CN1910305A - 化学镀预处理剂、利用它的化学镀方法和化学镀产品 - Google Patents

化学镀预处理剂、利用它的化学镀方法和化学镀产品 Download PDF

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CN1910305A
CN1910305A CNA2004800411893A CN200480041189A CN1910305A CN 1910305 A CN1910305 A CN 1910305A CN A2004800411893 A CNA2004800411893 A CN A2004800411893A CN 200480041189 A CN200480041189 A CN 200480041189A CN 1910305 A CN1910305 A CN 1910305A
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河村寿文
铃木准
伊森彻
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Abstract

本发明的目的是提供一种在有机溶剂中稳定可溶的用于化学镀的预处理剂,利用它进行优异粘附的化学镀方法和化学镀产品。使用包含具有5-25个碳原子的脂肪酸的贵金属皂的用于化学镀的预处理剂,或者优选使用还包含咪唑硅烷偶联剂或其它具有金属捕获能力的硅烷偶联剂的用于化学镀的预处理剂预处理待镀物体,接着进行化学镀。贵金属皂优选是钯皂。

Description

化学镀预处理剂、利用它的化学镀方法和化学镀产品
技术领域
本发明涉及一种在有机溶剂中稳定可溶的用于化学镀的预处理剂,利用它进行化学镀的方法和由该化学镀方法得到的产品。
背景技术
常规地,锡和钯的胶体溶液与氯化钯和其它钯化合物的水溶液用作化学镀中的催化剂。这些催化剂的问题在于由于它们使用无机钯化合物,所以当使用具有比水更好的润湿性、优异适应性和可加工性,并且还可溶解例如树脂的其它有机化合物的有机溶剂时,其可溶性差,并且钯会沉淀出,而不能提供均一溶液。带有低级脂肪酸的乙酸钯根据浓度可溶于甲醇,但钯会快速沉淀出。
发明内容
本发明的目的是提供一种可溶于有机溶剂中的用于化学镀的预处理剂;利用它进行优异粘附的化学镀方法和化学镀产品。
本发明人完成本发明是基于发现了由钯化合物或其它贵金属化合物与脂肪酸得到的贵金属皂可稳定溶于有机溶剂中,并且当金属从化学镀液体中沉积出时,保持其催化效果。
也就是说,本发明涉及:
(1)一种用于化学镀的预处理剂,包含具有5-25个碳原子的脂肪酸的贵金属皂;
(2.)根据以上(1)的用于化学镀的预处理剂,还包含分子中具有金属捕获能力的官能团的硅烷偶联剂;
(3)根据以上(2)的用于化学镀的预处理剂,其中硅烷偶联剂是通过将吡咯化合物或胺化合物与环氧硅烷化合物反应得到的硅烷偶联剂;
(4)根据以上(2)或(3)的用于化学镀的预处理剂,其中具有金属捕获能力的官能团是咪唑基;
(5)根据以上(1)-(4)任一项的用于化学镀的预处理剂,其中贵金属皂是钯皂;
(6)根据以上(1)-(5)任一项的用于化学镀的预处理剂,其中贵金属皂是环烷酸钯、新癸酸钯或辛酸钯;
(7)一种含有根据以上(1)-(6)任一项用于化学镀的预处理剂的油墨组合物;
(8)一种化学镀方法,其中用根据以上(1)-(7)任一项的用于化学镀的预处理剂或油墨组合物预处理待镀物体,接着进行化学镀;
(9)根据以上(8)的化学镀方法,其中用油墨组合物的预处理是使用喷墨设备进行喷绘(drawing);
(10)一种通过在物体上进行根据以上(8)或(9)的化学镀方法而获得的化学镀产品。
发明的最佳实施方式
本发明所用的贵金属皂可以通过脂肪酸与贵金属化合物反应得到。
该脂肪酸优选具有5-25个、或更优选8-16个碳原子。如果脂肪酸的碳原子数不大于4,则它在有机溶剂中溶解差,并且不稳定。碳原子数不少于26个是不实用的,因为有机溶剂中可以溶解多少是有上限的,并且由于贵金属含量低,需要加入更多。
上述脂肪酸的例子包括十二烷酸、十八烷酸和其它饱和脂肪酸、油酸、亚油酸和其它不饱和脂肪酸、羟基十四烷酸、羧基癸酸和其它含氧脂肪酸及其混合物。
上述脂肪酸的期望例子包括环烷酸、辛酸、新癸酸、十五烷酸等。
上述贵金属化合物的例子包括能够与脂肪酸形成皂的化合物,它们是在将液体化学镀到待镀物体表面上而沉积铜、镍等中起催化作用的钯、银、铂、金和其它金属的卤化物、氢氧化物、硫酸盐、碳酸盐和其它化合物。钯化合物是特别期望的。
