DE1143493T1 - Sublimationsanwachse von Siliziumkarbidkristallen - Google Patents
Sublimationsanwachse von SiliziumkarbidkristallenInfo
- Publication number
- DE1143493T1 DE1143493T1 DE1143493T DE01201980T DE1143493T1 DE 1143493 T1 DE1143493 T1 DE 1143493T1 DE 1143493 T DE1143493 T DE 1143493T DE 01201980 T DE01201980 T DE 01201980T DE 1143493 T1 DE1143493 T1 DE 1143493T1
- Authority
- DE
- Germany
- Prior art keywords
- starting powder
- seed crystal
- temperature
- growth
- maintaining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013078 crystal Substances 0.000 title claims 33
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims 17
- 229910010271 silicon carbide Inorganic materials 0.000 title claims 15
- 238000000859 sublimation Methods 0.000 title claims 7
- 230000008022 sublimation Effects 0.000 title claims 7
- 239000001993 wax Substances 0.000 title 1
- 239000000843 powder Substances 0.000 claims 43
- 238000000034 method Methods 0.000 claims 21
- 229910052710 silicon Inorganic materials 0.000 claims 8
- 239000002245 particle Substances 0.000 claims 6
- 239000000203 mixture Substances 0.000 claims 5
- 238000005092 sublimation method Methods 0.000 claims 4
- 244000309464 bull Species 0.000 claims 1
- 230000004907 flux Effects 0.000 claims 1
- 239000012535 impurity Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000012544 monitoring process Methods 0.000 claims 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims 1
Classifications
-
- H01L21/205—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0054—Processes for devices with an active region comprising only group IV elements
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/36—Carbides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/021—Continuous process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/148—Silicon carbide
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Claims (16)
1. Verfahren zur wiederholbaren Steuerung des Aufwachsens von großen Einkristallen eines einzelnen Polytyps Siliziumcarbid
unabhängig von der Verwendung von Verunreinigungen als ein primärer Mechanismus zur Steuerung des Wachsturas von PoIytypen,
wobei die Kristalle zur Verwendung in der Herstellung elektrischer Geräte geeignet sind, wobei das Verfahren Folgendes
aufweist:
Einführen eines monokristallinen Impfkristalls (17, 32) aus
Siliziumcarbid eines gewünschten Polytyps und eines Siliziumcarbid-Ausgangspulvers
(40) in ein Sublimationssystem; Erhöhen der Temperatur des Siliziumcarbid-Ausgangspulvers auf
eine Temperatur, die zur Sublimation des Ausgangspulvers ausreicht; während
die Temperatur der Aufwachsoberfläche des Impfkristalls auf
eine Temperatur angehoben wird, die nahezu der Temperatur des Ausgangspulvers entspricht, aber niedriger ist als die Temperatur
des Ausgangspulvers und niedriger als diejenige Temperatur, bei der Siliziumcarbid unter den .Gasdruckbedingungen des
Sublimationssystems sublimiert;
gekennzeichnet durch
gekennzeichnet durch
Erzeugen und Aufrechterhalten eines konstanten Stroms dampfförmigen
Si, Si2C und SiC2 pro Flächeneinheit und Zeiteinheit
aus dem Ausgangspulver (40) zur Aufwachsoberfläche des Impfkristalls
(17, 32) über eine hinreichend lange Zeit, um ein gewünschtes Maß des makroskopischen Wachstums aus monokristallinem
Siliziumcarbid des gewünschten Polytyps auf dem Impfkristall zu erzeugen, wobei der konstante Strom durch ein
Verfahren aufrechterhalten wird, das die Aufrechterhaltung eines konstanten Wärmegradienten umfasst, gemessen zwischen
der Aufwachsoberfläche des Impfkristalls und dem Ausgangspulver
während des Aufwachsens des Kristalls und des Verbrauchs des Ausgangspulvers, wobei die Aufwachsoberfläche des
Impfkristalls und das Ausgangspulver auf ihren jeweiligen ver-
DE/FP 1 1434S3T1
schiedenen Temperaturen gehalten werden, um dadurch eine konstante
Wachsturnsrate des Impf-Einkristalls und ein gleichmäßiges
Wachstum eines einzigen Polytpyen auf der einzigen Aufwachsoberfläche des Impfkristalls aufrechtzuerhalten.
2. Verfahren nach Anspruch 1, bei dem der Schritt des Aufrechterhaltens
des konstanten Wärmegradienten zwischen der Aufwachsoberfläche des Impfkristalls (17, 32) und dem Ausgangspulver
(40) die Schaffung einer relativen Bewegung zwischen der Aufwachsoberfläche des Impfkristalls und dem
Ausgangspulver während des Wachstums des Impfkristalls beinhaltet,
wobei das Ausgangspulver auf der Temperatur gehalten wird, die zur Sublimation von Siliziumcarbid ausreicht, und
der Impfkristall auf der Temperatur nahe der Temperatur des Ausgangspulver, aber niedriger als die Temperatur des Aus-'7
gangspulvers und niedriger als die Temperatur, bei der Siliziumcarbid sublimiert, gehalten wird.
3. Verfahren nach Anspruch 1, bei dem der Schritt des Aufrechterhaltens
des konstanten Wärmegradienten zwischen der Aufwachsoberfläche des Impfkristalls und dem Ausgangspulver
die Aufrechterhaltung eines festen Abstands zwischen der Aufwachsoberfläche
des Impfkristalls und dem Ausgangspulver während des Wachstums des Kristalls beinhaltet.
4. Verfahren nach Anspruch 1, bei dem der Schritt des Aufrechterhaltens
des konstanten Wärmegradienten zwischen der Aufwachsoberfläche des Impfkristalls und dem Ausgangspulver
die unabhängige Regelung der Temperaturen des Ausgangspulvers und des Impfkristalls beinhaltet, indem die Temperatur des
Ausgangspulvers und die Temperatur des Impfkristalls getrennt
überwacht und die Temperatur des Ausgangspulvers und die Temperatur des Impfkristalls getrennt eingeregelt werden.
OE/EP 1 U3A93T1
5. Verfahren nach einem der vorstehenden Ansprüche, das den Schritt der Rotation des Impfkristalls (17, 32) während des
Wachstums des Impfkristalls und des Verbrauchs des Ausgangspulvers
(40) enthält, um dadurch ein konstantes Temperaturprofil über die Aufwachsoberfläche des Impfkristalls aufrechtzuerhalten,
den Einfluss von Flussschwankungen zu dämpfen und um zu verhindern, dass der wachsende Kristall (33) an unerwünschten
mechanischen Abschnitten des Sublimationssystems haften bleibt.
6. Verfahren nach einem der vorstehenden Ansprüche, bei dem der Schritt der Erhöhung der Temperatur des Siliziumcarbid-Ausgangspulvers
(40) das Anheben der Temperatur des Siliziumcarbid-Ausgangspulvers auf zwischen ca. 22500C und 23500C
beinhaltet. ' .
7. Verfahren nach einem der vorstehenden Ansprüche, bei dem der Schritt des Anhebens der Temperatur des Impfkristalls (17,
32) das Anheben der Temperatur des Impfkristalls auf zwischen ca. 21500C und 2250°C beinhaltet.
8. Verfahren nach einem der vorstehenden Ansprüche, bei dem die Schritte des Anhebens der Temperatur des Siliziuracarbid-Ausgangspulvers
(40) und des Anhebens der Temperatur der Aufwachsoberfläche des Impfkristalls (17, 32) die,Einführung
eines Wärmegradienten von 20.0C pro Zentrimeter zwischen dem
Ausgangspulver und dem Impfkristall beinhaltet.
9. Verfahren nach einem der vorstehenden Ansprüche, bei dem der Schritt des Einführens eines Impf-Einkristalls (17, 32)
aus Siliziumcarbid das Einführen eines Impfkristalls beinhaltet,
für den eine Fläche entsprechend einer niedrigen ganzzahligen Millerschen Indexfläche geschnitten worden ist, um
eine Fläche freizulegen, die nicht senkrecht zu einer Achse senkrecht zur niedrigen ganzzahligen Millerschen Indexfläche
DE/EP 1 143493 T1
verläuft, die geschnitten wurde.
10. Verfahren nach einem der vorstehenden Ansprüche, bei dem der Schritt des Erzeugens und Aufrechterhaltens des im Wesentlichen
konstanten Stroms dampfförmigen Si, Si2C und SiC2 pro
Flächeneinheit und Zeiteinheit beinhaltet, ein Ausgangspulver (40) mit einer gewählten Polytypzusammensetzung einzuführen
und die gewählte Polytypzusammensetzung im Ausgangspulver während des gesamten Wachstumsprozesses im Wesentlichen
konstant zu halten.
11. Verfahren nach Anspruch 10, bei dem der Schritt der Einhaltung
der ursprünglich gewählten Zusammensetzung aus PoIytypen im Ausgangspulver das Nachfüllen des Ausgangspulvers
während des Sublimationsprozesses unter Verwendung eines Nachfüll-Ausgangspulvers
mit einer Polytypzusammensetzung beinhaltet, die die ursprünglich gewählte Polytypzusammensetzung
im Ausgangspulver im Sublimationssystem im Wesentlichen konstant hält.
12. Verfahren nach einem der vorstehenden Ansprüche, bei dem der Schritt des Erzeugens und Aufrechterhaltens des im Wesentlichen
konstanten Stroms dampfförmigen Si, Si2C und SiC2 pro
Flächeneinheit und Zeiteinheit beinhaltet, ein Ausgangspulver (40) mit einer gewählten vorgegebenen Verteilung von
Oberflächenbereichen einzuführen und die gewählte Verteilung von Oberflächenbereichen im Ausgangspulver während des
gesamten Wachstumsprozesses im Wesentlichen konstant, zu halten.
13. Verfahren nach Anspruch 12, bei dem der Schritt der Aufrechterhaltung
der ursprünglich gewählten vorgegebenen Verteilung von Oberflächenbereichen das Nachfüllen des
Ausgangspulvers (40) während des Sublimationsprozesses unter Verwendung eines Nachfüll-Ausgangspulvers mit einer Verteilung
• «
I··
DE/EP 1 143493 T1
von Oberflächenbereichen beinhaltet, die die ursprünglich
gewählte Verteilung von Oberflächenbereichen im Ausgangspulver im Sublimationssystem im Wesentlichen konstant hält.
14. Verfahren nach einem der vorstehenden Ansprüche, bei dem der Schritt des Erzeugens und Aufrechterhaltens des im Wesentlichen
konstanten Stroms dampfförmigen Si, Si2C und S1C2pro
Flächeneinheit und Zeiteinheit beinhaltet, ein Ausgangspulver (40) mit einer gewählten vorgebenen Verteilung der
Partikelgrößen einzuführen und die gewählte Verteilung der Partikelgrößen im Ausgangspulver während des gesamten
Wachstumsprozesses im Wesentlichen konstant zu halten.
15. Verfahren nach Anspruch 14, bei dem der Schritt der Auf-rechterhaltung
der "ursprünglich gewählten vorgegebenen Verteilung der Partikelgrößen das Nachfüllen des Ausgangspulvers
(40) während des Sublimationsprozesses unter Verwendung eines Nachfüll-Ausgangspulvers mit einer Partikelgrößenverteilung
beinhaltet, die die ursprünglich gewählte Verteilung der ■. Partikelgrößen im Ausgangspulver im Sublimationssystem im
Wesentlichen konstant hält.
