DE59001292D1
(de)
*
|
1989-06-20 |
1993-06-03 |
Siemens Ag |
Verfahren zum herstellen von einkristallinem siliziumkarbid.
|
US4946547A
(en)
*
|
1989-10-13 |
1990-08-07 |
Cree Research, Inc. |
Method of preparing silicon carbide surfaces for crystal growth
|
US5200022A
(en)
*
|
1990-10-03 |
1993-04-06 |
Cree Research, Inc. |
Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product
|
US5093576A
(en)
*
|
1991-03-15 |
1992-03-03 |
Cree Research |
High sensitivity ultraviolet radiation detector
|
US5958132A
(en)
*
|
1991-04-18 |
1999-09-28 |
Nippon Steel Corporation |
SiC single crystal and method for growth thereof
|
WO1992022922A2
(en)
*
|
1991-06-12 |
1992-12-23 |
Case Western Reserve University |
Process for the controlled growth of single-crystal films of silicon carbide polytypes on silicon carbide wafers
|
US5248385A
(en)
*
|
1991-06-12 |
1993-09-28 |
The United States Of America, As Represented By The Administrator, National Aeronautics And Space Administration |
Process for the homoepitaxial growth of single-crystal silicon carbide films on silicon carbide wafers
|
US5465249A
(en)
*
|
1991-11-26 |
1995-11-07 |
Cree Research, Inc. |
Nonvolatile random access memory device having transistor and capacitor made in silicon carbide substrate
|
US5783335A
(en)
*
|
1992-04-07 |
1998-07-21 |
The Regents Of The University Of California, Office Of Technology Transfer |
Fluidized bed deposition of diamond
|
US5459107A
(en)
*
|
1992-06-05 |
1995-10-17 |
Cree Research, Inc. |
Method of obtaining high quality silicon dioxide passivation on silicon carbide and resulting passivated structures
|
US5629531A
(en)
*
|
1992-06-05 |
1997-05-13 |
Cree Research, Inc. |
Method of obtaining high quality silicon dioxide passivation on silicon carbide and resulting passivated structures
|
US5709745A
(en)
*
|
1993-01-25 |
1998-01-20 |
Ohio Aerospace Institute |
Compound semi-conductors and controlled doping thereof
|
CA2113336C
(en)
*
|
1993-01-25 |
2001-10-23 |
David J. Larkin |
Compound semi-conductors and controlled doping thereof
|
US5441011A
(en)
*
|
1993-03-16 |
1995-08-15 |
Nippon Steel Corporation |
Sublimation growth of single crystal SiC
|
DE4310745C2
(de)
*
|
1993-04-01 |
1999-07-08 |
Siemens Ag |
Verfahren zum Herstellen von SiC-Einkristallen und Vorrichtung zur Durchführung des Verfahrens
|
DE4310744A1
(de)
*
|
1993-04-01 |
1994-10-06 |
Siemens Ag |
Vorrichtung zum Herstellen von SiC-Einkristallen
|
US5611955A
(en)
*
|
1993-10-18 |
1997-03-18 |
Northrop Grumman Corp. |
High resistivity silicon carbide substrates for high power microwave devices
|
US6309766B1
(en)
|
1994-10-31 |
2001-10-30 |
Thomas M. Sullivan |
Polycrystalline silicon carbide ceramic wafer and substrate
|
US6077619A
(en)
*
|
1994-10-31 |
2000-06-20 |
Sullivan; Thomas M. |
Polycrystalline silicon carbide ceramic wafer and substrate
|
KR0183082B1
(ko)
*
|
1994-11-28 |
1999-04-15 |
전성원 |
복합 재료용 예비성형체 제조방법
|
US5679153A
(en)
*
|
1994-11-30 |
1997-10-21 |
Cree Research, Inc. |
Method for reducing micropipe formation in the epitaxial growth of silicon carbide and resulting silicon carbide structures
|
US5585648A
(en)
*
|
1995-02-03 |
1996-12-17 |
Tischler; Michael A. |
High brightness electroluminescent device, emitting in the green to ultraviolet spectrum, and method of making the same
|
SE9502288D0
(sv)
*
|
1995-06-26 |
1995-06-26 |
Abb Research Ltd |
A device and a method for epitaxially growing objects by CVD
|
DE19527536A1
(de)
*
|
1995-07-27 |
1997-01-30 |
Siemens Ag |
Verfahren zum Herstellen von Siliciumcarbid-Einkristallen
|
US6030661A
(en)
*
|
1995-08-04 |
2000-02-29 |
Abb Research Ltd. |
Device and a method for epitaxially growing objects by CVD
|
JP3491402B2
(ja)
*
|
1995-08-07 |
2004-01-26 |
株式会社デンソー |
単結晶製造方法及びその単結晶製造装置
|
US5762896A
(en)
*
|
1995-08-31 |
1998-06-09 |
C3, Inc. |
Silicon carbide gemstones
|
US5683507A
(en)
*
|
1995-09-05 |
1997-11-04 |
Northrop Grumman Corporation |
Apparatus for growing large silicon carbide single crystals
|
SE9503428D0
(sv)
†
|
1995-10-04 |
1995-10-04 |
Abb Research Ltd |
A method for epitaxially growing objects and a device for such a growth
|
EP0781619A1
(de)
|
1995-12-15 |
1997-07-02 |
Cree Research, Inc. |
Verfahren zur Herstellung von Siliciumkarbidscheiden aus Siliciumkarbideinkristallen
|
US5746827A
(en)
*
|
1995-12-27 |
1998-05-05 |
Northrop Grumman Corporation |
Method of producing large diameter silicon carbide crystals
|
RU2094547C1
(ru)
*
|
1996-01-22 |
1997-10-27 |
Юрий Александрович Водаков |
Сублимационный способ выращивания монокристаллов карбида кремния и источник карбида кремния для осуществления способа
|
US6547877B2
(en)
|
1996-01-22 |
2003-04-15 |
The Fox Group, Inc. |
Tantalum crucible fabrication and treatment
|
US5718760A
(en)
*
|
1996-02-05 |
1998-02-17 |
Cree Research, Inc. |
Growth of colorless silicon carbide crystals
|
US5944890A
(en)
*
|
1996-03-29 |
1999-08-31 |
Denso Corporation |
Method of producing single crystals and a seed crystal used in the method
|
US6110279A
(en)
*
|
1996-03-29 |
2000-08-29 |
Denso Corporation |
Method of producing single-crystal silicon carbide
|
JP3384242B2
(ja)
*
|
1996-03-29 |
2003-03-10 |
株式会社豊田中央研究所 |
炭化珪素単結晶の製造方法
|
FR2747401B1
(fr)
*
|
1996-04-10 |
1998-05-15 |
Commissariat Energie Atomique |
Dispositif et procede pour la formation de carbure de silicium (sic) monocristallin sur un germe
|
US6403708B2
(en)
|
1996-05-27 |
2002-06-11 |
Mitsui Chemicals Inc |
Crystalline polypropylenes, process for preparing thereof, polypropylene compositions, and thermoformed products
|
US5858086A
(en)
|
1996-10-17 |
1999-01-12 |
Hunter; Charles Eric |
Growth of bulk single crystals of aluminum nitride
|
US6039812A
(en)
*
|
1996-10-21 |
2000-03-21 |
Abb Research Ltd. |
Device for epitaxially growing objects and method for such a growth
|
US6537371B2
(en)
|
1997-01-22 |
2003-03-25 |
The Fox Group, Inc. |
Niobium crucible fabrication and treatment
|
ATE217368T1
(de)
|
1997-01-22 |
2002-05-15 |
Yury Alexandrovich Vodakov |
Züchtung von siliziumkarbid einkristallen
|
US6562130B2
(en)
|
1997-01-22 |
2003-05-13 |
The Fox Group, Inc. |
Low defect axially grown single crystal silicon carbide
|
ATE202807T1
(de)
*
|
1997-01-31 |
2001-07-15 |
Northrop Grumman Corp |
Vorrichtung zur züchtung von grossen siliziumkarbideinkristallen
|
CN1159750C
(zh)
*
|
1997-04-11 |
2004-07-28 |
日亚化学工业株式会社 |
氮化物半导体的生长方法
|
US5873937A
(en)
*
|
1997-05-05 |
1999-02-23 |
Northrop Grumman Corporation |
Method of growing 4H silicon carbide crystal
|
US5937317A
(en)
*
|
1997-05-08 |
1999-08-10 |
Northrop Grumman Corporation |
Method of making a low resistivity silicon carbide boule
|
US5788768A
(en)
*
|
1997-05-08 |
1998-08-04 |
Northrop Grumman Corporation |
Feedstock arrangement for silicon carbide boule growth
|
ES2226169T3
(es)
*
|
1997-08-29 |
2005-03-16 |
Cree, Inc. |
Diodo emisor de luz del grupo iii robusto para una alta fiabilidad en aplicaciones habituales de encapsulacion.