用在本发明中的贵金属皂可以通过制备金属皂的普通方法获得,例如上述脂肪酸与上述贵金属化合物的直接方法或复分解方法。
环烷酸钯是本发明中所用的期望贵金属皂,如下式所示。
[化学式1]
                  n=9-13
             环烷酸钯的结构式
用在本发明中的上述贵金属皂是可溶于有机溶剂中,并且在溶液中稳定。这种有机溶剂的例子包括丁醇、2-乙基己醇、辛醇和其它醇、二甲苯和其它芳烃、己烷和其它脂族烃、氯仿、二氧杂环己烷等。
贵金属皂可以以在预处理剂溶液中为1-30,000mg/l或优选50-10,000mg/l的浓度使用。
除了上述脂肪酸贵金属皂之外,优选地将分子中具有捕获金属能力的官能团的硅烷偶联剂加到本发明的化学镀预处理剂中。这种硅烷偶联剂的加入使得贵金属皂经该硅烷偶联剂而更均匀、更牢固地固定到待镀物体表面上。
使用上述硅烷偶联剂进行处理可以这样来完成:将硅烷偶联剂加到包含贵金属皂的预处理剂中,并用该预处理剂处理待镀物体,或者可以在用贵金属皂处理之前,单独用硅烷偶联剂溶液处理待镀物体。
上述硅烷偶联剂优选通过吡咯化合物或胺化合物与环氧硅烷化合物的反应得到。
吡咯化合物的例子包括咪唑、噁唑、噻唑、硒唑、吡唑、异噁唑、异噻唑、三唑、噁二唑、噻重氮、四唑、噁三唑、噻三唑、bendazole、吲唑、苯并咪唑、苯并三唑等。咪唑灵特别期望的,但这不是限制。
胺化合物的例子包括丙胺和其它饱和烃胺、乙烯基胺和其它不饱和烃胺、苯胺和其它芳胺等。
上述硅烷偶联剂还是除了具有由上述吡咯化合物或胺化合物衍生的贵金属捕获基团之外,还具有-SiX1X2X3基团的化合物,其中X1、X2和X3是烷基、卤素、烷氧基或类似基团,并可以是能够固定到待镀物体上的官能团。X1、X2和X3可以相同或不同。
上述硅烷偶联剂可以通过将上述吡咯化合物或胺化合物与环氧硅烷化合物反应得到。
该环氧硅烷化合物优选是如下式所示的环氧硅烷偶联剂:
[化学式2]
Figure A20048004118900061
(其中R1和R2是氢原子或具有1-3个碳原子的烷基,n为0-3)。
上述吡咯化合物与含环氧基的硅烷化合物可以例如在日本专利公开No.6-256358A中所述的条件下反应。
例如,可以将0.1-10mol含环氧基的硅烷化合物在80-200℃下滴到1mol吡咯化合物中,然后使它们反应5分钟-2小时。在这种情况下,溶剂并非是特别必要的,但是可以使用例如氯仿、二氧杂环己烷、甲醇、乙醇等有机溶剂。
咪唑与环氧硅烷化合物之间的反应的特别期望例子如下所示:
[化学式3]
Figure A20048004118900062
(其中R1和R2是氢或具有1-3个碳原子的烷基,R3是氢或具有1-20个碳原子的烷基,R4是乙烯基或具有1-5个碳原子的烷基,n为0-3)。
本发明中所用的具有金属捕获能力官能团的硅烷偶联剂的其它例子包括γ-氨丙基甲氧基硅烷、γ-氨丙基三乙氧基硅烷、N-β(氨乙基)γ-氨丙基三甲氧基硅烷、N-β(氨乙基)γ-氨丙基三乙氧基硅烷、γ-巯基丙基三甲氧基硅烷等。
在本发明中必要地,预处理剂包含脂肪酸贵金属皂,但在本发明目的范围内它也可以包含常规氯化锡或其它催化剂。
可以利用喷墨系统将本发明用于化学镀的预处理剂作为油墨组合物施加到待镀物体上。在这种情况下,优选加入粘度调节剂、表面张力剂和其它添加剂,以达到油墨要求。
使用本发明的金属镀方法,对待镀物体的性质没有限制。例子包括玻璃、陶瓷和其它无机材料、聚酯、聚酰胺、聚酰亚胺、氟树脂和其它塑性材料及其膜、片材和纤维;例如玻璃纤维背材增强的环氧树脂绝缘板等的绝缘体,以及例如Si晶圆和其它半导体的低导电率物体也是适用的。即使待镀物体是镜类物体,例如透明玻璃板、Si晶圆或其它半导体衬底,或者即使它是粉末,仍可有利地应用本发明方法。这种粉末例子包括玻璃珠、二硫化钼粉末、氧化镁粉末、石墨粉末、SiC粉末、氧化锆粉末、氧化铝粉末、氧化硅粉末、云母薄片、玻璃纤维、氮化硅、TeflonTM粉末等。
当基材呈织物状或板状时,常规方法是通过浸渍、刷涂等涂布表面,然后将溶剂挥发掉,但这不是限制;该方法可以是使硅烷偶联剂均匀粘附到表面上的任何方法。在粉末的情况下,除了在浸渍后将溶剂挥发以迫使溶液中所含的硅烷偶联剂粘附到基材表面上的方法之外,由于硅烷偶联剂因其均匀的成膜能力而能够在浸渍处理过程中粘附到基材表面上,所以可以在处理后仅通过过滤除去溶剂,并干燥湿粉末。根据粘附状态,水洗可能已足够,而无需干燥步骤。