16. Verfahren nach Anspruch 13 oder 15, bei dem der Schritt des Nachfüllens des Ausgangspulvers (40) während des Sublimationsprozesses
unter Verwendung eines Ausgangspulvers mit einer gewählten Verteilung der Partikelgrößen das Einführen
von Siliziumcarbidpulver mit der folgenden Größenverteilung beinhaltet, bestimmt nach dem Gewichtsprozentsatz einer Probe,
der ein bestimmtes Tyler-Maschensieb passiert:
Tyler-Maschensieb Gewichtsprozent, passiert 20 - 40 43%
40 - 60 19%
60 - 100 17%
über 100 21%
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/113,565 US4866005A (en) | 1987-10-26 | 1987-10-26 | Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide |
Publications (1)
Publication Number | Publication Date |
---|---|
DE1143493T1 true DE1143493T1 (de) | 2002-11-28 |
Family
ID=22350170
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3856514T Expired - Lifetime DE3856514T2 (de) | 1987-10-26 | 1988-10-26 | Sublimationsanwachsen von Siliziumkarbideinkristallen |
DE3855539T Expired - Lifetime DE3855539T3 (de) | 1987-10-26 | 1988-10-26 | Sublimationsanwachsen von siliziumkarbideinkristallen |
DE1143493T Pending DE1143493T1 (de) | 1987-10-26 | 1988-10-26 | Sublimationsanwachse von Siliziumkarbidkristallen |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3856514T Expired - Lifetime DE3856514T2 (de) | 1987-10-26 | 1988-10-26 | Sublimationsanwachsen von Siliziumkarbideinkristallen |
DE3855539T Expired - Lifetime DE3855539T3 (de) | 1987-10-26 | 1988-10-26 | Sublimationsanwachsen von siliziumkarbideinkristallen |
Country Status (7)
Country | Link |
---|---|
US (2) | US4866005A (de) |
EP (3) | EP1143493A3 (de) |
JP (2) | JP3165685B2 (de) |
KR (1) | KR970008332B1 (de) |
CA (1) | CA1331730C (de) |
DE (3) | DE3856514T2 (de) |
WO (1) | WO1989004055A1 (de) |
Families Citing this family (480)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE59001292D1 (de) * | 1989-06-20 | 1993-06-03 | Siemens Ag | Verfahren zum herstellen von einkristallinem siliziumkarbid. |
US4946547A (en) * | 1989-10-13 | 1990-08-07 | Cree Research, Inc. | Method of preparing silicon carbide surfaces for crystal growth |
US5200022A (en) * | 1990-10-03 | 1993-04-06 | Cree Research, Inc. | Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product |
US5093576A (en) * | 1991-03-15 | 1992-03-03 | Cree Research | High sensitivity ultraviolet radiation detector |
US5958132A (en) * | 1991-04-18 | 1999-09-28 | Nippon Steel Corporation | SiC single crystal and method for growth thereof |
WO1992022922A2 (en) * | 1991-06-12 | 1992-12-23 | Case Western Reserve University | Process for the controlled growth of single-crystal films of silicon carbide polytypes on silicon carbide wafers |
US5248385A (en) * | 1991-06-12 | 1993-09-28 | The United States Of America, As Represented By The Administrator, National Aeronautics And Space Administration | Process for the homoepitaxial growth of single-crystal silicon carbide films on silicon carbide wafers |
US5465249A (en) * | 1991-11-26 | 1995-11-07 | Cree Research, Inc. | Nonvolatile random access memory device having transistor and capacitor made in silicon carbide substrate |
US5783335A (en) * | 1992-04-07 | 1998-07-21 | The Regents Of The University Of California, Office Of Technology Transfer | Fluidized bed deposition of diamond |
US5459107A (en) * | 1992-06-05 | 1995-10-17 | Cree Research, Inc. | Method of obtaining high quality silicon dioxide passivation on silicon carbide and resulting passivated structures |
US5629531A (en) * | 1992-06-05 | 1997-05-13 | Cree Research, Inc. | Method of obtaining high quality silicon dioxide passivation on silicon carbide and resulting passivated structures |
US5709745A (en) * | 1993-01-25 | 1998-01-20 | Ohio Aerospace Institute | Compound semi-conductors and controlled doping thereof |
CA2113336C (en) * | 1993-01-25 | 2001-10-23 | David J. Larkin | Compound semi-conductors and controlled doping thereof |
US5441011A (en) * | 1993-03-16 | 1995-08-15 | Nippon Steel Corporation | Sublimation growth of single crystal SiC |
DE4310745C2 (de) * | 1993-04-01 | 1999-07-08 | Siemens Ag | Verfahren zum Herstellen von SiC-Einkristallen und Vorrichtung zur Durchführung des Verfahrens |
DE4310744A1 (de) * | 1993-04-01 | 1994-10-06 | Siemens Ag | Vorrichtung zum Herstellen von SiC-Einkristallen |
US5611955A (en) * | 1993-10-18 | 1997-03-18 | Northrop Grumman Corp. | High resistivity silicon carbide substrates for high power microwave devices |
US6309766B1 (en) | 1994-10-31 | 2001-10-30 | Thomas M. Sullivan | Polycrystalline silicon carbide ceramic wafer and substrate |
US6077619A (en) * | 1994-10-31 | 2000-06-20 | Sullivan; Thomas M. | Polycrystalline silicon carbide ceramic wafer and substrate |
KR0183082B1 (ko) * | 1994-11-28 | 1999-04-15 | 전성원 | 복합 재료용 예비성형체 제조방법 |
US5679153A (en) * | 1994-11-30 | 1997-10-21 | Cree Research, Inc. | Method for reducing micropipe formation in the epitaxial growth of silicon carbide and resulting silicon carbide structures |
US5585648A (en) * | 1995-02-03 | 1996-12-17 | Tischler; Michael A. | High brightness electroluminescent device, emitting in the green to ultraviolet spectrum, and method of making the same |
SE9502288D0 (sv) * | 1995-06-26 | 1995-06-26 | Abb Research Ltd | A device and a method for epitaxially growing objects by CVD |
DE19527536A1 (de) * | 1995-07-27 | 1997-01-30 | Siemens Ag | Verfahren zum Herstellen von Siliciumcarbid-Einkristallen |
US6030661A (en) * | 1995-08-04 | 2000-02-29 | Abb Research Ltd. | Device and a method for epitaxially growing objects by CVD |
JP3491402B2 (ja) * | 1995-08-07 | 2004-01-26 | 株式会社デンソー | 単結晶製造方法及びその単結晶製造装置 |
US5762896A (en) * | 1995-08-31 | 1998-06-09 | C3, Inc. | Silicon carbide gemstones |
US5683507A (en) * | 1995-09-05 | 1997-11-04 | Northrop Grumman Corporation | Apparatus for growing large silicon carbide single crystals |
SE9503428D0 (sv) † | 1995-10-04 | 1995-10-04 | Abb Research Ltd | A method for epitaxially growing objects and a device for such a growth |
EP0781619A1 (de) | 1995-12-15 | 1997-07-02 | Cree Research, Inc. | Verfahren zur Herstellung von Siliciumkarbidscheiden aus Siliciumkarbideinkristallen |
US5746827A (en) * | 1995-12-27 | 1998-05-05 | Northrop Grumman Corporation | Method of producing large diameter silicon carbide crystals |
RU2094547C1 (ru) * | 1996-01-22 | 1997-10-27 | Юрий Александрович Водаков | Сублимационный способ выращивания монокристаллов карбида кремния и источник карбида кремния для осуществления способа |
US6547877B2 (en) | 1996-01-22 | 2003-04-15 | The Fox Group, Inc. | Tantalum crucible fabrication and treatment |
US5718760A (en) * | 1996-02-05 | 1998-02-17 | Cree Research, Inc. | Growth of colorless silicon carbide crystals |
US5944890A (en) * | 1996-03-29 | 1999-08-31 | Denso Corporation | Method of producing single crystals and a seed crystal used in the method |
US6110279A (en) * | 1996-03-29 | 2000-08-29 | Denso Corporation | Method of producing single-crystal silicon carbide |
JP3384242B2 (ja) * | 1996-03-29 | 2003-03-10 | 株式会社豊田中央研究所 | 炭化珪素単結晶の製造方法 |
FR2747401B1 (fr) * | 1996-04-10 | 1998-05-15 | Commissariat Energie Atomique | Dispositif et procede pour la formation de carbure de silicium (sic) monocristallin sur un germe |
US6403708B2 (en) | 1996-05-27 | 2002-06-11 | Mitsui Chemicals Inc | Crystalline polypropylenes, process for preparing thereof, polypropylene compositions, and thermoformed products |
US5858086A (en) | 1996-10-17 | 1999-01-12 | Hunter; Charles Eric | Growth of bulk single crystals of aluminum nitride |
US6039812A (en) * | 1996-10-21 | 2000-03-21 | Abb Research Ltd. | Device for epitaxially growing objects and method for such a growth |
US6537371B2 (en) | 1997-01-22 | 2003-03-25 | The Fox Group, Inc. | Niobium crucible fabrication and treatment |
ATE217368T1 (de) | 1997-01-22 | 2002-05-15 | Yury Alexandrovich Vodakov | Züchtung von siliziumkarbid einkristallen |
US6562130B2 (en) | 1997-01-22 | 2003-05-13 | The Fox Group, Inc. | Low defect axially grown single crystal silicon carbide |
ATE202807T1 (de) * | 1997-01-31 | 2001-07-15 | Northrop Grumman Corp | Vorrichtung zur züchtung von grossen siliziumkarbideinkristallen |
CN1159750C (zh) * | 1997-04-11 | 2004-07-28 | 日亚化学工业株式会社 | 氮化物半导体的生长方法 |
US5873937A (en) * | 1997-05-05 | 1999-02-23 | Northrop Grumman Corporation | Method of growing 4H silicon carbide crystal |
US5937317A (en) * | 1997-05-08 | 1999-08-10 | Northrop Grumman Corporation | Method of making a low resistivity silicon carbide boule |
US5788768A (en) * | 1997-05-08 | 1998-08-04 | Northrop Grumman Corporation | Feedstock arrangement for silicon carbide boule growth |
ES2226169T3 (es) * | 1997-08-29 | 2005-03-16 | Cree, Inc. | Diodo emisor de luz del grupo iii robusto para una alta fiabilidad en aplicaciones habituales de encapsulacion. |
US6825501B2 (en) * | 1997-08-29 | 2004-11-30 | Cree, Inc. | Robust Group III light emitting diode for high reliability in standard packaging applications |
AU9003498A (en) * | 1997-09-12 | 1999-04-05 | Showa Denko Kabushiki Kaisha | Method and apparatus for producing silicon carbide single crystal |
US6336971B1 (en) | 1997-09-12 | 2002-01-08 | Showa Denko Kabushiki Kaisha | Method and apparatus for producing silicon carbide single crystal |
US6599133B2 (en) | 1997-11-18 | 2003-07-29 | Technologies And Devices International, Inc. | Method for growing III-V compound semiconductor structures with an integral non-continuous quantum dot layer utilizing HVPE techniques |
US6479839B2 (en) | 1997-11-18 | 2002-11-12 | Technologies & Devices International, Inc. | III-V compounds semiconductor device with an AlxByInzGa1-x-y-zN non continuous quantum dot layer |
US6559038B2 (en) | 1997-11-18 | 2003-05-06 | Technologies And Devices International, Inc. | Method for growing p-n heterojunction-based structures utilizing HVPE techniques |
US20020047135A1 (en) * | 1997-11-18 | 2002-04-25 | Nikolaev Audrey E. | P-N junction-based structures utilizing HVPE grown III-V compound layers |
US6476420B2 (en) | 1997-11-18 | 2002-11-05 | Technologies And Devices International, Inc. | P-N homojunction-based structures utilizing HVPE growth III-V compound layers |