|
US6825501B2
(en)
*
|
1997-08-29 |
2004-11-30 |
Cree, Inc. |
Robust Group III light emitting diode for high reliability in standard packaging applications
|
AU9003498A
(en)
*
|
1997-09-12 |
1999-04-05 |
Showa Denko Kabushiki Kaisha |
Method and apparatus for producing silicon carbide single crystal
|
US6336971B1
(en)
|
1997-09-12 |
2002-01-08 |
Showa Denko Kabushiki Kaisha |
Method and apparatus for producing silicon carbide single crystal
|
US6599133B2
(en)
|
1997-11-18 |
2003-07-29 |
Technologies And Devices International, Inc. |
Method for growing III-V compound semiconductor structures with an integral non-continuous quantum dot layer utilizing HVPE techniques
|
US6479839B2
(en)
|
1997-11-18 |
2002-11-12 |
Technologies & Devices International, Inc. |
III-V compounds semiconductor device with an AlxByInzGa1-x-y-zN non continuous quantum dot layer
|
US6559038B2
(en)
|
1997-11-18 |
2003-05-06 |
Technologies And Devices International, Inc. |
Method for growing p-n heterojunction-based structures utilizing HVPE techniques
|
US20020047135A1
(en)
*
|
1997-11-18 |
2002-04-25 |
Nikolaev Audrey E. |
P-N junction-based structures utilizing HVPE grown III-V compound layers
|
US6476420B2
(en)
|
1997-11-18 |
2002-11-05 |
Technologies And Devices International, Inc. |
P-N homojunction-based structures utilizing HVPE growth III-V compound layers
|
US6555452B2
(en)
|
1997-11-18 |
2003-04-29 |
Technologies And Devices International, Inc. |
Method for growing p-type III-V compound material utilizing HVPE techniques
|
US6849862B2
(en)
|
1997-11-18 |
2005-02-01 |
Technologies And Devices International, Inc. |
III-V compound semiconductor device with an AlxByInzGa1-x-y-zN1-a-bPaAsb non-continuous quantum dot layer
|
US6890809B2
(en)
*
|
1997-11-18 |
2005-05-10 |
Technologies And Deviles International, Inc. |
Method for fabricating a P-N heterojunction device utilizing HVPE grown III-V compound layers and resultant device
|
US6472300B2
(en)
|
1997-11-18 |
2002-10-29 |
Technologies And Devices International, Inc. |
Method for growing p-n homojunction-based structures utilizing HVPE techniques
|
US6559467B2
(en)
|
1997-11-18 |
2003-05-06 |
Technologies And Devices International, Inc. |
P-n heterojunction-based structures utilizing HVPE grown III-V compound layers
|
US5985024A
(en)
*
|
1997-12-11 |
1999-11-16 |
Northrop Grumman Corporation |
Method and apparatus for growing high purity single crystal silicon carbide
|
EP0933450B1
(de)
*
|
1998-01-19 |
2002-04-17 |
Sumitomo Electric Industries, Ltd. |
Verfahren und Vorrichtung zur Herstellung eines SiC-Einkristalles
|
US6051849A
(en)
|
1998-02-27 |
2000-04-18 |
North Carolina State University |
Gallium nitride semiconductor structures including a lateral gallium nitride layer that extends from an underlying gallium nitride layer
|
US6608327B1
(en)
|
1998-02-27 |
2003-08-19 |
North Carolina State University |
Gallium nitride semiconductor structure including laterally offset patterned layers
|
US6265289B1
(en)
|
1998-06-10 |
2001-07-24 |
North Carolina State University |
Methods of fabricating gallium nitride semiconductor layers by lateral growth from sidewalls into trenches, and gallium nitride semiconductor structures fabricated thereby
|
US6048813A
(en)
|
1998-10-09 |
2000-04-11 |
Cree, Inc. |
Simulated diamond gemstones formed of aluminum nitride and aluminum nitride: silicon carbide alloys
|
US6177688B1
(en)
|
1998-11-24 |
2001-01-23 |
North Carolina State University |
Pendeoepitaxial gallium nitride semiconductor layers on silcon carbide substrates
|
US6255198B1
(en)
*
|
1998-11-24 |
2001-07-03 |
North Carolina State University |
Methods of fabricating gallium nitride microelectronic layers on silicon layers and gallium nitride microelectronic structures formed thereby
|
JP4614539B2
(ja)
*
|
1999-02-19 |
2011-01-19 |
エスアイクリスタル アクチエンゲゼルシャフト |
α‐SiC塊状単結晶の成長方法
|
US6406539B1
(en)
|
1999-04-28 |
2002-06-18 |
Showa Denko K.K, |
Process for producing silicon carbide single crystal and production apparatus therefor
|
DE50004010D1
(de)
|
1999-07-07 |
2003-11-13 |
Siemens Ag |
Verfahren zur sublimationszüchtung eines sic-einkristalls mit aufheizen unter züchtungsdruck
|
DE19931332C2
(de)
*
|
1999-07-07 |
2002-06-06 |
Siemens Ag |
Vorrichtung zur Herstellung eines SiC-Einkristalls mit einem doppelwandigen Tiegel
|
US6562131B2
(en)
|
1999-07-20 |
2003-05-13 |
The Fox Group, Inc. |
Method for growing single crystal silicon carbide
|
US6824611B1
(en)
*
|
1999-10-08 |
2004-11-30 |
Cree, Inc. |
Method and apparatus for growing silicon carbide crystals
|
US6451112B1
(en)
|
1999-10-15 |
2002-09-17 |
Denso Corporation |
Method and apparatus for fabricating high quality single crystal
|
US6521514B1
(en)
|
1999-11-17 |
2003-02-18 |
North Carolina State University |
Pendeoepitaxial methods of fabricating gallium nitride semiconductor layers on sapphire substrates
|
US8829546B2
(en)
|
1999-11-19 |
2014-09-09 |
Cree, Inc. |
Rare earth doped layer or substrate for light conversion
|
US6614056B1
(en)
|
1999-12-01 |
2003-09-02 |
Cree Lighting Company |
Scalable led with improved current spreading structures
|
US6410942B1
(en)
|
1999-12-03 |
2002-06-25 |
Cree Lighting Company |
Enhanced light extraction through the use of micro-LED arrays
|
WO2001041225A2
(en)
|
1999-12-03 |
2001-06-07 |
Cree Lighting Company |
Enhanced light extraction in leds through the use of internal and external optical elements
|
US6380108B1
(en)
|
1999-12-21 |
2002-04-30 |
North Carolina State University |
Pendeoepitaxial methods of fabricating gallium nitride semiconductor layers on weak posts, and gallium nitride semiconductor structures fabricated thereby
|
US6403451B1
(en)
|
2000-02-09 |
2002-06-11 |
Noerh Carolina State University |
Methods of fabricating gallium nitride semiconductor layers on substrates including non-gallium nitride posts
|
US6428621B1
(en)
|
2000-02-15 |
2002-08-06 |
The Fox Group, Inc. |
Method for growing low defect density silicon carbide
|
US6261929B1
(en)
|
2000-02-24 |
2001-07-17 |
North Carolina State University |
Methods of forming a plurality of semiconductor layers using spaced trench arrays
|
AU2001250835A1
(en)
*
|
2000-03-13 |
2001-09-24 |
Ii-Vi Incorporated |
Large size single crystal seed crystal fabrication by intergrowth of tiled seed crystals
|
WO2001068954A2
(en)
*
|
2000-03-13 |
2001-09-20 |
Ii-Vi Incorporated |
Axial gradient transport apparatus and process
|
US6573128B1
(en)
|
2000-11-28 |
2003-06-03 |
Cree, Inc. |
Epitaxial edge termination for silicon carbide Schottky devices and methods of fabricating silicon carbide devices incorporating same
|
JP4275308B2
(ja)
*
|
2000-12-28 |
2009-06-10 |
株式会社デンソー |
炭化珪素単結晶の製造方法およびその製造装置
|
US6800876B2
(en)
|
2001-01-16 |
2004-10-05 |
Cree, Inc. |
Group III nitride LED with undoped cladding layer (5000.137)
|
US6906352B2
(en)
|
2001-01-16 |
2005-06-14 |
Cree, Inc. |
Group III nitride LED with undoped cladding layer and multiple quantum well
|
US6863728B2
(en)
|
2001-02-14 |
2005-03-08 |
The Fox Group, Inc. |
Apparatus for growing low defect density silicon carbide
|
US6670278B2
(en)
|
2001-03-30 |
2003-12-30 |
Lam Research Corporation |
Method of plasma etching of silicon carbide
|
US6849882B2
(en)
|
2001-05-11 |
2005-02-01 |
Cree Inc. |
Group-III nitride based high electron mobility transistor (HEMT) with barrier/spacer layer
|
US6706114B2
(en)
*
|
2001-05-21 |
2004-03-16 |
Cree, Inc. |
Methods of fabricating silicon carbide crystals
|
CN1505843B
(zh)
|
2001-06-15 |
2010-05-05 |
克里公司 |
在SiC衬底上形成的GaN基LED
|
US20020189536A1
(en)
*
|
2001-06-15 |
2002-12-19 |
Bridgestone Corporation |
Silicon carbide single crystal and production thereof
|
US7553373B2
(en)
|
2001-06-15 |
2009-06-30 |
Bridgestone Corporation |
Silicon carbide single crystal and production thereof
|
US20030015708A1
(en)
|
2001-07-23 |
2003-01-23 |
Primit Parikh |
