205
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0054Processes for devices with an active region comprising only group IV elements
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00Single-crystal growth by condensing evaporated or sublimed materials
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/36Carbides
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/021Continuous process
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/148Silicon carbide

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Claims (16)

PATENTANSPRÜCHE
1. Verfahren zur wiederholbaren Steuerung des Aufwachsens von großen Einkristallen eines einzelnen Polytyps Siliziumcarbid unabhängig von der Verwendung von Verunreinigungen als ein primärer Mechanismus zur Steuerung des Wachsturas von PoIytypen, wobei die Kristalle zur Verwendung in der Herstellung elektrischer Geräte geeignet sind, wobei das Verfahren Folgendes aufweist:
Einführen eines monokristallinen Impfkristalls (17, 32) aus Siliziumcarbid eines gewünschten Polytyps und eines Siliziumcarbid-Ausgangspulvers (40) in ein Sublimationssystem; Erhöhen der Temperatur des Siliziumcarbid-Ausgangspulvers auf eine Temperatur, die zur Sublimation des Ausgangspulvers ausreicht; während
die Temperatur der Aufwachsoberfläche des Impfkristalls auf eine Temperatur angehoben wird, die nahezu der Temperatur des Ausgangspulvers entspricht, aber niedriger ist als die Temperatur des Ausgangspulvers und niedriger als diejenige Temperatur, bei der Siliziumcarbid unter den .Gasdruckbedingungen des Sublimationssystems sublimiert;
gekennzeichnet durch
Erzeugen und Aufrechterhalten eines konstanten Stroms dampfförmigen Si, Si2C und SiC2 pro Flächeneinheit und Zeiteinheit aus dem Ausgangspulver (40) zur Aufwachsoberfläche des Impfkristalls (17, 32) über eine hinreichend lange Zeit, um ein gewünschtes Maß des makroskopischen Wachstums aus monokristallinem Siliziumcarbid des gewünschten Polytyps auf dem Impfkristall zu erzeugen, wobei der konstante Strom durch ein Verfahren aufrechterhalten wird, das die Aufrechterhaltung eines konstanten Wärmegradienten umfasst, gemessen zwischen der Aufwachsoberfläche des Impfkristalls und dem Ausgangspulver während des Aufwachsens des Kristalls und des Verbrauchs des Ausgangspulvers, wobei die Aufwachsoberfläche des Impfkristalls und das Ausgangspulver auf ihren jeweiligen ver-
DE/FP 1 1434S3T1
schiedenen Temperaturen gehalten werden, um dadurch eine konstante Wachsturnsrate des Impf-Einkristalls und ein gleichmäßiges Wachstum eines einzigen Polytpyen auf der einzigen Aufwachsoberfläche des Impfkristalls aufrechtzuerhalten.
2. Verfahren nach Anspruch 1, bei dem der Schritt des Aufrechterhaltens des konstanten Wärmegradienten zwischen der Aufwachsoberfläche des Impfkristalls (17, 32) und dem Ausgangspulver (40) die Schaffung einer relativen Bewegung zwischen der Aufwachsoberfläche des Impfkristalls und dem Ausgangspulver während des Wachstums des Impfkristalls beinhaltet, wobei das Ausgangspulver auf der Temperatur gehalten wird, die zur Sublimation von Siliziumcarbid ausreicht, und der Impfkristall auf der Temperatur nahe der Temperatur des Ausgangspulver, aber niedriger als die Temperatur des Aus-'7 gangspulvers und niedriger als die Temperatur, bei der Siliziumcarbid sublimiert, gehalten wird.
3. Verfahren nach Anspruch 1, bei dem der Schritt des Aufrechterhaltens des konstanten Wärmegradienten zwischen der Aufwachsoberfläche des Impfkristalls und dem Ausgangspulver die Aufrechterhaltung eines festen Abstands zwischen der Aufwachsoberfläche des Impfkristalls und dem Ausgangspulver während des Wachstums des Kristalls beinhaltet.
4. Verfahren nach Anspruch 1, bei dem der Schritt des Aufrechterhaltens des konstanten Wärmegradienten zwischen der Aufwachsoberfläche des Impfkristalls und dem Ausgangspulver die unabhängige Regelung der Temperaturen des Ausgangspulvers und des Impfkristalls beinhaltet, indem die Temperatur des Ausgangspulvers und die Temperatur des Impfkristalls getrennt überwacht und die Temperatur des Ausgangspulvers und die Temperatur des Impfkristalls getrennt eingeregelt werden.
OE/EP 1 U3A93T1
5. Verfahren nach einem der vorstehenden Ansprüche, das den Schritt der Rotation des Impfkristalls (17, 32) während des Wachstums des Impfkristalls und des Verbrauchs des Ausgangspulvers (40) enthält, um dadurch ein konstantes Temperaturprofil über die Aufwachsoberfläche des Impfkristalls aufrechtzuerhalten, den Einfluss von Flussschwankungen zu dämpfen und um zu verhindern, dass der wachsende Kristall (33) an unerwünschten mechanischen Abschnitten des Sublimationssystems haften bleibt.
6. Verfahren nach einem der vorstehenden Ansprüche, bei dem der Schritt der Erhöhung der Temperatur des Siliziumcarbid-Ausgangspulvers (40) das Anheben der Temperatur des Siliziumcarbid-Ausgangspulvers auf zwischen ca. 22500C und 23500C beinhaltet. ' .
7. Verfahren nach einem der vorstehenden Ansprüche, bei dem der Schritt des Anhebens der Temperatur des Impfkristalls (17, 32) das Anheben der Temperatur des Impfkristalls auf zwischen ca. 21500C und 2250°C beinhaltet.
8. Verfahren nach einem der vorstehenden Ansprüche, bei dem die Schritte des Anhebens der Temperatur des Siliziuracarbid-Ausgangspulvers (40) und des Anhebens der Temperatur der Aufwachsoberfläche des Impfkristalls (17, 32) die,Einführung eines Wärmegradienten von 20.0C pro Zentrimeter zwischen dem Ausgangspulver und dem Impfkristall beinhaltet.
9. Verfahren nach einem der vorstehenden Ansprüche, bei dem der Schritt des Einführens eines Impf-Einkristalls (17, 32) aus Siliziumcarbid das Einführen eines Impfkristalls beinhaltet, für den eine Fläche entsprechend einer niedrigen ganzzahligen Millerschen Indexfläche geschnitten worden ist, um eine Fläche freizulegen, die nicht senkrecht zu einer Achse senkrecht zur niedrigen ganzzahligen Millerschen Indexfläche
DE/EP 1 143493 T1
verläuft, die geschnitten wurde.
10. Verfahren nach einem der vorstehenden Ansprüche, bei dem der Schritt des Erzeugens und Aufrechterhaltens des im Wesentlichen konstanten Stroms dampfförmigen Si, Si2C und SiC2 pro Flächeneinheit und Zeiteinheit beinhaltet, ein Ausgangspulver (40) mit einer gewählten Polytypzusammensetzung einzuführen und die gewählte Polytypzusammensetzung im Ausgangspulver während des gesamten Wachstumsprozesses im Wesentlichen konstant zu halten.
11. Verfahren nach Anspruch 10, bei dem der Schritt der Einhaltung der ursprünglich gewählten Zusammensetzung aus PoIytypen im Ausgangspulver das Nachfüllen des Ausgangspulvers während des Sublimationsprozesses unter Verwendung eines Nachfüll-Ausgangspulvers mit einer Polytypzusammensetzung beinhaltet, die die ursprünglich gewählte Polytypzusammensetzung im Ausgangspulver im Sublimationssystem im Wesentlichen konstant hält.
12. Verfahren nach einem der vorstehenden Ansprüche, bei dem der Schritt des Erzeugens und Aufrechterhaltens des im Wesentlichen konstanten Stroms dampfförmigen Si, Si2C und SiC2 pro Flächeneinheit und Zeiteinheit beinhaltet, ein Ausgangspulver (40) mit einer gewählten vorgegebenen Verteilung von Oberflächenbereichen einzuführen und die gewählte Verteilung von Oberflächenbereichen im Ausgangspulver während des gesamten Wachstumsprozesses im Wesentlichen konstant, zu halten.
13. Verfahren nach Anspruch 12, bei dem der Schritt der Aufrechterhaltung der ursprünglich gewählten vorgegebenen Verteilung von Oberflächenbereichen das Nachfüllen des Ausgangspulvers (40) während des Sublimationsprozesses unter Verwendung eines Nachfüll-Ausgangspulvers mit einer Verteilung
• «
I··
DE/EP 1 143493 T1
von Oberflächenbereichen beinhaltet, die die ursprünglich gewählte Verteilung von Oberflächenbereichen im Ausgangspulver im Sublimationssystem im Wesentlichen konstant hält.
14. Verfahren nach einem der vorstehenden Ansprüche, bei dem der Schritt des Erzeugens und Aufrechterhaltens des im Wesentlichen konstanten Stroms dampfförmigen Si, Si2C und S1C2pro Flächeneinheit und Zeiteinheit beinhaltet, ein Ausgangspulver (40) mit einer gewählten vorgebenen Verteilung der Partikelgrößen einzuführen und die gewählte Verteilung der Partikelgrößen im Ausgangspulver während des gesamten Wachstumsprozesses im Wesentlichen konstant zu halten.
15. Verfahren nach Anspruch 14, bei dem der Schritt der Auf-rechterhaltung der "ursprünglich gewählten vorgegebenen Verteilung der Partikelgrößen das Nachfüllen des Ausgangspulvers (40) während des Sublimationsprozesses unter Verwendung eines Nachfüll-Ausgangspulvers mit einer Partikelgrößenverteilung beinhaltet, die die ursprünglich gewählte Verteilung der ■. Partikelgrößen im Ausgangspulver im Sublimationssystem im Wesentlichen konstant hält.