US6555452B2 (en) | 1997-11-18 | 2003-04-29 | Technologies And Devices International, Inc. | Method for growing p-type III-V compound material utilizing HVPE techniques |
US6849862B2 (en) | 1997-11-18 | 2005-02-01 | Technologies And Devices International, Inc. | III-V compound semiconductor device with an AlxByInzGa1-x-y-zN1-a-bPaAsb non-continuous quantum dot layer |
US6890809B2 (en) * | 1997-11-18 | 2005-05-10 | Technologies And Deviles International, Inc. | Method for fabricating a P-N heterojunction device utilizing HVPE grown III-V compound layers and resultant device |
US6472300B2 (en) | 1997-11-18 | 2002-10-29 | Technologies And Devices International, Inc. | Method for growing p-n homojunction-based structures utilizing HVPE techniques |
US6559467B2 (en) | 1997-11-18 | 2003-05-06 | Technologies And Devices International, Inc. | P-n heterojunction-based structures utilizing HVPE grown III-V compound layers |
US5985024A (en) * | 1997-12-11 | 1999-11-16 | Northrop Grumman Corporation | Method and apparatus for growing high purity single crystal silicon carbide |
EP0933450B1 (de) * | 1998-01-19 | 2002-04-17 | Sumitomo Electric Industries, Ltd. | Verfahren und Vorrichtung zur Herstellung eines SiC-Einkristalles |
US6051849A (en) | 1998-02-27 | 2000-04-18 | North Carolina State University | Gallium nitride semiconductor structures including a lateral gallium nitride layer that extends from an underlying gallium nitride layer |
US6608327B1 (en) | 1998-02-27 | 2003-08-19 | North Carolina State University | Gallium nitride semiconductor structure including laterally offset patterned layers |
US6265289B1 (en) | 1998-06-10 | 2001-07-24 | North Carolina State University | Methods of fabricating gallium nitride semiconductor layers by lateral growth from sidewalls into trenches, and gallium nitride semiconductor structures fabricated thereby |
US6048813A (en) | 1998-10-09 | 2000-04-11 | Cree, Inc. | Simulated diamond gemstones formed of aluminum nitride and aluminum nitride: silicon carbide alloys |
US6177688B1 (en) | 1998-11-24 | 2001-01-23 | North Carolina State University | Pendeoepitaxial gallium nitride semiconductor layers on silcon carbide substrates |
US6255198B1 (en) * | 1998-11-24 | 2001-07-03 | North Carolina State University | Methods of fabricating gallium nitride microelectronic layers on silicon layers and gallium nitride microelectronic structures formed thereby |
JP4614539B2 (ja) * | 1999-02-19 | 2011-01-19 | エスアイクリスタル アクチエンゲゼルシャフト | α‐SiC塊状単結晶の成長方法 |
US6406539B1 (en) | 1999-04-28 | 2002-06-18 | Showa Denko K.K, | Process for producing silicon carbide single crystal and production apparatus therefor |
DE50004010D1 (de) | 1999-07-07 | 2003-11-13 | Siemens Ag | Verfahren zur sublimationszüchtung eines sic-einkristalls mit aufheizen unter züchtungsdruck |
DE19931332C2 (de) * | 1999-07-07 | 2002-06-06 | Siemens Ag | Vorrichtung zur Herstellung eines SiC-Einkristalls mit einem doppelwandigen Tiegel |
US6562131B2 (en) | 1999-07-20 | 2003-05-13 | The Fox Group, Inc. | Method for growing single crystal silicon carbide |
US6824611B1 (en) * | 1999-10-08 | 2004-11-30 | Cree, Inc. | Method and apparatus for growing silicon carbide crystals |
US6451112B1 (en) | 1999-10-15 | 2002-09-17 | Denso Corporation | Method and apparatus for fabricating high quality single crystal |
US6521514B1 (en) | 1999-11-17 | 2003-02-18 | North Carolina State University | Pendeoepitaxial methods of fabricating gallium nitride semiconductor layers on sapphire substrates |
US8829546B2 (en) | 1999-11-19 | 2014-09-09 | Cree, Inc. | Rare earth doped layer or substrate for light conversion |
US6614056B1 (en) | 1999-12-01 | 2003-09-02 | Cree Lighting Company | Scalable led with improved current spreading structures |
US6410942B1 (en) | 1999-12-03 | 2002-06-25 | Cree Lighting Company | Enhanced light extraction through the use of micro-LED arrays |
WO2001041225A2 (en) | 1999-12-03 | 2001-06-07 | Cree Lighting Company | Enhanced light extraction in leds through the use of internal and external optical elements |
US6380108B1 (en) | 1999-12-21 | 2002-04-30 | North Carolina State University | Pendeoepitaxial methods of fabricating gallium nitride semiconductor layers on weak posts, and gallium nitride semiconductor structures fabricated thereby |
US6403451B1 (en) | 2000-02-09 | 2002-06-11 | Noerh Carolina State University | Methods of fabricating gallium nitride semiconductor layers on substrates including non-gallium nitride posts |
US6428621B1 (en) | 2000-02-15 | 2002-08-06 | The Fox Group, Inc. | Method for growing low defect density silicon carbide |
US6261929B1 (en) | 2000-02-24 | 2001-07-17 | North Carolina State University | Methods of forming a plurality of semiconductor layers using spaced trench arrays |
AU2001250835A1 (en) * | 2000-03-13 | 2001-09-24 | Ii-Vi Incorporated | Large size single crystal seed crystal fabrication by intergrowth of tiled seed crystals |
WO2001068954A2 (en) * | 2000-03-13 | 2001-09-20 | Ii-Vi Incorporated | Axial gradient transport apparatus and process |
US6573128B1 (en) | 2000-11-28 | 2003-06-03 | Cree, Inc. | Epitaxial edge termination for silicon carbide Schottky devices and methods of fabricating silicon carbide devices incorporating same |
JP4275308B2 (ja) * | 2000-12-28 | 2009-06-10 | 株式会社デンソー | 炭化珪素単結晶の製造方法およびその製造装置 |
US6800876B2 (en) | 2001-01-16 | 2004-10-05 | Cree, Inc. | Group III nitride LED with undoped cladding layer (5000.137) |
US6906352B2 (en) | 2001-01-16 | 2005-06-14 | Cree, Inc. | Group III nitride LED with undoped cladding layer and multiple quantum well |
US6863728B2 (en) | 2001-02-14 | 2005-03-08 | The Fox Group, Inc. | Apparatus for growing low defect density silicon carbide |
US6670278B2 (en) | 2001-03-30 | 2003-12-30 | Lam Research Corporation | Method of plasma etching of silicon carbide |
US6849882B2 (en) | 2001-05-11 | 2005-02-01 | Cree Inc. | Group-III nitride based high electron mobility transistor (HEMT) with barrier/spacer layer |
US6706114B2 (en) * | 2001-05-21 | 2004-03-16 | Cree, Inc. | Methods of fabricating silicon carbide crystals |
CN1505843B (zh) | 2001-06-15 | 2010-05-05 | 克里公司 | 在SiC衬底上形成的GaN基LED |
US20020189536A1 (en) * | 2001-06-15 | 2002-12-19 | Bridgestone Corporation | Silicon carbide single crystal and production thereof |
US7553373B2 (en) | 2001-06-15 | 2009-06-30 | Bridgestone Corporation | Silicon carbide single crystal and production thereof |
US20030015708A1 (en) | 2001-07-23 | 2003-01-23 | Primit Parikh | Gallium nitride based diodes with low forward voltage and low reverse current operation |
AU2002357640A1 (en) | 2001-07-24 | 2003-04-22 | Cree, Inc. | Insulting gate algan/gan hemt |
US6749685B2 (en) * | 2001-08-16 | 2004-06-15 | Cree, Inc. | Silicon carbide sublimation systems and associated methods |
US6903446B2 (en) * | 2001-10-23 | 2005-06-07 | Cree, Inc. | Pattern for improved visual inspection of semiconductor devices |
US6780243B1 (en) | 2001-11-01 | 2004-08-24 | Dow Corning Enterprises, Inc. | Method of silicon carbide monocrystalline boule growth |
US7030428B2 (en) * | 2001-12-03 | 2006-04-18 | Cree, Inc. | Strain balanced nitride heterojunction transistors |
US7220313B2 (en) * | 2003-07-28 | 2007-05-22 | Cree, Inc. | Reducing nitrogen content in silicon carbide crystals by sublimation growth in a hydrogen-containing ambient |
US7601441B2 (en) * | 2002-06-24 | 2009-10-13 | Cree, Inc. | One hundred millimeter high purity semi-insulating single crystal silicon carbide wafer |
US7316747B2 (en) * | 2002-06-24 | 2008-01-08 | Cree, Inc. | Seeded single crystal silicon carbide growth and resulting crystals |
US6814801B2 (en) * | 2002-06-24 | 2004-11-09 | Cree, Inc. | Method for producing semi-insulating resistivity in high purity silicon carbide crystals |
US6982204B2 (en) | 2002-07-16 | 2006-01-03 | Cree, Inc. | Nitride-based transistors and methods of fabrication thereof using non-etched contact recesses |
EP1540048B1 (de) * | 2002-09-19 | 2010-05-12 | Showa Denko K.K. | Siliciumcarbid-einkristall und verfahren und vorrichtung zu seiner herstellung |
US6825559B2 (en) | 2003-01-02 | 2004-11-30 | Cree, Inc. | Group III nitride based flip-chip intergrated circuit and method for fabricating |
US9515135B2 (en) * | 2003-01-15 | 2016-12-06 | Cree, Inc. | Edge termination structures for silicon carbide devices |
US7026650B2 (en) * | 2003-01-15 | 2006-04-11 | Cree, Inc. | Multiple floating guard ring edge termination for silicon carbide devices |
US6987281B2 (en) * | 2003-02-13 | 2006-01-17 | Cree, Inc. | Group III nitride contact structures for light emitting devices |
US6952024B2 (en) * | 2003-02-13 | 2005-10-04 | Cree, Inc. | Group III nitride LED with silicon carbide cladding layer |
US7170097B2 (en) * | 2003-02-14 | 2007-01-30 | Cree, Inc. | Inverted light emitting diode on conductive substrate |
US7898047B2 (en) | 2003-03-03 | 2011-03-01 | Samsung Electronics Co., Ltd. | Integrated nitride and silicon carbide-based devices and methods of fabricating integrated nitride-based devices |
US7112860B2 (en) | 2003-03-03 | 2006-09-26 | Cree, Inc. | Integrated nitride-based acoustic wave devices and methods of fabricating integrated nitride-based acoustic wave devices |
US6964917B2 (en) * | 2003-04-08 | 2005-11-15 | Cree, Inc. | Semi-insulating silicon carbide produced by Neutron transmutation doping |
EP2264798B1 (de) | 2003-04-30 | 2020-10-14 | Cree, Inc. | Hochleistungs-Lichtemitter-Verkapselungen mit kompakter Optik |
ITMI20031196A1 (it) * | 2003-06-13 | 2004-12-14 | Lpe Spa | Sistema per crescere cristalli di carburo di silicio |
KR100782998B1 (ko) | 2003-06-16 | 2007-12-07 | 쇼와 덴코 가부시키가이샤 | 실리콘 카바이드 단결정의 성장 방법, 실리콘 카바이드 씨드결정 및 실리콘 카바이드 단결정 |
US7915085B2 (en) * | 2003-09-18 | 2011-03-29 | Cree, Inc. | Molded chip fabrication method |
US6972438B2 (en) * | 2003-09-30 | 2005-12-06 | Cree, Inc. | Light emitting diode with porous SiC substrate and method for fabricating |
US6974720B2 (en) * | 2003-10-16 | 2005-12-13 | Cree, Inc. | Methods of forming power semiconductor devices using boule-grown silicon carbide drift layers and power semiconductor devices formed thereby |
KR20060122868A (ko) * | 2003-11-25 | 2006-11-30 | 스미토모덴키고교가부시키가이샤 | 다이아몬드 n형 반도체, 그의 제조 방법, 반도체 소자 및전자 방출 소자 |