Gallium nitride based diodes with low forward voltage and low reverse current operation
|
AU2002357640A1
(en)
|
2001-07-24 |
2003-04-22 |
Cree, Inc. |
Insulting gate algan/gan hemt
|
US6749685B2
(en)
*
|
2001-08-16 |
2004-06-15 |
Cree, Inc. |
Silicon carbide sublimation systems and associated methods
|
US6903446B2
(en)
*
|
2001-10-23 |
2005-06-07 |
Cree, Inc. |
Pattern for improved visual inspection of semiconductor devices
|
US6780243B1
(en)
|
2001-11-01 |
2004-08-24 |
Dow Corning Enterprises, Inc. |
Method of silicon carbide monocrystalline boule growth
|
US7030428B2
(en)
*
|
2001-12-03 |
2006-04-18 |
Cree, Inc. |
Strain balanced nitride heterojunction transistors
|
US7220313B2
(en)
*
|
2003-07-28 |
2007-05-22 |
Cree, Inc. |
Reducing nitrogen content in silicon carbide crystals by sublimation growth in a hydrogen-containing ambient
|
US7601441B2
(en)
*
|
2002-06-24 |
2009-10-13 |
Cree, Inc. |
One hundred millimeter high purity semi-insulating single crystal silicon carbide wafer
|
US7316747B2
(en)
*
|
2002-06-24 |
2008-01-08 |
Cree, Inc. |
Seeded single crystal silicon carbide growth and resulting crystals
|
US6814801B2
(en)
*
|
2002-06-24 |
2004-11-09 |
Cree, Inc. |
Method for producing semi-insulating resistivity in high purity silicon carbide crystals
|
US6982204B2
(en)
|
2002-07-16 |
2006-01-03 |
Cree, Inc. |
Nitride-based transistors and methods of fabrication thereof using non-etched contact recesses
|
EP1540048B1
(de)
*
|
2002-09-19 |
2010-05-12 |
Showa Denko K.K. |
Siliciumcarbid-einkristall und verfahren und vorrichtung zu seiner herstellung
|
US6825559B2
(en)
|
2003-01-02 |
2004-11-30 |
Cree, Inc. |
Group III nitride based flip-chip intergrated circuit and method for fabricating
|
US9515135B2
(en)
*
|
2003-01-15 |
2016-12-06 |
Cree, Inc. |
Edge termination structures for silicon carbide devices
|
US7026650B2
(en)
*
|
2003-01-15 |
2006-04-11 |
Cree, Inc. |
Multiple floating guard ring edge termination for silicon carbide devices
|
US6987281B2
(en)
*
|
2003-02-13 |
2006-01-17 |
Cree, Inc. |
Group III nitride contact structures for light emitting devices
|
US6952024B2
(en)
*
|
2003-02-13 |
2005-10-04 |
Cree, Inc. |
Group III nitride LED with silicon carbide cladding layer
|
US7170097B2
(en)
*
|
2003-02-14 |
2007-01-30 |
Cree, Inc. |
Inverted light emitting diode on conductive substrate
|
US7898047B2
(en)
|
2003-03-03 |
2011-03-01 |
Samsung Electronics Co., Ltd. |
Integrated nitride and silicon carbide-based devices and methods of fabricating integrated nitride-based devices
|
US7112860B2
(en)
|
2003-03-03 |
2006-09-26 |
Cree, Inc. |
Integrated nitride-based acoustic wave devices and methods of fabricating integrated nitride-based acoustic wave devices
|
US6964917B2
(en)
*
|
2003-04-08 |
2005-11-15 |
Cree, Inc. |
Semi-insulating silicon carbide produced by Neutron transmutation doping
|
EP2264798B1
(de)
|
2003-04-30 |
2020-10-14 |
Cree, Inc. |
Hochleistungs-Lichtemitter-Verkapselungen mit kompakter Optik
|
ITMI20031196A1
(it)
*
|
2003-06-13 |
2004-12-14 |
Lpe Spa |
Sistema per crescere cristalli di carburo di silicio
|
KR100782998B1
(ko)
|
2003-06-16 |
2007-12-07 |
쇼와 덴코 가부시키가이샤 |
실리콘 카바이드 단결정의 성장 방법, 실리콘 카바이드 씨드결정 및 실리콘 카바이드 단결정
|
US7915085B2
(en)
*
|
2003-09-18 |
2011-03-29 |
Cree, Inc. |
Molded chip fabrication method
|
US6972438B2
(en)
*
|
2003-09-30 |
2005-12-06 |
Cree, Inc. |
Light emitting diode with porous SiC substrate and method for fabricating
|
US6974720B2
(en)
*
|
2003-10-16 |
2005-12-13 |
Cree, Inc. |
Methods of forming power semiconductor devices using boule-grown silicon carbide drift layers and power semiconductor devices formed thereby
|
KR20060122868A
(ko)
*
|
2003-11-25 |
2006-11-30 |
스미토모덴키고교가부시키가이샤 |
다이아몬드 n형 반도체, 그의 제조 방법, 반도체 소자 및전자 방출 소자
|
US7135715B2
(en)
*
|
2004-01-07 |
2006-11-14 |
Cree, Inc. |
Co-doping for fermi level control in semi-insulating Group III nitrides
|
US7901994B2
(en)
|
2004-01-16 |
2011-03-08 |
Cree, Inc. |
Methods of manufacturing group III nitride semiconductor devices with silicon nitride layers
|
US7045404B2
(en)
|
2004-01-16 |
2006-05-16 |
Cree, Inc. |
Nitride-based transistors with a protective layer and a low-damage recess and methods of fabrication thereof
|
US7170111B2
(en)
|
2004-02-05 |
2007-01-30 |
Cree, Inc. |
Nitride heterojunction transistors having charge-transfer induced energy barriers and methods of fabricating the same
|
US7612390B2
(en)
*
|
2004-02-05 |
2009-11-03 |
Cree, Inc. |
Heterojunction transistors including energy barriers
|
US7056383B2
(en)
*
|
2004-02-13 |
2006-06-06 |
The Fox Group, Inc. |
Tantalum based crucible
|
US7872268B2
(en)
*
|
2004-04-22 |
2011-01-18 |
Cree, Inc. |
Substrate buffer structure for group III nitride devices
|
US7825006B2
(en)
|
2004-05-06 |
2010-11-02 |
Cree, Inc. |
Lift-off process for GaN films formed on SiC substrates and devices fabricated using the method
|
US7084441B2
(en)
|
2004-05-20 |
2006-08-01 |
Cree, Inc. |
Semiconductor devices having a hybrid channel layer, current aperture transistors and methods of fabricating same
|
US7432142B2
(en)
|
2004-05-20 |
2008-10-07 |
Cree, Inc. |
Methods of fabricating nitride-based transistors having regrown ohmic contact regions
|
WO2005119793A2
(en)
*
|
2004-05-28 |
2005-12-15 |
Caracal, Inc. |
Silicon carbide schottky diodes and fabrication method
|
US7795623B2
(en)
|
2004-06-30 |
2010-09-14 |
Cree, Inc. |
Light emitting devices having current reducing structures and methods of forming light emitting devices having current reducing structures
|
US9368428B2
(en)
*
|
2004-06-30 |
2016-06-14 |
Cree, Inc. |
Dielectric wafer level bonding with conductive feed-throughs for electrical connection and thermal management
|
US7534633B2
(en)
*
|
2004-07-02 |
2009-05-19 |
Cree, Inc. |
LED with substrate modifications for enhanced light extraction and method of making same
|
US7238560B2
(en)
|
2004-07-23 |
2007-07-03 |
Cree, Inc. |
Methods of fabricating nitride-based transistors with a cap layer and a recessed gate
|
US20060017064A1
(en)
*
|
2004-07-26 |
2006-01-26 |
Saxler Adam W |
Nitride-based transistors having laterally grown active region and methods of fabricating same
|
US7192482B2
(en)
*
|
2004-08-10 |
2007-03-20 |
Cree, Inc. |
Seed and seedholder combinations for high quality growth of large silicon carbide single crystals
|
US7217583B2
(en)
*
|
2004-09-21 |
2007-05-15 |
Cree, Inc. |
Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension
|
US7294324B2
(en)
*
|
2004-09-21 |
2007-11-13 |
Cree, Inc. |
Low basal plane dislocation bulk grown SiC wafers
|
US8174037B2
(en)
*
|
2004-09-22 |
2012-05-08 |
Cree, Inc. |
High efficiency group III nitride LED with lenticular surface
|
US7314520B2
(en)
|
2004-10-04 |
2008-01-01 |
Cree, Inc. |
Low 1c screw dislocation 3 inch silicon carbide wafer
|
US7314521B2
(en)
|
2004-10-04 |
2008-01-01 |
Cree, Inc. |
Low micropipe 100 mm silicon carbide wafer
|
US8998949B2
(en)
*
|
2004-11-09 |
2015-04-07 |
Biomet Sports Medicine, Llc |
Soft tissue conduit device
|
US7300519B2
(en)
*
|
2004-11-17 |
2007-11-27 |
Cree, Inc. |
Reduction of subsurface damage in the production of bulk SiC crystals
|
US7709859B2
(en)
*
|
2004-11-23 |
2010-05-04 |
Cree, Inc. |
Cap layers including aluminum nitride for nitride-based transistors
|
US7456443B2
(en)
|
2004-11-23 |
2008-11-25 |
Cree, Inc. |
Transistors having buried n-type and p-type regions beneath the source region
|
US7161194B2
(en)
|
2004-12-06 |
2007-01-09 |
Cree, Inc. |
High power density and/or linearity transistors
|
US7355215B2
(en)
|
2004-12-06 |
2008-04-08 |
Cree, Inc. |
Field effect transistors (FETs) having multi-watt output power at millimeter-wave frequencies
|
US7563321B2
(en)
*
|
2004-12-08 |
2009-07-21 |
Cree, Inc. |
Process for producing high quality large size silicon carbide crystals
|
US7811943B2
(en)
*
|
2004-12-22 |
2010-10-12 |
Cree, Inc. |