16. Verfahren nach Anspruch 13 oder 15, bei dem der Schritt des Nachfüllens des Ausgangspulvers (40) während des Sublimationsprozesses unter Verwendung eines Ausgangspulvers mit einer gewählten Verteilung der Partikelgrößen das Einführen von Siliziumcarbidpulver mit der folgenden Größenverteilung beinhaltet, bestimmt nach dem Gewichtsprozentsatz einer Probe, der ein bestimmtes Tyler-Maschensieb passiert:
Tyler-Maschensieb Gewichtsprozent, passiert 20 - 40 43%
40 - 60 19%
60 - 100 17%
über 100 21%
DE1143493T 1987-10-26 1988-10-26 Sublimationsanwachse von Siliziumkarbidkristallen Pending DE1143493T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/113,565 US4866005A (en) 1987-10-26 1987-10-26 Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide

Publications (1)

Publication Number Publication Date
DE1143493T1 true DE1143493T1 (de) 2002-11-28

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ID=22350170

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Application Number Title Priority Date Filing Date
DE3856514T Expired - Lifetime DE3856514T2 (de) 1987-10-26 1988-10-26 Sublimationsanwachsen von Siliziumkarbideinkristallen
DE3855539T Expired - Lifetime DE3855539T3 (de) 1987-10-26 1988-10-26 Sublimationsanwachsen von siliziumkarbideinkristallen
DE1143493T Pending DE1143493T1 (de) 1987-10-26 1988-10-26 Sublimationsanwachse von Siliziumkarbidkristallen

Family Applications Before (2)

Application Number Title Priority Date Filing Date
DE3856514T Expired - Lifetime DE3856514T2 (de) 1987-10-26 1988-10-26 Sublimationsanwachsen von Siliziumkarbideinkristallen
DE3855539T Expired - Lifetime DE3855539T3 (de) 1987-10-26 1988-10-26 Sublimationsanwachsen von siliziumkarbideinkristallen

Country Status (7)

Country Link
US (2) US4866005A (de)
EP (3) EP1143493A3 (de)
JP (2) JP3165685B2 (de)
KR (1) KR970008332B1 (de)
CA (1) CA1331730C (de)
DE (3) DE3856514T2 (de)
WO (1) WO1989004055A1 (de)

Families Citing this family (480)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59001292D1 (de) * 1989-06-20 1993-06-03 Siemens Ag Verfahren zum herstellen von einkristallinem siliziumkarbid.
US4946547A (en) * 1989-10-13 1990-08-07 Cree Research, Inc. Method of preparing silicon carbide surfaces for crystal growth
US5200022A (en) * 1990-10-03 1993-04-06 Cree Research, Inc. Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product
US5093576A (en) * 1991-03-15 1992-03-03 Cree Research High sensitivity ultraviolet radiation detector
US5958132A (en) * 1991-04-18 1999-09-28 Nippon Steel Corporation SiC single crystal and method for growth thereof
WO1992022922A2 (en) * 1991-06-12 1992-12-23 Case Western Reserve University Process for the controlled growth of single-crystal films of silicon carbide polytypes on silicon carbide wafers
US5248385A (en) * 1991-06-12 1993-09-28 The United States Of America, As Represented By The Administrator, National Aeronautics And Space Administration Process for the homoepitaxial growth of single-crystal silicon carbide films on silicon carbide wafers
US5465249A (en) * 1991-11-26 1995-11-07 Cree Research, Inc. Nonvolatile random access memory device having transistor and capacitor made in silicon carbide substrate
US5783335A (en) * 1992-04-07 1998-07-21 The Regents Of The University Of California, Office Of Technology Transfer Fluidized bed deposition of diamond
US5459107A (en) * 1992-06-05 1995-10-17 Cree Research, Inc. Method of obtaining high quality silicon dioxide passivation on silicon carbide and resulting passivated structures
US5629531A (en) * 1992-06-05 1997-05-13 Cree Research, Inc. Method of obtaining high quality silicon dioxide passivation on silicon carbide and resulting passivated structures
US5709745A (en) * 1993-01-25 1998-01-20 Ohio Aerospace Institute Compound semi-conductors and controlled doping thereof
CA2113336C (en) * 1993-01-25 2001-10-23 David J. Larkin Compound semi-conductors and controlled doping thereof
US5441011A (en) * 1993-03-16 1995-08-15 Nippon Steel Corporation Sublimation growth of single crystal SiC
DE4310745C2 (de) * 1993-04-01 1999-07-08 Siemens Ag Verfahren zum Herstellen von SiC-Einkristallen und Vorrichtung zur Durchführung des Verfahrens
DE4310744A1 (de) * 1993-04-01 1994-10-06 Siemens Ag Vorrichtung zum Herstellen von SiC-Einkristallen
US5611955A (en) * 1993-10-18 1997-03-18 Northrop Grumman Corp. High resistivity silicon carbide substrates for high power microwave devices
US6309766B1 (en) 1994-10-31 2001-10-30 Thomas M. Sullivan Polycrystalline silicon carbide ceramic wafer and substrate
US6077619A (en) * 1994-10-31 2000-06-20 Sullivan; Thomas M. Polycrystalline silicon carbide ceramic wafer and substrate
KR0183082B1 (ko) * 1994-11-28 1999-04-15 전성원 복합 재료용 예비성형체 제조방법
US5679153A (en) * 1994-11-30 1997-10-21 Cree Research, Inc. Method for reducing micropipe formation in the epitaxial growth of silicon carbide and resulting silicon carbide structures
US5585648A (en) * 1995-02-03 1996-12-17 Tischler; Michael A. High brightness electroluminescent device, emitting in the green to ultraviolet spectrum, and method of making the same
SE9502288D0 (sv) * 1995-06-26 1995-06-26 Abb Research Ltd A device and a method for epitaxially growing objects by CVD
DE19527536A1 (de) * 1995-07-27 1997-01-30 Siemens Ag Verfahren zum Herstellen von Siliciumcarbid-Einkristallen
US6030661A (en) * 1995-08-04 2000-02-29 Abb Research Ltd. Device and a method for epitaxially growing objects by CVD
JP3491402B2 (ja) * 1995-08-07 2004-01-26 株式会社デンソー 単結晶製造方法及びその単結晶製造装置
US5762896A (en) * 1995-08-31 1998-06-09 C3, Inc. Silicon carbide gemstones
US5683507A (en) * 1995-09-05 1997-11-04 Northrop Grumman Corporation Apparatus for growing large silicon carbide single crystals
SE9503428D0 (sv) 1995-10-04 1995-10-04 Abb Research Ltd A method for epitaxially growing objects and a device for such a growth
EP0781619A1 (de) 1995-12-15 1997-07-02 Cree Research, Inc. Verfahren zur Herstellung von Siliciumkarbidscheiden aus Siliciumkarbideinkristallen
US5746827A (en) * 1995-12-27 1998-05-05 Northrop Grumman Corporation Method of producing large diameter silicon carbide crystals
RU2094547C1 (ru) * 1996-01-22 1997-10-27 Юрий Александрович Водаков Сублимационный способ выращивания монокристаллов карбида кремния и источник карбида кремния для осуществления способа
US6547877B2 (en) 1996-01-22 2003-04-15 The Fox Group, Inc. Tantalum crucible fabrication and treatment
US5718760A (en) * 1996-02-05 1998-02-17 Cree Research, Inc. Growth of colorless silicon carbide crystals
US5944890A (en) * 1996-03-29 1999-08-31 Denso Corporation Method of producing single crystals and a seed crystal used in the method
US6110279A (en) * 1996-03-29 2000-08-29 Denso Corporation Method of producing single-crystal silicon carbide
JP3384242B2 (ja) * 1996-03-29 2003-03-10 株式会社豊田中央研究所 炭化珪素単結晶の製造方法
FR2747401B1 (fr) * 1996-04-10 1998-05-15 Commissariat Energie Atomique Dispositif et procede pour la formation de carbure de silicium (sic) monocristallin sur un germe
US6403708B2 (en) 1996-05-27 2002-06-11 Mitsui Chemicals Inc Crystalline polypropylenes, process for preparing thereof, polypropylene compositions, and thermoformed products
US5858086A (en) 1996-10-17 1999-01-12 Hunter; Charles Eric Growth of bulk single crystals of aluminum nitride
US6039812A (en) * 1996-10-21 2000-03-21 Abb Research Ltd. Device for epitaxially growing objects and method for such a growth
US6537371B2 (en) 1997-01-22 2003-03-25 The Fox Group, Inc. Niobium crucible fabrication and treatment
ATE217368T1 (de) 1997-01-22 2002-05-15 Yury Alexandrovich Vodakov Züchtung von siliziumkarbid einkristallen
US6562130B2 (en) 1997-01-22 2003-05-13 The Fox Group, Inc. Low defect axially grown single crystal silicon carbide
ATE202807T1 (de) * 1997-01-31 2001-07-15 Northrop Grumman Corp Vorrichtung zur züchtung von grossen siliziumkarbideinkristallen
CN1159750C (zh) * 1997-04-11 2004-07-28 日亚化学工业株式会社 氮化物半导体的生长方法
US5873937A (en) * 1997-05-05 1999-02-23 Northrop Grumman Corporation Method of growing 4H silicon carbide crystal
US5937317A (en) * 1997-05-08 1999-08-10 Northrop Grumman Corporation Method of making a low resistivity silicon carbide boule
US5788768A (en) * 1997-05-08 1998-08-04 Northrop Grumman Corporation Feedstock arrangement for silicon carbide boule growth
ES2226169T3 (es) * 1997-08-29 2005-03-16 Cree, Inc. Diodo emisor de luz del grupo iii robusto para una alta fiabilidad en aplicaciones habituales de encapsulacion.