US7135715B2 (en) * | 2004-01-07 | 2006-11-14 | Cree, Inc. | Co-doping for fermi level control in semi-insulating Group III nitrides |
US7901994B2 (en) | 2004-01-16 | 2011-03-08 | Cree, Inc. | Methods of manufacturing group III nitride semiconductor devices with silicon nitride layers |
US7045404B2 (en) | 2004-01-16 | 2006-05-16 | Cree, Inc. | Nitride-based transistors with a protective layer and a low-damage recess and methods of fabrication thereof |
US7170111B2 (en) | 2004-02-05 | 2007-01-30 | Cree, Inc. | Nitride heterojunction transistors having charge-transfer induced energy barriers and methods of fabricating the same |
US7612390B2 (en) * | 2004-02-05 | 2009-11-03 | Cree, Inc. | Heterojunction transistors including energy barriers |
US7056383B2 (en) * | 2004-02-13 | 2006-06-06 | The Fox Group, Inc. | Tantalum based crucible |
US7872268B2 (en) * | 2004-04-22 | 2011-01-18 | Cree, Inc. | Substrate buffer structure for group III nitride devices |
US7825006B2 (en) | 2004-05-06 | 2010-11-02 | Cree, Inc. | Lift-off process for GaN films formed on SiC substrates and devices fabricated using the method |
US7084441B2 (en) | 2004-05-20 | 2006-08-01 | Cree, Inc. | Semiconductor devices having a hybrid channel layer, current aperture transistors and methods of fabricating same |
US7432142B2 (en) | 2004-05-20 | 2008-10-07 | Cree, Inc. | Methods of fabricating nitride-based transistors having regrown ohmic contact regions |
WO2005119793A2 (en) * | 2004-05-28 | 2005-12-15 | Caracal, Inc. | Silicon carbide schottky diodes and fabrication method |
US7795623B2 (en) | 2004-06-30 | 2010-09-14 | Cree, Inc. | Light emitting devices having current reducing structures and methods of forming light emitting devices having current reducing structures |
US9368428B2 (en) * | 2004-06-30 | 2016-06-14 | Cree, Inc. | Dielectric wafer level bonding with conductive feed-throughs for electrical connection and thermal management |
US7534633B2 (en) * | 2004-07-02 | 2009-05-19 | Cree, Inc. | LED with substrate modifications for enhanced light extraction and method of making same |
US7238560B2 (en) | 2004-07-23 | 2007-07-03 | Cree, Inc. | Methods of fabricating nitride-based transistors with a cap layer and a recessed gate |
US20060017064A1 (en) * | 2004-07-26 | 2006-01-26 | Saxler Adam W | Nitride-based transistors having laterally grown active region and methods of fabricating same |
US7192482B2 (en) * | 2004-08-10 | 2007-03-20 | Cree, Inc. | Seed and seedholder combinations for high quality growth of large silicon carbide single crystals |
US7217583B2 (en) * | 2004-09-21 | 2007-05-15 | Cree, Inc. | Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension |
US7294324B2 (en) * | 2004-09-21 | 2007-11-13 | Cree, Inc. | Low basal plane dislocation bulk grown SiC wafers |
US8174037B2 (en) * | 2004-09-22 | 2012-05-08 | Cree, Inc. | High efficiency group III nitride LED with lenticular surface |
US7314520B2 (en) | 2004-10-04 | 2008-01-01 | Cree, Inc. | Low 1c screw dislocation 3 inch silicon carbide wafer |
US7314521B2 (en) | 2004-10-04 | 2008-01-01 | Cree, Inc. | Low micropipe 100 mm silicon carbide wafer |
US8998949B2 (en) * | 2004-11-09 | 2015-04-07 | Biomet Sports Medicine, Llc | Soft tissue conduit device |
US7300519B2 (en) * | 2004-11-17 | 2007-11-27 | Cree, Inc. | Reduction of subsurface damage in the production of bulk SiC crystals |
US7709859B2 (en) * | 2004-11-23 | 2010-05-04 | Cree, Inc. | Cap layers including aluminum nitride for nitride-based transistors |
US7456443B2 (en) | 2004-11-23 | 2008-11-25 | Cree, Inc. | Transistors having buried n-type and p-type regions beneath the source region |
US7161194B2 (en) | 2004-12-06 | 2007-01-09 | Cree, Inc. | High power density and/or linearity transistors |
US7355215B2 (en) | 2004-12-06 | 2008-04-08 | Cree, Inc. | Field effect transistors (FETs) having multi-watt output power at millimeter-wave frequencies |
US7563321B2 (en) * | 2004-12-08 | 2009-07-21 | Cree, Inc. | Process for producing high quality large size silicon carbide crystals |
US7811943B2 (en) * | 2004-12-22 | 2010-10-12 | Cree, Inc. | Process for producing silicon carbide crystals having increased minority carrier lifetimes |
US7236053B2 (en) * | 2004-12-31 | 2007-06-26 | Cree, Inc. | High efficiency switch-mode power amplifier |
US7436039B2 (en) | 2005-01-06 | 2008-10-14 | Velox Semiconductor Corporation | Gallium nitride semiconductor device |
US7246735B2 (en) * | 2005-01-07 | 2007-07-24 | Asm Assembly Automation Ltd. | Wire clamping plate |
US9793247B2 (en) * | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
US7821023B2 (en) | 2005-01-10 | 2010-10-26 | Cree, Inc. | Solid state lighting component |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US7335920B2 (en) | 2005-01-24 | 2008-02-26 | Cree, Inc. | LED with current confinement structure and surface roughening |
US7276117B2 (en) * | 2005-02-09 | 2007-10-02 | Cree Dulles, Inc. | Method of forming semi-insulating silicon carbide single crystal |
US7932111B2 (en) * | 2005-02-23 | 2011-04-26 | Cree, Inc. | Substrate removal process for high light extraction LEDs |
US7465967B2 (en) * | 2005-03-15 | 2008-12-16 | Cree, Inc. | Group III nitride field effect transistors (FETS) capable of withstanding high temperature reverse bias test conditions |
US7323052B2 (en) * | 2005-03-24 | 2008-01-29 | Cree, Inc. | Apparatus and method for the production of bulk silicon carbide single crystals |
US7422634B2 (en) * | 2005-04-07 | 2008-09-09 | Cree, Inc. | Three inch silicon carbide wafer with low warp, bow, and TTV |
US8575651B2 (en) | 2005-04-11 | 2013-11-05 | Cree, Inc. | Devices having thick semi-insulating epitaxial gallium nitride layer |
US7626217B2 (en) * | 2005-04-11 | 2009-12-01 | Cree, Inc. | Composite substrates of conductive and insulating or semi-insulating group III-nitrides for group III-nitride devices |
US7608524B2 (en) * | 2005-04-19 | 2009-10-27 | Ii-Vi Incorporated | Method of and system for forming SiC crystals having spatially uniform doping impurities |
US20060263279A1 (en) * | 2005-04-28 | 2006-11-23 | Laurencin Cato T | Adjustable path sublimator system and related method of use |
US7615774B2 (en) * | 2005-04-29 | 2009-11-10 | Cree.Inc. | Aluminum free group III-nitride based high electron mobility transistors |
US7544963B2 (en) | 2005-04-29 | 2009-06-09 | Cree, Inc. | Binary group III-nitride based high electron mobility transistors |
US8901699B2 (en) | 2005-05-11 | 2014-12-02 | Cree, Inc. | Silicon carbide junction barrier Schottky diodes with suppressed minority carrier injection |
US7387680B2 (en) * | 2005-05-13 | 2008-06-17 | Cree, Inc. | Method and apparatus for the production of silicon carbide crystals |
US9412926B2 (en) * | 2005-06-10 | 2016-08-09 | Cree, Inc. | High power solid-state lamp |
US9331192B2 (en) * | 2005-06-29 | 2016-05-03 | Cree, Inc. | Low dislocation density group III nitride layers on silicon carbide substrates and methods of making the same |
US20070018199A1 (en) | 2005-07-20 | 2007-01-25 | Cree, Inc. | Nitride-based transistors and fabrication methods with an etch stop layer |
US20070018198A1 (en) * | 2005-07-20 | 2007-01-25 | Brandes George R | High electron mobility electronic device structures comprising native substrates and methods for making the same |
US8674375B2 (en) * | 2005-07-21 | 2014-03-18 | Cree, Inc. | Roughened high refractive index layer/LED for high light extraction |
TW200715570A (en) | 2005-09-07 | 2007-04-16 | Cree Inc | Robust transistors with fluorine treatment |
US20070110657A1 (en) * | 2005-11-14 | 2007-05-17 | Hunter Charles E | Unseeded silicon carbide single crystals |
US7419892B2 (en) * | 2005-12-13 | 2008-09-02 | Cree, Inc. | Semiconductor devices including implanted regions and protective layers and methods of forming the same |
JP5614766B2 (ja) * | 2005-12-21 | 2014-10-29 | クリー インコーポレイテッドCree Inc. | 照明装置 |
US7709269B2 (en) | 2006-01-17 | 2010-05-04 | Cree, Inc. | Methods of fabricating transistors including dielectrically-supported gate electrodes |
US7592211B2 (en) | 2006-01-17 | 2009-09-22 | Cree, Inc. | Methods of fabricating transistors including supported gate electrodes |
US8101961B2 (en) | 2006-01-25 | 2012-01-24 | Cree, Inc. | Transparent ohmic contacts on light emitting diodes with growth substrates |
EP1985884B1 (de) * | 2006-02-08 | 2012-10-24 | Hitachi, Ltd. | Elektrische bremse |
US7566918B2 (en) * | 2006-02-23 | 2009-07-28 | Cree, Inc. | Nitride based transistors for millimeter wave operation |
US7388236B2 (en) * | 2006-03-29 | 2008-06-17 | Cree, Inc. | High efficiency and/or high power density wide bandgap transistors |
US8969908B2 (en) * | 2006-04-04 | 2015-03-03 | Cree, Inc. | Uniform emission LED package |
USD738832S1 (en) | 2006-04-04 | 2015-09-15 | Cree, Inc. | Light emitting diode (LED) package |
US9780268B2 (en) | 2006-04-04 | 2017-10-03 | Cree, Inc. | Submount based surface mount device (SMD) light emitter components and methods |
AU2007233320B2 (en) | 2006-04-04 | 2013-12-12 | Singulex, Inc. | Highly sensitive system and methods for analysis of troponin |
WO2007116517A1 (ja) * | 2006-04-10 | 2007-10-18 | Fujitsu Limited | 化合物半導体構造とその製造方法 |
US9335006B2 (en) * | 2006-04-18 | 2016-05-10 | Cree, Inc. | Saturated yellow phosphor converted LED and blue converted red LED |
JP2007284306A (ja) * | 2006-04-19 | 2007-11-01 | Nippon Steel Corp | 炭化珪素単結晶及びその製造方法 |
JP4954596B2 (ja) * | 2006-04-21 | 2012-06-20 | 新日本製鐵株式会社 | 炭化珪素単結晶インゴットの製造方法 |
US8748915B2 (en) | 2006-04-24 | 2014-06-10 | Cree Hong Kong Limited | Emitter package with angled or vertical LED |
US11210971B2 (en) | 2009-07-06 | 2021-12-28 | Cree Huizhou Solid State Lighting Company Limited | Light emitting diode display with tilted peak emission pattern |
US9040398B2 (en) * | 2006-05-16 | 2015-05-26 | Cree, Inc. | Method of fabricating seminconductor devices including self aligned refractory contacts |
WO2007139894A2 (en) | 2006-05-26 | 2007-12-06 | Cree Led Lighting Solutions, Inc. | Solid state light emitting device and method of making same |
US8698184B2 (en) | 2011-01-21 | 2014-04-15 | Cree, Inc. | Light emitting diodes with low junction temperature and solid state backlight components including light emitting diodes with low junction temperature |