Process for producing silicon carbide crystals having increased minority carrier lifetimes
|
US7236053B2
(en)
*
|
2004-12-31 |
2007-06-26 |
Cree, Inc. |
High efficiency switch-mode power amplifier
|
US7436039B2
(en)
|
2005-01-06 |
2008-10-14 |
Velox Semiconductor Corporation |
Gallium nitride semiconductor device
|
US7246735B2
(en)
*
|
2005-01-07 |
2007-07-24 |
Asm Assembly Automation Ltd. |
Wire clamping plate
|
US9793247B2
(en)
*
|
2005-01-10 |
2017-10-17 |
Cree, Inc. |
Solid state lighting component
|
US7821023B2
(en)
|
2005-01-10 |
2010-10-26 |
Cree, Inc. |
Solid state lighting component
|
US9070850B2
(en)
|
2007-10-31 |
2015-06-30 |
Cree, Inc. |
Light emitting diode package and method for fabricating same
|
US7335920B2
(en)
|
2005-01-24 |
2008-02-26 |
Cree, Inc. |
LED with current confinement structure and surface roughening
|
US7276117B2
(en)
*
|
2005-02-09 |
2007-10-02 |
Cree Dulles, Inc. |
Method of forming semi-insulating silicon carbide single crystal
|
US7932111B2
(en)
*
|
2005-02-23 |
2011-04-26 |
Cree, Inc. |
Substrate removal process for high light extraction LEDs
|
US7465967B2
(en)
*
|
2005-03-15 |
2008-12-16 |
Cree, Inc. |
Group III nitride field effect transistors (FETS) capable of withstanding high temperature reverse bias test conditions
|
US7323052B2
(en)
*
|
2005-03-24 |
2008-01-29 |
Cree, Inc. |
Apparatus and method for the production of bulk silicon carbide single crystals
|
US7422634B2
(en)
*
|
2005-04-07 |
2008-09-09 |
Cree, Inc. |
Three inch silicon carbide wafer with low warp, bow, and TTV
|
US8575651B2
(en)
|
2005-04-11 |
2013-11-05 |
Cree, Inc. |
Devices having thick semi-insulating epitaxial gallium nitride layer
|
US7626217B2
(en)
*
|
2005-04-11 |
2009-12-01 |
Cree, Inc. |
Composite substrates of conductive and insulating or semi-insulating group III-nitrides for group III-nitride devices
|
US7608524B2
(en)
*
|
2005-04-19 |
2009-10-27 |
Ii-Vi Incorporated |
Method of and system for forming SiC crystals having spatially uniform doping impurities
|
US20060263279A1
(en)
*
|
2005-04-28 |
2006-11-23 |
Laurencin Cato T |
Adjustable path sublimator system and related method of use
|
US7615774B2
(en)
*
|
2005-04-29 |
2009-11-10 |
Cree.Inc. |
Aluminum free group III-nitride based high electron mobility transistors
|
US7544963B2
(en)
|
2005-04-29 |
2009-06-09 |
Cree, Inc. |
Binary group III-nitride based high electron mobility transistors
|
US8901699B2
(en)
|
2005-05-11 |
2014-12-02 |
Cree, Inc. |
Silicon carbide junction barrier Schottky diodes with suppressed minority carrier injection
|
US7387680B2
(en)
*
|
2005-05-13 |
2008-06-17 |
Cree, Inc. |
Method and apparatus for the production of silicon carbide crystals
|
US9412926B2
(en)
*
|
2005-06-10 |
2016-08-09 |
Cree, Inc. |
High power solid-state lamp
|
US9331192B2
(en)
*
|
2005-06-29 |
2016-05-03 |
Cree, Inc. |
Low dislocation density group III nitride layers on silicon carbide substrates and methods of making the same
|
US20070018199A1
(en)
|
2005-07-20 |
2007-01-25 |
Cree, Inc. |
Nitride-based transistors and fabrication methods with an etch stop layer
|
US20070018198A1
(en)
*
|
2005-07-20 |
2007-01-25 |
Brandes George R |
High electron mobility electronic device structures comprising native substrates and methods for making the same
|
US8674375B2
(en)
*
|
2005-07-21 |
2014-03-18 |
Cree, Inc. |
Roughened high refractive index layer/LED for high light extraction
|
TW200715570A
(en)
|
2005-09-07 |
2007-04-16 |
Cree Inc |
Robust transistors with fluorine treatment
|
US20070110657A1
(en)
*
|
2005-11-14 |
2007-05-17 |
Hunter Charles E |
Unseeded silicon carbide single crystals
|
US7419892B2
(en)
*
|
2005-12-13 |
2008-09-02 |
Cree, Inc. |
Semiconductor devices including implanted regions and protective layers and methods of forming the same
|
JP5614766B2
(ja)
*
|
2005-12-21 |
2014-10-29 |
クリー インコーポレイテッドCree Inc. |
照明装置
|
US7709269B2
(en)
|
2006-01-17 |
2010-05-04 |
Cree, Inc. |
Methods of fabricating transistors including dielectrically-supported gate electrodes
|
US7592211B2
(en)
|
2006-01-17 |
2009-09-22 |
Cree, Inc. |
Methods of fabricating transistors including supported gate electrodes
|
US8101961B2
(en)
|
2006-01-25 |
2012-01-24 |
Cree, Inc. |
Transparent ohmic contacts on light emitting diodes with growth substrates
|
EP1985884B1
(de)
*
|
2006-02-08 |
2012-10-24 |
Hitachi, Ltd. |
Elektrische bremse
|
US7566918B2
(en)
*
|
2006-02-23 |
2009-07-28 |
Cree, Inc. |
Nitride based transistors for millimeter wave operation
|
US7388236B2
(en)
*
|
2006-03-29 |
2008-06-17 |
Cree, Inc. |
High efficiency and/or high power density wide bandgap transistors
|
US8969908B2
(en)
*
|
2006-04-04 |
2015-03-03 |
Cree, Inc. |
Uniform emission LED package
|
USD738832S1
(en)
|
2006-04-04 |
2015-09-15 |
Cree, Inc. |
Light emitting diode (LED) package
|
US9780268B2
(en)
|
2006-04-04 |
2017-10-03 |
Cree, Inc. |
Submount based surface mount device (SMD) light emitter components and methods
|
AU2007233320B2
(en)
|
2006-04-04 |
2013-12-12 |
Singulex, Inc. |
Highly sensitive system and methods for analysis of troponin
|
WO2007116517A1
(ja)
*
|
2006-04-10 |
2007-10-18 |
Fujitsu Limited |
化合物半導体構造とその製造方法
|
US9335006B2
(en)
*
|
2006-04-18 |
2016-05-10 |
Cree, Inc. |
Saturated yellow phosphor converted LED and blue converted red LED
|
JP2007284306A
(ja)
*
|
2006-04-19 |
2007-11-01 |
Nippon Steel Corp |
炭化珪素単結晶及びその製造方法
|
JP4954596B2
(ja)
*
|
2006-04-21 |
2012-06-20 |
新日本製鐵株式会社 |
炭化珪素単結晶インゴットの製造方法
|
US8748915B2
(en)
|
2006-04-24 |
2014-06-10 |
Cree Hong Kong Limited |
Emitter package with angled or vertical LED
|
US11210971B2
(en)
|
2009-07-06 |
2021-12-28 |
Cree Huizhou Solid State Lighting Company Limited |
Light emitting diode display with tilted peak emission pattern
|
US9040398B2
(en)
*
|
2006-05-16 |
2015-05-26 |
Cree, Inc. |
Method of fabricating seminconductor devices including self aligned refractory contacts
|
WO2007139894A2
(en)
|
2006-05-26 |
2007-12-06 |
Cree Led Lighting Solutions, Inc. |
Solid state light emitting device and method of making same
|
US8698184B2
(en)
|
2011-01-21 |
2014-04-15 |
Cree, Inc. |
Light emitting diodes with low junction temperature and solid state backlight components including light emitting diodes with low junction temperature
|
US8980445B2
(en)
*
|
2006-07-06 |
2015-03-17 |
Cree, Inc. |
One hundred millimeter SiC crystal grown on off-axis seed
|
AU2007275780B2
(en)
*
|
2006-07-19 |
2011-02-24 |
Sk Siltron Css, Llc |
Method of manufacturing substrates having improved carrier lifetimes
|
US7943952B2
(en)
*
|
2006-07-31 |
2011-05-17 |
Cree, Inc. |
Method of uniform phosphor chip coating and LED package fabricated using method
|
US7728402B2
(en)
*
|
2006-08-01 |
2010-06-01 |
Cree, Inc. |
Semiconductor devices including schottky diodes with controlled breakdown
|
US8432012B2
(en)
|
2006-08-01 |
2013-04-30 |
Cree, Inc. |
Semiconductor devices including schottky diodes having overlapping doped regions and methods of fabricating same
|
EP2052414B1
(de)
|
2006-08-17 |
2016-03-30 |
Cree, Inc. |
Bipolare hochleistungstransistoren mit isoliertem gate
|
CN101554089A
(zh)
*
|
2006-08-23 |
2009-10-07 |
科锐Led照明科技公司 |
照明装置和照明方法
|
JP5562641B2
(ja)
|
2006-09-14 |
2014-07-30 |
クリー インコーポレイテッド |
マイクロパイプ・フリーの炭化ケイ素およびその製造方法
|
US9018619B2
(en)
*
|
2006-10-09 |
2015-04-28 |
Cree, Inc. |
Quantum wells for light conversion
|
US10873002B2
(en)
*
|
2006-10-20 |
2020-12-22 |
Cree, Inc. |
Permanent wafer bonding using metal alloy preform discs
|
US8823057B2
(en)
|
2006-11-06 |
2014-09-02 |
Cree, Inc. |
Semiconductor devices including implanted regions for providing low-resistance contact to buried layers and related devices
|
US10295147B2
(en)
*
|
2006-11-09 |
2019-05-21 |
Cree, Inc. |
LED array and method for fabricating same
|
JP5105160B2
(ja)
|
2006-11-13 |
2012-12-19 |
クリー インコーポレイテッド |
トランジスタ
|
US7692263B2
(en)
|
2006-11-21 |
2010-04-06 |
Cree, Inc. |
High voltage GaN transistors
|
US9318327B2
