ATE444381T1 - Verfahren zur metallabscheidung und vorbehandlungsmittel - Google Patents
Verfahren zur metallabscheidung und vorbehandlungsmittelInfo
- Publication number
- ATE444381T1 ATE444381T1 AT03788697T AT03788697T ATE444381T1 AT E444381 T1 ATE444381 T1 AT E444381T1 AT 03788697 T AT03788697 T AT 03788697T AT 03788697 T AT03788697 T AT 03788697T AT E444381 T1 ATE444381 T1 AT E444381T1
- Authority
- AT
- Austria
- Prior art keywords
- metal deposition
- coupling agent
- pretreatment agents
- plating method
- plating
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1882—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002263736 | 2002-09-10 | ||
PCT/JP2003/009968 WO2004024984A1 (ja) | 2002-09-10 | 2003-08-05 | 金属めっき方法および前処理剤 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE444381T1 true ATE444381T1 (de) | 2009-10-15 |
Family
ID=31986464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03788697T ATE444381T1 (de) | 2002-09-10 | 2003-08-05 | Verfahren zur metallabscheidung und vorbehandlungsmittel |
Country Status (7)
Country | Link |
---|---|
US (1) | US7867564B2 (de) |
EP (1) | EP1538237B1 (de) |
JP (1) | JP3849946B2 (de) |
KR (1) | KR100568386B1 (de) |
AT (1) | ATE444381T1 (de) |
DE (1) | DE60329501D1 (de) |
WO (1) | WO2004024984A1 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1760171B1 (de) * | 2004-01-29 | 2011-04-27 | Nippon Mining & Metals Co., Ltd. | Vorbehandlungsmittel für die stromlose metallabscheidung und verfahren zur stromlosen metallabscheidung unter verwendung davon |
JP5072094B2 (ja) * | 2005-03-10 | 2012-11-14 | Jx日鉱日石金属株式会社 | 樹脂用フィラー、それを配合した樹脂基材、及び電子部品基材 |
NL1029311C2 (nl) * | 2005-06-22 | 2006-12-27 | Nanotechnology B V | Microscopisch substraat alzijdig bedekt met een metaallaag en werkwijze voor het metalliseren van een microscopisch substraat. |
US8697233B2 (en) * | 2006-03-07 | 2014-04-15 | Nara Institute Of Science And Technology | Metal-coated lipid bilayer vesicles and process for producing same |
JP4794326B2 (ja) * | 2006-03-09 | 2011-10-19 | 株式会社ブリヂストン | 光透過性電磁波シールド材の製造方法、光透過性電磁波シールド材、およびディスプレイ用フィルタ |
KR20080100447A (ko) * | 2006-03-09 | 2008-11-18 | 가부시키가이샤 브리지스톤 | 광 투과성 전자파 실드재의 제조 방법, 광 투과성 전자파 실드재 및 디스플레이용 필터 |
JP4794325B2 (ja) * | 2006-03-09 | 2011-10-19 | 株式会社ブリヂストン | 光透過性電磁波シールド材の製造方法、光透過性電磁波シールド材、およびディスプレイ用フィルタ |
US7931518B2 (en) * | 2006-08-03 | 2011-04-26 | Bridgestone Corporation | Process for preparing light transmissive electromagnetic wave shielding material, light transmissive electromagnetic wave shielding material and display filter |
JP4897384B2 (ja) * | 2006-08-03 | 2012-03-14 | 株式会社ブリヂストン | 光透過性電磁波シールド材の製造方法、光透過性電磁波シールド材、およびディスプレイ用フィルタ |
JP2008041823A (ja) * | 2006-08-03 | 2008-02-21 | Bridgestone Corp | 光透過性電磁波シールド材の製造方法、光透過性電磁波シールド材、およびディスプレイ用フィルタ |
JP2008060350A (ja) * | 2006-08-31 | 2008-03-13 | Bridgestone Corp | 光透過性電磁波シールド材の製造方法 |
JP2008218714A (ja) * | 2007-03-05 | 2008-09-18 | Bridgestone Corp | 光透過性電磁波シールド材及びその製造方法、並びに貴金属の極薄膜を有する微粒子及びその製造方法 |
KR20100091663A (ko) | 2009-02-11 | 2010-08-19 | 삼성전자주식회사 | 표면개질제, 이를 사용하여 제조된 적층 구조, 그 구조의 제조방법 및 이를 포함하는 트랜지스터 |
CA2763967C (en) | 2009-06-08 | 2017-08-15 | Basf Se | Use of ionic liquids for the pretreatment of surfaces of plastics for metallization |
US8814997B2 (en) | 2010-03-23 | 2014-08-26 | Jx Nippon Mining & Metals Corporation | Electroless plating pretreatment agent, electroless plating method using same, and electroless plated object |