US6825501B2 (en) * 1997-08-29 2004-11-30 Cree, Inc. Robust Group III light emitting diode for high reliability in standard packaging applications
AU9003498A (en) * 1997-09-12 1999-04-05 Showa Denko Kabushiki Kaisha Method and apparatus for producing silicon carbide single crystal
US6336971B1 (en) 1997-09-12 2002-01-08 Showa Denko Kabushiki Kaisha Method and apparatus for producing silicon carbide single crystal
US6599133B2 (en) 1997-11-18 2003-07-29 Technologies And Devices International, Inc. Method for growing III-V compound semiconductor structures with an integral non-continuous quantum dot layer utilizing HVPE techniques
US6479839B2 (en) 1997-11-18 2002-11-12 Technologies & Devices International, Inc. III-V compounds semiconductor device with an AlxByInzGa1-x-y-zN non continuous quantum dot layer
US6559038B2 (en) 1997-11-18 2003-05-06 Technologies And Devices International, Inc. Method for growing p-n heterojunction-based structures utilizing HVPE techniques
US20020047135A1 (en) * 1997-11-18 2002-04-25 Nikolaev Audrey E. P-N junction-based structures utilizing HVPE grown III-V compound layers
US6476420B2 (en) 1997-11-18 2002-11-05 Technologies And Devices International, Inc. P-N homojunction-based structures utilizing HVPE growth III-V compound layers
US6555452B2 (en) 1997-11-18 2003-04-29 Technologies And Devices International, Inc. Method for growing p-type III-V compound material utilizing HVPE techniques
US6849862B2 (en) 1997-11-18 2005-02-01 Technologies And Devices International, Inc. III-V compound semiconductor device with an AlxByInzGa1-x-y-zN1-a-bPaAsb non-continuous quantum dot layer
US6890809B2 (en) * 1997-11-18 2005-05-10 Technologies And Deviles International, Inc. Method for fabricating a P-N heterojunction device utilizing HVPE grown III-V compound layers and resultant device
US6472300B2 (en) 1997-11-18 2002-10-29 Technologies And Devices International, Inc. Method for growing p-n homojunction-based structures utilizing HVPE techniques
US6559467B2 (en) 1997-11-18 2003-05-06 Technologies And Devices International, Inc. P-n heterojunction-based structures utilizing HVPE grown III-V compound layers
US5985024A (en) * 1997-12-11 1999-11-16 Northrop Grumman Corporation Method and apparatus for growing high purity single crystal silicon carbide
EP0933450B1 (de) * 1998-01-19 2002-04-17 Sumitomo Electric Industries, Ltd. Verfahren und Vorrichtung zur Herstellung eines SiC-Einkristalles
US6051849A (en) 1998-02-27 2000-04-18 North Carolina State University Gallium nitride semiconductor structures including a lateral gallium nitride layer that extends from an underlying gallium nitride layer
US6608327B1 (en) 1998-02-27 2003-08-19 North Carolina State University Gallium nitride semiconductor structure including laterally offset patterned layers
US6265289B1 (en) 1998-06-10 2001-07-24 North Carolina State University Methods of fabricating gallium nitride semiconductor layers by lateral growth from sidewalls into trenches, and gallium nitride semiconductor structures fabricated thereby
US6048813A (en) 1998-10-09 2000-04-11 Cree, Inc. Simulated diamond gemstones formed of aluminum nitride and aluminum nitride: silicon carbide alloys
US6177688B1 (en) 1998-11-24 2001-01-23 North Carolina State University Pendeoepitaxial gallium nitride semiconductor layers on silcon carbide substrates
US6255198B1 (en) * 1998-11-24 2001-07-03 North Carolina State University Methods of fabricating gallium nitride microelectronic layers on silicon layers and gallium nitride microelectronic structures formed thereby
JP4614539B2 (ja) * 1999-02-19 2011-01-19 エスアイクリスタル アクチエンゲゼルシャフト α‐SiC塊状単結晶の成長方法
US6406539B1 (en) 1999-04-28 2002-06-18 Showa Denko K.K, Process for producing silicon carbide single crystal and production apparatus therefor
DE50004010D1 (de) 1999-07-07 2003-11-13 Siemens Ag Verfahren zur sublimationszüchtung eines sic-einkristalls mit aufheizen unter züchtungsdruck
DE19931332C2 (de) * 1999-07-07 2002-06-06 Siemens Ag Vorrichtung zur Herstellung eines SiC-Einkristalls mit einem doppelwandigen Tiegel
US6562131B2 (en) 1999-07-20 2003-05-13 The Fox Group, Inc. Method for growing single crystal silicon carbide
US6824611B1 (en) * 1999-10-08 2004-11-30 Cree, Inc. Method and apparatus for growing silicon carbide crystals
US6451112B1 (en) 1999-10-15 2002-09-17 Denso Corporation Method and apparatus for fabricating high quality single crystal
US6521514B1 (en) 1999-11-17 2003-02-18 North Carolina State University Pendeoepitaxial methods of fabricating gallium nitride semiconductor layers on sapphire substrates
US8829546B2 (en) 1999-11-19 2014-09-09 Cree, Inc. Rare earth doped layer or substrate for light conversion
US6614056B1 (en) 1999-12-01 2003-09-02 Cree Lighting Company Scalable led with improved current spreading structures
US6410942B1 (en) 1999-12-03 2002-06-25 Cree Lighting Company Enhanced light extraction through the use of micro-LED arrays
WO2001041225A2 (en) 1999-12-03 2001-06-07 Cree Lighting Company Enhanced light extraction in leds through the use of internal and external optical elements
US6380108B1 (en) 1999-12-21 2002-04-30 North Carolina State University Pendeoepitaxial methods of fabricating gallium nitride semiconductor layers on weak posts, and gallium nitride semiconductor structures fabricated thereby
US6403451B1 (en) 2000-02-09 2002-06-11 Noerh Carolina State University Methods of fabricating gallium nitride semiconductor layers on substrates including non-gallium nitride posts
US6428621B1 (en) 2000-02-15 2002-08-06 The Fox Group, Inc. Method for growing low defect density silicon carbide
US6261929B1 (en) 2000-02-24 2001-07-17 North Carolina State University Methods of forming a plurality of semiconductor layers using spaced trench arrays
AU2001250835A1 (en) * 2000-03-13 2001-09-24 Ii-Vi Incorporated Large size single crystal seed crystal fabrication by intergrowth of tiled seed crystals
WO2001068954A2 (en) * 2000-03-13 2001-09-20 Ii-Vi Incorporated Axial gradient transport apparatus and process
US6573128B1 (en) 2000-11-28 2003-06-03 Cree, Inc. Epitaxial edge termination for silicon carbide Schottky devices and methods of fabricating silicon carbide devices incorporating same
JP4275308B2 (ja) * 2000-12-28 2009-06-10 株式会社デンソー 炭化珪素単結晶の製造方法およびその製造装置
US6800876B2 (en) 2001-01-16 2004-10-05 Cree, Inc. Group III nitride LED with undoped cladding layer (5000.137)
US6906352B2 (en) 2001-01-16 2005-06-14 Cree, Inc. Group III nitride LED with undoped cladding layer and multiple quantum well
US6863728B2 (en) 2001-02-14 2005-03-08 The Fox Group, Inc. Apparatus for growing low defect density silicon carbide
US6670278B2 (en) 2001-03-30 2003-12-30 Lam Research Corporation Method of plasma etching of silicon carbide
US6849882B2 (en) 2001-05-11 2005-02-01 Cree Inc. Group-III nitride based high electron mobility transistor (HEMT) with barrier/spacer layer
US6706114B2 (en) * 2001-05-21 2004-03-16 Cree, Inc. Methods of fabricating silicon carbide crystals
CN1505843B (zh) 2001-06-15 2010-05-05 克里公司 在SiC衬底上形成的GaN基LED
US20020189536A1 (en) * 2001-06-15 2002-12-19 Bridgestone Corporation Silicon carbide single crystal and production thereof
US7553373B2 (en) 2001-06-15 2009-06-30 Bridgestone Corporation Silicon carbide single crystal and production thereof
US20030015708A1 (en) 2001-07-23 2003-01-23 Primit Parikh Gallium nitride based diodes with low forward voltage and low reverse current operation
AU2002357640A1 (en) 2001-07-24 2003-04-22 Cree, Inc. Insulting gate algan/gan hemt
US6749685B2 (en) * 2001-08-16 2004-06-15 Cree, Inc. Silicon carbide sublimation systems and associated methods
US6903446B2 (en) * 2001-10-23 2005-06-07 Cree, Inc. Pattern for improved visual inspection of semiconductor devices
US6780243B1 (en) 2001-11-01 2004-08-24 Dow Corning Enterprises, Inc. Method of silicon carbide monocrystalline boule growth
US7030428B2 (en) * 2001-12-03 2006-04-18 Cree, Inc. Strain balanced nitride heterojunction transistors
US7220313B2 (en) * 2003-07-28 2007-05-22 Cree, Inc. Reducing nitrogen content in silicon carbide crystals by sublimation growth in a hydrogen-containing ambient
US7601441B2 (en) * 2002-06-24 2009-10-13 Cree, Inc. One hundred millimeter high purity semi-insulating single crystal silicon carbide wafer
US7316747B2 (en) * 2002-06-24 2008-01-08 Cree, Inc. Seeded single crystal silicon carbide growth and resulting crystals
US6814801B2 (en) * 2002-06-24 2004-11-09 Cree, Inc. Method for producing semi-insulating resistivity in high purity silicon carbide crystals
US6982204B2 (en) 2002-07-16 2006-01-03 Cree, Inc. Nitride-based transistors and methods of fabrication thereof using non-etched contact recesses
EP1540048B1 (de) * 2002-09-19 2010-05-12 Showa Denko K.K. Siliciumcarbid-einkristall und verfahren und vorrichtung zu seiner herstellung
