WO2004024984A1 - 金属めっき方法および前処理剤 - Google Patents
金属めっき方法および前処理剤 Download PDFInfo
- Publication number
- WO2004024984A1 WO2004024984A1 PCT/JP2003/009968 JP0309968W WO2004024984A1 WO 2004024984 A1 WO2004024984 A1 WO 2004024984A1 JP 0309968 W JP0309968 W JP 0309968W WO 2004024984 A1 WO2004024984 A1 WO 2004024984A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- coupling agent
- plating
- silane coupling
- azole
- compound
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1882—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Definitions
- the present invention relates to a method for metal plating by electroless plating on a surface of a low conductive material, a mirror-like object, a powder, or the like, and a pretreatment agent therefor.
- the electroless metal plating method is one of the methods of forming a metal coating on a non-conductive substrate.
- a pre-treatment for electroless plating an activity of pre-adhering a noble metal such as palladium as a catalyst to the substrate in advance.
- a method called encapsulation is common.
- S n C 1 2 of or P d C 1 2 aqueous solution immersion treatment to adsorb P d after treatment with hydrochloric acid aqueous solution, P by including S n and P d co port I de solution d
- a method has been used in which is carried on the surface. These methods have many problems such as the use of highly toxic Sn and the complicated processing steps.
- Patent Document 1 Japanese Patent Publication No. 5-9-5 2 7 0 1
- Patent Document 2 JP-A-60-1812-1294
- Patent Document 3 JP-A-61-194183
- Patent Document 4 JP-A-3-44149
- Patent Document 5 JP 2002-47573 A
- Patent Document 6 JP 2002-161389 A
- Patent Document 8 WOO 1/49898 A 1 Disclosure of the Invention
- the electroless plating can be performed uniformly and with good adhesion to powders, mirrors, or resin cloths to which conventional electroless plating is difficult to apply under such circumstances. It is an object of the present invention to provide a novel metal plating method by electroless plating and a pretreatment agent therefor.
- the present inventor has solved the problem by surface-treating an adherend with a liquid in which the silane coupling agent having a complex forming ability with the noble metal ion is mixed or reacted in advance in the form of an organic acid salt thereof.
- the present invention was found to be obtained. That is, the present invention
- a silane coupling agent having an azole in one molecule An organic acid salt and a noble metal compound are mixed or reacted in advance, and the surface of the object is treated with electroless dissolution after being treated.
- Metal plating method
- silane coupling agent having an azole in one molecule is a silane coupling agent obtained by a reaction between an azole compound and an epoxysilane compound.
- the present invention relates to a metal plating pretreatment agent comprising a liquid obtained by previously mixing or reacting an organic acid salt of a silane coupling agent having an azole in one molecule with a noble metal compound.
- the present invention provides an electroless plating after a surface treatment using a specific compound having a function of capturing a noble metal ion serving as a catalyst for electroless plating and a function of fixing the same to an object to be plated in the same molecule.
- a metal plating method and a pretreatment agent therefor By having both the function of capturing the catalyst and the function of fixing the adhered substance in the same molecule, it is possible not only to shorten the plating process but also to effectively fix the catalyst to the adhered substance.
- a specific silane coupling agent as an organic acid salt.
- the presence of the azole in the molecule makes it possible to take an electronic state and orientation that effectively expresses the activity of the plating catalyst due to the conjugation and aromaticity of the azole. Thereby, it becomes possible to express adhesion to the covering agent.
- an organic acid salt by using an organic acid salt, the adsorption of the noble metal compound to the plating object can be further promoted, and as a result, the electroless plating to the plating object can be performed more uniformly.
- imidazole which is an azole compound but not a silane coupling agent
- the plating is performed with good uniformity, but the adhesion of the plating to the adherend is extremely low.
- azoles examples include imidazole, oxazole, thiazole, selenazole, pyrazole, isoxazole, isothiazole, triazole, oxaziazol, thiadiazole, tetrazole, oxatriazole, thiatriazole, vendazonole, indazonole, benzimidazoleno, benzoinolezono, benzoinoleno benzole, benzoinoleno benzole And the like.
- an imidazonole ring is particularly preferred.
- the silane coupling agent is a compound having one S i X i X s X g group, and X 2 and X 3 each represent an alkyl group, a halogen or an alkoxy group, and the like. Any functional group that can be fixed may be used.
- X i, x 2 , and x 3 may be the same or different.
- the silane coupling agent of the present invention comprises the above azole in one molecule.
- silane coupling agent which is a reaction product obtained by reacting imidazole as an azole compound and ⁇ -dalicydoxypropyl trialkoxysilane as an epoxysilane compound in an equimolar amount
- the organic acid salts of these silane coupling agents can be synthesized by reacting an equivalent amount of an organic acid with the silane coupling agent. This reaction occurs when an organic acid binds to the azole of the azole compound to form a salt.
- the organic acid is not particularly limited as long as it forms a salt with azole, but a carboxylic acid such as acetic acid is preferable. Among them, acetic acid is particularly preferred in terms of availability and cost.
- reaction solvent such as methanol and ethanol may be used.