US8980445B2 (en) * | 2006-07-06 | 2015-03-17 | Cree, Inc. | One hundred millimeter SiC crystal grown on off-axis seed |
AU2007275780B2 (en) * | 2006-07-19 | 2011-02-24 | Sk Siltron Css, Llc | Method of manufacturing substrates having improved carrier lifetimes |
US7943952B2 (en) * | 2006-07-31 | 2011-05-17 | Cree, Inc. | Method of uniform phosphor chip coating and LED package fabricated using method |
US7728402B2 (en) * | 2006-08-01 | 2010-06-01 | Cree, Inc. | Semiconductor devices including schottky diodes with controlled breakdown |
US8432012B2 (en) | 2006-08-01 | 2013-04-30 | Cree, Inc. | Semiconductor devices including schottky diodes having overlapping doped regions and methods of fabricating same |
EP2052414B1 (de) | 2006-08-17 | 2016-03-30 | Cree, Inc. | Bipolare hochleistungstransistoren mit isoliertem gate |
CN101554089A (zh) * | 2006-08-23 | 2009-10-07 | 科锐Led照明科技公司 | 照明装置和照明方法 |
JP5562641B2 (ja) | 2006-09-14 | 2014-07-30 | クリー インコーポレイテッド | マイクロパイプ・フリーの炭化ケイ素およびその製造方法 |
US9018619B2 (en) * | 2006-10-09 | 2015-04-28 | Cree, Inc. | Quantum wells for light conversion |
US10873002B2 (en) * | 2006-10-20 | 2020-12-22 | Cree, Inc. | Permanent wafer bonding using metal alloy preform discs |
US8823057B2 (en) | 2006-11-06 | 2014-09-02 | Cree, Inc. | Semiconductor devices including implanted regions for providing low-resistance contact to buried layers and related devices |
US10295147B2 (en) * | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
JP5105160B2 (ja) | 2006-11-13 | 2012-12-19 | クリー インコーポレイテッド | トランジスタ |
US7692263B2 (en) | 2006-11-21 | 2010-04-06 | Cree, Inc. | High voltage GaN transistors |
US9318327B2 (en) | 2006-11-28 | 2016-04-19 | Cree, Inc. | Semiconductor devices having low threading dislocations and improved light extraction and methods of making the same |
CN101622493A (zh) * | 2006-12-04 | 2010-01-06 | 科锐Led照明科技公司 | 照明装置和照明方法 |
US9310026B2 (en) | 2006-12-04 | 2016-04-12 | Cree, Inc. | Lighting assembly and lighting method |
US7834367B2 (en) | 2007-01-19 | 2010-11-16 | Cree, Inc. | Low voltage diode with reduced parasitic resistance and method for fabricating |
US8232564B2 (en) * | 2007-01-22 | 2012-07-31 | Cree, Inc. | Wafer level phosphor coating technique for warm light emitting diodes |
US9196799B2 (en) * | 2007-01-22 | 2015-11-24 | Cree, Inc. | LED chips having fluorescent substrates with microholes and methods for fabricating |
US9024349B2 (en) | 2007-01-22 | 2015-05-05 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US9159888B2 (en) * | 2007-01-22 | 2015-10-13 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US8021904B2 (en) * | 2007-02-01 | 2011-09-20 | Cree, Inc. | Ohmic contacts to nitrogen polarity GaN |
US8835987B2 (en) * | 2007-02-27 | 2014-09-16 | Cree, Inc. | Insulated gate bipolar transistors including current suppressing layers |
US8362503B2 (en) | 2007-03-09 | 2013-01-29 | Cree, Inc. | Thick nitride semiconductor structures with interlayer structures |
US8212290B2 (en) * | 2007-03-23 | 2012-07-03 | Cree, Inc. | High temperature performance capable gallium nitride transistor |
US9484499B2 (en) * | 2007-04-20 | 2016-11-01 | Cree, Inc. | Transparent ohmic contacts on light emitting diodes with carrier substrates |
US20080258130A1 (en) * | 2007-04-23 | 2008-10-23 | Bergmann Michael J | Beveled LED Chip with Transparent Substrate |
US7982363B2 (en) * | 2007-05-14 | 2011-07-19 | Cree, Inc. | Bulk acoustic device and method for fabricating |
US8449671B2 (en) | 2007-06-27 | 2013-05-28 | Ii-Vi Incorporated | Fabrication of SiC substrates with low warp and bow |
US9401461B2 (en) * | 2007-07-11 | 2016-07-26 | Cree, Inc. | LED chip design for white conversion |
US10505083B2 (en) * | 2007-07-11 | 2019-12-10 | Cree, Inc. | Coating method utilizing phosphor containment structure and devices fabricated using same |
US8111001B2 (en) | 2007-07-17 | 2012-02-07 | Cree, Inc. | LED with integrated constant current driver |
JP5431320B2 (ja) * | 2007-07-17 | 2014-03-05 | クリー インコーポレイテッド | 内部光学機能を備えた光学素子およびその製造方法 |
US8409351B2 (en) * | 2007-08-08 | 2013-04-02 | Sic Systems, Inc. | Production of bulk silicon carbide with hot-filament chemical vapor deposition |
US11114594B2 (en) * | 2007-08-24 | 2021-09-07 | Creeled, Inc. | Light emitting device packages using light scattering particles of different size |
US8163086B2 (en) * | 2007-08-29 | 2012-04-24 | Cree, Inc. | Halogen assisted physical vapor transport method for silicon carbide growth |
US9012937B2 (en) | 2007-10-10 | 2015-04-21 | Cree, Inc. | Multiple conversion material light emitting diode package and method of fabricating same |
US9666762B2 (en) | 2007-10-31 | 2017-05-30 | Cree, Inc. | Multi-chip light emitter packages and related methods |
US9082921B2 (en) | 2007-10-31 | 2015-07-14 | Cree, Inc. | Multi-die LED package |
US8866169B2 (en) | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
US9172012B2 (en) | 2007-10-31 | 2015-10-27 | Cree, Inc. | Multi-chip light emitter packages and related methods |
US9461201B2 (en) | 2007-11-14 | 2016-10-04 | Cree, Inc. | Light emitting diode dielectric mirror |
US8536584B2 (en) | 2007-11-14 | 2013-09-17 | Cree, Inc. | High voltage wire bond free LEDS |
US7985970B2 (en) * | 2009-04-06 | 2011-07-26 | Cree, Inc. | High voltage low current surface-emitting LED |
US7915629B2 (en) * | 2008-12-08 | 2011-03-29 | Cree, Inc. | Composite high reflectivity layer |
US8167674B2 (en) * | 2007-12-14 | 2012-05-01 | Cree, Inc. | Phosphor distribution in LED lamps using centrifugal force |
US9041285B2 (en) | 2007-12-14 | 2015-05-26 | Cree, Inc. | Phosphor distribution in LED lamps using centrifugal force |
US9431589B2 (en) * | 2007-12-14 | 2016-08-30 | Cree, Inc. | Textured encapsulant surface in LED packages |
US10008637B2 (en) | 2011-12-06 | 2018-06-26 | Cree, Inc. | Light emitter devices and methods with reduced dimensions and improved light output |
US8460764B2 (en) * | 2008-03-06 | 2013-06-11 | Georgia Tech Research Corporation | Method and apparatus for producing ultra-thin graphitic layers |
US8637883B2 (en) | 2008-03-19 | 2014-01-28 | Cree, Inc. | Low index spacer layer in LED devices |
US8877524B2 (en) * | 2008-03-31 | 2014-11-04 | Cree, Inc. | Emission tuning methods and devices fabricated utilizing methods |
US7859000B2 (en) * | 2008-04-10 | 2010-12-28 | Cree, Inc. | LEDs using single crystalline phosphor and methods of fabricating same |
US9287469B2 (en) | 2008-05-02 | 2016-03-15 | Cree, Inc. | Encapsulation for phosphor-converted white light emitting diode |
US8232558B2 (en) | 2008-05-21 | 2012-07-31 | Cree, Inc. | Junction barrier Schottky diodes with current surge capability |
WO2009148543A2 (en) * | 2008-05-29 | 2009-12-10 | Cree, Inc. | Light source with near field mixing |
US20090311381A1 (en) * | 2008-06-11 | 2009-12-17 | Gardner Susanne | Beverages composed of wine components |
US8384115B2 (en) * | 2008-08-01 | 2013-02-26 | Cree, Inc. | Bond pad design for enhancing light extraction from LED chips |
US9425172B2 (en) * | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
US8858032B2 (en) | 2008-10-24 | 2014-10-14 | Cree, Inc. | Lighting device, heat transfer structure and heat transfer element |
SE537049C2 (sv) * | 2008-12-08 | 2014-12-16 | Ii Vi Inc | Process och apparat för tillväxt via axiell gradienttransport (AGT) nyttjande resistiv uppvärmning |
US8017963B2 (en) | 2008-12-08 | 2011-09-13 | Cree, Inc. | Light emitting diode with a dielectric mirror having a lateral configuration |
US7897419B2 (en) | 2008-12-23 | 2011-03-01 | Cree, Inc. | Color correction for wafer level white LEDs |
US7923739B2 (en) | 2009-06-05 | 2011-04-12 | Cree, Inc. | Solid state lighting device |
US8598602B2 (en) | 2009-01-12 | 2013-12-03 | Cree, Inc. | Light emitting device packages with improved heat transfer |
US10431567B2 (en) | 2010-11-03 | 2019-10-01 | Cree, Inc. | White ceramic LED package |
US8368112B2 (en) | 2009-01-14 | 2013-02-05 | Cree Huizhou Opto Limited | Aligned multiple emitter package |
US8083384B2 (en) | 2009-02-02 | 2011-12-27 | Teledyne Technologies Incorporated | Efficient illumination device for aircraft |
EP2411569B1 (de) | 2009-03-26 | 2021-09-22 | II-VI Incorporated | Verfahren und vorrichtung für sic-einzelkristall-sublimationszüchtung |
US9093293B2 (en) | 2009-04-06 | 2015-07-28 | Cree, Inc. | High voltage low current surface emitting light emitting diode |
US8476668B2 (en) * | 2009-04-06 | 2013-07-02 | Cree, Inc. | High voltage low current surface emitting LED |
US8741715B2 (en) * | 2009-04-29 | 2014-06-03 | Cree, Inc. | Gate electrodes for millimeter-wave operation and methods of fabrication |
US8294507B2 (en) | 2009-05-08 | 2012-10-23 | Cree, Inc. | Wide bandgap bipolar turn-off thyristor having non-negative temperature coefficient and related control circuits |
US9035328B2 (en) | 2011-02-04 | 2015-05-19 | Cree, Inc. | Light-emitting diode component |
US8629509B2 (en) * | 2009-06-02 | 2014-01-14 | Cree, Inc. | High voltage insulated gate bipolar transistors with minority carrier diverter |
US8193848B2 (en) | 2009-06-02 | 2012-06-05 | Cree, Inc. | Power switching devices having controllable surge current capabilities |
US8304783B2 (en) | 2009-06-03 | 2012-11-06 | Cree, Inc. | Schottky diodes including polysilicon having low barrier heights and methods of fabricating the same |
US8686445B1 (en) | 2009-06-05 | 2014-04-01 | Cree, Inc. | Solid state lighting devices and methods |
US9111778B2 (en) | 2009-06-05 | 2015-08-18 | Cree, Inc. | Light emitting diode (LED) devices, systems, and methods |
US8860043B2 (en) | 2009-06-05 | 2014-10-14 | Cree, Inc. | Light emitting device packages, systems and methods |
US8415692B2 (en) | 2009-07-06 | 2013-04-09 | Cree, Inc. | LED packages with scattering particle regions |
US8541787B2 (en) * | 2009-07-15 | 2013-09-24 | Cree, Inc. | High breakdown voltage wide band-gap MOS-gated bipolar junction transistors with avalanche capability |
US8105889B2 (en) | 2009-07-27 | 2012-01-31 | Cree, Inc. | Methods of fabricating transistors including self-aligned gate electrodes and source/drain regions |