US6825559B2 (en) 2003-01-02 2004-11-30 Cree, Inc. Group III nitride based flip-chip intergrated circuit and method for fabricating
US9515135B2 (en) * 2003-01-15 2016-12-06 Cree, Inc. Edge termination structures for silicon carbide devices
US7026650B2 (en) * 2003-01-15 2006-04-11 Cree, Inc. Multiple floating guard ring edge termination for silicon carbide devices
US6987281B2 (en) * 2003-02-13 2006-01-17 Cree, Inc. Group III nitride contact structures for light emitting devices
US6952024B2 (en) * 2003-02-13 2005-10-04 Cree, Inc. Group III nitride LED with silicon carbide cladding layer
US7170097B2 (en) * 2003-02-14 2007-01-30 Cree, Inc. Inverted light emitting diode on conductive substrate
US7898047B2 (en) 2003-03-03 2011-03-01 Samsung Electronics Co., Ltd. Integrated nitride and silicon carbide-based devices and methods of fabricating integrated nitride-based devices
US7112860B2 (en) 2003-03-03 2006-09-26 Cree, Inc. Integrated nitride-based acoustic wave devices and methods of fabricating integrated nitride-based acoustic wave devices
US6964917B2 (en) * 2003-04-08 2005-11-15 Cree, Inc. Semi-insulating silicon carbide produced by Neutron transmutation doping
EP2264798B1 (de) 2003-04-30 2020-10-14 Cree, Inc. Hochleistungs-Lichtemitter-Verkapselungen mit kompakter Optik
ITMI20031196A1 (it) * 2003-06-13 2004-12-14 Lpe Spa Sistema per crescere cristalli di carburo di silicio
KR100782998B1 (ko) 2003-06-16 2007-12-07 쇼와 덴코 가부시키가이샤 실리콘 카바이드 단결정의 성장 방법, 실리콘 카바이드 씨드결정 및 실리콘 카바이드 단결정
US7915085B2 (en) * 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
US6972438B2 (en) * 2003-09-30 2005-12-06 Cree, Inc. Light emitting diode with porous SiC substrate and method for fabricating
US6974720B2 (en) * 2003-10-16 2005-12-13 Cree, Inc. Methods of forming power semiconductor devices using boule-grown silicon carbide drift layers and power semiconductor devices formed thereby
KR20060122868A (ko) * 2003-11-25 2006-11-30 스미토모덴키고교가부시키가이샤 다이아몬드 n형 반도체, 그의 제조 방법, 반도체 소자 및전자 방출 소자
US7135715B2 (en) * 2004-01-07 2006-11-14 Cree, Inc. Co-doping for fermi level control in semi-insulating Group III nitrides
US7901994B2 (en) 2004-01-16 2011-03-08 Cree, Inc. Methods of manufacturing group III nitride semiconductor devices with silicon nitride layers
US7045404B2 (en) 2004-01-16 2006-05-16 Cree, Inc. Nitride-based transistors with a protective layer and a low-damage recess and methods of fabrication thereof
US7170111B2 (en) 2004-02-05 2007-01-30 Cree, Inc. Nitride heterojunction transistors having charge-transfer induced energy barriers and methods of fabricating the same
US7612390B2 (en) * 2004-02-05 2009-11-03 Cree, Inc. Heterojunction transistors including energy barriers
US7056383B2 (en) * 2004-02-13 2006-06-06 The Fox Group, Inc. Tantalum based crucible
US7872268B2 (en) * 2004-04-22 2011-01-18 Cree, Inc. Substrate buffer structure for group III nitride devices
US7825006B2 (en) 2004-05-06 2010-11-02 Cree, Inc. Lift-off process for GaN films formed on SiC substrates and devices fabricated using the method
US7084441B2 (en) 2004-05-20 2006-08-01 Cree, Inc. Semiconductor devices having a hybrid channel layer, current aperture transistors and methods of fabricating same
US7432142B2 (en) 2004-05-20 2008-10-07 Cree, Inc. Methods of fabricating nitride-based transistors having regrown ohmic contact regions
WO2005119793A2 (en) * 2004-05-28 2005-12-15 Caracal, Inc. Silicon carbide schottky diodes and fabrication method
US7795623B2 (en) 2004-06-30 2010-09-14 Cree, Inc. Light emitting devices having current reducing structures and methods of forming light emitting devices having current reducing structures
US9368428B2 (en) * 2004-06-30 2016-06-14 Cree, Inc. Dielectric wafer level bonding with conductive feed-throughs for electrical connection and thermal management
US7534633B2 (en) * 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
US7238560B2 (en) 2004-07-23 2007-07-03 Cree, Inc. Methods of fabricating nitride-based transistors with a cap layer and a recessed gate
US20060017064A1 (en) * 2004-07-26 2006-01-26 Saxler Adam W Nitride-based transistors having laterally grown active region and methods of fabricating same
US7192482B2 (en) * 2004-08-10 2007-03-20 Cree, Inc. Seed and seedholder combinations for high quality growth of large silicon carbide single crystals
US7217583B2 (en) * 2004-09-21 2007-05-15 Cree, Inc. Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension
US7294324B2 (en) * 2004-09-21 2007-11-13 Cree, Inc. Low basal plane dislocation bulk grown SiC wafers
US8174037B2 (en) * 2004-09-22 2012-05-08 Cree, Inc. High efficiency group III nitride LED with lenticular surface
US7314520B2 (en) 2004-10-04 2008-01-01 Cree, Inc. Low 1c screw dislocation 3 inch silicon carbide wafer
US7314521B2 (en) 2004-10-04 2008-01-01 Cree, Inc. Low micropipe 100 mm silicon carbide wafer
US8998949B2 (en) * 2004-11-09 2015-04-07 Biomet Sports Medicine, Llc Soft tissue conduit device
US7300519B2 (en) * 2004-11-17 2007-11-27 Cree, Inc. Reduction of subsurface damage in the production of bulk SiC crystals
US7709859B2 (en) * 2004-11-23 2010-05-04 Cree, Inc. Cap layers including aluminum nitride for nitride-based transistors
US7456443B2 (en) 2004-11-23 2008-11-25 Cree, Inc. Transistors having buried n-type and p-type regions beneath the source region
US7161194B2 (en) 2004-12-06 2007-01-09 Cree, Inc. High power density and/or linearity transistors
US7355215B2 (en) 2004-12-06 2008-04-08 Cree, Inc. Field effect transistors (FETs) having multi-watt output power at millimeter-wave frequencies
US7563321B2 (en) * 2004-12-08 2009-07-21 Cree, Inc. Process for producing high quality large size silicon carbide crystals
US7811943B2 (en) * 2004-12-22 2010-10-12 Cree, Inc. Process for producing silicon carbide crystals having increased minority carrier lifetimes
US7236053B2 (en) * 2004-12-31 2007-06-26 Cree, Inc. High efficiency switch-mode power amplifier
US7436039B2 (en) 2005-01-06 2008-10-14 Velox Semiconductor Corporation Gallium nitride semiconductor device
US7246735B2 (en) * 2005-01-07 2007-07-24 Asm Assembly Automation Ltd. Wire clamping plate
US9793247B2 (en) * 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US7821023B2 (en) 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US7335920B2 (en) 2005-01-24 2008-02-26 Cree, Inc. LED with current confinement structure and surface roughening
US7276117B2 (en) * 2005-02-09 2007-10-02 Cree Dulles, Inc. Method of forming semi-insulating silicon carbide single crystal
US7932111B2 (en) * 2005-02-23 2011-04-26 Cree, Inc. Substrate removal process for high light extraction LEDs
US7465967B2 (en) * 2005-03-15 2008-12-16 Cree, Inc. Group III nitride field effect transistors (FETS) capable of withstanding high temperature reverse bias test conditions
US7323052B2 (en) * 2005-03-24 2008-01-29 Cree, Inc. Apparatus and method for the production of bulk silicon carbide single crystals
US7422634B2 (en) * 2005-04-07 2008-09-09 Cree, Inc. Three inch silicon carbide wafer with low warp, bow, and TTV
US8575651B2 (en) 2005-04-11 2013-11-05 Cree, Inc. Devices having thick semi-insulating epitaxial gallium nitride layer
US7626217B2 (en) * 2005-04-11 2009-12-01 Cree, Inc. Composite substrates of conductive and insulating or semi-insulating group III-nitrides for group III-nitride devices
US7608524B2 (en) * 2005-04-19 2009-10-27 Ii-Vi Incorporated Method of and system for forming SiC crystals having spatially uniform doping impurities
US20060263279A1 (en) * 2005-04-28 2006-11-23 Laurencin Cato T Adjustable path sublimator system and related method of use
US7615774B2 (en) * 2005-04-29 2009-11-10 Cree.Inc. Aluminum free group III-nitride based high electron mobility transistors
US7544963B2 (en) 2005-04-29 2009-06-09 Cree, Inc. Binary group III-nitride based high electron mobility transistors
US8901699B2 (en) 2005-05-11 2014-12-02 Cree, Inc. Silicon carbide junction barrier Schottky diodes with suppressed minority carrier injection
US7387680B2 (en) * 2005-05-13 2008-06-17 Cree, Inc. Method and apparatus for the production of silicon carbide crystals
US9412926B2 (en) * 2005-06-10 2016-08-09 Cree, Inc. High power solid-state lamp
US9331192B2 (en) * 2005-06-29 2016-05-03 Cree, Inc. Low dislocation density group III nitride layers on silicon carbide substrates and methods of making the same
US20070018199A1 (en) 2005-07-20 2007-01-25 Cree, Inc. Nitride-based transistors and fabrication methods with an etch stop layer
US20070018198A1 (en) * 2005-07-20 2007-01-25 Brandes George R High electron mobility electronic device structures comprising native substrates and methods for making the same
US8674375B2 (en) * 2005-07-21 2014-03-18 Cree, Inc. Roughened high refractive index layer/LED for high light extraction