(en)
|
2006-11-28 |
2016-04-19 |
Cree, Inc. |
Semiconductor devices having low threading dislocations and improved light extraction and methods of making the same
|
CN101622493A
(zh)
*
|
2006-12-04 |
2010-01-06 |
科锐Led照明科技公司 |
照明装置和照明方法
|
US9310026B2
(en)
|
2006-12-04 |
2016-04-12 |
Cree, Inc. |
Lighting assembly and lighting method
|
US7834367B2
(en)
|
2007-01-19 |
2010-11-16 |
Cree, Inc. |
Low voltage diode with reduced parasitic resistance and method for fabricating
|
US8232564B2
(en)
*
|
2007-01-22 |
2012-07-31 |
Cree, Inc. |
Wafer level phosphor coating technique for warm light emitting diodes
|
US9196799B2
(en)
*
|
2007-01-22 |
2015-11-24 |
Cree, Inc. |
LED chips having fluorescent substrates with microholes and methods for fabricating
|
US9024349B2
(en)
|
2007-01-22 |
2015-05-05 |
Cree, Inc. |
Wafer level phosphor coating method and devices fabricated utilizing method
|
US9159888B2
(en)
*
|
2007-01-22 |
2015-10-13 |
Cree, Inc. |
Wafer level phosphor coating method and devices fabricated utilizing method
|
US8021904B2
(en)
*
|
2007-02-01 |
2011-09-20 |
Cree, Inc. |
Ohmic contacts to nitrogen polarity GaN
|
US8835987B2
(en)
*
|
2007-02-27 |
2014-09-16 |
Cree, Inc. |
Insulated gate bipolar transistors including current suppressing layers
|
US8362503B2
(en)
|
2007-03-09 |
2013-01-29 |
Cree, Inc. |
Thick nitride semiconductor structures with interlayer structures
|
US8212290B2
(en)
*
|
2007-03-23 |
2012-07-03 |
Cree, Inc. |
High temperature performance capable gallium nitride transistor
|
US9484499B2
(en)
*
|
2007-04-20 |
2016-11-01 |
Cree, Inc. |
Transparent ohmic contacts on light emitting diodes with carrier substrates
|
US20080258130A1
(en)
*
|
2007-04-23 |
2008-10-23 |
Bergmann Michael J |
Beveled LED Chip with Transparent Substrate
|
US7982363B2
(en)
*
|
2007-05-14 |
2011-07-19 |
Cree, Inc. |
Bulk acoustic device and method for fabricating
|
US8449671B2
(en)
|
2007-06-27 |
2013-05-28 |
Ii-Vi Incorporated |
Fabrication of SiC substrates with low warp and bow
|
US9401461B2
(en)
*
|
2007-07-11 |
2016-07-26 |
Cree, Inc. |
LED chip design for white conversion
|
US10505083B2
(en)
*
|
2007-07-11 |
2019-12-10 |
Cree, Inc. |
Coating method utilizing phosphor containment structure and devices fabricated using same
|
US8111001B2
(en)
|
2007-07-17 |
2012-02-07 |
Cree, Inc. |
LED with integrated constant current driver
|
JP5431320B2
(ja)
*
|
2007-07-17 |
2014-03-05 |
クリー インコーポレイテッド |
内部光学機能を備えた光学素子およびその製造方法
|
US8409351B2
(en)
*
|
2007-08-08 |
2013-04-02 |
Sic Systems, Inc. |
Production of bulk silicon carbide with hot-filament chemical vapor deposition
|
US11114594B2
(en)
*
|
2007-08-24 |
2021-09-07 |
Creeled, Inc. |
Light emitting device packages using light scattering particles of different size
|
US8163086B2
(en)
*
|
2007-08-29 |
2012-04-24 |
Cree, Inc. |
Halogen assisted physical vapor transport method for silicon carbide growth
|
US9012937B2
(en)
|
2007-10-10 |
2015-04-21 |
Cree, Inc. |
Multiple conversion material light emitting diode package and method of fabricating same
|
US9666762B2
(en)
|
2007-10-31 |
2017-05-30 |
Cree, Inc. |
Multi-chip light emitter packages and related methods
|
US9082921B2
(en)
|
2007-10-31 |
2015-07-14 |
Cree, Inc. |
Multi-die LED package
|
US8866169B2
(en)
|
2007-10-31 |
2014-10-21 |
Cree, Inc. |
LED package with increased feature sizes
|
US10256385B2
(en)
|
2007-10-31 |
2019-04-09 |
Cree, Inc. |
Light emitting die (LED) packages and related methods
|
US9172012B2
(en)
|
2007-10-31 |
2015-10-27 |
Cree, Inc. |
Multi-chip light emitter packages and related methods
|
US9461201B2
(en)
|
2007-11-14 |
2016-10-04 |
Cree, Inc. |
Light emitting diode dielectric mirror
|
US8536584B2
(en)
|
2007-11-14 |
2013-09-17 |
Cree, Inc. |
High voltage wire bond free LEDS
|
US7985970B2
(en)
*
|
2009-04-06 |
2011-07-26 |
Cree, Inc. |
High voltage low current surface-emitting LED
|
US7915629B2
(en)
*
|
2008-12-08 |
2011-03-29 |
Cree, Inc. |
Composite high reflectivity layer
|
US8167674B2
(en)
*
|
2007-12-14 |
2012-05-01 |
Cree, Inc. |
Phosphor distribution in LED lamps using centrifugal force
|
US9041285B2
(en)
|
2007-12-14 |
2015-05-26 |
Cree, Inc. |
Phosphor distribution in LED lamps using centrifugal force
|
US9431589B2
(en)
*
|
2007-12-14 |
2016-08-30 |
Cree, Inc. |
Textured encapsulant surface in LED packages
|
US10008637B2
(en)
|
2011-12-06 |
2018-06-26 |
Cree, Inc. |
Light emitter devices and methods with reduced dimensions and improved light output
|
US8460764B2
(en)
*
|
2008-03-06 |
2013-06-11 |
Georgia Tech Research Corporation |
Method and apparatus for producing ultra-thin graphitic layers
|
US8637883B2
(en)
|
2008-03-19 |
2014-01-28 |
Cree, Inc. |
Low index spacer layer in LED devices
|
US8877524B2
(en)
*
|
2008-03-31 |
2014-11-04 |
Cree, Inc. |
Emission tuning methods and devices fabricated utilizing methods
|
US7859000B2
(en)
*
|
2008-04-10 |
2010-12-28 |
Cree, Inc. |
LEDs using single crystalline phosphor and methods of fabricating same
|
US9287469B2
(en)
|
2008-05-02 |
2016-03-15 |
Cree, Inc. |
Encapsulation for phosphor-converted white light emitting diode
|
US8232558B2
(en)
|
2008-05-21 |
2012-07-31 |
Cree, Inc. |
Junction barrier Schottky diodes with current surge capability
|
WO2009148543A2
(en)
*
|
2008-05-29 |
2009-12-10 |
Cree, Inc. |
Light source with near field mixing
|
US20090311381A1
(en)
*
|
2008-06-11 |
2009-12-17 |
Gardner Susanne |
Beverages composed of wine components
|
US8384115B2
(en)
*
|
2008-08-01 |
2013-02-26 |
Cree, Inc. |
Bond pad design for enhancing light extraction from LED chips
|
US9425172B2
(en)
*
|
2008-10-24 |
2016-08-23 |
Cree, Inc. |
Light emitter array
|
US8858032B2
(en)
|
2008-10-24 |
2014-10-14 |
Cree, Inc. |
Lighting device, heat transfer structure and heat transfer element
|
SE537049C2
(sv)
*
|
2008-12-08 |
2014-12-16 |
Ii Vi Inc |
Process och apparat för tillväxt via axiell gradienttransport (AGT) nyttjande resistiv uppvärmning
|
US8017963B2
(en)
|
2008-12-08 |
2011-09-13 |
Cree, Inc. |
Light emitting diode with a dielectric mirror having a lateral configuration
|
US7897419B2
(en)
|
2008-12-23 |
2011-03-01 |
Cree, Inc. |
Color correction for wafer level white LEDs
|
US7923739B2
(en)
|
2009-06-05 |
2011-04-12 |
Cree, Inc. |
Solid state lighting device
|
US8598602B2
(en)
|
2009-01-12 |
2013-12-03 |
Cree, Inc. |
Light emitting device packages with improved heat transfer
|
US10431567B2
(en)
|
2010-11-03 |
2019-10-01 |
Cree, Inc. |
White ceramic LED package
|
US8368112B2
(en)
|
2009-01-14 |
2013-02-05 |
Cree Huizhou Opto Limited |
Aligned multiple emitter package
|
US8083384B2
(en)
|
2009-02-02 |
2011-12-27 |
Teledyne Technologies Incorporated |
Efficient illumination device for aircraft
|
EP2411569B1
(de)
|
2009-03-26 |
2021-09-22 |
II-VI Incorporated |
Verfahren und vorrichtung für sic-einzelkristall-sublimationszüchtung
|
US9093293B2
(en)
|
2009-04-06 |
2015-07-28 |
Cree, Inc. |
High voltage low current surface emitting light emitting diode
|
US8476668B2
(en)
*
|
2009-04-06 |
2013-07-02 |
Cree, Inc. |
High voltage low current surface emitting LED
|
US8741715B2
(en)
*
|
2009-04-29 |
2014-06-03 |
Cree, Inc. |
Gate electrodes for millimeter-wave operation and methods of fabrication
|
US8294507B2
(en)
|
2009-05-08 |
2012-10-23 |
Cree, Inc. |
Wide bandgap bipolar turn-off thyristor having non-negative temperature coefficient and related control circuits
|
US9035328B2
(en)
|
2011-02-04 |
2015-05-19 |
Cree, Inc. |
Light-emitting diode component
|
US8629509B2
(en)
*
|
2009-06-02 |
2014-01-14 |
Cree, Inc. |
High voltage insulated gate bipolar transistors with minority carrier diverter
|
US8193848B2
(en)
|
2009-06-02 |
2012-06-05 |
Cree, Inc. |
Power switching devices having controllable surge current capabilities
|
US8304783B2
(en)
|
2009-06-03 |
2012-11-06 |
Cree, Inc. |
Schottky diodes including polysilicon having low barrier heights and methods of fabricating the same