- the desired product can be synthesized by reacting at a reaction temperature of 50 ° C. to 100 ° C. for 0.5 to 20 hours.
- the noble metal compound examples include chlorides, hydroxides, and oxides of palladium, silver, platinum, gold, and the like, which exhibit a catalytic effect when depositing copper, nickel, and the like from the electroless plating solution on the surface of the object to be plated.
- examples thereof include ammine complexes such as sodium, sulfate, and ammonium salts.
- Palladium chloride is particularly preferred.
- the noble metal compound is used in the pretreatment solution at a concentration of 1 to 100 mg / K, preferably 10 to 200 mg Zl.
- the properties of the adherend are not limited.
- inorganic materials such as glass and ceramics, plastic materials such as polyester, polyamide, polyimide, and fluororesin, films, sheets, fibers, and insulating plates such as epoxy resin reinforced with glass cloth base materials as necessary
- plastic materials such as polyester, polyamide, polyimide, and fluororesin
- films, sheets, fibers, and insulating plates such as epoxy resin reinforced with glass cloth base materials as necessary
- low conductivity objects such as insulators and semiconductors such as Si wafers
- the objects to be coated are mirror-like objects such as transparent glass plates, Si wafers, and other semiconductor substrates.
- the method of the present invention can be preferably applied to powder or powder.
- Such powders include, for example, glass beads, molybdenum disulfide powder, magnesium oxide powder, graphite powder, SiC powder, hydridzirconium oxide powder, alumina powder, oxidized silicon powder, mica flake, Examples include glass fiber, silicon nitride, and Teflon (registered trademark) powder.
- Silane force having sol in one molecule as described above for the base to be electroless plated When surface treatment is performed with a liquid in which the organic acid salt of the coupling agent and the noble metal ion have been mixed or reacted in advance, this liquid must be a suitable solvent, for example, water, methyl alcohol, ethyl alcohol, 2-propanol, acetone, toluene, ethylene.
- a suitable solvent for example, water, methyl alcohol, ethyl alcohol, 2-propanol, acetone, toluene, ethylene.
- Glycol, polyethylene glycol, dimethinolephonolemamide, dimethinoresnorolefoxide, dioxane, and the like, and a solution obtained by dissolving them in a mixed solution thereof can be used.
- the washing step may be omitted only by washing with water.
- the concentration of the organic acid salt of the silane coupling agent having an azole in one molecule in the solution to be treated is not limited to this, but is preferably 0.01 to 10% by weight. If the amount is less than 0.001% by weight, the amount of the compound adhering to the surface of the base material tends to be low, and the effect is hardly obtained. On the other hand, if the content exceeds 10% by weight, the amount of adhesion is so large that it is difficult to dry and that the powder is apt to agglomerate.
- the drying step can be omitted, and the surface treatment can be performed only by washing with water. However, at this time, it is necessary to perform sufficient washing with water so as not to bring the catalyst into the plating solution.
- Room temperature is sufficient for pretreatment, but heating may be effective depending on the object to be covered.
- the object to be covered may be washed before performing the plating pretreatment.
- adhesion is required, use the conventional etching process with But it's fine.
- metals such as copper, nickel, cobalt, tin, and gold can be plated by electroless plating.
- ⁇ has a blank area in part
- acetate refers to the silane coupling agent converted to acetate
- non-acetate refers to vinegar. It means a silane coupling agent that is not an acid salt, and 3 and 6 in the table indicate the case where neither silane coupling agent is used.
- the novel plating method of the present invention it is possible to perform plating on a base material, which was conventionally impossible by a simple process, and to use a silane coupling agent.
- a silane coupling agent By using it as an organic acid salt, the amount of noble metal adsorbed on the adherend can be significantly increased, and electroless plating can be performed more uniformly.