尽管没有限制,但具有金属捕获能力的硅烷偶联剂在处理溶液中的浓度优选为0.001-10wt%。低于0.001wt%,粘附到基材表面上的化合物的量可能太低,而难以达到效果。高于10wt%,则粘附过度,使得干燥困难,并增加了粉末团聚的可能性。
为挥发掉表面处理中所用的溶剂,通过将其加热到溶剂挥发温度或该温度以上来充分干燥表面。优选地,将其在60-120℃下加热3-60分钟。
在本发明的化学镀方法中,可以接着通过普通方法对如上所述已经预处理的待镀物体进行化学镀。这样,可以获得具有例如铜、镍、锡、银或类似物的均匀、高度粘附的化学镀膜涂层的化学镀物体。
实施例
下面利用实施例详细解释本发明。
实施例1
制备具有500ml/L氯化锡和500mg/L环烷酸钯(Nikko Materials Co.,Ltd.制造,60mg/L钯)的镀用丁醇预处理剂。将玻璃基材在60℃下在该溶液中浸10分钟,用流水冲洗,并在100℃的氛围中对其进行15分钟的热处理。将其冷却到室温,并将镍化学镀液体Nikom 7N-0(Nikko Meatl Plating Co.,Ltd.制造)加热到70℃,进行化学镀5分钟。接着施加铜化学镀液体KC500(Nikko Meatl Plating Co.,Ltd.制造),以提供1μm厚的镀层。当测试铜镀膜的粘附性时,剥落强度为0.9kgf/cm2,表明强烈粘附。
实施例2
制备具有500mg/L环烷酸钯(Nikko Materials Co.,Ltd.制造,60mg/L钯)和500mg/L硅烷偶联剂(咪唑和γ-环氧丙氧丙基三甲氧基硅烷的等摩尔量反应产物)的镀用2-乙基己醇体系预处理剂。将玻璃-环氧基材在60℃下在该液体中浸10分钟,用流水冲洗,并在100℃的氛围中对其进行15分钟的热处理。将其冷却到室温,并将镍化学镀液体Nikom 7N-0(Nikko Meatl Plating Co.,Ltd.制造)加热到70℃,进行化学镀5分钟。接着施加铜化学镀液体KC500(Nikko MeatlPlating Co.,Ltd.制造),以提供1μm厚的镀层。当测试铜镀膜的粘附性时,剥落强度为1.3kgf/cm2,表明强烈粘附。
实施例3
添加γ-氨丙基三甲氧基硅烷至2g/L,添加辛酸钯(Nikko Materials Co.,Ltd.制造,300mg/L钯)至3g/L,以制备镀用辛醇体系预处理剂。
将玻璃板在60℃下在该液体中浸30分钟,用流水冲洗,并在150℃的氛围中对其进行20分钟的热处理。使用加热到70℃的镍化学镀液体Nikom7N-0(Nikko Meatl Plating Co.,Ltd.制造)将其化学镀10分钟,至镀层厚度达到1μm。粘附性强,剥落强度为1.2kgf/cm2
实施例4
将聚酰亚胺膜在室温下浸在含有5g/L硅烷偶联剂(咪唑和γ-环氧丙氧丙基三甲氧基硅烷的等摩尔量反应产物)的水溶液中。在用流水冲洗后,将其浸在含有10g/L环烷酸钯(Nikko Materials Co.,Ltd.制造,1.2g/L钯)的二甲苯溶液中。接着在100℃的氛围中对其进行15分钟的热处理,并将其冷却到室温。接着将镍化学镀液体Nikom 7N-0(Nikko Meatl Plating Co.,Ltd.制造)加热到70℃,进行化学镀5分钟。接着施加铜化学镀液体KC500(Nikko Meatl Plating Co.,Ltd.制造),以提供1μm厚的镀层。当测试铜镀膜的粘附性时,剥落强度为1.3kgf/cm2,表明高度粘附。
实施例5
混合(a)咪唑和γ-环氧丙氧丙基三甲氧基硅烷的等摩尔量反应产物的硅烷偶联剂和(b)新癸酸钯(Nikko Materials Co.,Ltd.制造),以制备2-乙基己醇溶液。向该溶液中加入粘度调节剂和表面张力剂,以制得含有1g/L(a)和1g/L(b)(100mg/L钯)的油墨。将其从喷墨嘴中喷射出,以在聚酰亚胺膜基材上绘出电路。空气干燥后,用镍化学镀液体Nikom 7N-0(Nikko Meatl Plating Co.,Ltd.制造)对其进行化学镀。接着施加铜化学镀液体KC500(Nikko Meatl PlatingCo.,Ltd.制造),以提供1μm厚的镀层。SEM的截面观测表明所形成的线路具有清晰的镀层边界,没有多余的图案沉积。
实施例6
将10g/L环烷酸钯(Nikko Materials Co.,Ltd.制造,1.2g/L钯)加到10g/L咪唑和γ-环氧丙氧丙基三甲氧基硅烷的等摩尔量反应产物中,以制备辛醇溶液。将该溶液在室温下稳定1个月或更长时间。
对比例1