TW200715570A (en) 2005-09-07 2007-04-16 Cree Inc Robust transistors with fluorine treatment
US20070110657A1 (en) * 2005-11-14 2007-05-17 Hunter Charles E Unseeded silicon carbide single crystals
US7419892B2 (en) * 2005-12-13 2008-09-02 Cree, Inc. Semiconductor devices including implanted regions and protective layers and methods of forming the same
JP5614766B2 (ja) * 2005-12-21 2014-10-29 クリー インコーポレイテッドCree Inc. 照明装置
US7709269B2 (en) 2006-01-17 2010-05-04 Cree, Inc. Methods of fabricating transistors including dielectrically-supported gate electrodes
US7592211B2 (en) 2006-01-17 2009-09-22 Cree, Inc. Methods of fabricating transistors including supported gate electrodes
US8101961B2 (en) 2006-01-25 2012-01-24 Cree, Inc. Transparent ohmic contacts on light emitting diodes with growth substrates
EP1985884B1 (de) * 2006-02-08 2012-10-24 Hitachi, Ltd. Elektrische bremse
US7566918B2 (en) * 2006-02-23 2009-07-28 Cree, Inc. Nitride based transistors for millimeter wave operation
US7388236B2 (en) * 2006-03-29 2008-06-17 Cree, Inc. High efficiency and/or high power density wide bandgap transistors
US8969908B2 (en) * 2006-04-04 2015-03-03 Cree, Inc. Uniform emission LED package
USD738832S1 (en) 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
US9780268B2 (en) 2006-04-04 2017-10-03 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
AU2007233320B2 (en) 2006-04-04 2013-12-12 Singulex, Inc. Highly sensitive system and methods for analysis of troponin
WO2007116517A1 (ja) * 2006-04-10 2007-10-18 Fujitsu Limited 化合物半導体構造とその製造方法
US9335006B2 (en) * 2006-04-18 2016-05-10 Cree, Inc. Saturated yellow phosphor converted LED and blue converted red LED
JP2007284306A (ja) * 2006-04-19 2007-11-01 Nippon Steel Corp 炭化珪素単結晶及びその製造方法
JP4954596B2 (ja) * 2006-04-21 2012-06-20 新日本製鐵株式会社 炭化珪素単結晶インゴットの製造方法
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US11210971B2 (en) 2009-07-06 2021-12-28 Cree Huizhou Solid State Lighting Company Limited Light emitting diode display with tilted peak emission pattern
US9040398B2 (en) * 2006-05-16 2015-05-26 Cree, Inc. Method of fabricating seminconductor devices including self aligned refractory contacts
WO2007139894A2 (en) 2006-05-26 2007-12-06 Cree Led Lighting Solutions, Inc. Solid state light emitting device and method of making same
US8698184B2 (en) 2011-01-21 2014-04-15 Cree, Inc. Light emitting diodes with low junction temperature and solid state backlight components including light emitting diodes with low junction temperature
US8980445B2 (en) * 2006-07-06 2015-03-17 Cree, Inc. One hundred millimeter SiC crystal grown on off-axis seed
AU2007275780B2 (en) * 2006-07-19 2011-02-24 Sk Siltron Css, Llc Method of manufacturing substrates having improved carrier lifetimes
US7943952B2 (en) * 2006-07-31 2011-05-17 Cree, Inc. Method of uniform phosphor chip coating and LED package fabricated using method
US7728402B2 (en) * 2006-08-01 2010-06-01 Cree, Inc. Semiconductor devices including schottky diodes with controlled breakdown
US8432012B2 (en) 2006-08-01 2013-04-30 Cree, Inc. Semiconductor devices including schottky diodes having overlapping doped regions and methods of fabricating same
EP2052414B1 (de) 2006-08-17 2016-03-30 Cree, Inc. Bipolare hochleistungstransistoren mit isoliertem gate
CN101554089A (zh) * 2006-08-23 2009-10-07 科锐Led照明科技公司 照明装置和照明方法
JP5562641B2 (ja) 2006-09-14 2014-07-30 クリー インコーポレイテッド マイクロパイプ・フリーの炭化ケイ素およびその製造方法
US9018619B2 (en) * 2006-10-09 2015-04-28 Cree, Inc. Quantum wells for light conversion
US10873002B2 (en) * 2006-10-20 2020-12-22 Cree, Inc. Permanent wafer bonding using metal alloy preform discs
US8823057B2 (en) 2006-11-06 2014-09-02 Cree, Inc. Semiconductor devices including implanted regions for providing low-resistance contact to buried layers and related devices
US10295147B2 (en) * 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
JP5105160B2 (ja) 2006-11-13 2012-12-19 クリー インコーポレイテッド トランジスタ
US7692263B2 (en) 2006-11-21 2010-04-06 Cree, Inc. High voltage GaN transistors
US9318327B2 (en) 2006-11-28 2016-04-19 Cree, Inc. Semiconductor devices having low threading dislocations and improved light extraction and methods of making the same
CN101622493A (zh) * 2006-12-04 2010-01-06 科锐Led照明科技公司 照明装置和照明方法
US9310026B2 (en) 2006-12-04 2016-04-12 Cree, Inc. Lighting assembly and lighting method
US7834367B2 (en) 2007-01-19 2010-11-16 Cree, Inc. Low voltage diode with reduced parasitic resistance and method for fabricating
US8232564B2 (en) * 2007-01-22 2012-07-31 Cree, Inc. Wafer level phosphor coating technique for warm light emitting diodes
US9196799B2 (en) * 2007-01-22 2015-11-24 Cree, Inc. LED chips having fluorescent substrates with microholes and methods for fabricating
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9159888B2 (en) * 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US8021904B2 (en) * 2007-02-01 2011-09-20 Cree, Inc. Ohmic contacts to nitrogen polarity GaN
US8835987B2 (en) * 2007-02-27 2014-09-16 Cree, Inc. Insulated gate bipolar transistors including current suppressing layers
US8362503B2 (en) 2007-03-09 2013-01-29 Cree, Inc. Thick nitride semiconductor structures with interlayer structures
US8212290B2 (en) * 2007-03-23 2012-07-03 Cree, Inc. High temperature performance capable gallium nitride transistor
US9484499B2 (en) * 2007-04-20 2016-11-01 Cree, Inc. Transparent ohmic contacts on light emitting diodes with carrier substrates
US20080258130A1 (en) * 2007-04-23 2008-10-23 Bergmann Michael J Beveled LED Chip with Transparent Substrate
US7982363B2 (en) * 2007-05-14 2011-07-19 Cree, Inc. Bulk acoustic device and method for fabricating
US8449671B2 (en) 2007-06-27 2013-05-28 Ii-Vi Incorporated Fabrication of SiC substrates with low warp and bow
US9401461B2 (en) * 2007-07-11 2016-07-26 Cree, Inc. LED chip design for white conversion
US10505083B2 (en) * 2007-07-11 2019-12-10 Cree, Inc. Coating method utilizing phosphor containment structure and devices fabricated using same
US8111001B2 (en) 2007-07-17 2012-02-07 Cree, Inc. LED with integrated constant current driver
JP5431320B2 (ja) * 2007-07-17 2014-03-05 クリー インコーポレイテッド 内部光学機能を備えた光学素子およびその製造方法
US8409351B2 (en) * 2007-08-08 2013-04-02 Sic Systems, Inc. Production of bulk silicon carbide with hot-filament chemical vapor deposition
US11114594B2 (en) * 2007-08-24 2021-09-07 Creeled, Inc. Light emitting device packages using light scattering particles of different size
US8163086B2 (en) * 2007-08-29 2012-04-24 Cree, Inc. Halogen assisted physical vapor transport method for silicon carbide growth
US9012937B2 (en) 2007-10-10 2015-04-21 Cree, Inc. Multiple conversion material light emitting diode package and method of fabricating same
US9666762B2 (en) 2007-10-31 2017-05-30 Cree, Inc. Multi-chip light emitter packages and related methods
US9082921B2 (en) 2007-10-31 2015-07-14 Cree, Inc. Multi-die LED package
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US9172012B2 (en) 2007-10-31 2015-10-27 Cree, Inc. Multi-chip light emitter packages and related methods
US9461201B2 (en) 2007-11-14 2016-10-04 Cree, Inc. Light emitting diode dielectric mirror
US8536584B2 (en) 2007-11-14 2013-09-17 Cree, Inc. High voltage wire bond free LEDS
US7985970B2 (en) * 2009-04-06 2011-07-26 Cree, Inc. High voltage low current surface-emitting LED
US7915629B2 (en) * 2008-12-08 2011-03-29 Cree, Inc. Composite high reflectivity layer
US8167674B2 (en) * 2007-12-14 2012-05-01 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US9041285B2 (en) 2007-12-14 2015-05-26 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US9431589B2 (en) * 2007-12-14 2016-08-30 Cree, Inc. Textured encapsulant surface in LED packages
US10008637B2 (en) 2011-12-06 2018-06-26 Cree, Inc. Light emitter devices and methods with reduced dimensions and improved light output
US8460764B2 (en) * 2008-03-06 2013-06-11 Georgia Tech Research Corporation Method and apparatus for producing ultra-thin graphitic layers
US8637883B2 (en) 2008-03-19 2014-01-28 Cree, Inc. Low index spacer layer in LED devices
US8877524B2 (en) * 2008-03-31 2014-11-04 Cree, Inc. Emission tuning methods and devices fabricated utilizing methods
US7859000B2 (en) * 2008-04-10 2010-12-28 Cree, Inc. LEDs using single crystalline phosphor and methods of fabricating same
US9287469B2 (en) 2008-05-02 2016-03-15 Cree, Inc. Encapsulation for phosphor-converted white light emitting diode
US8232558B2 (en) 2008-05-21 2012-07-31 Cree, Inc. Junction barrier Schottky diodes with current surge capability
WO2009148543A2 (en) * 2008-05-29 2009-12-10 Cree, Inc. Light source with near field mixing
US20090311381A1 (en) * 2008-06-11 2009-12-17 Gardner Susanne Beverages composed of wine components
US8384115B2 (en) * 2008-08-01 2013-02-26 Cree, Inc. Bond pad design for enhancing light extraction from LED chips
