CN1920585B - 基板检查装置 - Google Patents

基板检查装置 Download PDF

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Publication number
CN1920585B
CN1920585B CN2006100802489A CN200610080248A CN1920585B CN 1920585 B CN1920585 B CN 1920585B CN 2006100802489 A CN2006100802489 A CN 2006100802489A CN 200610080248 A CN200610080248 A CN 200610080248A CN 1920585 B CN1920585 B CN 1920585B
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CN
China
Prior art keywords
inspection
substrate
temperature
inspection substrate
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006100802489A
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English (en)
Chinese (zh)
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CN1920585A (zh
Inventor
绪方光
太田宪宏
天川良太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Corp
Nidec Read Corp
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Nidec Corp
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Publication date
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Publication of CN1920585A publication Critical patent/CN1920585A/zh
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Publication of CN1920585B publication Critical patent/CN1920585B/zh
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2817—Environmental-, stress-, or burn-in tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0458—Details related to environmental aspects, e.g. temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
CN2006100802489A 2005-08-25 2006-05-15 基板检查装置 Expired - Fee Related CN1920585B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005245060A JP2007059727A (ja) 2005-08-25 2005-08-25 基板検査装置及び基板検査方法
JP2005-245060 2005-08-25
JP2005245060 2005-08-25
JP2005245065A JP2007057444A (ja) 2005-08-25 2005-08-25 基板検査装置、及び基板検査装置の温度維持機構

Publications (2)

Publication Number Publication Date
CN1920585A CN1920585A (zh) 2007-02-28
CN1920585B true CN1920585B (zh) 2011-08-24

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ID=38099046

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006100802489A Expired - Fee Related CN1920585B (zh) 2005-08-25 2006-05-15 基板检查装置

Country Status (3)

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JP (2) JP2007059727A (ko)
KR (1) KR100827465B1 (ko)
CN (1) CN1920585B (ko)

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CN101413978B (zh) * 2007-10-16 2011-03-23 京元电子股份有限公司 半导体封装组件测试装置
JP5377915B2 (ja) * 2008-09-30 2013-12-25 東京エレクトロン株式会社 検査装置及び検査方法
KR101011457B1 (ko) * 2009-02-23 2011-01-28 양 전자시스템 주식회사 평판디스플레이 기판의 전기적 특성 시험을 위한 냉각 및 방습 장치
CN101852819B (zh) * 2009-04-02 2013-01-23 名硕电脑(苏州)有限公司 电路板自动热机装置
JP2011075498A (ja) * 2009-10-01 2011-04-14 Mitsubishi Electric Corp 検査装置、及び検査方法
JP5466043B2 (ja) * 2010-02-25 2014-04-09 タツモ株式会社 電子機器に用いられるプリント基板の検査方法及びこれに用いる検査装置
JP2011185746A (ja) * 2010-03-09 2011-09-22 Tatsumo Kk プリント基板の検査方法及びこれに用いる検査装置
CN102651303B (zh) * 2011-05-09 2014-12-10 京东方科技集团股份有限公司 基板温度管控系统及方法
JP5218871B2 (ja) * 2011-08-01 2013-06-26 アキム株式会社 温度特性計測装置
JP2014215062A (ja) * 2013-04-23 2014-11-17 セイコーエプソン株式会社 ハンドラーおよび検査装置
KR101501129B1 (ko) * 2013-08-23 2015-03-12 주식회사 고영테크놀러지 기판 검사 장치
JP2015061049A (ja) 2013-09-20 2015-03-30 日本電産リード株式会社 処理対象物搬送システム、及び基板検査システム
JP5482958B1 (ja) * 2013-11-25 2014-05-07 富士ゼロックス株式会社 検査装置
CN105731068B (zh) * 2014-12-24 2019-05-21 炭研轴封精工有限公司 非接触输送装置和非接触吸附盘
CN104833888B (zh) * 2015-05-27 2018-04-20 芜湖佳宏新材料股份有限公司 加热电缆冷热循环寿命测试设备及测试方法
JP6890921B2 (ja) * 2015-10-21 2021-06-18 株式会社日本マイクロニクス プローブカード及び接触検査装置
JP6617963B2 (ja) * 2016-02-17 2019-12-11 株式会社Ｓｃｒｅｅｎホールディングス 基板保持状態の異常検査の検査領域の自動決定方法および基板処理装置
JP6655516B2 (ja) * 2016-09-23 2020-02-26 東京エレクトロン株式会社 基板検査装置
KR101893831B1 (ko) * 2016-10-20 2018-08-31 주식회사 고영테크놀러지 기판 검사장치 및 이를 이용한 기판 검사방법
JP2018141700A (ja) * 2017-02-28 2018-09-13 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
TWI755492B (zh) * 2017-03-06 2022-02-21 美商卡爾拜斯有限公司 基於碳納米管的熱界面材料及其製造和使用方法
TWI629490B (zh) * 2017-07-07 2018-07-11 鴻勁精密股份有限公司 具下置式冷源輸送裝置之電子元件測試設備
US10948534B2 (en) * 2017-08-28 2021-03-16 Teradyne, Inc. Automated test system employing robotics
US10845410B2 (en) 2017-08-28 2020-11-24 Teradyne, Inc. Automated test system having orthogonal robots
US11226390B2 (en) 2017-08-28 2022-01-18 Teradyne, Inc. Calibration process for an automated test system
JP2019045169A (ja) * 2017-08-30 2019-03-22 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
JP6955989B2 (ja) * 2017-12-13 2021-10-27 東京エレクトロン株式会社 検査装置
US10983145B2 (en) * 2018-04-24 2021-04-20 Teradyne, Inc. System for testing devices inside of carriers
CN109649988A (zh) * 2018-11-30 2019-04-19 格力电器（武汉）有限公司 电加热耐压测试装置
CN110065814A (zh) * 2019-03-07 2019-07-30 安徽奥博智能科技有限公司 半导体三温自动测试生产线
KR102122820B1 (ko) * 2019-04-19 2020-06-15 디플러스(주) 핀 블럭 자가 정렬 장치
KR102294199B1 (ko) * 2019-11-27 2021-08-27 주식회사 탑 엔지니어링 프로브 검사장치 및 프로브 검사방법
KR102294195B1 (ko) * 2019-11-27 2021-08-27 주식회사 탑 엔지니어링 프로브 검사장치 및 프로브 검사방법
KR102294188B1 (ko) * 2019-11-27 2021-08-27 주식회사 탑 엔지니어링 프로브 헤드 및 이를 포함하는 프로브 검사장치
US11953519B2 (en) 2020-10-22 2024-04-09 Teradyne, Inc. Modular automated test system
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system

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CN1601732A (zh) * 2003-09-25 2005-03-30 Smc株式会社 半导体基板的温度调节装置

Also Published As

Publication number Publication date
KR100827465B1 (ko) 2008-05-06
JP2007057444A (ja) 2007-03-08
KR20070024354A (ko) 2007-03-02
JP2007059727A (ja) 2007-03-08
CN1920585A (zh) 2007-02-28

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