制备具有500mg/L氯化锡和500mg/L氯化钯(300mg/L钯)的镀用丁醇体系预处理剂。将玻璃板在60℃下在该液体中浸10分钟,用流水冲洗,并在100℃的氛围中对其进行15分钟的热处理。将其冷却到室温后,并将加热到70℃的镍化学镀液体Nikom 7N-0(Nikko Meatl Plating Co.,Ltd.制造)对其进行5分钟的化学镀。接着施加铜化学镀液体KC500(Nikko Meatl Plating Co.,Ltd.制造),以提供1μm厚的镀层。当测试铜版的粘附性时,剥落强度为0.3kgf/cm2。钯在室温下5小时内即从该预处理剂中沉淀出。
对比例2
将1g/L乙酸钯(0.5g/L钯)加到1g/L咪唑和γ-环氧丙氧丙基三甲氧基硅烷的等摩尔量反应产物中,以制备辛醇溶液。钯在室温下大约5分钟内即从该溶液中沉淀出,因此它不能用作预处理剂。
工业实用性
本发明的化学镀预处理剂可溶于有机溶剂中,并且在这些溶剂中极端稳定。相对于待镀物体,这种溶液还具有优异的适应性和可加工性,并可以用喷墨设备作为油墨喷绘。因此,它甚至可以化学镀到以前难镀的物体上。它还可以形成高度均匀和粘附的镀膜。

Claims (10)

1.一种用于化学镀的预处理剂,包含具有5-25个碳原子的脂肪酸的贵金属皂。
2.如权利要求1所述的用于化学镀的预处理剂,还包含分子中具有金属捕获能力的官能团的硅烷偶联剂。
3.如权利要求2所述的用于化学镀的预处理剂,其中硅烷偶联剂是通过将吡咯化合物或胺化合物与环氧硅烷化合物反应得到的硅烷偶联剂。
4.如权利要求2或3所述的用于化学镀的预处理剂,其中具有金属捕获能力的官能团是咪唑基。
5.如权利要求1-4任一项所述的用于化学镀的预处理剂,其中贵金属皂是钯皂。
6.如权利要求1-5任一项所述的用于化学镀的预处理剂,其中贵金属皂是环烷酸钯、新癸酸钯或辛酸钯。
7.一种含有如权利要求1-6任一项用于化学镀的预处理剂的油墨组合物。
8.一种化学镀方法,其中用如权利要求1-7任一项的用于化学镀的预处理剂或油墨组合物预处理待镀物体,接着进行化学镀。
9.如权利要求8所述的化学镀方法,其中用油墨组合物的预处理是使用喷墨设备进行喷绘。
10.一种通过在物体上进行如权利要求8或9所述的化学镀方法而获得的化学镀产品。
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104742438A (zh) * 2013-12-31 2015-07-01 财团法人工业技术研究院 积层板及其制作方法
CN111455366A (zh) * 2020-04-03 2020-07-28 贵州水钢同鑫晟金属制品有限公司 一种改性无磷无硼镀膜剂及其制备方法
CN113151811A (zh) * 2021-04-13 2021-07-23 赤壁市聚茂新材料科技有限公司 一种非钯活化镀镍液、镀镍方法

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4270517B2 (ja) * 2003-06-09 2009-06-03 日鉱金属株式会社 無電解めっき方法及び金属めっき物
KR100764294B1 (ko) * 2003-11-05 2007-10-05 닛코킨조쿠 가부시키가이샤 잉크젯용 잉크 조성물
WO2006027947A1 (ja) * 2004-09-10 2006-03-16 Nippon Mining & Metals Co., Ltd. 無電解めっき前処理剤及びフレキシブル基板用銅張り積層体
JP2007242919A (ja) * 2006-03-09 2007-09-20 Bridgestone Corp 光透過性電磁波シールド材の製造方法、光透過性電磁波シールド材、およびディスプレイ用フィルタ
KR20080100447A (ko) * 2006-03-09 2008-11-18 가부시키가이샤 브리지스톤 광 투과성 전자파 실드재의 제조 방법, 광 투과성 전자파 실드재 및 디스플레이용 필터
JP2007242918A (ja) * 2006-03-09 2007-09-20 Bridgestone Corp 光透過性電磁波シールド材の製造方法、光透過性電磁波シールド材、およびディスプレイ用フィルタ
JP2007242915A (ja) * 2006-03-09 2007-09-20 Bridgestone Corp 光透過性電磁波シールド材の製造方法、光透過性電磁波シールド材、およびディスプレイ用フィルタ