US8598809B2 (en) * | 2009-08-19 | 2013-12-03 | Cree, Inc. | White light color changing solid state lighting and methods |
US8354690B2 (en) | 2009-08-31 | 2013-01-15 | Cree, Inc. | Solid-state pinch off thyristor circuits |
US9362459B2 (en) * | 2009-09-02 | 2016-06-07 | United States Department Of Energy | High reflectivity mirrors and method for making same |
WO2011034850A1 (en) * | 2009-09-15 | 2011-03-24 | Ii-Vi Incorporated | Sublimation growth of sic single crystals |
US9312343B2 (en) | 2009-10-13 | 2016-04-12 | Cree, Inc. | Transistors with semiconductor interconnection layers and semiconductor channel layers of different semiconductor materials |
US8511851B2 (en) | 2009-12-21 | 2013-08-20 | Cree, Inc. | High CRI adjustable color temperature lighting devices |
US8350370B2 (en) * | 2010-01-29 | 2013-01-08 | Cree Huizhou Opto Limited | Wide angle oval light emitting diode package |
US8563372B2 (en) * | 2010-02-11 | 2013-10-22 | Cree, Inc. | Methods of forming contact structures including alternating metal and silicon layers and related devices |
US9214352B2 (en) | 2010-02-11 | 2015-12-15 | Cree, Inc. | Ohmic contact to semiconductor device |
US9548206B2 (en) | 2010-02-11 | 2017-01-17 | Cree, Inc. | Ohmic contact structure for group III nitride semiconductor device having improved surface morphology and well-defined edge features |
US9468070B2 (en) | 2010-02-16 | 2016-10-11 | Cree Inc. | Color control of light emitting devices and applications thereof |
US9117739B2 (en) | 2010-03-08 | 2015-08-25 | Cree, Inc. | Semiconductor devices with heterojunction barrier regions and methods of fabricating same |
US9105824B2 (en) | 2010-04-09 | 2015-08-11 | Cree, Inc. | High reflective board or substrate for LEDs |
US9012938B2 (en) | 2010-04-09 | 2015-04-21 | Cree, Inc. | High reflective substrate of light emitting devices with improved light output |
US8901583B2 (en) | 2010-04-12 | 2014-12-02 | Cree Huizhou Opto Limited | Surface mount device thin package |
US8415671B2 (en) | 2010-04-16 | 2013-04-09 | Cree, Inc. | Wide band-gap MOSFETs having a heterojunction under gate trenches thereof and related methods of forming such devices |
US8329482B2 (en) | 2010-04-30 | 2012-12-11 | Cree, Inc. | White-emitting LED chips and method for making same |
US8269244B2 (en) | 2010-06-28 | 2012-09-18 | Cree, Inc. | LED package with efficient, isolated thermal path |
US8648359B2 (en) | 2010-06-28 | 2014-02-11 | Cree, Inc. | Light emitting devices and methods |
WO2012005771A2 (en) | 2010-07-06 | 2012-01-12 | Cree, Inc. | Compact optically efficient solid state light source with integrated thermal management |
USD643819S1 (en) | 2010-07-16 | 2011-08-23 | Cree, Inc. | Package for light emitting diode (LED) lighting |
US10546846B2 (en) | 2010-07-23 | 2020-01-28 | Cree, Inc. | Light transmission control for masking appearance of solid state light sources |
US9831393B2 (en) | 2010-07-30 | 2017-11-28 | Cree Hong Kong Limited | Water resistant surface mount device package |
US8764224B2 (en) | 2010-08-12 | 2014-07-01 | Cree, Inc. | Luminaire with distributed LED sources |
US9627361B2 (en) | 2010-10-07 | 2017-04-18 | Cree, Inc. | Multiple configuration light emitting devices and methods |
US8455882B2 (en) | 2010-10-15 | 2013-06-04 | Cree, Inc. | High efficiency LEDs |
US9249952B2 (en) | 2010-11-05 | 2016-02-02 | Cree, Inc. | Multi-configurable, high luminous output light fixture systems, devices and methods |
USD712850S1 (en) | 2010-11-18 | 2014-09-09 | Cree, Inc. | Light emitter device |
USD707192S1 (en) | 2010-11-18 | 2014-06-17 | Cree, Inc. | Light emitting device |
USD721339S1 (en) | 2010-12-03 | 2015-01-20 | Cree, Inc. | Light emitter device |
US8564000B2 (en) | 2010-11-22 | 2013-10-22 | Cree, Inc. | Light emitting devices for light emitting diodes (LEDs) |
US9490235B2 (en) | 2010-11-22 | 2016-11-08 | Cree, Inc. | Light emitting devices, systems, and methods |
US8575639B2 (en) | 2011-02-16 | 2013-11-05 | Cree, Inc. | Light emitting devices for light emitting diodes (LEDs) |
US8624271B2 (en) | 2010-11-22 | 2014-01-07 | Cree, Inc. | Light emitting devices |
US20150062915A1 (en) | 2013-09-05 | 2015-03-05 | Cree, Inc. | Light emitting diode devices and methods with reflective material for increased light output |
US9300062B2 (en) | 2010-11-22 | 2016-03-29 | Cree, Inc. | Attachment devices and methods for light emitting devices |
US10267506B2 (en) | 2010-11-22 | 2019-04-23 | Cree, Inc. | Solid state lighting apparatuses with non-uniformly spaced emitters for improved heat distribution, system having the same, and methods having the same |
US9000470B2 (en) | 2010-11-22 | 2015-04-07 | Cree, Inc. | Light emitter devices |
US9240395B2 (en) | 2010-11-30 | 2016-01-19 | Cree Huizhou Opto Limited | Waterproof surface mount device package and method |
USD706231S1 (en) | 2010-12-03 | 2014-06-03 | Cree, Inc. | Light emitting device |
US9822951B2 (en) | 2010-12-06 | 2017-11-21 | Cree, Inc. | LED retrofit lens for fluorescent tube |
US10309627B2 (en) | 2012-11-08 | 2019-06-04 | Cree, Inc. | Light fixture retrofit kit with integrated light bar |
USD679842S1 (en) | 2011-01-03 | 2013-04-09 | Cree, Inc. | High brightness LED package |
US8610140B2 (en) | 2010-12-15 | 2013-12-17 | Cree, Inc. | Light emitting diode (LED) packages, systems, devices and related methods |
US9391247B2 (en) | 2010-12-16 | 2016-07-12 | Cree, Inc. | High power LEDs with non-polymer material lenses and methods of making the same |
US9166126B2 (en) | 2011-01-31 | 2015-10-20 | Cree, Inc. | Conformally coated light emitting devices and methods for providing the same |
TW201251140A (en) | 2011-01-31 | 2012-12-16 | Cree Inc | High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion |
US9786811B2 (en) | 2011-02-04 | 2017-10-10 | Cree, Inc. | Tilted emission LED array |
US9583681B2 (en) | 2011-02-07 | 2017-02-28 | Cree, Inc. | Light emitter device packages, modules and methods |
CN103348496A (zh) | 2011-02-07 | 2013-10-09 | 克利公司 | 用于发光二极管(led)发光的部件和方法 |
US8809880B2 (en) | 2011-02-16 | 2014-08-19 | Cree, Inc. | Light emitting diode (LED) chips and devices for providing failure mitigation in LED arrays |
US8455908B2 (en) | 2011-02-16 | 2013-06-04 | Cree, Inc. | Light emitting devices |
US8729589B2 (en) | 2011-02-16 | 2014-05-20 | Cree, Inc. | High voltage array light emitting diode (LED) devices and fixtures |
USD702653S1 (en) | 2011-10-26 | 2014-04-15 | Cree, Inc. | Light emitting device component |
US8922108B2 (en) | 2011-03-01 | 2014-12-30 | Cree, Inc. | Remote component devices, systems, and methods for use with light emitting devices |
US10147853B2 (en) | 2011-03-18 | 2018-12-04 | Cree, Inc. | Encapsulant with index matched thixotropic agent |
US8680556B2 (en) | 2011-03-24 | 2014-03-25 | Cree, Inc. | Composite high reflectivity layer |
US9263636B2 (en) | 2011-05-04 | 2016-02-16 | Cree, Inc. | Light-emitting diode (LED) for achieving an asymmetric light output |
US9029945B2 (en) | 2011-05-06 | 2015-05-12 | Cree, Inc. | Field effect transistor devices with low source resistance |
US9142662B2 (en) | 2011-05-06 | 2015-09-22 | Cree, Inc. | Field effect transistor devices with low source resistance |
KR20120128506A (ko) * | 2011-05-17 | 2012-11-27 | 엘지이노텍 주식회사 | 종자정 부착 장치 |
US8777455B2 (en) | 2011-06-23 | 2014-07-15 | Cree, Inc. | Retroreflective, multi-element design for a solid state directional lamp |
US8757840B2 (en) | 2011-06-23 | 2014-06-24 | Cree, Inc. | Solid state retroreflective directional lamp |
US8616724B2 (en) | 2011-06-23 | 2013-12-31 | Cree, Inc. | Solid state directional lamp including retroreflective, multi-element directional lamp optic |
US8777463B2 (en) | 2011-06-23 | 2014-07-15 | Cree, Inc. | Hybrid solid state emitter printed circuit board for use in a solid state directional lamp |
US10243121B2 (en) | 2011-06-24 | 2019-03-26 | Cree, Inc. | High voltage monolithic LED chip with improved reliability |
US8686429B2 (en) | 2011-06-24 | 2014-04-01 | Cree, Inc. | LED structure with enhanced mirror reflectivity |
US9728676B2 (en) | 2011-06-24 | 2017-08-08 | Cree, Inc. | High voltage monolithic LED chip |
KR20130002616A (ko) * | 2011-06-29 | 2013-01-08 | 에스케이이노베이션 주식회사 | 탄화규소 단결정 성장 장치 및 그 방법 |
USD700584S1 (en) | 2011-07-06 | 2014-03-04 | Cree, Inc. | LED component |
US10842016B2 (en) | 2011-07-06 | 2020-11-17 | Cree, Inc. | Compact optically efficient solid state light source with integrated thermal management |
US10211380B2 (en) | 2011-07-21 | 2019-02-19 | Cree, Inc. | Light emitting devices and components having improved chemical resistance and related methods |
US10686107B2 (en) | 2011-07-21 | 2020-06-16 | Cree, Inc. | Light emitter devices and components with improved chemical resistance and related methods |
CN103782402B (zh) | 2011-07-21 | 2017-12-01 | 克利公司 | 用于改进的化学抗性的发光体器件封装、部件和方法、以及相关方法 |
US8558252B2 (en) | 2011-08-26 | 2013-10-15 | Cree, Inc. | White LEDs with emission wavelength correction |
CN103782403B (zh) | 2011-09-06 | 2017-06-30 | 克利公司 | 具有改进的引线接合的光发射器封装件和装置及相关方法 |
US8664665B2 (en) | 2011-09-11 | 2014-03-04 | Cree, Inc. | Schottky diode employing recesses for elements of junction barrier array |
US9640617B2 (en) | 2011-09-11 | 2017-05-02 | Cree, Inc. | High performance power module |
US8680587B2 (en) | 2011-09-11 | 2014-03-25 | Cree, Inc. | Schottky diode |
CN103918079B (zh) | 2011-09-11 | 2017-10-31 | 科锐 | 包括具有改进布局的晶体管的高电流密度功率模块 |
US9373617B2 (en) | 2011-09-11 | 2016-06-21 | Cree, Inc. | High current, low switching loss SiC power module |
US8618582B2 (en) | 2011-09-11 | 2013-12-31 | Cree, Inc. | Edge termination structure employing recesses for edge termination elements |
US8957440B2 (en) | 2011-10-04 | 2015-02-17 | Cree, Inc. | Light emitting devices with low packaging factor |
USD705181S1 (en) | 2011-10-26 | 2014-05-20 | Cree, Inc. | Light emitting device component |
US10043960B2 (en) | 2011-11-15 | 2018-08-07 | Cree, Inc. | Light emitting diode (LED) packages and related methods |
US8564004B2 (en) | 2011-11-29 | 2013-10-22 | Cree, Inc. | Complex primary optics with intermediate elements |
US9496466B2 (en) | 2011-12-06 | 2016-11-15 | Cree, Inc. | Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction |
US9786825B2 (en) | 2012-02-07 | 2017-10-10 | Cree, Inc. | Ceramic-based light emitting diode (LED) devices, components, and methods |
