JP6558385B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 196
- 238000004519 manufacturing process Methods 0.000 title claims description 35
- 239000000758 substrate Substances 0.000 claims description 138
- 238000000034 method Methods 0.000 claims description 49
- 230000002093 peripheral effect Effects 0.000 claims description 34
- 230000000630 rising effect Effects 0.000 claims description 28
- 238000005530 etching Methods 0.000 claims description 15
- 239000003595 mist Substances 0.000 claims description 14
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 claims description 10
- 229910001195 gallium oxide Inorganic materials 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 description 19
- 230000015572 biosynthetic process Effects 0.000 description 18
- 239000000463 material Substances 0.000 description 15
- 239000012535 impurity Substances 0.000 description 14
- 238000005229 chemical vapour deposition Methods 0.000 description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 7
- 230000005684 electric field Effects 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000005468 ion implantation Methods 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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Description
12:半導体基板
12a:半導体基板の上面
12b:半導体基板の下面
14:上面電極
16:ショットキー電極
18:コンタクト電極
18f:フィールドプレート電極
20:絶縁膜
22:保護膜
24:下面電極
32:オーミック接触層
34:ドリフト層
36:高比抵抗層
36c:溝
X:第1範囲
Y:第2範囲
Z:立上り面
Claims (6)
- 半導体装置の製造方法であって、
その上面に第1範囲と前記第1範囲を取り囲む第2範囲とを有するn型の半導体基板であって、前記上面にそれぞれ露出するn型のドリフト層と前記ドリフト層よりもキャリア濃度が低いn型の高比抵抗層とを有し、前記上面において前記高比抵抗層が前記ドリフト層を取り囲んでいるとともに、前記第1範囲と前記第2範囲との境界が前記高比抵抗層上に位置する半導体基板を用意する工程と、
前記半導体基板の前記上面の少なくとも前記第1範囲上に、前記半導体基板の前記上面にショットキー接触するショットキー電極を形成する工程と、
前記半導体基板の前記上面が前記第1範囲において前記第2範囲よりも高く、前記第1範囲と前記第2範囲との間に立上り面が形成され、前記ショットキー電極の外周縁が前記第1範囲上に位置するように、前記半導体基板の前記上面の前記第2範囲をエッチングする工程と、
前記半導体基板の前記上面において前記立上り面に沿って環状に延び、その内周縁が前記ショットキー電極上に位置するとともにその外周縁が前記第2範囲上に位置する絶縁膜を形成する工程と、
前記ショットキー電極と電気的に接続され、前記ショットキー電極の前記外周縁から前記立上り面を経て前記第2範囲に至る範囲において、前記絶縁膜を介して前記半導体基板の前記上面に対向するフィールドプレート電極を形成する工程と、
を備え、
前記用意する工程は、前記ドリフト層をエピタキシャル成長によって形成する工程、前記ドリフト層の一部をエッチングして前記高比抵抗層を形成する位置に溝を形成する工程、及び、前記溝内に、前記高比抵抗層をエピタキシャル成長によって形成する工程を備える、
製造方法。 - 前記半導体基板は、酸化物半導体の基板であって、
前記酸化物半導体は、真空準位を基準として、伝導帯の最低部が−4.0eVよりも低く、かつ、価電子帯の最上部が−6.0eVよりも低い、請求項1に記載の製造方法。 - 前記半導体基板は、酸化ガリウムの基板である、請求項1又は2に記載の製造方法。
- 前記絶縁膜の形成は、ミストCVDによって行われる、請求項1から3のいずれか一項に記載の製造方法。
- 前記ショットキー電極を形成する工程では、前記ショットキー電極が前記第2範囲上にも形成され、
前記第2範囲をエッチングする工程では、前記ショットキー電極のうちの前記第2範囲上に形成された部分も除去される、請求項1から4のいずれか一項に記載の製造方法。 - 前記高比抵抗層の前記エピタキシャル成長は、ミストCVDによって行われる、請求項1から5のいずれか一項に記載の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017032307A JP6558385B2 (ja) | 2017-02-23 | 2017-02-23 | 半導体装置の製造方法 |
US15/867,242 US10418494B2 (en) | 2017-02-23 | 2018-01-10 | Method of manufacturing semiconductor device |
CN201810150819.4A CN108470775B (zh) | 2017-02-23 | 2018-02-13 | 半导体装置的制造方法 |
DE102018104102.0A DE102018104102A1 (de) | 2017-02-23 | 2018-02-23 | Verfahren zur Herrstellung einer Halbleitervorrichtung |
Applications Claiming Priority (1)
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US4674177A (en) * | 1984-12-19 | 1987-06-23 | Eaton Corporation | Method for making an edge junction schottky diode |
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US7973381B2 (en) * | 2003-09-08 | 2011-07-05 | International Rectifier Corporation | Thick field oxide termination for trench schottky device |
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US20150255362A1 (en) * | 2014-03-07 | 2015-09-10 | Infineon Technologies Ag | Semiconductor Device with a Passivation Layer and Method for Producing Thereof |
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