DE102010036535A1 (de) * | 2010-07-21 | 2012-01-26 | Saint-Gobain Isover G+H Ag | Verfahren zum Metallisieren von Mineralfasern sowie Verwendung derselben |
TWI414643B (zh) * | 2010-09-01 | 2013-11-11 | Univ Nat Chunghsing | 銅電鍍液組成物 |
US9499912B2 (en) | 2014-05-26 | 2016-11-22 | Rohm And Haas Electronic Materials Llc | Copolymers of diglycidyl ether terminated polysiloxane compounds and non-aromatic polyamines |
TWI608124B (zh) * | 2015-09-21 | 2017-12-11 | 國立清華大學 | 使用高附著性觸媒的無矽烷無電鍍金屬沉積方法及其生成物 |
WO2018147205A1 (ja) * | 2017-02-13 | 2018-08-16 | 東洋炭素株式会社 | めっきの前処理方法、めっき方法、めっき前処理物及びめっき物 |
ES2646237B2 (es) | 2017-09-28 | 2018-07-27 | Avanzare Innovacion Tecnologica S.L. | Formulación para el mordentado de materiales poliméricos previo al recubrimiento de los mismos |
TWI672175B (zh) * | 2017-10-20 | 2019-09-21 | 國立清華大學 | 自吸附觸媒組成物、自吸附觸媒組成物的製造方法以及無電鍍基板的製造方法 |
KR102300834B1 (ko) * | 2019-11-21 | 2021-09-13 | 주식회사 포스코 | 스테인리스강 산세용 이온성 액체 및 이를 이용한 스테인리스강의 산세방법 |
KR20240004056A (ko) | 2022-07-04 | 2024-01-11 | 김강민 | 도금층 표면 균일화 도금 방법 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5952701A (ja) | 1982-09-21 | 1984-03-27 | Fuji Xerox Co Ltd | 測定具の目盛表示装置 |
JPS60181294A (ja) | 1984-02-24 | 1985-09-14 | Agency Of Ind Science & Technol | 金属皮膜を表面に有する無機質粉体の製造方法 |
JPS61194183A (ja) | 1985-02-21 | 1986-08-28 | Hitachi Chem Co Ltd | 無電解めつき法 |
JPH0344149A (ja) | 1989-07-11 | 1991-02-26 | Nec Corp | ハンズフリー電話機 |
JPH06256358A (ja) | 1993-03-01 | 1994-09-13 | Japan Energy Corp | 新規イミダゾールシラン化合物及びその製造方法並びにそれを用いる金属表面処理剤 |
JP3277463B2 (ja) | 1998-07-07 | 2002-04-22 | 株式会社ジャパンエナジー | 金属めっき前処理剤、およびそれを用いる金属めっき方法 |
CN1174118C (zh) | 2000-01-07 | 2004-11-03 | 株式会社日矿材料 | 金属镀覆方法、预处理剂以及使用它们制得的半导体晶片和半导体器件 |
US7045461B2 (en) * | 2000-01-07 | 2006-05-16 | Nikkon Materials Co., Ltd. | Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these |
JP3536014B2 (ja) * | 2000-04-07 | 2004-06-07 | 株式会社日鉱マテリアルズ | イミダゾール有機モノカルボン酸塩誘導体反応生成物及びその製造方法、並びにそれを用いる表面処理剤、樹脂添加剤および樹脂組成物 |
CN1261618C (zh) * | 2000-04-25 | 2006-06-28 | 株式会社日矿材料 | 镀覆用预处理剂和使用它的金属镀覆方法 |
JP4836312B2 (ja) | 2000-08-01 | 2011-12-14 | Jx日鉱日石金属株式会社 | 銀めっき前処理剤および銀めっき方法 |
JP4425453B2 (ja) | 2000-11-24 | 2010-03-03 | 日鉱金属株式会社 | 金属膜間密着性向上方法 |
JP2002226972A (ja) | 2001-02-01 | 2002-08-14 | Nikko Materials Co Ltd | 無電解めっき方法 |
JP4270517B2 (ja) * | 2003-06-09 | 2009-06-03 | 日鉱金属株式会社 | 無電解めっき方法及び金属めっき物 |
-
2003
- 2003-08-05 AT AT03788697T patent/ATE444381T1/de not_active IP Right Cessation
- 2003-08-05 WO PCT/JP2003/009968 patent/WO2004024984A1/ja active Application Filing
- 2003-08-05 JP JP2004535867A patent/JP3849946B2/ja not_active Expired - Lifetime
- 2003-08-05 US US10/482,092 patent/US7867564B2/en active Active
- 2003-08-05 DE DE60329501T patent/DE60329501D1/de not_active Expired - Lifetime
- 2003-08-05 KR KR1020047000325A patent/KR100568386B1/ko active IP Right Grant
- 2003-08-05 EP EP03788697A patent/EP1538237B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR20040043153A (ko) | 2004-05-22 |
EP1538237B1 (de) | 2009-09-30 |
JPWO2004024984A1 (ja) | 2006-01-12 |
KR100568386B1 (ko) | 2006-04-05 |
JP3849946B2 (ja) | 2006-11-22 |
DE60329501D1 (de) | 2009-11-12 |
US20050147755A1 (en) | 2005-07-07 |
US7867564B2 (en) | 2011-01-11 |
EP1538237A1 (de) | 2005-06-08 |
EP1538237A4 (de) | 2006-03-15 |
WO2004024984A1 (ja) | 2004-03-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |