DE102015103318B4 - Halbleiter-Bauelement mit einer Passivierungsschicht und Verfahren zum Herstellen eines solchen - Google Patents
Halbleiter-Bauelement mit einer Passivierungsschicht und Verfahren zum Herstellen eines solchen Download PDFInfo
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- DE102015103318B4 DE102015103318B4 DE102015103318.6A DE102015103318A DE102015103318B4 DE 102015103318 B4 DE102015103318 B4 DE 102015103318B4 DE 102015103318 A DE102015103318 A DE 102015103318A DE 102015103318 B4 DE102015103318 B4 DE 102015103318B4
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- H01L2924/1032—III-V
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- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/1026—Compound semiconductors
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- H01L2924/1025—Semiconducting materials
- H01L2924/1026—Compound semiconductors
- H01L2924/1032—III-V
- H01L2924/10335—Indium phosphide [InP]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/1025—Semiconducting materials
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- H01L2924/1032—III-V
- H01L2924/10346—Indium gallium nitride [InGaN]
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- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/1026—Compound semiconductors
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- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H01L2924/11—Device type
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- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
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- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
- H10D62/104—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices having particular shapes of the bodies at or near reverse-biased junctions, e.g. having bevels or moats
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- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
- H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]
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- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/112—Constructional design considerations for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layers, e.g. by using channel stoppers
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- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/512—Disposition of the gate electrodes, e.g. buried gates
- H10D64/513—Disposition of the gate electrodes, e.g. buried gates within recesses in the substrate, e.g. trench gates, groove gates or buried gates
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
- Junction Field-Effect Transistors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Bipolar Transistors (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/200,732 US20150255362A1 (en) | 2014-03-07 | 2014-03-07 | Semiconductor Device with a Passivation Layer and Method for Producing Thereof |
| US14/200,732 | 2014-03-07 |
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| DE102015103318A1 DE102015103318A1 (de) | 2015-09-10 |
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| CN (1) | CN104900685B (enExample) |
| DE (1) | DE102015103318B4 (enExample) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017174608A1 (en) * | 2016-04-06 | 2017-10-12 | Abb Schweiz Ag | Semiconductor chip with moisture protection layer |
| CN106252244A (zh) * | 2016-09-22 | 2016-12-21 | 全球能源互联网研究院 | 一种终端钝化方法及半导体功率器件 |
| DE102017100109A1 (de) * | 2017-01-04 | 2018-07-05 | Infineon Technologies Ag | Halbleitervorrichtung und verfahren zum herstellen derselben |
| JP6828472B2 (ja) * | 2017-02-01 | 2021-02-10 | 富士電機株式会社 | 半導体装置 |
| JP6528793B2 (ja) | 2017-02-22 | 2019-06-12 | サンケン電気株式会社 | 半導体装置 |
| JP6558385B2 (ja) * | 2017-02-23 | 2019-08-14 | トヨタ自動車株式会社 | 半導体装置の製造方法 |
| JP6846687B2 (ja) * | 2017-09-12 | 2021-03-24 | パナソニックIpマネジメント株式会社 | 半導体装置およびその製造方法 |
| US10332817B1 (en) * | 2017-12-01 | 2019-06-25 | Cree, Inc. | Semiconductor die with improved ruggedness |
| DE102019100130B4 (de) * | 2018-04-10 | 2021-11-04 | Infineon Technologies Ag | Ein halbleiterbauelement und ein verfahren zum bilden eines halbleiterbauelements |
| DE102019131238B4 (de) * | 2018-12-06 | 2025-09-18 | Infineon Technologies Ag | Passivierungsstruktur enthaltende halbleitervorrichtung und herstellungsverfahren |
| US10957664B2 (en) * | 2019-05-29 | 2021-03-23 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and manufacturing method thereof |
| US20220189840A1 (en) * | 2020-12-16 | 2022-06-16 | Stmicroelectronics Pte Ltd | Passivation layer for an integrated circuit device that provides a moisture and proton barrier |
| WO2022202088A1 (ja) * | 2021-03-26 | 2022-09-29 | ローム株式会社 | 半導体装置 |
| CN113921588A (zh) * | 2021-09-01 | 2022-01-11 | 格力电器(合肥)有限公司 | 半导体器件及其制备方法 |
| JPWO2023067925A1 (enExample) * | 2021-10-21 | 2023-04-27 | ||
| DE102024203635A1 (de) * | 2024-04-18 | 2025-10-23 | Infineon Technologies Ag | Halbleiterchip und verfahren zum herstellen desselben |
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2015
- 2015-03-05 JP JP2015043280A patent/JP2015170857A/ja active Pending
- 2015-03-06 CN CN201510099304.2A patent/CN104900685B/zh active Active
- 2015-03-06 DE DE102015103318.6A patent/DE102015103318B4/de active Active
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2017
- 2017-08-04 JP JP2017151588A patent/JP6691076B2/ja active Active
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2019
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2021
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| US6544904B1 (en) | 2001-12-17 | 2003-04-08 | Ryoden Semiconductor System Engineering Corporation | Method of manufacturing semiconductor device |
| US20060220081A1 (en) | 2005-03-30 | 2006-10-05 | Fujitsu Limited | Semiconductor device and manufacturing method of the same |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20190252282A1 (en) | 2019-08-15 |
| JP2017224838A (ja) | 2017-12-21 |
| JP2015170857A (ja) | 2015-09-28 |
| DE102015103318A1 (de) | 2015-09-10 |
| CN104900685B (zh) | 2019-10-22 |
| US11158557B2 (en) | 2021-10-26 |
| US20220005742A1 (en) | 2022-01-06 |
| CN104900685A (zh) | 2015-09-09 |
| JP6691076B2 (ja) | 2020-04-28 |
| US20150255362A1 (en) | 2015-09-10 |
| US11854926B2 (en) | 2023-12-26 |
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