|
US8686445B1
(en)
|
2009-06-05 |
2014-04-01 |
Cree, Inc. |
Solid state lighting devices and methods
|
US9111778B2
(en)
|
2009-06-05 |
2015-08-18 |
Cree, Inc. |
Light emitting diode (LED) devices, systems, and methods
|
US8860043B2
(en)
|
2009-06-05 |
2014-10-14 |
Cree, Inc. |
Light emitting device packages, systems and methods
|
US8415692B2
(en)
|
2009-07-06 |
2013-04-09 |
Cree, Inc. |
LED packages with scattering particle regions
|
US8541787B2
(en)
*
|
2009-07-15 |
2013-09-24 |
Cree, Inc. |
High breakdown voltage wide band-gap MOS-gated bipolar junction transistors with avalanche capability
|
US8105889B2
(en)
|
2009-07-27 |
2012-01-31 |
Cree, Inc. |
Methods of fabricating transistors including self-aligned gate electrodes and source/drain regions
|
US8598809B2
(en)
*
|
2009-08-19 |
2013-12-03 |
Cree, Inc. |
White light color changing solid state lighting and methods
|
US8354690B2
(en)
|
2009-08-31 |
2013-01-15 |
Cree, Inc. |
Solid-state pinch off thyristor circuits
|
US9362459B2
(en)
*
|
2009-09-02 |
2016-06-07 |
United States Department Of Energy |
High reflectivity mirrors and method for making same
|
WO2011034850A1
(en)
*
|
2009-09-15 |
2011-03-24 |
Ii-Vi Incorporated |
Sublimation growth of sic single crystals
|
US9312343B2
(en)
|
2009-10-13 |
2016-04-12 |
Cree, Inc. |
Transistors with semiconductor interconnection layers and semiconductor channel layers of different semiconductor materials
|
US8511851B2
(en)
|
2009-12-21 |
2013-08-20 |
Cree, Inc. |
High CRI adjustable color temperature lighting devices
|
US8350370B2
(en)
*
|
2010-01-29 |
2013-01-08 |
Cree Huizhou Opto Limited |
Wide angle oval light emitting diode package
|
US8563372B2
(en)
*
|
2010-02-11 |
2013-10-22 |
Cree, Inc. |
Methods of forming contact structures including alternating metal and silicon layers and related devices
|
US9214352B2
(en)
|
2010-02-11 |
2015-12-15 |
Cree, Inc. |
Ohmic contact to semiconductor device
|
US9548206B2
(en)
|
2010-02-11 |
2017-01-17 |
Cree, Inc. |
Ohmic contact structure for group III nitride semiconductor device having improved surface morphology and well-defined edge features
|
US9468070B2
(en)
|
2010-02-16 |
2016-10-11 |
Cree Inc. |
Color control of light emitting devices and applications thereof
|
US9117739B2
(en)
|
2010-03-08 |
2015-08-25 |
Cree, Inc. |
Semiconductor devices with heterojunction barrier regions and methods of fabricating same
|
US9105824B2
(en)
|
2010-04-09 |
2015-08-11 |
Cree, Inc. |
High reflective board or substrate for LEDs
|
US9012938B2
(en)
|
2010-04-09 |
2015-04-21 |
Cree, Inc. |
High reflective substrate of light emitting devices with improved light output
|
US8901583B2
(en)
|
2010-04-12 |
2014-12-02 |
Cree Huizhou Opto Limited |
Surface mount device thin package
|
US8415671B2
(en)
|
2010-04-16 |
2013-04-09 |
Cree, Inc. |
Wide band-gap MOSFETs having a heterojunction under gate trenches thereof and related methods of forming such devices
|
US8329482B2
(en)
|
2010-04-30 |
2012-12-11 |
Cree, Inc. |
White-emitting LED chips and method for making same
|
US8269244B2
(en)
|
2010-06-28 |
2012-09-18 |
Cree, Inc. |
LED package with efficient, isolated thermal path
|
US8648359B2
(en)
|
2010-06-28 |
2014-02-11 |
Cree, Inc. |
Light emitting devices and methods
|
WO2012005771A2
(en)
|
2010-07-06 |
2012-01-12 |
Cree, Inc. |
Compact optically efficient solid state light source with integrated thermal management
|
USD643819S1
(en)
|
2010-07-16 |
2011-08-23 |
Cree, Inc. |
Package for light emitting diode (LED) lighting
|
US10546846B2
(en)
|
2010-07-23 |
2020-01-28 |
Cree, Inc. |
Light transmission control for masking appearance of solid state light sources
|
US9831393B2
(en)
|
2010-07-30 |
2017-11-28 |
Cree Hong Kong Limited |
Water resistant surface mount device package
|
US8764224B2
(en)
|
2010-08-12 |
2014-07-01 |
Cree, Inc. |
Luminaire with distributed LED sources
|
US9627361B2
(en)
|
2010-10-07 |
2017-04-18 |
Cree, Inc. |
Multiple configuration light emitting devices and methods
|
US8455882B2
(en)
|
2010-10-15 |
2013-06-04 |
Cree, Inc. |
High efficiency LEDs
|
US9249952B2
(en)
|
2010-11-05 |
2016-02-02 |
Cree, Inc. |
Multi-configurable, high luminous output light fixture systems, devices and methods
|
USD712850S1
(en)
|
2010-11-18 |
2014-09-09 |
Cree, Inc. |
Light emitter device
|
USD707192S1
(en)
|
2010-11-18 |
2014-06-17 |
Cree, Inc. |
Light emitting device
|
USD721339S1
(en)
|
2010-12-03 |
2015-01-20 |
Cree, Inc. |
Light emitter device
|
US8564000B2
(en)
|
2010-11-22 |
2013-10-22 |
Cree, Inc. |
Light emitting devices for light emitting diodes (LEDs)
|
US9490235B2
(en)
|
2010-11-22 |
2016-11-08 |
Cree, Inc. |
Light emitting devices, systems, and methods
|
US8575639B2
(en)
|
2011-02-16 |
2013-11-05 |
Cree, Inc. |
Light emitting devices for light emitting diodes (LEDs)
|
US8624271B2
(en)
|
2010-11-22 |
2014-01-07 |
Cree, Inc. |
Light emitting devices
|
US20150062915A1
(en)
|
2013-09-05 |
2015-03-05 |
Cree, Inc. |
Light emitting diode devices and methods with reflective material for increased light output
|
US9300062B2
(en)
|
2010-11-22 |
2016-03-29 |
Cree, Inc. |
Attachment devices and methods for light emitting devices
|
US10267506B2
(en)
|
2010-11-22 |
2019-04-23 |
Cree, Inc. |
Solid state lighting apparatuses with non-uniformly spaced emitters for improved heat distribution, system having the same, and methods having the same
|
US9000470B2
(en)
|
2010-11-22 |
2015-04-07 |
Cree, Inc. |
Light emitter devices
|
US9240395B2
(en)
|
2010-11-30 |
2016-01-19 |
Cree Huizhou Opto Limited |
Waterproof surface mount device package and method
|
USD706231S1
(en)
|
2010-12-03 |
2014-06-03 |
Cree, Inc. |
Light emitting device
|
US9822951B2
(en)
|
2010-12-06 |
2017-11-21 |
Cree, Inc. |
LED retrofit lens for fluorescent tube
|
US10309627B2
(en)
|
2012-11-08 |
2019-06-04 |
Cree, Inc. |
Light fixture retrofit kit with integrated light bar
|
USD679842S1
(en)
|
2011-01-03 |
2013-04-09 |
Cree, Inc. |
High brightness LED package
|
US8610140B2
(en)
|
2010-12-15 |
2013-12-17 |
Cree, Inc. |
Light emitting diode (LED) packages, systems, devices and related methods
|
US9391247B2
(en)
|
2010-12-16 |
2016-07-12 |
Cree, Inc. |
High power LEDs with non-polymer material lenses and methods of making the same
|
US9166126B2
(en)
|
2011-01-31 |
2015-10-20 |
Cree, Inc. |
Conformally coated light emitting devices and methods for providing the same
|
TW201251140A
(en)
|
2011-01-31 |
2012-12-16 |
Cree Inc |
High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
|
US9786811B2
(en)
|
2011-02-04 |
2017-10-10 |
Cree, Inc. |
Tilted emission LED array
|
US9583681B2
(en)
|
2011-02-07 |
2017-02-28 |
Cree, Inc. |
Light emitter device packages, modules and methods
|
CN103348496A
(zh)
|
2011-02-07 |
2013-10-09 |
克利公司 |
用于发光二极管(led)发光的部件和方法
|
US8809880B2
(en)
|
2011-02-16 |
2014-08-19 |
Cree, Inc. |
Light emitting diode (LED) chips and devices for providing failure mitigation in LED arrays
|
US8455908B2
(en)
|
2011-02-16 |
2013-06-04 |
Cree, Inc. |
Light emitting devices
|
US8729589B2
(en)
|
2011-02-16 |
2014-05-20 |
Cree, Inc. |
High voltage array light emitting diode (LED) devices and fixtures
|
USD702653S1
(en)
|
2011-10-26 |
2014-04-15 |
Cree, Inc. |
Light emitting device component
|
US8922108B2
(en)
|
2011-03-01 |
2014-12-30 |
Cree, Inc. |
Remote component devices, systems, and methods for use with light emitting devices
|
US10147853B2
(en)
|
2011-03-18 |
2018-12-04 |
Cree, Inc. |
Encapsulant with index matched thixotropic agent
|
US8680556B2
(en)
|
2011-03-24 |
2014-03-25 |
Cree, Inc. |
Composite high reflectivity layer
|
US9263636B2
(en)
|
2011-05-04 |
2016-02-16 |
Cree, Inc. |
Light-emitting diode (LED) for achieving an asymmetric light output
|
US9029945B2
(en)
|
2011-05-06 |
2015-05-12 |
Cree, Inc. |
Field effect transistor devices with low source resistance
|
US9142662B2
(en)
|
2011-05-06 |
2015-09-22 |
Cree, Inc. |