US9425172B2 (en) * 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
US8858032B2 (en) 2008-10-24 2014-10-14 Cree, Inc. Lighting device, heat transfer structure and heat transfer element
SE537049C2 (sv) * 2008-12-08 2014-12-16 Ii Vi Inc Process och apparat för tillväxt via axiell gradienttransport (AGT) nyttjande resistiv uppvärmning
US8017963B2 (en) 2008-12-08 2011-09-13 Cree, Inc. Light emitting diode with a dielectric mirror having a lateral configuration
US7897419B2 (en) 2008-12-23 2011-03-01 Cree, Inc. Color correction for wafer level white LEDs
US7923739B2 (en) 2009-06-05 2011-04-12 Cree, Inc. Solid state lighting device
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US10431567B2 (en) 2010-11-03 2019-10-01 Cree, Inc. White ceramic LED package
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US8083384B2 (en) 2009-02-02 2011-12-27 Teledyne Technologies Incorporated Efficient illumination device for aircraft
EP2411569B1 (de) 2009-03-26 2021-09-22 II-VI Incorporated Verfahren und vorrichtung für sic-einzelkristall-sublimationszüchtung
US9093293B2 (en) 2009-04-06 2015-07-28 Cree, Inc. High voltage low current surface emitting light emitting diode
US8476668B2 (en) * 2009-04-06 2013-07-02 Cree, Inc. High voltage low current surface emitting LED
US8741715B2 (en) * 2009-04-29 2014-06-03 Cree, Inc. Gate electrodes for millimeter-wave operation and methods of fabrication
US8294507B2 (en) 2009-05-08 2012-10-23 Cree, Inc. Wide bandgap bipolar turn-off thyristor having non-negative temperature coefficient and related control circuits
US9035328B2 (en) 2011-02-04 2015-05-19 Cree, Inc. Light-emitting diode component
US8629509B2 (en) * 2009-06-02 2014-01-14 Cree, Inc. High voltage insulated gate bipolar transistors with minority carrier diverter
US8193848B2 (en) 2009-06-02 2012-06-05 Cree, Inc. Power switching devices having controllable surge current capabilities
US8304783B2 (en) 2009-06-03 2012-11-06 Cree, Inc. Schottky diodes including polysilicon having low barrier heights and methods of fabricating the same
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US8860043B2 (en) 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
US8415692B2 (en) 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
US8541787B2 (en) * 2009-07-15 2013-09-24 Cree, Inc. High breakdown voltage wide band-gap MOS-gated bipolar junction transistors with avalanche capability
US8105889B2 (en) 2009-07-27 2012-01-31 Cree, Inc. Methods of fabricating transistors including self-aligned gate electrodes and source/drain regions
US8598809B2 (en) * 2009-08-19 2013-12-03 Cree, Inc. White light color changing solid state lighting and methods
US8354690B2 (en) 2009-08-31 2013-01-15 Cree, Inc. Solid-state pinch off thyristor circuits
US9362459B2 (en) * 2009-09-02 2016-06-07 United States Department Of Energy High reflectivity mirrors and method for making same
WO2011034850A1 (en) * 2009-09-15 2011-03-24 Ii-Vi Incorporated Sublimation growth of sic single crystals
US9312343B2 (en) 2009-10-13 2016-04-12 Cree, Inc. Transistors with semiconductor interconnection layers and semiconductor channel layers of different semiconductor materials
US8511851B2 (en) 2009-12-21 2013-08-20 Cree, Inc. High CRI adjustable color temperature lighting devices
US8350370B2 (en) * 2010-01-29 2013-01-08 Cree Huizhou Opto Limited Wide angle oval light emitting diode package
US8563372B2 (en) * 2010-02-11 2013-10-22 Cree, Inc. Methods of forming contact structures including alternating metal and silicon layers and related devices
US9214352B2 (en) 2010-02-11 2015-12-15 Cree, Inc. Ohmic contact to semiconductor device
US9548206B2 (en) 2010-02-11 2017-01-17 Cree, Inc. Ohmic contact structure for group III nitride semiconductor device having improved surface morphology and well-defined edge features
US9468070B2 (en) 2010-02-16 2016-10-11 Cree Inc. Color control of light emitting devices and applications thereof
US9117739B2 (en) 2010-03-08 2015-08-25 Cree, Inc. Semiconductor devices with heterojunction barrier regions and methods of fabricating same
US9105824B2 (en) 2010-04-09 2015-08-11 Cree, Inc. High reflective board or substrate for LEDs
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
US8901583B2 (en) 2010-04-12 2014-12-02 Cree Huizhou Opto Limited Surface mount device thin package
US8415671B2 (en) 2010-04-16 2013-04-09 Cree, Inc. Wide band-gap MOSFETs having a heterojunction under gate trenches thereof and related methods of forming such devices
US8329482B2 (en) 2010-04-30 2012-12-11 Cree, Inc. White-emitting LED chips and method for making same
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
WO2012005771A2 (en) 2010-07-06 2012-01-12 Cree, Inc. Compact optically efficient solid state light source with integrated thermal management
USD643819S1 (en) 2010-07-16 2011-08-23 Cree, Inc. Package for light emitting diode (LED) lighting
US10546846B2 (en) 2010-07-23 2020-01-28 Cree, Inc. Light transmission control for masking appearance of solid state light sources
US9831393B2 (en) 2010-07-30 2017-11-28 Cree Hong Kong Limited Water resistant surface mount device package
US8764224B2 (en) 2010-08-12 2014-07-01 Cree, Inc. Luminaire with distributed LED sources
US9627361B2 (en) 2010-10-07 2017-04-18 Cree, Inc. Multiple configuration light emitting devices and methods
US8455882B2 (en) 2010-10-15 2013-06-04 Cree, Inc. High efficiency LEDs
US9249952B2 (en) 2010-11-05 2016-02-02 Cree, Inc. Multi-configurable, high luminous output light fixture systems, devices and methods
USD712850S1 (en) 2010-11-18 2014-09-09 Cree, Inc. Light emitter device
USD707192S1 (en) 2010-11-18 2014-06-17 Cree, Inc. Light emitting device
USD721339S1 (en) 2010-12-03 2015-01-20 Cree, Inc. Light emitter device
US8564000B2 (en) 2010-11-22 2013-10-22 Cree, Inc. Light emitting devices for light emitting diodes (LEDs)
US9490235B2 (en) 2010-11-22 2016-11-08 Cree, Inc. Light emitting devices, systems, and methods
US8575639B2 (en) 2011-02-16 2013-11-05 Cree, Inc. Light emitting devices for light emitting diodes (LEDs)
US8624271B2 (en) 2010-11-22 2014-01-07 Cree, Inc. Light emitting devices
US20150062915A1 (en) 2013-09-05 2015-03-05 Cree, Inc. Light emitting diode devices and methods with reflective material for increased light output
US9300062B2 (en) 2010-11-22 2016-03-29 Cree, Inc. Attachment devices and methods for light emitting devices
US10267506B2 (en) 2010-11-22 2019-04-23 Cree, Inc. Solid state lighting apparatuses with non-uniformly spaced emitters for improved heat distribution, system having the same, and methods having the same
US9000470B2 (en) 2010-11-22 2015-04-07 Cree, Inc. Light emitter devices
US9240395B2 (en) 2010-11-30 2016-01-19 Cree Huizhou Opto Limited Waterproof surface mount device package and method
USD706231S1 (en) 2010-12-03 2014-06-03 Cree, Inc. Light emitting device
US9822951B2 (en) 2010-12-06 2017-11-21 Cree, Inc. LED retrofit lens for fluorescent tube
US10309627B2 (en) 2012-11-08 2019-06-04 Cree, Inc. Light fixture retrofit kit with integrated light bar
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
US9391247B2 (en) 2010-12-16 2016-07-12 Cree, Inc. High power LEDs with non-polymer material lenses and methods of making the same
US9166126B2 (en) 2011-01-31 2015-10-20 Cree, Inc. Conformally coated light emitting devices and methods for providing the same
TW201251140A (en) 2011-01-31 2012-12-16 Cree Inc High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US9786811B2 (en) 2011-02-04 2017-10-10 Cree, Inc. Tilted emission LED array
US9583681B2 (en) 2011-02-07 2017-02-28 Cree, Inc. Light emitter device packages, modules and methods
CN103348496A (zh) 2011-02-07 2013-10-09 克利公司 用于发光二极管(led)发光的部件和方法
US8809880B2 (en) 2011-02-16 2014-08-19 Cree, Inc. Light emitting diode (LED) chips and devices for providing failure mitigation in LED arrays
US8455908B2 (en) 2011-02-16 2013-06-04 Cree, Inc. Light emitting devices
US8729589B2 (en) 2011-02-16 2014-05-20 Cree, Inc. High voltage array light emitting diode (LED) devices and fixtures
USD702653S1 (en) 2011-10-26 2014-04-15 Cree, Inc. Light emitting device component
US8922108B2 (en) 2011-03-01 2014-12-30 Cree, Inc. Remote component devices, systems, and methods for use with light emitting devices
US10147853B2 (en) 2011-03-18 2018-12-04 Cree, Inc. Encapsulant with index matched thixotropic agent
US8680556B2 (en) 2011-03-24 2014-03-25 Cree, Inc. Composite high reflectivity layer
US9263636B2 (en) 2011-05-04 2016-02-16 Cree, Inc. Light-emitting diode (LED) for achieving an asymmetric light output
US9029945B2 (en) 2011-05-06 2015-05-12 Cree, Inc. Field effect transistor devices with low source resistance
US9142662B2 (en) 2011-05-06 2015-09-22 Cree, Inc. Field effect transistor devices with low source resistance