JP2008060350A (ja) * 2006-08-31 2008-03-13 Bridgestone Corp 光透過性電磁波シールド材の製造方法
JP2008218777A (ja) * 2007-03-06 2008-09-18 Bridgestone Corp 光透過性電磁波シールド材の製造方法
KR100997629B1 (ko) * 2007-06-15 2010-12-01 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 내열 에이징 특성이 우수한 금속 피복 폴리이미드 수지 기판의 제조 방법
JP5041214B2 (ja) 2007-06-15 2012-10-03 ソニー株式会社 金属薄膜の形成方法および電子デバイスの製造方法
US8814997B2 (en) * 2010-03-23 2014-08-26 Jx Nippon Mining & Metals Corporation Electroless plating pretreatment agent, electroless plating method using same, and electroless plated object
US8350414B2 (en) * 2010-08-11 2013-01-08 Xantrex Technology Inc. Semiconductor assisted DC load break contactor
US10280514B2 (en) * 2011-05-20 2019-05-07 S.T. Trading Company Limited Fabrication of mirror-like coatings
KR101483920B1 (ko) 2011-12-15 2015-01-16 헨켈 아이피 앤드 홀딩 게엠베하 흑연 상으로의 은의 무전해 도금 방법
US9499912B2 (en) 2014-05-26 2016-11-22 Rohm And Haas Electronic Materials Llc Copolymers of diglycidyl ether terminated polysiloxane compounds and non-aromatic polyamines
ES2646237B2 (es) 2017-09-28 2018-07-27 Avanzare Innovacion Tecnologica S.L. Formulación para el mordentado de materiales poliméricos previo al recubrimiento de los mismos

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58189365A (ja) 1982-04-28 1983-11-05 Okuno Seiyaku Kogyo Kk 化学メッキ用アンダーコート組成物
JPS60110877A (ja) * 1983-11-18 1985-06-17 Okuno Seiyaku Kogyo Kk 化学メツキ用組成物及び該組成物を使用する化学めつき方法
JPS60195077A (ja) 1984-03-16 1985-10-03 奥野製薬工業株式会社 セラミツクスの無電解めつき用触媒組成物
JPH04215855A (ja) 1990-04-02 1992-08-06 Nippondenso Co Ltd 触媒処理液、触媒担持方法及び導体形成方法
JPH06256358A (ja) 1993-03-01 1994-09-13 Japan Energy Corp 新規イミダゾールシラン化合物及びその製造方法並びにそれを用いる金属表面処理剤
US5894038A (en) * 1997-02-28 1999-04-13 The Whitaker Corporation Direct deposition of palladium
US5846615A (en) 1997-02-28 1998-12-08 The Whitaker Corporation Direct deposition of a gold layer
JPH10317155A (ja) * 1997-05-22 1998-12-02 Canon Inc 金属膜形成方法