Field effect transistor devices with low source resistance
|
KR20120128506A
(ko)
*
|
2011-05-17 |
2012-11-27 |
엘지이노텍 주식회사 |
종자정 부착 장치
|
US8777455B2
(en)
|
2011-06-23 |
2014-07-15 |
Cree, Inc. |
Retroreflective, multi-element design for a solid state directional lamp
|
US8757840B2
(en)
|
2011-06-23 |
2014-06-24 |
Cree, Inc. |
Solid state retroreflective directional lamp
|
US8616724B2
(en)
|
2011-06-23 |
2013-12-31 |
Cree, Inc. |
Solid state directional lamp including retroreflective, multi-element directional lamp optic
|
US8777463B2
(en)
|
2011-06-23 |
2014-07-15 |
Cree, Inc. |
Hybrid solid state emitter printed circuit board for use in a solid state directional lamp
|
US10243121B2
(en)
|
2011-06-24 |
2019-03-26 |
Cree, Inc. |
High voltage monolithic LED chip with improved reliability
|
US8686429B2
(en)
|
2011-06-24 |
2014-04-01 |
Cree, Inc. |
LED structure with enhanced mirror reflectivity
|
US9728676B2
(en)
|
2011-06-24 |
2017-08-08 |
Cree, Inc. |
High voltage monolithic LED chip
|
KR20130002616A
(ko)
*
|
2011-06-29 |
2013-01-08 |
에스케이이노베이션 주식회사 |
탄화규소 단결정 성장 장치 및 그 방법
|
USD700584S1
(en)
|
2011-07-06 |
2014-03-04 |
Cree, Inc. |
LED component
|
US10842016B2
(en)
|
2011-07-06 |
2020-11-17 |
Cree, Inc. |
Compact optically efficient solid state light source with integrated thermal management
|
US10211380B2
(en)
|
2011-07-21 |
2019-02-19 |
Cree, Inc. |
Light emitting devices and components having improved chemical resistance and related methods
|
US10686107B2
(en)
|
2011-07-21 |
2020-06-16 |
Cree, Inc. |
Light emitter devices and components with improved chemical resistance and related methods
|
CN103782402B
(zh)
|
2011-07-21 |
2017-12-01 |
克利公司 |
用于改进的化学抗性的发光体器件封装、部件和方法、以及相关方法
|
US8558252B2
(en)
|
2011-08-26 |
2013-10-15 |
Cree, Inc. |
White LEDs with emission wavelength correction
|
CN103782403B
(zh)
|
2011-09-06 |
2017-06-30 |
克利公司 |
具有改进的引线接合的光发射器封装件和装置及相关方法
|
US8664665B2
(en)
|
2011-09-11 |
2014-03-04 |
Cree, Inc. |
Schottky diode employing recesses for elements of junction barrier array
|
US9640617B2
(en)
|
2011-09-11 |
2017-05-02 |
Cree, Inc. |
High performance power module
|
US8680587B2
(en)
|
2011-09-11 |
2014-03-25 |
Cree, Inc. |
Schottky diode
|
CN103918079B
(zh)
|
2011-09-11 |
2017-10-31 |
科锐 |
包括具有改进布局的晶体管的高电流密度功率模块
|
US9373617B2
(en)
|
2011-09-11 |
2016-06-21 |
Cree, Inc. |
High current, low switching loss SiC power module
|
US8618582B2
(en)
|
2011-09-11 |
2013-12-31 |
Cree, Inc. |
Edge termination structure employing recesses for edge termination elements
|
US8957440B2
(en)
|
2011-10-04 |
2015-02-17 |
Cree, Inc. |
Light emitting devices with low packaging factor
|
USD705181S1
(en)
|
2011-10-26 |
2014-05-20 |
Cree, Inc. |
Light emitting device component
|
US10043960B2
(en)
|
2011-11-15 |
2018-08-07 |
Cree, Inc. |
Light emitting diode (LED) packages and related methods
|
US8564004B2
(en)
|
2011-11-29 |
2013-10-22 |
Cree, Inc. |
Complex primary optics with intermediate elements
|
US9496466B2
(en)
|
2011-12-06 |
2016-11-15 |
Cree, Inc. |
Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction
|
US9786825B2
(en)
|
2012-02-07 |
2017-10-10 |
Cree, Inc. |
Ceramic-based light emitting diode (LED) devices, components, and methods
|
US9806246B2
(en)
|
2012-02-07 |
2017-10-31 |
Cree, Inc. |
Ceramic-based light emitting diode (LED) devices, components, and methods
|
US8895998B2
(en)
|
2012-03-30 |
2014-11-25 |
Cree, Inc. |
Ceramic-based light emitting diode (LED) devices, components and methods
|
US9240530B2
(en)
|
2012-02-13 |
2016-01-19 |
Cree, Inc. |
Light emitter devices having improved chemical and physical resistance and related methods
|
US9343441B2
(en)
|
2012-02-13 |
2016-05-17 |
Cree, Inc. |
Light emitter devices having improved light output and related methods
|
JP5799846B2
(ja)
*
|
2012-02-14 |
2015-10-28 |
住友電気工業株式会社 |
炭化珪素単結晶の製造方法および製造装置
|
US10020244B2
(en)
|
2012-03-27 |
2018-07-10 |
Cree, Inc. |
Polymer via plugs with high thermal integrity
|
US10222032B2
(en)
|
2012-03-30 |
2019-03-05 |
Cree, Inc. |
Light emitter components and methods having improved electrical contacts
|
US10134961B2
(en)
|
2012-03-30 |
2018-11-20 |
Cree, Inc. |
Submount based surface mount device (SMD) light emitter components and methods
|
US9735198B2
(en)
|
2012-03-30 |
2017-08-15 |
Cree, Inc. |
Substrate based light emitter devices, components, and related methods
|
US9538590B2
(en)
|
2012-03-30 |
2017-01-03 |
Cree, Inc. |
Solid state lighting apparatuses, systems, and related methods
|
WO2013151411A1
(en)
|
2012-04-06 |
2013-10-10 |
Cree, Inc. |
Light emitting diode components and methods for emitting a desired light beam pattern
|
US9188290B2
(en)
|
2012-04-10 |
2015-11-17 |
Cree, Inc. |
Indirect linear fixture
|
US8878204B2
(en)
|
2012-05-04 |
2014-11-04 |
Cree, Inc. |
Submount based light emitter components and methods
|
US10439112B2
(en)
|
2012-05-31 |
2019-10-08 |
Cree, Inc. |
Light emitter packages, systems, and methods having improved performance
|
US9349929B2
(en)
|
2012-05-31 |
2016-05-24 |
Cree, Inc. |
Light emitter packages, systems, and methods
|
USD749051S1
(en)
|
2012-05-31 |
2016-02-09 |
Cree, Inc. |
Light emitting diode (LED) package
|
US9590155B2
(en)
|
2012-06-06 |
2017-03-07 |
Cree, Inc. |
Light emitting devices and substrates with improved plating
|
US9685585B2
(en)
|
2012-06-25 |
2017-06-20 |
Cree, Inc. |
Quantum dot narrow-band downconverters for high efficiency LEDs
|
US8860040B2
(en)
|
2012-09-11 |
2014-10-14 |
Dow Corning Corporation |
High voltage power semiconductor devices on SiC
|
US9018639B2
(en)
|
2012-10-26 |
2015-04-28 |
Dow Corning Corporation |
Flat SiC semiconductor substrate
|
US9494304B2
(en)
|
2012-11-08 |
2016-11-15 |
Cree, Inc. |
Recessed light fixture retrofit kit
|
US9482396B2
(en)
|
2012-11-08 |
2016-11-01 |
Cree, Inc. |
Integrated linear light engine
|
US9441818B2
(en)
|
2012-11-08 |
2016-09-13 |
Cree, Inc. |
Uplight with suspended fixture
|
US10788176B2
(en)
|
2013-02-08 |
2020-09-29 |
Ideal Industries Lighting Llc |
Modular LED lighting system
|
US9316382B2
(en)
|
2013-01-31 |
2016-04-19 |
Cree, Inc. |
Connector devices, systems, and related methods for connecting light emitting diode (LED) modules
|
US9738991B2
(en)
|
2013-02-05 |
2017-08-22 |
Dow Corning Corporation |
Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a supporting shelf which permits thermal expansion
|
US9017804B2
(en)
|
2013-02-05 |
2015-04-28 |
Dow Corning Corporation |
Method to reduce dislocations in SiC crystal growth
|
US9797064B2
(en)
|
2013-02-05 |
2017-10-24 |
Dow Corning Corporation |
Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a support shelf which permits thermal expansion
|
US9345091B2
(en)
|
2013-02-08 |
2016-05-17 |
Cree, Inc. |
Light emitting device (LED) light fixture control systems and related methods
|
US8916896B2
(en)
|
2013-02-22 |
2014-12-23 |
Cree, Inc. |
Light emitter components and methods having improved performance
|
US10295124B2
(en)
|
2013-02-27 |
2019-05-21 |
Cree, Inc. |
Light emitter packages and methods
|
US10584860B2
(en)
|
2013-03-14 |
2020-03-10 |
Ideal Industries, Llc |
Linear light fixture with interchangeable light engine unit
|
USD738026S1
(en)
|
2013-03-14 |
2015-09-01 |
Cree, Inc. |
Linear wrap light fixture
|
US9874333B2
(en)
|
2013-03-14 |
2018-01-23 |
Cree, Inc. |
Surface ambient wrap light fixture
|
US9215792B2
(en)
|
2013-03-15 |
2015-12-15 |
Cree, Inc. |
Connector devices, systems, and related methods for light emitter components
|
US8940614B2
(en)
|
2013-03-15 |
2015-01-27 |
Dow Corning Corporation |
SiC substrate with SiC epitaxial film
|
USD733952S1
(en)
|
2013-03-15 |
2015-07-07 |
Cree, Inc. |
Indirect linear fixture
|
US9897267B2
(en)
|
2013-03-15 |
2018-02-20 |
Cree, Inc. |
Light emitter components, systems, and related methods
|
US9431590B2
(en)
|
2013-03-15 |
2016-08-30 |
Cree, Inc. |
Ceramic based light emitting diode (LED) devices and methods