KR20120128506A (ko) * 2011-05-17 2012-11-27 엘지이노텍 주식회사 종자정 부착 장치
US8777455B2 (en) 2011-06-23 2014-07-15 Cree, Inc. Retroreflective, multi-element design for a solid state directional lamp
US8757840B2 (en) 2011-06-23 2014-06-24 Cree, Inc. Solid state retroreflective directional lamp
US8616724B2 (en) 2011-06-23 2013-12-31 Cree, Inc. Solid state directional lamp including retroreflective, multi-element directional lamp optic
US8777463B2 (en) 2011-06-23 2014-07-15 Cree, Inc. Hybrid solid state emitter printed circuit board for use in a solid state directional lamp
US10243121B2 (en) 2011-06-24 2019-03-26 Cree, Inc. High voltage monolithic LED chip with improved reliability
US8686429B2 (en) 2011-06-24 2014-04-01 Cree, Inc. LED structure with enhanced mirror reflectivity
US9728676B2 (en) 2011-06-24 2017-08-08 Cree, Inc. High voltage monolithic LED chip
KR20130002616A (ko) * 2011-06-29 2013-01-08 에스케이이노베이션 주식회사 탄화규소 단결정 성장 장치 및 그 방법
USD700584S1 (en) 2011-07-06 2014-03-04 Cree, Inc. LED component
US10842016B2 (en) 2011-07-06 2020-11-17 Cree, Inc. Compact optically efficient solid state light source with integrated thermal management
US10211380B2 (en) 2011-07-21 2019-02-19 Cree, Inc. Light emitting devices and components having improved chemical resistance and related methods
US10686107B2 (en) 2011-07-21 2020-06-16 Cree, Inc. Light emitter devices and components with improved chemical resistance and related methods
CN103782402B (zh) 2011-07-21 2017-12-01 克利公司 用于改进的化学抗性的发光体器件封装、部件和方法、以及相关方法
US8558252B2 (en) 2011-08-26 2013-10-15 Cree, Inc. White LEDs with emission wavelength correction
CN103782403B (zh) 2011-09-06 2017-06-30 克利公司 具有改进的引线接合的光发射器封装件和装置及相关方法
US8664665B2 (en) 2011-09-11 2014-03-04 Cree, Inc. Schottky diode employing recesses for elements of junction barrier array
US9640617B2 (en) 2011-09-11 2017-05-02 Cree, Inc. High performance power module
US8680587B2 (en) 2011-09-11 2014-03-25 Cree, Inc. Schottky diode
CN103918079B (zh) 2011-09-11 2017-10-31 科锐 包括具有改进布局的晶体管的高电流密度功率模块
US9373617B2 (en) 2011-09-11 2016-06-21 Cree, Inc. High current, low switching loss SiC power module
US8618582B2 (en) 2011-09-11 2013-12-31 Cree, Inc. Edge termination structure employing recesses for edge termination elements
US8957440B2 (en) 2011-10-04 2015-02-17 Cree, Inc. Light emitting devices with low packaging factor
USD705181S1 (en) 2011-10-26 2014-05-20 Cree, Inc. Light emitting device component
US10043960B2 (en) 2011-11-15 2018-08-07 Cree, Inc. Light emitting diode (LED) packages and related methods
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
US9496466B2 (en) 2011-12-06 2016-11-15 Cree, Inc. Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction
US9786825B2 (en) 2012-02-07 2017-10-10 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components, and methods
US9806246B2 (en) 2012-02-07 2017-10-31 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components, and methods
US8895998B2 (en) 2012-03-30 2014-11-25 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components and methods
US9240530B2 (en) 2012-02-13 2016-01-19 Cree, Inc. Light emitter devices having improved chemical and physical resistance and related methods
US9343441B2 (en) 2012-02-13 2016-05-17 Cree, Inc. Light emitter devices having improved light output and related methods
JP5799846B2 (ja) * 2012-02-14 2015-10-28 住友電気工業株式会社 炭化珪素単結晶の製造方法および製造装置
US10020244B2 (en) 2012-03-27 2018-07-10 Cree, Inc. Polymer via plugs with high thermal integrity
US10222032B2 (en) 2012-03-30 2019-03-05 Cree, Inc. Light emitter components and methods having improved electrical contacts
US10134961B2 (en) 2012-03-30 2018-11-20 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US9538590B2 (en) 2012-03-30 2017-01-03 Cree, Inc. Solid state lighting apparatuses, systems, and related methods
WO2013151411A1 (en) 2012-04-06 2013-10-10 Cree, Inc. Light emitting diode components and methods for emitting a desired light beam pattern
US9188290B2 (en) 2012-04-10 2015-11-17 Cree, Inc. Indirect linear fixture
US8878204B2 (en) 2012-05-04 2014-11-04 Cree, Inc. Submount based light emitter components and methods
US10439112B2 (en) 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
US9349929B2 (en) 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
USD749051S1 (en) 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
US9590155B2 (en) 2012-06-06 2017-03-07 Cree, Inc. Light emitting devices and substrates with improved plating
US9685585B2 (en) 2012-06-25 2017-06-20 Cree, Inc. Quantum dot narrow-band downconverters for high efficiency LEDs
US8860040B2 (en) 2012-09-11 2014-10-14 Dow Corning Corporation High voltage power semiconductor devices on SiC
US9018639B2 (en) 2012-10-26 2015-04-28 Dow Corning Corporation Flat SiC semiconductor substrate
US9494304B2 (en) 2012-11-08 2016-11-15 Cree, Inc. Recessed light fixture retrofit kit
US9482396B2 (en) 2012-11-08 2016-11-01 Cree, Inc. Integrated linear light engine
US9441818B2 (en) 2012-11-08 2016-09-13 Cree, Inc. Uplight with suspended fixture
US10788176B2 (en) 2013-02-08 2020-09-29 Ideal Industries Lighting Llc Modular LED lighting system
US9316382B2 (en) 2013-01-31 2016-04-19 Cree, Inc. Connector devices, systems, and related methods for connecting light emitting diode (LED) modules
US9738991B2 (en) 2013-02-05 2017-08-22 Dow Corning Corporation Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a supporting shelf which permits thermal expansion
US9017804B2 (en) 2013-02-05 2015-04-28 Dow Corning Corporation Method to reduce dislocations in SiC crystal growth
US9797064B2 (en) 2013-02-05 2017-10-24 Dow Corning Corporation Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a support shelf which permits thermal expansion
US9345091B2 (en) 2013-02-08 2016-05-17 Cree, Inc. Light emitting device (LED) light fixture control systems and related methods
US8916896B2 (en) 2013-02-22 2014-12-23 Cree, Inc. Light emitter components and methods having improved performance
US10295124B2 (en) 2013-02-27 2019-05-21 Cree, Inc. Light emitter packages and methods
US10584860B2 (en) 2013-03-14 2020-03-10 Ideal Industries, Llc Linear light fixture with interchangeable light engine unit
USD738026S1 (en) 2013-03-14 2015-09-01 Cree, Inc. Linear wrap light fixture
US9874333B2 (en) 2013-03-14 2018-01-23 Cree, Inc. Surface ambient wrap light fixture
US9215792B2 (en) 2013-03-15 2015-12-15 Cree, Inc. Connector devices, systems, and related methods for light emitter components
US8940614B2 (en) 2013-03-15 2015-01-27 Dow Corning Corporation SiC substrate with SiC epitaxial film
USD733952S1 (en) 2013-03-15 2015-07-07 Cree, Inc. Indirect linear fixture
US9897267B2 (en) 2013-03-15 2018-02-20 Cree, Inc. Light emitter components, systems, and related methods
US9431590B2 (en) 2013-03-15 2016-08-30 Cree, Inc. Ceramic based light emitting diode (LED) devices and methods
USD738542S1 (en) 2013-04-19 2015-09-08 Cree, Inc. Light emitting unit
US9711489B2 (en) 2013-05-29 2017-07-18 Cree Huizhou Solid State Lighting Company Limited Multiple pixel surface mount device package
CN110246946B (zh) 2013-06-04 2023-04-21 科锐Led公司 发光二极管介质镜
US9679981B2 (en) 2013-06-09 2017-06-13 Cree, Inc. Cascode structures for GaN HEMTs
US9847411B2 (en) 2013-06-09 2017-12-19 Cree, Inc. Recessed field plate transistor structures
US9755059B2 (en) 2013-06-09 2017-09-05 Cree, Inc. Cascode structures with GaN cap layers
CN104241262B (zh) 2013-06-14 2020-11-06 惠州科锐半导体照明有限公司 发光装置以及显示装置
USD740453S1 (en) 2013-06-27 2015-10-06 Cree, Inc. Light emitter unit
USD739565S1 (en) 2013-06-27 2015-09-22 Cree, Inc. Light emitter unit
US9461024B2 (en) 2013-08-01 2016-10-04 Cree, Inc. Light emitter devices and methods for light emitting diode (LED) chips
USD758976S1 (en) 2013-08-08 2016-06-14 Cree, Inc. LED package
KR102245506B1 (ko) * 2013-09-06 2021-04-28 지티에이티 코포레이션 탄화규소 전구체로부터 벌크 탄화규소를 제조하기 위한 방법 및 장치
US10900653B2 (en) 2013-11-01 2021-01-26 Cree Hong Kong Limited LED mini-linear light engine
US10100988B2 (en) 2013-12-16 2018-10-16 Cree, Inc. Linear shelf light fixture with reflectors
USD750308S1 (en) 2013-12-16 2016-02-23 Cree, Inc. Linear shelf light fixture
US10612747B2 (en) 2013-12-16 2020-04-07 Ideal Industries Lighting Llc Linear shelf light fixture with gap filler elements
US10234119B2 (en) 2014-03-24 2019-03-19 Cree, Inc. Multiple voltage light emitter packages, systems, and related methods
USD757324S1 (en) 2014-04-14 2016-05-24 Cree, Inc. Linear shelf light fixture with reflectors
US9279192B2 (en) 2014-07-29 2016-03-08 Dow Corning Corporation Method for manufacturing SiC wafer fit for integration with power device manufacturing technology
USD790486S1 (en) 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
US9826581B2 (en) 2014-12-05 2017-11-21 Cree, Inc. Voltage configurable solid state lighting apparatuses, systems, and related methods
