JP2014011342A - 炭化珪素半導体装置 - Google Patents
炭化珪素半導体装置 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 63
- 229910010271 silicon carbide Inorganic materials 0.000 title claims description 52
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims description 46
- 238000002161 passivation Methods 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 8
- 230000006866 deterioration Effects 0.000 abstract description 9
- 239000012212 insulator Substances 0.000 abstract 4
- 230000000644 propagated effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 15
- 239000010936 titanium Substances 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 7
- 229910052719 titanium Inorganic materials 0.000 description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- -1 but in addition Chemical compound 0.000 description 1
- 238000004883 computer application Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
- H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
- H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
- H01L2224/02165—Reinforcing structures
- H01L2224/02166—Collar structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12032—Schottky diode
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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Abstract
【解決手段】絶縁膜3をSiC半導体装置を構成するチップの端部まで形成しつつ、絶縁膜3のうちパッシベーション膜6にて覆われている部分にセル領域を囲む溝部3bを形成する。これにより、ダイシング時に絶縁膜3を切断してクラックが発生したとしても、クラックが溝部3bによって堰き止められ、それよりも内側には伝わらないようにできる。このため、絶縁膜3をチップ端部まで形成し、SiC表面が露出しないようにして沿面放電を抑制できる構造にしたときにも、半導体素子の特性劣化を招かないようにできる。
【選択図】図3
Description
本発明の第1実施形態にかかるSiC半導体装置について、図1および図2を参照して説明する。
本発明の第2実施形態について説明する。本実施形態のSiC半導体装置は、第1実施形態に対して絶縁膜3に発生するクラックを堰き止める構造を変更したものであり、その他に関しては第1実施形態と同様であるため、第1実施形態と異なる部分についてのみ説明する。
また、上記実施形態では、半導体素子としてSBDを備えたSiC半導体装置を例に挙げて説明したが、他の半導体素子、例えばMOSFET、IGBTなどを備えたSiC半導体装置に対しても、本発明を適用することができる。すなわち、SiCにて構成された半導体基板のセル領域に半導体素子が形成され、セル領域を囲むようにパッシベーション膜6が備えられたSiC半導体装置に対して本発明を適用できる。
1a 主表面
1b 裏面
2 n-型ドリフト層
3 絶縁膜
3b 溝部
4 ショットキー電極
5 オーミック電極
6 パッシベーション膜
7 絶縁膜
Claims (3)
- 炭化珪素にて構成され、チップ単位に分割された半導体基板(1、2)と、
前記半導体基板のセル領域に形成された半導体素子と、
前記半導体基板の表面において、前記セル領域を囲みつつ、前記半導体基板の端部まで形成された第1絶縁膜(3)と、
前記第1絶縁膜上に形成され、前記セル領域の外周を囲むように配置されたパッシベーション膜(6)と、を有し、
前記第1絶縁膜(3)には、前記パッシベーション膜(6)に覆われた部分において、該第1絶縁膜(3)を前記セル領域側となる内側と前記セル領域と反対側となる外側とに分離する溝部(3b)が形成されていることを特徴とする炭化珪素半導体装置。 - 前記溝部(3b)は、前記セル領域の周囲を全周囲むように形成されていることを特徴とする請求項1に記載の炭化珪素半導体装置。
- 前記溝部(3b)内には、前記第1絶縁膜を構成する材料とは異なる材料で構成された第2絶縁膜(7)が備えられていることを特徴とする請求項1または2に記載の炭化珪素半導体装置。
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016042667A1 (ja) * | 2014-09-19 | 2016-03-24 | 三菱電機株式会社 | 半導体装置の製造方法 |
WO2016080102A1 (ja) * | 2014-11-19 | 2016-05-26 | 住友電気工業株式会社 | 炭化珪素半導体装置の製造方法 |
WO2017009964A1 (ja) * | 2015-07-15 | 2017-01-19 | 三菱電機株式会社 | 半導体装置の製造方法 |
JP2017224838A (ja) * | 2014-03-07 | 2017-12-21 | インフィネオン テクノロジーズ アーゲーInfineon Technologies Ag | パッシベーション層を有する半導体素子およびその生産方法 |
EP3144975A4 (en) * | 2014-05-16 | 2018-03-14 | Rohm Co., Ltd. | Semiconductor device |
JP2018107378A (ja) * | 2016-12-28 | 2018-07-05 | 昭和電工株式会社 | 炭化珪素半導体装置とその製造方法、炭化珪素半導体の酸化膜の形成方法 |
CN108493259A (zh) * | 2018-06-01 | 2018-09-04 | 淄博汉林半导体有限公司 | 一种结势垒肖特基二极管及制造方法 |
CN108550631A (zh) * | 2018-06-01 | 2018-09-18 | 淄博汉林半导体有限公司 | 一种沟槽式mos势垒肖特基二极管及制造方法 |
DE112018001989T5 (de) | 2017-04-14 | 2019-12-24 | Mitsubishi Electric Corporation | Siliciumcarbid-halbleitereinheit, elektrische leistungswandlungseinheit, verfahren zur herstellung einer siliciumcarbid-halbleitereinheit sowie verfahren zur herstellung einer elektrischen leistungswandlungseinheit |
US11749620B2 (en) | 2019-05-14 | 2023-09-05 | Denso Corporation | Semiconductor module |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005260059A (ja) * | 2004-03-12 | 2005-09-22 | Renesas Technology Corp | 半導体装置、半導体ウェハおよび半導体装置の製造方法 |
WO2008126268A1 (ja) * | 2007-03-30 | 2008-10-23 | Fujitsu Microelectronics Limited | 半導体装置 |