|
USD738542S1
(en)
|
2013-04-19 |
2015-09-08 |
Cree, Inc. |
Light emitting unit
|
US9711489B2
(en)
|
2013-05-29 |
2017-07-18 |
Cree Huizhou Solid State Lighting Company Limited |
Multiple pixel surface mount device package
|
CN110246946B
(zh)
|
2013-06-04 |
2023-04-21 |
科锐Led公司 |
发光二极管介质镜
|
US9679981B2
(en)
|
2013-06-09 |
2017-06-13 |
Cree, Inc. |
Cascode structures for GaN HEMTs
|
US9847411B2
(en)
|
2013-06-09 |
2017-12-19 |
Cree, Inc. |
Recessed field plate transistor structures
|
US9755059B2
(en)
|
2013-06-09 |
2017-09-05 |
Cree, Inc. |
Cascode structures with GaN cap layers
|
CN104241262B
(zh)
|
2013-06-14 |
2020-11-06 |
惠州科锐半导体照明有限公司 |
发光装置以及显示装置
|
USD740453S1
(en)
|
2013-06-27 |
2015-10-06 |
Cree, Inc. |
Light emitter unit
|
USD739565S1
(en)
|
2013-06-27 |
2015-09-22 |
Cree, Inc. |
Light emitter unit
|
US9461024B2
(en)
|
2013-08-01 |
2016-10-04 |
Cree, Inc. |
Light emitter devices and methods for light emitting diode (LED) chips
|
USD758976S1
(en)
|
2013-08-08 |
2016-06-14 |
Cree, Inc. |
LED package
|
KR102245506B1
(ko)
*
|
2013-09-06 |
2021-04-28 |
지티에이티 코포레이션 |
탄화규소 전구체로부터 벌크 탄화규소를 제조하기 위한 방법 및 장치
|
US10900653B2
(en)
|
2013-11-01 |
2021-01-26 |
Cree Hong Kong Limited |
LED mini-linear light engine
|
US10100988B2
(en)
|
2013-12-16 |
2018-10-16 |
Cree, Inc. |
Linear shelf light fixture with reflectors
|
USD750308S1
(en)
|
2013-12-16 |
2016-02-23 |
Cree, Inc. |
Linear shelf light fixture
|
US10612747B2
(en)
|
2013-12-16 |
2020-04-07 |
Ideal Industries Lighting Llc |
Linear shelf light fixture with gap filler elements
|
US10234119B2
(en)
|
2014-03-24 |
2019-03-19 |
Cree, Inc. |
Multiple voltage light emitter packages, systems, and related methods
|
USD757324S1
(en)
|
2014-04-14 |
2016-05-24 |
Cree, Inc. |
Linear shelf light fixture with reflectors
|
US9279192B2
(en)
|
2014-07-29 |
2016-03-08 |
Dow Corning Corporation |
Method for manufacturing SiC wafer fit for integration with power device manufacturing technology
|
USD790486S1
(en)
|
2014-09-30 |
2017-06-27 |
Cree, Inc. |
LED package with truncated encapsulant
|
US9826581B2
(en)
|
2014-12-05 |
2017-11-21 |
Cree, Inc. |
Voltage configurable solid state lighting apparatuses, systems, and related methods
|
US10658546B2
(en)
|
2015-01-21 |
2020-05-19 |
Cree, Inc. |
High efficiency LEDs and methods of manufacturing
|
WO2016126554A1
(en)
|
2015-02-05 |
2016-08-11 |
Dow Corning Corporation |
Furnace for seeded sublimation of wide band gap crystals
|
USD777122S1
(en)
|
2015-02-27 |
2017-01-24 |
Cree, Inc. |
LED package
|
USD783547S1
(en)
|
2015-06-04 |
2017-04-11 |
Cree, Inc. |
LED package
|
RU2603159C1
(ru)
*
|
2015-07-23 |
2016-11-20 |
Федеральное государственное автономное образовательное учреждение высшего образования "Санкт-Петербургский государственный электротехнический университет "ЛЭТИ" им. В.И. Ульянова (Ленина)" (СПбГЭТУ "ЛЭТИ") |
Способ получения монокристаллического sic
|
JP6036946B2
(ja)
*
|
2015-08-26 |
2016-11-30 |
住友電気工業株式会社 |
炭化珪素単結晶の製造方法および製造装置
|
EP3353339A4
(de)
|
2015-09-24 |
2019-05-08 |
Melior Innovations Inc. |
Dampfabscheidungsvorrichtung und verfahren mit hochreinem siliciumcarbid aus polymer
|
USD823492S1
(en)
|
2016-10-04 |
2018-07-17 |
Cree, Inc. |
Light emitting device
|
US10804251B2
(en)
|
2016-11-22 |
2020-10-13 |
Cree, Inc. |
Light emitting diode (LED) devices, components and methods
|
US10672957B2
(en)
|
2017-07-19 |
2020-06-02 |
Cree, Inc. |
LED apparatuses and methods for high lumen output density
|
US11094852B2
(en)
|
2017-08-25 |
2021-08-17 |
Cree Huizhou Solid State Lighting Company Limited |
Multiple LED light source lens design in an integrated package
|
US11056625B2
(en)
|
2018-02-19 |
2021-07-06 |
Creeled, Inc. |
Clear coating for light emitting device exterior having chemical resistance and related methods
|
JP7255089B2
(ja)
*
|
2018-05-25 |
2023-04-11 |
株式会社デンソー |
炭化珪素単結晶製造装置および炭化珪素単結晶の製造方法
|
JP7129856B2
(ja)
*
|
2018-09-06 |
2022-09-02 |
昭和電工株式会社 |
結晶成長装置
|
IT201900000223A1
(it)
*
|
2019-01-09 |
2020-07-09 |
Lpe Spa |
Camera di reazione con elemento rotante e reattore per deposizione di materiale semiconduttore
|
US10923585B2
(en)
|
2019-06-13 |
2021-02-16 |
Cree, Inc. |
High electron mobility transistors having improved contact spacing and/or improved contact vias
|
US10971612B2
(en)
|
2019-06-13 |
2021-04-06 |
Cree, Inc. |
High electron mobility transistors and power amplifiers including said transistors having improved performance and reliability
|
JP7393900B2
(ja)
*
|
2019-09-24 |
2023-12-07 |
一般財団法人電力中央研究所 |
炭化珪素単結晶ウェハ及び炭化珪素単結晶インゴットの製造方法
|
US11257940B2
(en)
|
2020-01-14 |
2022-02-22 |
Cree, Inc. |
Group III HEMT and capacitor that share structural features
|
CN111304746A
(zh)
*
|
2020-03-31 |
2020-06-19 |
福建北电新材料科技有限公司 |
SiC晶体生长装置及方法
|
US11837457B2
(en)
|
2020-09-11 |
2023-12-05 |
Wolfspeed, Inc. |
Packaging for RF transistor amplifiers
|
US11356070B2
(en)
|
2020-06-01 |
2022-06-07 |
Wolfspeed, Inc. |
RF amplifiers having shielded transmission line structures
|
US20210313293A1
(en)
|
2020-04-03 |
2021-10-07 |
Cree, Inc. |
Rf amplifier devices and methods of manufacturing
|
US11769768B2
(en)
|
2020-06-01 |
2023-09-26 |
Wolfspeed, Inc. |
Methods for pillar connection on frontside and passive device integration on backside of die
|
US11228287B2
(en)
|
2020-06-17 |
2022-01-18 |
Cree, Inc. |
Multi-stage decoupling networks integrated with on-package impedance matching networks for RF power amplifiers
|
US11533025B2
(en)
|
2020-06-18 |
2022-12-20 |
Wolfspeed, Inc. |
Integrated doherty amplifier with added isolation between the carrier and the peaking transistors
|
US11581859B2
(en)
|
2020-06-26 |
2023-02-14 |
Wolfspeed, Inc. |
Radio frequency (RF) transistor amplifier packages with improved isolation and lead configurations
|
US11887945B2
(en)
|
2020-09-30 |
2024-01-30 |
Wolfspeed, Inc. |
Semiconductor device with isolation and/or protection structures
|
US20220139852A1
(en)
|
2020-10-30 |
2022-05-05 |
Cree, Inc. |
Transistor packages with improved die attach
|
US12009417B2
(en)
|
2021-05-20 |
2024-06-11 |
Macom Technology Solutions Holdings, Inc. |
High electron mobility transistors having improved performance
|
US12015075B2
(en)
|
2021-05-20 |
2024-06-18 |
Macom Technology Solutions Holdings, Inc. |
Methods of manufacturing high electron mobility transistors having a modified interface region
|
US11842937B2
(en)
|
2021-07-30 |
2023-12-12 |
Wolfspeed, Inc. |
Encapsulation stack for improved humidity performance and related fabrication methods
|
US20230075505A1
(en)
|
2021-09-03 |
2023-03-09 |
Wolfspeed, Inc. |
Metal pillar connection topologies for heterogeneous packaging
|
US20230078017A1
(en)
|
2021-09-16 |
2023-03-16 |
Wolfspeed, Inc. |
Semiconductor device incorporating a substrate recess
|
EP4324961A1
(de)
*
|
2022-08-17 |
2024-02-21 |
SiCrystal GmbH |
Verfahren zur herstellung eines massiven sic-einkristalls mit verbesserter qualität unter verwendung eines sic-impfkristalls mit einer temporären schutzoxidschicht und sic-impfkristall mit schutzoxidschicht
|
US20240105823A1
(en)
|
2022-09-23 |
2024-03-28 |
Wolfspeed, Inc. |
Barrier Structure for Dispersion Reduction in Transistor Devices
|
US20240105824A1
(en)
|
2022-09-23 |
2024-03-28 |
Wolfspeed, Inc. |
Barrier Structure for Sub-100 Nanometer Gate Length Devices
|
US20240120202A1
(en)
|
2022-10-06 |
2024-04-11 |
Wolfspeed, Inc. |
Implanted Regions for Semiconductor Structures with Deep Buried Layers
|
US20240266419A1
(en)
|
2023-02-03 |
2024-08-08 |
Wolfspeed, Inc. |
Semiconductor Device Having Semiconductor Structure with Polarity Inverting Layer
|
US20240266426A1
(en)
|
2023-02-03 |
2024-08-08 |
Wolfspeed, Inc. |
Semiconductor Structure for Improved Radio Frequency Thermal Management
|
US20240304702A1
(en)
|
2023-03-06 |
2024-09-12 |
Wolfspeed, Inc. |
Field Reducing Structures for Nitrogen-Polar Group III-Nitride Semiconductor Devices
|