US9806246B2 (en) | 2012-02-07 | 2017-10-31 | Cree, Inc. | Ceramic-based light emitting diode (LED) devices, components, and methods |
US8895998B2 (en) | 2012-03-30 | 2014-11-25 | Cree, Inc. | Ceramic-based light emitting diode (LED) devices, components and methods |
US9240530B2 (en) | 2012-02-13 | 2016-01-19 | Cree, Inc. | Light emitter devices having improved chemical and physical resistance and related methods |
US9343441B2 (en) | 2012-02-13 | 2016-05-17 | Cree, Inc. | Light emitter devices having improved light output and related methods |
JP5799846B2 (ja) * | 2012-02-14 | 2015-10-28 | 住友電気工業株式会社 | 炭化珪素単結晶の製造方法および製造装置 |
US10020244B2 (en) | 2012-03-27 | 2018-07-10 | Cree, Inc. | Polymer via plugs with high thermal integrity |
US10222032B2 (en) | 2012-03-30 | 2019-03-05 | Cree, Inc. | Light emitter components and methods having improved electrical contacts |
US10134961B2 (en) | 2012-03-30 | 2018-11-20 | Cree, Inc. | Submount based surface mount device (SMD) light emitter components and methods |
US9735198B2 (en) | 2012-03-30 | 2017-08-15 | Cree, Inc. | Substrate based light emitter devices, components, and related methods |
US9538590B2 (en) | 2012-03-30 | 2017-01-03 | Cree, Inc. | Solid state lighting apparatuses, systems, and related methods |
WO2013151411A1 (en) | 2012-04-06 | 2013-10-10 | Cree, Inc. | Light emitting diode components and methods for emitting a desired light beam pattern |
US9188290B2 (en) | 2012-04-10 | 2015-11-17 | Cree, Inc. | Indirect linear fixture |
US8878204B2 (en) | 2012-05-04 | 2014-11-04 | Cree, Inc. | Submount based light emitter components and methods |
US10439112B2 (en) | 2012-05-31 | 2019-10-08 | Cree, Inc. | Light emitter packages, systems, and methods having improved performance |
US9349929B2 (en) | 2012-05-31 | 2016-05-24 | Cree, Inc. | Light emitter packages, systems, and methods |
USD749051S1 (en) | 2012-05-31 | 2016-02-09 | Cree, Inc. | Light emitting diode (LED) package |
US9590155B2 (en) | 2012-06-06 | 2017-03-07 | Cree, Inc. | Light emitting devices and substrates with improved plating |
US9685585B2 (en) | 2012-06-25 | 2017-06-20 | Cree, Inc. | Quantum dot narrow-band downconverters for high efficiency LEDs |
US8860040B2 (en) | 2012-09-11 | 2014-10-14 | Dow Corning Corporation | High voltage power semiconductor devices on SiC |
US9018639B2 (en) | 2012-10-26 | 2015-04-28 | Dow Corning Corporation | Flat SiC semiconductor substrate |
US9494304B2 (en) | 2012-11-08 | 2016-11-15 | Cree, Inc. | Recessed light fixture retrofit kit |
US9482396B2 (en) | 2012-11-08 | 2016-11-01 | Cree, Inc. | Integrated linear light engine |
US9441818B2 (en) | 2012-11-08 | 2016-09-13 | Cree, Inc. | Uplight with suspended fixture |
US10788176B2 (en) | 2013-02-08 | 2020-09-29 | Ideal Industries Lighting Llc | Modular LED lighting system |
US9316382B2 (en) | 2013-01-31 | 2016-04-19 | Cree, Inc. | Connector devices, systems, and related methods for connecting light emitting diode (LED) modules |
US9738991B2 (en) | 2013-02-05 | 2017-08-22 | Dow Corning Corporation | Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a supporting shelf which permits thermal expansion |
US9017804B2 (en) | 2013-02-05 | 2015-04-28 | Dow Corning Corporation | Method to reduce dislocations in SiC crystal growth |
US9797064B2 (en) | 2013-02-05 | 2017-10-24 | Dow Corning Corporation | Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a support shelf which permits thermal expansion |
US9345091B2 (en) | 2013-02-08 | 2016-05-17 | Cree, Inc. | Light emitting device (LED) light fixture control systems and related methods |
US8916896B2 (en) | 2013-02-22 | 2014-12-23 | Cree, Inc. | Light emitter components and methods having improved performance |
US10295124B2 (en) | 2013-02-27 | 2019-05-21 | Cree, Inc. | Light emitter packages and methods |
US10584860B2 (en) | 2013-03-14 | 2020-03-10 | Ideal Industries, Llc | Linear light fixture with interchangeable light engine unit |
USD738026S1 (en) | 2013-03-14 | 2015-09-01 | Cree, Inc. | Linear wrap light fixture |
US9874333B2 (en) | 2013-03-14 | 2018-01-23 | Cree, Inc. | Surface ambient wrap light fixture |
US9215792B2 (en) | 2013-03-15 | 2015-12-15 | Cree, Inc. | Connector devices, systems, and related methods for light emitter components |
US8940614B2 (en) | 2013-03-15 | 2015-01-27 | Dow Corning Corporation | SiC substrate with SiC epitaxial film |
USD733952S1 (en) | 2013-03-15 | 2015-07-07 | Cree, Inc. | Indirect linear fixture |
US9897267B2 (en) | 2013-03-15 | 2018-02-20 | Cree, Inc. | Light emitter components, systems, and related methods |
US9431590B2 (en) | 2013-03-15 | 2016-08-30 | Cree, Inc. | Ceramic based light emitting diode (LED) devices and methods |
USD738542S1 (en) | 2013-04-19 | 2015-09-08 | Cree, Inc. | Light emitting unit |
US9711489B2 (en) | 2013-05-29 | 2017-07-18 | Cree Huizhou Solid State Lighting Company Limited | Multiple pixel surface mount device package |
CN110246946B (zh) | 2013-06-04 | 2023-04-21 | 科锐Led公司 | 发光二极管介质镜 |
US9679981B2 (en) | 2013-06-09 | 2017-06-13 | Cree, Inc. | Cascode structures for GaN HEMTs |
US9847411B2 (en) | 2013-06-09 | 2017-12-19 | Cree, Inc. | Recessed field plate transistor structures |
US9755059B2 (en) | 2013-06-09 | 2017-09-05 | Cree, Inc. | Cascode structures with GaN cap layers |
CN104241262B (zh) | 2013-06-14 | 2020-11-06 | 惠州科锐半导体照明有限公司 | 发光装置以及显示装置 |
USD740453S1 (en) | 2013-06-27 | 2015-10-06 | Cree, Inc. | Light emitter unit |
USD739565S1 (en) | 2013-06-27 | 2015-09-22 | Cree, Inc. | Light emitter unit |
US9461024B2 (en) | 2013-08-01 | 2016-10-04 | Cree, Inc. | Light emitter devices and methods for light emitting diode (LED) chips |
USD758976S1 (en) | 2013-08-08 | 2016-06-14 | Cree, Inc. | LED package |
KR102245506B1 (ko) * | 2013-09-06 | 2021-04-28 | 지티에이티 코포레이션 | 탄화규소 전구체로부터 벌크 탄화규소를 제조하기 위한 방법 및 장치 |
US10900653B2 (en) | 2013-11-01 | 2021-01-26 | Cree Hong Kong Limited | LED mini-linear light engine |
US10100988B2 (en) | 2013-12-16 | 2018-10-16 | Cree, Inc. | Linear shelf light fixture with reflectors |
USD750308S1 (en) | 2013-12-16 | 2016-02-23 | Cree, Inc. | Linear shelf light fixture |
US10612747B2 (en) | 2013-12-16 | 2020-04-07 | Ideal Industries Lighting Llc | Linear shelf light fixture with gap filler elements |
US10234119B2 (en) | 2014-03-24 | 2019-03-19 | Cree, Inc. | Multiple voltage light emitter packages, systems, and related methods |
USD757324S1 (en) | 2014-04-14 | 2016-05-24 | Cree, Inc. | Linear shelf light fixture with reflectors |
US9279192B2 (en) | 2014-07-29 | 2016-03-08 | Dow Corning Corporation | Method for manufacturing SiC wafer fit for integration with power device manufacturing technology |
USD790486S1 (en) | 2014-09-30 | 2017-06-27 | Cree, Inc. | LED package with truncated encapsulant |
US9826581B2 (en) | 2014-12-05 | 2017-11-21 | Cree, Inc. | Voltage configurable solid state lighting apparatuses, systems, and related methods |
US10658546B2 (en) | 2015-01-21 | 2020-05-19 | Cree, Inc. | High efficiency LEDs and methods of manufacturing |
WO2016126554A1 (en) | 2015-02-05 | 2016-08-11 | Dow Corning Corporation | Furnace for seeded sublimation of wide band gap crystals |
USD777122S1 (en) | 2015-02-27 | 2017-01-24 | Cree, Inc. | LED package |
USD783547S1 (en) | 2015-06-04 | 2017-04-11 | Cree, Inc. | LED package |
RU2603159C1 (ru) * | 2015-07-23 | 2016-11-20 | Федеральное государственное автономное образовательное учреждение высшего образования "Санкт-Петербургский государственный электротехнический университет "ЛЭТИ" им. В.И. Ульянова (Ленина)" (СПбГЭТУ "ЛЭТИ") | Способ получения монокристаллического sic |
JP6036946B2 (ja) * | 2015-08-26 | 2016-11-30 | 住友電気工業株式会社 | 炭化珪素単結晶の製造方法および製造装置 |
EP3353339A4 (de) | 2015-09-24 | 2019-05-08 | Melior Innovations Inc. | Dampfabscheidungsvorrichtung und verfahren mit hochreinem siliciumcarbid aus polymer |
USD823492S1 (en) | 2016-10-04 | 2018-07-17 | Cree, Inc. | Light emitting device |
US10804251B2 (en) | 2016-11-22 | 2020-10-13 | Cree, Inc. | Light emitting diode (LED) devices, components and methods |
US10672957B2 (en) | 2017-07-19 | 2020-06-02 | Cree, Inc. | LED apparatuses and methods for high lumen output density |
US11094852B2 (en) | 2017-08-25 | 2021-08-17 | Cree Huizhou Solid State Lighting Company Limited | Multiple LED light source lens design in an integrated package |
US11056625B2 (en) | 2018-02-19 | 2021-07-06 | Creeled, Inc. | Clear coating for light emitting device exterior having chemical resistance and related methods |
JP7255089B2 (ja) * | 2018-05-25 | 2023-04-11 | 株式会社デンソー | 炭化珪素単結晶製造装置および炭化珪素単結晶の製造方法 |
JP7129856B2 (ja) * | 2018-09-06 | 2022-09-02 | 昭和電工株式会社 | 結晶成長装置 |
IT201900000223A1 (it) * | 2019-01-09 | 2020-07-09 | Lpe Spa | Camera di reazione con elemento rotante e reattore per deposizione di materiale semiconduttore |
US10923585B2 (en) | 2019-06-13 | 2021-02-16 | Cree, Inc. | High electron mobility transistors having improved contact spacing and/or improved contact vias |
US10971612B2 (en) | 2019-06-13 | 2021-04-06 | Cree, Inc. | High electron mobility transistors and power amplifiers including said transistors having improved performance and reliability |
JP7393900B2 (ja) * | 2019-09-24 | 2023-12-07 | 一般財団法人電力中央研究所 | 炭化珪素単結晶ウェハ及び炭化珪素単結晶インゴットの製造方法 |
US11257940B2 (en) | 2020-01-14 | 2022-02-22 | Cree, Inc. | Group III HEMT and capacitor that share structural features |
CN111304746A (zh) * | 2020-03-31 | 2020-06-19 | 福建北电新材料科技有限公司 | SiC晶体生长装置及方法 |
US11837457B2 (en) | 2020-09-11 | 2023-12-05 | Wolfspeed, Inc. | Packaging for RF transistor amplifiers |
US11356070B2 (en) | 2020-06-01 | 2022-06-07 | Wolfspeed, Inc. | RF amplifiers having shielded transmission line structures |
US20210313293A1 (en) | 2020-04-03 | 2021-10-07 | Cree, Inc. | Rf amplifier devices and methods of manufacturing |
US11769768B2 (en) | 2020-06-01 | 2023-09-26 | Wolfspeed, Inc. | Methods for pillar connection on frontside and passive device integration on backside of die |
US11228287B2 (en) | 2020-06-17 | 2022-01-18 | Cree, Inc. | Multi-stage decoupling networks integrated with on-package impedance matching networks for RF power amplifiers |