JP2009231321A (ja) * | 2008-03-19 | 2009-10-08 | Denso Corp | 炭化珪素半導体装置およびその製造方法 |
JP2011014605A (ja) * | 2009-06-30 | 2011-01-20 | Sanyo Electric Co Ltd | 半導体装置およびその製造方法 |
JP2013191632A (ja) * | 2012-03-12 | 2013-09-26 | Rohm Co Ltd | 半導体装置および半導体装置の製造方法 |
-
2012
- 2012-06-29 JP JP2012147457A patent/JP2014011342A/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005260059A (ja) * | 2004-03-12 | 2005-09-22 | Renesas Technology Corp | 半導体装置、半導体ウェハおよび半導体装置の製造方法 |
WO2008126268A1 (ja) * | 2007-03-30 | 2008-10-23 | Fujitsu Microelectronics Limited | 半導体装置 |
JP2009231321A (ja) * | 2008-03-19 | 2009-10-08 | Denso Corp | 炭化珪素半導体装置およびその製造方法 |
JP2011014605A (ja) * | 2009-06-30 | 2011-01-20 | Sanyo Electric Co Ltd | 半導体装置およびその製造方法 |
JP2013191632A (ja) * | 2012-03-12 | 2013-09-26 | Rohm Co Ltd | 半導体装置および半導体装置の製造方法 |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017224838A (ja) * | 2014-03-07 | 2017-12-21 | インフィネオン テクノロジーズ アーゲーInfineon Technologies Ag | パッシベーション層を有する半導体素子およびその生産方法 |
US11158557B2 (en) | 2014-03-07 | 2021-10-26 | Infineon Technologies Ag | Semiconductor device with a passivation layer and method for producing thereof |
US11854926B2 (en) | 2014-03-07 | 2023-12-26 | Infineon Technologies Ag | Semiconductor device with a passivation layer and method for producing thereof |
EP3783667A1 (en) * | 2014-05-16 | 2021-02-24 | Rohm Co., Ltd. | Semiconductor device |
US10692978B2 (en) | 2014-05-16 | 2020-06-23 | Rohm Co., Ltd. | SiC semiconductor device with insulating film and organic insulating layer |
EP3144975A4 (en) * | 2014-05-16 | 2018-03-14 | Rohm Co., Ltd. | Semiconductor device |
JPWO2016042667A1 (ja) * | 2014-09-19 | 2017-06-01 | 三菱電機株式会社 | 半導体装置の製造方法 |
US9881818B2 (en) | 2014-09-19 | 2018-01-30 | Mitsubishi Electric Corporation | Method for manufacturing semiconductor device |
WO2016042667A1 (ja) * | 2014-09-19 | 2016-03-24 | 三菱電機株式会社 | 半導体装置の製造方法 |
KR101900631B1 (ko) | 2014-09-19 | 2018-09-19 | 미쓰비시덴키 가부시키가이샤 | 반도체 장치의 제조 방법 |
CN107004588A (zh) * | 2014-11-19 | 2017-08-01 | 住友电气工业株式会社 | 制造碳化硅半导体装置的方法 |
US10056247B2 (en) | 2014-11-19 | 2018-08-21 | Sumitomo Electric Industries, Ltd. | Method of manufacturing silicon carbide semiconductor device |
JP2016100412A (ja) * | 2014-11-19 | 2016-05-30 | 住友電気工業株式会社 | 炭化珪素半導体装置の製造方法 |
WO2016080102A1 (ja) * | 2014-11-19 | 2016-05-26 | 住友電気工業株式会社 | 炭化珪素半導体装置の製造方法 |
JPWO2017009964A1 (ja) * | 2015-07-15 | 2017-11-09 | 三菱電機株式会社 | 半導体装置の製造方法 |
WO2017009964A1 (ja) * | 2015-07-15 | 2017-01-19 | 三菱電機株式会社 | 半導体装置の製造方法 |
JP2018107378A (ja) * | 2016-12-28 | 2018-07-05 | 昭和電工株式会社 | 炭化珪素半導体装置とその製造方法、炭化珪素半導体の酸化膜の形成方法 |
US10804360B2 (en) | 2017-04-14 | 2020-10-13 | Mitsubishi Electric Corporation | Silicon carbide semiconductor device, electric power conversion device, method for producing silicon carbide semiconductor device, and method for producing electric power conversion device |
DE112018001989T5 (de) | 2017-04-14 | 2019-12-24 | Mitsubishi Electric Corporation | Siliciumcarbid-halbleitereinheit, elektrische leistungswandlungseinheit, verfahren zur herstellung einer siliciumcarbid-halbleitereinheit sowie verfahren zur herstellung einer elektrischen leistungswandlungseinheit |
DE112018001989B4 (de) | 2017-04-14 | 2022-12-01 | Mitsubishi Electric Corporation | Siliciumcarbid-halbleitereinheit, elektrische leistungswandlungseinheit, verfahren zur herstellung einer siliciumcarbid-halbleitereinheit sowie verfahren zur herstellung einer elektrischen leistungswandlungseinheit |
CN108550631A (zh) * | 2018-06-01 | 2018-09-18 | 淄博汉林半导体有限公司 | 一种沟槽式mos势垒肖特基二极管及制造方法 |
CN108493259A (zh) * | 2018-06-01 | 2018-09-04 | 淄博汉林半导体有限公司 | 一种结势垒肖特基二极管及制造方法 |
US11749620B2 (en) | 2019-05-14 | 2023-09-05 | Denso Corporation | Semiconductor module |
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