US10658546B2 (en) 2015-01-21 2020-05-19 Cree, Inc. High efficiency LEDs and methods of manufacturing
WO2016126554A1 (en) 2015-02-05 2016-08-11 Dow Corning Corporation Furnace for seeded sublimation of wide band gap crystals
USD777122S1 (en) 2015-02-27 2017-01-24 Cree, Inc. LED package
USD783547S1 (en) 2015-06-04 2017-04-11 Cree, Inc. LED package
RU2603159C1 (ru) * 2015-07-23 2016-11-20 Федеральное государственное автономное образовательное учреждение высшего образования "Санкт-Петербургский государственный электротехнический университет "ЛЭТИ" им. В.И. Ульянова (Ленина)" (СПбГЭТУ "ЛЭТИ") Способ получения монокристаллического sic
JP6036946B2 (ja) * 2015-08-26 2016-11-30 住友電気工業株式会社 炭化珪素単結晶の製造方法および製造装置
EP3353339A4 (de) 2015-09-24 2019-05-08 Melior Innovations Inc. Dampfabscheidungsvorrichtung und verfahren mit hochreinem siliciumcarbid aus polymer
USD823492S1 (en) 2016-10-04 2018-07-17 Cree, Inc. Light emitting device
US10804251B2 (en) 2016-11-22 2020-10-13 Cree, Inc. Light emitting diode (LED) devices, components and methods
US10672957B2 (en) 2017-07-19 2020-06-02 Cree, Inc. LED apparatuses and methods for high lumen output density
US11094852B2 (en) 2017-08-25 2021-08-17 Cree Huizhou Solid State Lighting Company Limited Multiple LED light source lens design in an integrated package
US11056625B2 (en) 2018-02-19 2021-07-06 Creeled, Inc. Clear coating for light emitting device exterior having chemical resistance and related methods
JP7255089B2 (ja) * 2018-05-25 2023-04-11 株式会社デンソー 炭化珪素単結晶製造装置および炭化珪素単結晶の製造方法
JP7129856B2 (ja) * 2018-09-06 2022-09-02 昭和電工株式会社 結晶成長装置
IT201900000223A1 (it) * 2019-01-09 2020-07-09 Lpe Spa Camera di reazione con elemento rotante e reattore per deposizione di materiale semiconduttore
US10923585B2 (en) 2019-06-13 2021-02-16 Cree, Inc. High electron mobility transistors having improved contact spacing and/or improved contact vias
US10971612B2 (en) 2019-06-13 2021-04-06 Cree, Inc. High electron mobility transistors and power amplifiers including said transistors having improved performance and reliability
JP7393900B2 (ja) * 2019-09-24 2023-12-07 一般財団法人電力中央研究所 炭化珪素単結晶ウェハ及び炭化珪素単結晶インゴットの製造方法
US11257940B2 (en) 2020-01-14 2022-02-22 Cree, Inc. Group III HEMT and capacitor that share structural features
CN111304746A (zh) * 2020-03-31 2020-06-19 福建北电新材料科技有限公司 SiC晶体生长装置及方法
US11837457B2 (en) 2020-09-11 2023-12-05 Wolfspeed, Inc. Packaging for RF transistor amplifiers
US11356070B2 (en) 2020-06-01 2022-06-07 Wolfspeed, Inc. RF amplifiers having shielded transmission line structures
US20210313293A1 (en) 2020-04-03 2021-10-07 Cree, Inc. Rf amplifier devices and methods of manufacturing
US11769768B2 (en) 2020-06-01 2023-09-26 Wolfspeed, Inc. Methods for pillar connection on frontside and passive device integration on backside of die
US11228287B2 (en) 2020-06-17 2022-01-18 Cree, Inc. Multi-stage decoupling networks integrated with on-package impedance matching networks for RF power amplifiers
US11533025B2 (en) 2020-06-18 2022-12-20 Wolfspeed, Inc. Integrated doherty amplifier with added isolation between the carrier and the peaking transistors
US11581859B2 (en) 2020-06-26 2023-02-14 Wolfspeed, Inc. Radio frequency (RF) transistor amplifier packages with improved isolation and lead configurations
US11887945B2 (en) 2020-09-30 2024-01-30 Wolfspeed, Inc. Semiconductor device with isolation and/or protection structures
US20220139852A1 (en) 2020-10-30 2022-05-05 Cree, Inc. Transistor packages with improved die attach
US12009417B2 (en) 2021-05-20 2024-06-11 Macom Technology Solutions Holdings, Inc. High electron mobility transistors having improved performance
US12015075B2 (en) 2021-05-20 2024-06-18 Macom Technology Solutions Holdings, Inc. Methods of manufacturing high electron mobility transistors having a modified interface region
US11842937B2 (en) 2021-07-30 2023-12-12 Wolfspeed, Inc. Encapsulation stack for improved humidity performance and related fabrication methods
US20230075505A1 (en) 2021-09-03 2023-03-09 Wolfspeed, Inc. Metal pillar connection topologies for heterogeneous packaging
US20230078017A1 (en) 2021-09-16 2023-03-16 Wolfspeed, Inc. Semiconductor device incorporating a substrate recess
EP4324961A1 (de) * 2022-08-17 2024-02-21 SiCrystal GmbH Verfahren zur herstellung eines massiven sic-einkristalls mit verbesserter qualität unter verwendung eines sic-impfkristalls mit einer temporären schutzoxidschicht und sic-impfkristall mit schutzoxidschicht
US20240105823A1 (en) 2022-09-23 2024-03-28 Wolfspeed, Inc. Barrier Structure for Dispersion Reduction in Transistor Devices
US20240105824A1 (en) 2022-09-23 2024-03-28 Wolfspeed, Inc. Barrier Structure for Sub-100 Nanometer Gate Length Devices
US20240120202A1 (en) 2022-10-06 2024-04-11 Wolfspeed, Inc. Implanted Regions for Semiconductor Structures with Deep Buried Layers
US20240266419A1 (en) 2023-02-03 2024-08-08 Wolfspeed, Inc. Semiconductor Device Having Semiconductor Structure with Polarity Inverting Layer
US20240266426A1 (en) 2023-02-03 2024-08-08 Wolfspeed, Inc. Semiconductor Structure for Improved Radio Frequency Thermal Management
US20240304702A1 (en) 2023-03-06 2024-09-12 Wolfspeed, Inc. Field Reducing Structures for Nitrogen-Polar Group III-Nitride Semiconductor Devices

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL87348C (de) * 1954-03-19 1900-01-01
US3228756A (en) * 1960-05-20 1966-01-11 Transitron Electronic Corp Method of growing single crystal silicon carbide
US3236780A (en) * 1962-12-19 1966-02-22 Gen Electric Luminescent silicon carbide and preparation thereof
NL6615060A (de) * 1966-10-25 1968-04-26
US3558284A (en) * 1967-05-05 1971-01-26 American Science & Eng Inc Crystal growing apparatus
US3511614A (en) * 1967-06-16 1970-05-12 Little Inc A Heat sensitive fuel controlled verneuil process
US3962406A (en) * 1967-11-25 1976-06-08 U.S. Philips Corporation Method of manufacturing silicon carbide crystals
US3910767A (en) * 1972-07-05 1975-10-07 Emile Joseph Jemal Apparatus for preparing metallic compounds by sublimation
US3862857A (en) * 1972-12-26 1975-01-28 Ibm Method for making amorphous semiconductor thin films
US3901767A (en) * 1973-04-23 1975-08-26 Robert L Williams Distillation mechanism and system
DE2324783A1 (de) * 1973-05-16 1974-12-12 Siemens Ag Verfahren und vorrichtung zum herstellen eines kristalls nach verneuil
US3960503A (en) * 1974-12-27 1976-06-01 Corning Glass Works Particulate material feeder for high temperature vacuum system
US4147572A (en) * 1976-10-18 1979-04-03 Vodakov Jury A Method for epitaxial production of semiconductor silicon carbide utilizing a close-space sublimation deposition technique
US4108670A (en) * 1976-12-20 1978-08-22 Ppg Industries, Inc. Porous refractory metal boride article having dense matrix
US4310614A (en) * 1979-03-19 1982-01-12 Xerox Corporation Method and apparatus for pretreating and depositing thin films on substrates
JPS5696883A (en) * 1979-12-29 1981-08-05 Toshiba Corp Manufacture of silicon carbide diode
JPS5948792B2 (ja) * 1982-08-17 1984-11-28 工業技術院長 炭化けい素結晶成長法
DE3230727C2 (de) * 1982-08-18 1987-02-19 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Herstellen von Einkristallen aus Siliziumkarbid SiC
DD224886A1 (de) * 1983-06-30 1985-07-17 Univ Dresden Tech Verfahren zur zuechtung von siliciumcarbid-einkristallen
US4627990A (en) * 1984-03-07 1986-12-09 Honda Giken Kogyo Kabushiki Kaisha Method of and apparatus for supplying powdery material
US4556436A (en) * 1984-08-22 1985-12-03 The United States Of America As Represented By The Secretary Of The Navy Method of preparing single crystalline cubic silicon carbide layers
NL8500645A (nl) * 1985-03-07 1986-10-01 Philips Nv Werkwijze voor het afzetten van een laag, die in hoofdzaak uit siliciumcarbide bestaat op een substraat.
JPH0788274B2 (ja) * 1985-09-18 1995-09-27 三洋電機株式会社 SiC単結晶の成長方法
US4640221A (en) * 1985-10-30 1987-02-03 International Business Machines Corporation Vacuum deposition system with improved mass flow control
US4664944A (en) * 1986-01-31 1987-05-12 The United States Of America As Represented By The United States Department Of Energy Deposition method for producing silicon carbide high-temperature semiconductors
JPS63283014A (ja) * 1987-04-28 1988-11-18 Sharp Corp 炭化珪素半導体素子
US10156877B2 (en) 2016-10-01 2018-12-18 Intel Corporation Enhanced power management for support of priority system events
CN110312461B (zh) 2017-04-19 2022-07-15 Hoya株式会社 内窥镜顶部的安装装置

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US4866005A (en) 1989-09-12
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EP1143493A2 (de) 2001-10-10
EP0712150B1 (de) 2002-02-06
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JPH03501118A (ja) 1991-03-14
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