JP6260553B2 - 半導体装置およびその製造方法 - Google Patents
半導体装置およびその製造方法 Download PDFInfo
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- JP6260553B2 JP6260553B2 JP2015037508A JP2015037508A JP6260553B2 JP 6260553 B2 JP6260553 B2 JP 6260553B2 JP 2015037508 A JP2015037508 A JP 2015037508A JP 2015037508 A JP2015037508 A JP 2015037508A JP 6260553 B2 JP6260553 B2 JP 6260553B2
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- electrode
- semiconductor device
- schottky electrode
- schottky
- insulating film
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 24
- 239000010936 titanium Substances 0.000 claims description 20
- 238000001312 dry etching Methods 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 12
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- 239000010703 silicon Substances 0.000 claims description 12
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 11
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 10
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- 229910052719 titanium Inorganic materials 0.000 claims description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 9
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- 239000000377 silicon dioxide Substances 0.000 claims description 6
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
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- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
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- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims description 3
- 229910052741 iridium Inorganic materials 0.000 claims description 3
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- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
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- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 3
- 230000008569 process Effects 0.000 description 57
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- 239000000758 substrate Substances 0.000 description 11
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- 238000005566 electron beam evaporation Methods 0.000 description 9
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- 238000011109 contamination Methods 0.000 description 6
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 5
- 229910000676 Si alloy Inorganic materials 0.000 description 5
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 5
- 229910052801 chlorine Inorganic materials 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 4
- 238000000231 atomic layer deposition Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
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- 229910052751 metal Inorganic materials 0.000 description 4
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- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 3
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- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 238000001039 wet etching Methods 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
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Description
A−1.半導体装置の構成
図1は、第1実施形態における半導体装置100の構成を模式的に示す断面図である。図1には、相互に直交するXYZ軸が図示されている。図1のXYZ軸のうち、X軸は、図1の紙面左から紙面右に向かう軸である。+X軸方向は、紙面右に向かう方向であり、−X軸方向は、紙面左に向かう方向である。図1のXYZ軸のうち、Y軸は、図1の紙面手前から紙面奥に向かう軸である。+Y軸方向は、紙面奥に向かう方向であり、−Y軸方向は、紙面手前に向かう方向である。図1のXYZ軸のうち、Z軸は、図1の紙面下から紙面上に向かう軸である。+Z軸方向は、紙面上に向かう方向であり、−Z軸方向は、紙面下に向かう方向である。図1のXYZ軸は、他の図のXYZ軸に対応する。
図2は、第1実施形態における半導体装置100の製造方法を示す工程図である。半導体装置100の製造者は、基板110の上に半導体層112をエピタキシャル成長によって形成する(工程P110)。本実施形態では、製造者は、有機金属気相成長法(MOCVD)を実現するMOCVD装置を用いたエピタキシャル成長によって、半導体層112を形成する。
図3は、評価試験の試料として用意した半導体装置900の構成を模式的に示す断面図である。試験者は、図1の半導体装置100を試料A1として用意するとともに図3の半導体装置900を試料A2として用意し、各試料についてショットキー障壁高さおよびリーク耐圧を評価した。
