JP7258668B2 - 半導体装置、及び、半導体装置の製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims description 54
- 238000000034 method Methods 0.000 title claims description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000010410 layer Substances 0.000 claims description 199
- 239000012535 impurity Substances 0.000 claims description 45
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- 238000005530 etching Methods 0.000 claims description 21
- 238000001465 metallisation Methods 0.000 claims description 17
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 10
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 9
- 238000001312 dry etching Methods 0.000 claims description 7
- 239000002356 single layer Substances 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 229910015844 BCl3 Inorganic materials 0.000 claims 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 claims 1
- 238000002347 injection Methods 0.000 description 22
- 239000007924 injection Substances 0.000 description 22
- 239000000463 material Substances 0.000 description 10
- 230000005684 electric field Effects 0.000 description 7
- 238000002513 implantation Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- 229910002601 GaN Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- H01L29/6606—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
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- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
Description
以下、第1導電型はn型であり、第2導電型はp型である構成を例にして説明する。しかしながらこれに限ったものではなく、第1導電型がp型であり、第2導電型がn型であってもよい。
図4~図9は、本実施の形態1に係る半導体装置の製造方法を説明するための断面図である。なお、以下で説明するパターニングには、例えば、写真製版工程及びエッチング工程などが適宜用いられる。
以上のような本実施の形態1に係る半導体装置によれば、一括してドライエッチングを行うことにより、平面視において、メタライズ層6の第1端部61の位置と、電極7の第2端部71の位置とが同じとなる。このような構成によれば、ウエットエッチングでエッチングする場合に生じていた抉れも残渣を抑制することができるので、半導体装置の信頼性を高めることができる。また、メタライズ層6及び電極7のそれぞれについてパターニングを行わなくても、メタライズ層6の第1端部61の抉れや残渣の影響を抑制することができるので、製造コストを低減することができる。
Claims (6)
- 炭化珪素を含む第1導電型のバッファ層と、
前記バッファ層上に配設され、活性領域と、前記活性領域を囲むインターフェイス領域と、前記インターフェイス領域を囲む終端領域とが規定された、炭化珪素を含む第1導電型のドリフト層と、
前記インターフェイス領域の前記ドリフト層の表面に配設された、第2導電型の第1不純物層と、
前記第1不純物層の表面に配設され、側部及び底部が前記第1不純物層に覆われた、前記第1不純物層よりも不純物濃度が高い第2導電型の第2不純物層と、
前記活性領域側の前記第1不純物層及び前記第2不純物層を露出して、前記終端領域側の前記第1不純物層及び前記第2不純物層上に配設された絶縁層と、
前記絶縁層から露出された前記第1不純物層及び前記第2不純物層上、並びに、前記絶縁層上に直接接して配設された単一層のメタライズ層と、
前記メタライズ層上に配設された単一層の電極と
を備え、
平面視において、前記メタライズ層の前記終端領域側の第1端部の位置と、前記電極の前記終端領域側の第2端部の位置とが同じであり、
前記メタライズ層の厚さはサブミクロンメートルオーダーであり、前記電極の厚さはミクロンメートルオーダーである、半導体装置。 - 請求項1に記載の半導体装置であって、
前記メタライズ層は、チタン、モリブデン、または、タングステンを含む、半導体装置。 - 請求項1または請求項2に記載の半導体装置であって、
平面視において、前記第1端部及び前記第2端部は、前記第2不純物層の前記終端領域側の端部よりも前記活性領域に近い、半導体装置。 - 請求項3に記載の半導体装置であって、
平面視において、前記第1端部及び前記第2端部と、前記第2不純物層の前記終端領域側の端部との間の距離が、0より大きく20μm以下である、半導体装置。 - 炭化珪素を含む第1導電型のバッファ層を準備する工程と、
活性領域と、前記活性領域を囲むインターフェイス領域と、前記インターフェイス領域を囲む終端領域とが規定された、炭化珪素を含む第1導電型のドリフト層を、前記バッファ層上に形成する工程と、
第2導電型の第1不純物層を、前記インターフェイス領域の前記ドリフト層の表面に形成する工程と、
側部及び底部が前記第1不純物層に覆われた、前記第1不純物層よりも不純物濃度が高い第2導電型の第2不純物層を、前記第1不純物層の表面に形成する工程と、
前記活性領域側の前記第1不純物層及び前記第2不純物層を露出する絶縁層を、前記終端領域側の前記第1不純物層及び前記第2不純物層上に形成する工程と、
前記絶縁層及び前記ドリフト層上に、単一層の第1金属膜を直接接して形成し、前記第1金属膜上に単一層の第2金属膜を形成する工程と、
前記第1金属膜及び前記第2金属膜に一括してドライエッチングを行うことにより、平面視において、残存した前記第1金属膜であるメタライズ層の前記終端領域側の第1端部の位置と、残存した前記第2金属膜である電極の前記終端領域側の第2端部の位置とを同じにする工程と
を備え、
前記メタライズ層の厚さはサブミクロンメートルオーダーであり、前記電極の厚さはミクロンメートルオーダーである、半導体装置の製造方法。 - 請求項5に記載の半導体装置の製造方法であって、
前記ドライエッチングのエッチングガスは、BCl3及びCl2を含む、半導体装置の製造方法。
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US16/845,716 US11437465B2 (en) | 2019-06-13 | 2020-04-10 | Semiconductor device and method for manufacturing semiconductor device |
DE102020114810.0A DE102020114810A1 (de) | 2019-06-13 | 2020-06-04 | Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung |
CN202010512859.6A CN112086509A (zh) | 2019-06-13 | 2020-06-08 | 半导体装置及半导体装置的制造方法 |
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