JP3007961B2 (ja) * 1998-03-13 2000-02-14 工業技術院長 金属酸化物薄膜の製造方法
JP2000289167A (ja) * 1999-02-03 2000-10-17 Ube Ind Ltd 化学メッキ用ベ−スフィルム及びメッキフィルム
US6440576B1 (en) * 1999-02-03 2002-08-27 Ube Industries, Ltd. Metal plated aromatic polyimide film
US7045461B2 (en) * 2000-01-07 2006-05-16 Nikkon Materials Co., Ltd. Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these
CN1174118C (zh) 2000-01-07 2004-11-03 株式会社日矿材料 金属镀覆方法、预处理剂以及使用它们制得的半导体晶片和半导体器件
JP3536014B2 (ja) * 2000-04-07 2004-06-07 株式会社日鉱マテリアルズ イミダゾール有機モノカルボン酸塩誘導体反応生成物及びその製造方法、並びにそれを用いる表面処理剤、樹脂添加剤および樹脂組成物
CN1261618C (zh) * 2000-04-25 2006-06-28 株式会社日矿材料 镀覆用预处理剂和使用它的金属镀覆方法
GB0025989D0 (en) * 2000-10-24 2000-12-13 Shipley Co Llc Plating catalysts
BR0210147A (pt) * 2001-06-04 2004-06-08 Qinetiq Ltd Métodos para preparar um material de substrato, para preparar um substrato, para depositar um material sobre um substrato em um padrão definido pelo usuário através de uma reação catalìtica e para galvanizar metal sobre um substrato em um padrão definido pelo usuário através de um processo autocatalìtico, e, formulação de tinta
JP4582528B2 (ja) 2001-07-31 2010-11-17 Jx日鉱日石金属株式会社 表面処理剤、およびそれを用いた表面処理物
KR100893564B1 (ko) * 2001-10-05 2009-04-17 캐보트 코포레이션 저점도 전구체 조성물 및 전도성 전자 형상의 증착 방법
JP2003193245A (ja) * 2001-12-21 2003-07-09 Nikko Materials Co Ltd めっき前処理剤、及びそれを用いた無電解めっき方法
KR100560268B1 (ko) * 2002-04-23 2006-03-10 가부시키 가이샤 닛코 마테리알즈 무전해 도금방법 및 금속도금층이 형성된 반도체 웨이퍼
ATE444381T1 (de) * 2002-09-10 2009-10-15 Nippon Mining Co Verfahren zur metallabscheidung und vorbehandlungsmittel
KR100764294B1 (ko) * 2003-11-05 2007-10-05 닛코킨조쿠 가부시키가이샤 잉크젯용 잉크 조성물
WO2006027947A1 (ja) * 2004-09-10 2006-03-16 Nippon Mining & Metals Co., Ltd. 無電解めっき前処理剤及びフレキシブル基板用銅張り積層体

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104742438A (zh) * 2013-12-31 2015-07-01 财团法人工业技术研究院 积层板及其制作方法
CN111455366A (zh) * 2020-04-03 2020-07-28 贵州水钢同鑫晟金属制品有限公司 一种改性无磷无硼镀膜剂及其制备方法
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