上述の実施形態において、基板110の材質は、窒化ガリウム(GaN)に限らず、ケイ素(Si)、サファイア(Al2O3)および炭化ケイ素(SiC)などのいずれであってもよい。
以上説明した第1実施形態によれば、ショットキー電極150ではなく配線電極180によってフィールドプレート構造を実現できる。また、ショットキー電極150を形成した後に絶縁膜160を形成する製造方法を適用できる。これらのことから、ショットキー電極150および絶縁膜160の材料の選択肢を広げながら、逆方向リーク電流を十分に抑制できる。
図6は、第2実施形態における半導体装置100の製造方法を示す工程図である。第2実施形態の半導体装置100は、その製造方法が異なる点を除き、第1実施形態と同様である。
図7は、第3実施形態における半導体装置100の製造方法を示す工程図である。第3実施形態の半導体装置100は、その製造方法が異なる点を除き、第1実施形態と同様である。
図8は、第4実施形態における半導体装置100の製造方法を示す工程図である。第4実施形態の半導体装置100は、その製造方法が異なる点を除き、第1実施形態と同様である。
図9は、第5実施形態における半導体装置100Dの構成を模式的に示す断面図である。半導体装置100Dは、絶縁膜160に代えて絶縁膜160Dを備える点を除き、第1実施形態の半導体装置100と同様である。
図10は、第6実施形態における半導体装置100Eの構成を模式的に示す断面図である。半導体装置100Eは、中間電極152を備える点、絶縁膜160に代えて絶縁膜160Eを備える点、並びに、配線電極180に代えて配線電極180Eを備える点を除き、第1実施形態の半導体装置100と同様である。
図11は、第7実施形態における半導体装置100Fの構成を模式的に示す断面図である。半導体装置100Fは、中間電極154を備える点、並びに、配線電極180に代えて配線電極180Fを備える点を除き、第1実施形態の半導体装置100と同様である。
本発明は、上述の実施形態や実施例、変形例に限られるものではなく、その趣旨を逸脱しない範囲において種々の構成で実現することができる。例えば、発明の概要の欄に記載した各形態中の技術的特徴に対応する実施形態、実施例、変形例中の技術的特徴は、上述の課題の一部または全部を解決するために、あるいは、上述の効果の一部または全部を達成するために、適宜、差し替えや、組み合わせを行うことが可能である。また、その技術的特徴が本明細書中に必須なものとして説明されていなければ、適宜、削除することが可能である。
110…基板
112…半導体層
112m…メサ構造
112p…周囲面
112u…上面
112e…端部
112s…側面
150…ショットキー電極
150e…端部
152…中間電極
152e…端部
154…中間電極
154e…端部
160,160D,160E…絶縁膜
160p…傾斜面
160t…頂点
168,168E…開口部
168e…端部
180,180E,180F…配線電極
190…カソード電極
900…半導体装置
950…ショットキー電極
960…絶縁膜
968…開口部
Claims (15)
- 半導体装置であって、
上面と側面とを有する台地状を成すメサ構造と、前記メサ構造の周囲に広がる周囲面と、を有する半導体層と、
前記上面にショットキー接合されたショットキー電極と、
前記周囲面から前記側面を通じて前記ショットキー電極の上にわたって形成され、前記ショットキー電極の上に開口部を有する絶縁膜と、
前記開口部の内側において前記ショットキー電極と電気的に接続され、前記開口部の内側から、前記絶縁膜の部位のうち前記側面に形成された部位の上を通じて、前記絶縁膜の部位のうち前記周囲面に形成された部分の上にわたって形成された配線電極と
を備え、
前記ショットキー電極は、
前記上面に形成された第1の電極層と、
前記第1の電極層の上に形成された第2の電極層と
を含み、
前記第2の電極層の端部は、前記第1の電極層の端部より内側に位置し、
前記第1の電極層の端部と前記第2の電極層の端部との間の距離は、前記第1の電極層の端部と前記上面の端部との間の距離以上である、半導体装置。 - 更に、前記開口部の内側における前記ショットキー電極の上から前記絶縁膜の上にわたって形成され、前記ショットキー電極と前記配線電極との間を電気的に接続する他の電極を備える請求項1に記載の半導体装置。
- 半導体装置であって、
上面と側面とを有する台地状を成すメサ構造と、前記メサ構造の周囲に広がる周囲面と、を有する半導体層と、
前記上面にショットキー接合されたショットキー電極と、
前記周囲面から前記側面を通じて前記ショットキー電極の上にわたって形成され、前記ショットキー電極の上に開口部を有する絶縁膜と、
前記開口部の内側において前記ショットキー電極と電気的に接続され、前記開口部の内側から、前記絶縁膜の部位のうち前記側面に形成された部位の上を通じて、前記絶縁膜の部位のうち前記周囲面に形成された部分の上にわたって形成された配線電極と
前記開口部の内側における前記ショットキー電極の上から前記絶縁膜の上にわたって形成され、前記ショットキー電極と前記配線電極との間を電気的に接続する他の電極と、
を備える半導体装置。 - 前記ショットキー電極の端部と前記開口部の端部との間の距離は、前記ショットキー電極の端部と前記上面の端部との間の距離以上である、請求項1から請求項3までのいずれか一項に記載の半導体装置。
- 前記絶縁膜は、前記開口部の端部から前記ショットキー電極の端部より外側にわたって広がるとともに前記開口部の内側を向いた傾斜面を、有する、請求項1から請求項4までのいずれか一項に記載の半導体装置。
- 前記ショットキー電極の端部と前記上面の端部との間の距離は、2μm以下である、請求項1から請求項5までのいずれか一項に記載の半導体装置。
- 前記半導体層は、n型半導体層である、請求項1から請求項6までのいずれか一項に記載の半導体装置。
- 前記半導体層は、窒化ガリウム(GaN)、炭化ケイ素(SiC)、ケイ素(Si)およびヒ化ガリウム(GaAs)の少なくとも1つから主に成る、請求項1から請求項7までのいずれか一項に記載の半導体装置。
- 前記ショットキー電極は、ニッケル(Ni)、パラジウム(Pd)、白金(Pt)およびイリジウム(Ir)の少なくとも1つから主に成る、請求項1から請求項8までのいずれか一項に記載の半導体装置。
- 前記配線電極は、アルミニウム(Al)、チタン(Ti)、モリブデン(Mo)、バナジウム(V)、タンタル(Ta)、金(Au)および銅(Cu)の少なくとも1つから主に成る、請求項1から請求項9までのいずれか一項に記載の半導体装置。
- 前記絶縁膜は、二酸化ケイ素(SiO2)、酸化アルミニウム(Al2O3)、窒化ケイ素(SiNx)、酸窒化ケイ素(SiON)、酸窒化ジルコニウム(ZrON)、酸窒化アルミニウム(AlON)、酸化ジルコニウム(ZrO2)および酸化ハフニウム(HfO)の少なくとも1つから主に成る、請求項1から請求項10までのいずれか一項に記載の半導体装置。
- 前記周囲面に対する前記側面の角度は、10°以上90°以下である、請求項1から請求項11までのいずれか一項に記載の半導体装置。
- 前記メサ構造の高さは、0.1μm以上である、請求項1から請求項12までのいずれか一項に記載の半導体装置。
- 半導体装置の製造方法であって、
上面と側面とを有する台地状を成すメサ構造と、前記メサ構造の周囲に広がる周囲面と、を半導体層に形成するとともに、前記上面にショットキー接合されたショットキー電極を形成し、
前記周囲面から前記側面を通じて前記ショットキー電極の上にわたって絶縁膜を形成し、
前記ショットキー電極を露出させる開口部を前記絶縁膜に形成し、
前記開口部の内側において前記ショットキー電極と電気的に接続される配線電極を、前記開口部の内側から、前記絶縁膜の部位のうち前記側面に形成された部位の上を通じて、前記絶縁膜の部位のうち前記周囲面に形成された部分の上にわたって形成する、半導体装置の製造方法。 - 前記メサ構造および前記周囲面を形成する前の半導体層の表面に、前記ショットキー電極の元となる電極層を形成した後、マスクを用いたドライエッチングにより前記電極層と共に前記半導体層を加工することによって、前記ショットキー電極と共に前記メサ構造および前記周囲面を形成する、請求項14に記載の半導体装置の製造方法。
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