US11533025B2 (en) | 2020-06-18 | 2022-12-20 | Wolfspeed, Inc. | Integrated doherty amplifier with added isolation between the carrier and the peaking transistors |
US11581859B2 (en) | 2020-06-26 | 2023-02-14 | Wolfspeed, Inc. | Radio frequency (RF) transistor amplifier packages with improved isolation and lead configurations |
US11887945B2 (en) | 2020-09-30 | 2024-01-30 | Wolfspeed, Inc. | Semiconductor device with isolation and/or protection structures |
US20220139852A1 (en) | 2020-10-30 | 2022-05-05 | Cree, Inc. | Transistor packages with improved die attach |
US12009417B2 (en) | 2021-05-20 | 2024-06-11 | Macom Technology Solutions Holdings, Inc. | High electron mobility transistors having improved performance |
US12015075B2 (en) | 2021-05-20 | 2024-06-18 | Macom Technology Solutions Holdings, Inc. | Methods of manufacturing high electron mobility transistors having a modified interface region |
US11842937B2 (en) | 2021-07-30 | 2023-12-12 | Wolfspeed, Inc. | Encapsulation stack for improved humidity performance and related fabrication methods |
US20230075505A1 (en) | 2021-09-03 | 2023-03-09 | Wolfspeed, Inc. | Metal pillar connection topologies for heterogeneous packaging |
US20230078017A1 (en) | 2021-09-16 | 2023-03-16 | Wolfspeed, Inc. | Semiconductor device incorporating a substrate recess |
EP4324961A1 (de) * | 2022-08-17 | 2024-02-21 | SiCrystal GmbH | Verfahren zur herstellung eines massiven sic-einkristalls mit verbesserter qualität unter verwendung eines sic-impfkristalls mit einer temporären schutzoxidschicht und sic-impfkristall mit schutzoxidschicht |
US20240105823A1 (en) | 2022-09-23 | 2024-03-28 | Wolfspeed, Inc. | Barrier Structure for Dispersion Reduction in Transistor Devices |
US20240105824A1 (en) | 2022-09-23 | 2024-03-28 | Wolfspeed, Inc. | Barrier Structure for Sub-100 Nanometer Gate Length Devices |
US20240120202A1 (en) | 2022-10-06 | 2024-04-11 | Wolfspeed, Inc. | Implanted Regions for Semiconductor Structures with Deep Buried Layers |
US20240266419A1 (en) | 2023-02-03 | 2024-08-08 | Wolfspeed, Inc. | Semiconductor Device Having Semiconductor Structure with Polarity Inverting Layer |
US20240266426A1 (en) | 2023-02-03 | 2024-08-08 | Wolfspeed, Inc. | Semiconductor Structure for Improved Radio Frequency Thermal Management |
US20240304702A1 (en) | 2023-03-06 | 2024-09-12 | Wolfspeed, Inc. | Field Reducing Structures for Nitrogen-Polar Group III-Nitride Semiconductor Devices |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL87348C (de) * | 1954-03-19 | 1900-01-01 | ||
US3228756A (en) * | 1960-05-20 | 1966-01-11 | Transitron Electronic Corp | Method of growing single crystal silicon carbide |
US3236780A (en) * | 1962-12-19 | 1966-02-22 | Gen Electric | Luminescent silicon carbide and preparation thereof |
NL6615060A (de) * | 1966-10-25 | 1968-04-26 | ||
US3558284A (en) * | 1967-05-05 | 1971-01-26 | American Science & Eng Inc | Crystal growing apparatus |
US3511614A (en) * | 1967-06-16 | 1970-05-12 | Little Inc A | Heat sensitive fuel controlled verneuil process |
US3962406A (en) * | 1967-11-25 | 1976-06-08 | U.S. Philips Corporation | Method of manufacturing silicon carbide crystals |
US3910767A (en) * | 1972-07-05 | 1975-10-07 | Emile Joseph Jemal | Apparatus for preparing metallic compounds by sublimation |
US3862857A (en) * | 1972-12-26 | 1975-01-28 | Ibm | Method for making amorphous semiconductor thin films |
US3901767A (en) * | 1973-04-23 | 1975-08-26 | Robert L Williams | Distillation mechanism and system |
DE2324783A1 (de) * | 1973-05-16 | 1974-12-12 | Siemens Ag | Verfahren und vorrichtung zum herstellen eines kristalls nach verneuil |
US3960503A (en) * | 1974-12-27 | 1976-06-01 | Corning Glass Works | Particulate material feeder for high temperature vacuum system |
US4147572A (en) * | 1976-10-18 | 1979-04-03 | Vodakov Jury A | Method for epitaxial production of semiconductor silicon carbide utilizing a close-space sublimation deposition technique |
US4108670A (en) * | 1976-12-20 | 1978-08-22 | Ppg Industries, Inc. | Porous refractory metal boride article having dense matrix |
US4310614A (en) * | 1979-03-19 | 1982-01-12 | Xerox Corporation | Method and apparatus for pretreating and depositing thin films on substrates |
JPS5696883A (en) * | 1979-12-29 | 1981-08-05 | Toshiba Corp | Manufacture of silicon carbide diode |
JPS5948792B2 (ja) * | 1982-08-17 | 1984-11-28 | 工業技術院長 | 炭化けい素結晶成長法 |
DE3230727C2 (de) * | 1982-08-18 | 1987-02-19 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum Herstellen von Einkristallen aus Siliziumkarbid SiC |
DD224886A1 (de) * | 1983-06-30 | 1985-07-17 | Univ Dresden Tech | Verfahren zur zuechtung von siliciumcarbid-einkristallen |
US4627990A (en) * | 1984-03-07 | 1986-12-09 | Honda Giken Kogyo Kabushiki Kaisha | Method of and apparatus for supplying powdery material |
US4556436A (en) * | 1984-08-22 | 1985-12-03 | The United States Of America As Represented By The Secretary Of The Navy | Method of preparing single crystalline cubic silicon carbide layers |
NL8500645A (nl) * | 1985-03-07 | 1986-10-01 | Philips Nv | Werkwijze voor het afzetten van een laag, die in hoofdzaak uit siliciumcarbide bestaat op een substraat. |
JPH0788274B2 (ja) * | 1985-09-18 | 1995-09-27 | 三洋電機株式会社 | SiC単結晶の成長方法 |
US4640221A (en) * | 1985-10-30 | 1987-02-03 | International Business Machines Corporation | Vacuum deposition system with improved mass flow control |
US4664944A (en) * | 1986-01-31 | 1987-05-12 | The United States Of America As Represented By The United States Department Of Energy | Deposition method for producing silicon carbide high-temperature semiconductors |
JPS63283014A (ja) * | 1987-04-28 | 1988-11-18 | Sharp Corp | 炭化珪素半導体素子 |
US10156877B2 (en) | 2016-10-01 | 2018-12-18 | Intel Corporation | Enhanced power management for support of priority system events |
CN110312461B (zh) | 2017-04-19 | 2022-07-15 | Hoya株式会社 | 内窥镜顶部的安装装置 |
-
1987
- 1987-10-26 US US07/113,565 patent/US4866005A/en not_active Ceased
-
1988
- 1988-10-25 CA CA000581145A patent/CA1331730C/en not_active Expired - Lifetime
- 1988-10-26 DE DE3856514T patent/DE3856514T2/de not_active Expired - Lifetime
- 1988-10-26 JP JP50938588A patent/JP3165685B2/ja not_active Expired - Lifetime
- 1988-10-26 WO PCT/US1988/003794 patent/WO1989004055A1/en active IP Right Grant
- 1988-10-26 EP EP01201980A patent/EP1143493A3/de not_active Withdrawn
- 1988-10-26 EP EP88910210A patent/EP0389533B2/de not_active Expired - Lifetime
- 1988-10-26 EP EP95202796A patent/EP0712150B1/de not_active Expired - Lifetime
- 1988-10-26 DE DE3855539T patent/DE3855539T3/de not_active Expired - Lifetime
- 1988-10-26 DE DE1143493T patent/DE1143493T1/de active Pending
- 1988-10-26 KR KR1019890701158A patent/KR970008332B1/ko not_active IP Right Cessation
-
1990
- 1990-10-09 US US07/594,856 patent/USRE34861E/en not_active Expired - Lifetime
-
2000
- 2000-03-14 JP JP2000070469A patent/JP2000302600A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0389533B2 (de) | 2004-12-22 |
JP3165685B2 (ja) | 2001-05-14 |
DE3855539T3 (de) | 2005-06-30 |
EP0712150A1 (de) | 1996-05-15 |
KR890702244A (ko) | 1989-12-23 |
DE3856514T2 (de) | 2003-02-13 |
DE3856514D1 (de) | 2002-03-21 |
EP0389533A4 (en) | 1992-12-09 |
DE3855539T2 (de) | 1997-01-23 |
DE3855539D1 (de) | 1996-10-17 |
US4866005A (en) | 1989-09-12 |
JP2000302600A (ja) | 2000-10-31 |
EP1143493A2 (de) | 2001-10-10 |
EP0712150B1 (de) | 2002-02-06 |
WO1989004055A1 (en) | 1989-05-05 |
JPH03501118A (ja) | 1991-03-14 |
EP1143493A3 (de) | 2004-01-02 |
USRE34861E (en) | 1995-02-14 |
KR970008332B1 (ko) | 1997-05-23 |
EP0389533B1 (de) | 1996-09-11 |
CA1331730C (en) | 1994-08-30 |
EP0389533A1 (de) | 1990-10-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE1143493T1 (de) | Sublimationsanwachse von Siliziumkarbidkristallen | |
DE112009000360B4 (de) | Verfahren zum Wachsen eines Siliziumkarbideinkristalls | |
DE60125689T2 (de) | Verfahren und Vorrichtung zur Herstellung von Siliziumkarbidkristallen unter Verwendung von Quellegasen | |
DE2039172C3 (de) | Vorrichtung zur Herstellung epitaktisch auf ein einkristallines Halbleitersubstrat aufgewachsener Schichten aus Halbleitermaterial | |
CA1041322A (en) | Fibre reinforced superalloys and process for making same | |
DE112007002336B4 (de) | Vorrichtung und Verfahren zur Herstellung von Einkristallen | |
DE1290921B (de) | Kristallzuechtungsverfahren | |
DE112009000328B4 (de) | Verfahren zum Aufwachsen eines Siliziumcarbideinkristalls | |
DE102018009473A1 (de) | Tantalkarbidbeschichtetes Kohlenstoffmaterial, Verfahren zu dessen Herstellung und Teil für eine Vorrichtung zur Herstellung von Halbleitereinkristallen | |
DE69934643T2 (de) | Verfahren zur herstellung eines einkristalls mit halbleitender zusammensetzung | |
DE19529481A1 (de) | Verfahren und Vorrichtung zur Herstellung von Einkristallen | |
DE2114645C3 (de) | Verfahren zum epitaktischen Aufwachsen einer Halbleiterverbindung | |
DE69613033T2 (de) | Züchtung von Silizium-Einkristall aus einer Schmelze mit aussergewöhnlichen Wirbelströmen auf der Oberfläche | |
Brown et al. | The growth of single crystals of lead molybdate by the Czochralski technique | |
DE1917136C3 (de) | Verfahren zur Herstellung von drahtförmigen Kristallen | |
LU84519A1 (de) | Verfahren zum herstellen polykristalliner,fuer nachfolgendes zonenschmelzen geeigneter siliciumstaebe | |
DE3013045A1 (de) | Verfahren zur herstellung massiver, perfekter einkristallbirnen aus gadolinium-gallium-granat | |
CH517525A (de) | Verfahren zum Herstellen stabförmiger Siliciumeinkristalle mit homogener Antimondotierung | |
DE2161472B2 (de) | Verfahren zum Aufwachsen einer polykristallinen Silicium-Schicht auf einer Halbleiterscheibe | |
DE1218412B (de) | Verfahren zum Herstellen von einkristallinem Halbleitermaterial | |
DE3002671C2 (de) | Verfahren zur Herstellung eines Siliciumcarbidsubstrats | |
DE2217301C3 (de) | Verfahren zum epitaktischen Aufwachsen kristallisierbaren Materials | |
DE2442517A1 (de) | Verfahren zur zuechtung von kristallen | |
DE69415709T2 (de) | Verfahren und Vorrichtung zur Ziehung eines Si Einkristalles mittels eines Dichtedetektors | |
DE1232558B (de) | Verfahren zum Herstellen von kristallinem, insbesondere einkristallinem Bor |