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE60329501T DE60329501D1 (de) | 2002-09-10 | 2003-08-05 | Verfahren zur metallabscheidung und vorbehandlungsmittel |
JP2004535867A JP3849946B2 (ja) | 2002-09-10 | 2003-08-05 | 金属めっき方法および前処理剤 |
AT03788697T ATE444381T1 (de) | 2002-09-10 | 2003-08-05 | Verfahren zur metallabscheidung und vorbehandlungsmittel |
KR1020047000325A KR100568386B1 (ko) | 2002-09-10 | 2003-08-05 | 금속도금방법 및 전처리제 |
US10/482,092 US7867564B2 (en) | 2002-09-10 | 2003-08-05 | Metal plating method and pretreatment agent |
EP03788697A EP1538237B1 (en) | 2002-09-10 | 2003-08-05 | Method for metal plating and pre-treating agent |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002263736 | 2002-09-10 | ||
JP2002-263736 | 2002-09-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004024984A1 true WO2004024984A1 (ja) | 2004-03-25 |
Family
ID=31986464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/009968 WO2004024984A1 (ja) | 2002-09-10 | 2003-08-05 | 金属めっき方法および前処理剤 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7867564B2 (ja) |
EP (1) | EP1538237B1 (ja) |
JP (1) | JP3849946B2 (ja) |
KR (1) | KR100568386B1 (ja) |
AT (1) | ATE444381T1 (ja) |
DE (1) | DE60329501D1 (ja) |
WO (1) | WO2004024984A1 (ja) |
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WO2006095590A1 (ja) * | 2005-03-10 | 2006-09-14 | Nippon Mining & Metals Co., Ltd. | 樹脂用フィラー、それを配合した樹脂基材、及び電子部品基材 |
JP2007242922A (ja) * | 2006-03-09 | 2007-09-20 | Bridgestone Corp | 光透過性電磁波シールド材の製造方法、光透過性電磁波シールド材、およびディスプレイ用フィルタ |
JP2007242921A (ja) * | 2006-03-09 | 2007-09-20 | Bridgestone Corp | 光透過性電磁波シールド材の製造方法、光透過性電磁波シールド材、およびディスプレイ用フィルタ |
WO2008016142A1 (fr) * | 2006-08-03 | 2008-02-07 | Bridgestone Corporation | Procédé de production d'un matériau de blindage électromagnétique à transmission optique, matériau de blindage électromagnétique à transmission optique et filtre d'affichage |
JP2008041824A (ja) * | 2006-08-03 | 2008-02-21 | Bridgestone Corp | 光透過性電磁波シールド材の製造方法、光透過性電磁波シールド材、およびディスプレイ用フィルタ |
JP2008041823A (ja) * | 2006-08-03 | 2008-02-21 | Bridgestone Corp | 光透過性電磁波シールド材の製造方法、光透過性電磁波シールド材、およびディスプレイ用フィルタ |
JP2008060350A (ja) * | 2006-08-31 | 2008-03-13 | Bridgestone Corp | 光透過性電磁波シールド材の製造方法 |
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WO2018147205A1 (ja) * | 2017-02-13 | 2018-08-16 | 東洋炭素株式会社 | めっきの前処理方法、めっき方法、めっき前処理物及びめっき物 |
JP2020535322A (ja) * | 2017-09-28 | 2020-12-03 | エスアールジー グローバル リリア ソシエダッド リミターダ | 表面活性化ポリマー |
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NL1029311C2 (nl) * | 2005-06-22 | 2006-12-27 | Nanotechnology B V | Microscopisch substraat alzijdig bedekt met een metaallaag en werkwijze voor het metalliseren van een microscopisch substraat. |
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CA2763967C (en) | 2009-06-08 | 2017-08-15 | Basf Se | Use of ionic liquids for the pretreatment of surfaces of plastics for metallization |
DE102010036535A1 (de) * | 2010-07-21 | 2012-01-26 | Saint-Gobain Isover G+H Ag | Verfahren zum Metallisieren von Mineralfasern sowie Verwendung derselben |
TWI414643B (zh) * | 2010-09-01 | 2013-11-11 | Univ Nat Chunghsing | 銅電鍍液組成物 |
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WO2000001862A1 (fr) * | 1998-07-07 | 2000-01-13 | Japan Energy Corporation | Agent de pretraitement utilise dans le placage de metal et procede d'utilisation correspondant |
WO2001049898A1 (fr) * | 2000-01-07 | 2001-07-12 | Nikko Materials Co., Ltd. | Procede de galvanoplastie, agent de pretraitement et tranche de semi-conducteurs et dispositif semi-conducteur utilisant cette derniere |
WO2001077119A1 (fr) * | 2000-04-07 | 2001-10-18 | Nikko Materials Co., Ltd. | Monocarboxylates, sels de produits de reaction de l'imidazole |
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JPS5952701A (ja) | 1982-09-21 | 1984-03-27 | Fuji Xerox Co Ltd | 測定具の目盛表示装置 |
JPS60181294A (ja) | 1984-02-24 | 1985-09-14 | Agency Of Ind Science & Technol | 金属皮膜を表面に有する無機質粉体の製造方法 |
JPS61194183A (ja) | 1985-02-21 | 1986-08-28 | Hitachi Chem Co Ltd | 無電解めつき法 |
JPH0344149A (ja) | 1989-07-11 | 1991-02-26 | Nec Corp | ハンズフリー電話機 |
JPH06256358A (ja) | 1993-03-01 | 1994-09-13 | Japan Energy Corp | 新規イミダゾールシラン化合物及びその製造方法並びにそれを用いる金属表面処理剤 |
US7045461B2 (en) * | 2000-01-07 | 2006-05-16 | Nikkon Materials Co., Ltd. | Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these |
WO2001081652A1 (fr) * | 2000-04-25 | 2001-11-01 | Nikko Materials Co., Ltd. | Agent de pretraitement pour revetement metallique |
JP4836312B2 (ja) | 2000-08-01 | 2011-12-14 | Jx日鉱日石金属株式会社 | 銀めっき前処理剤および銀めっき方法 |
JP4425453B2 (ja) | 2000-11-24 | 2010-03-03 | 日鉱金属株式会社 | 金属膜間密着性向上方法 |
JP2002226972A (ja) | 2001-02-01 | 2002-08-14 | Nikko Materials Co Ltd | 無電解めっき方法 |
JP4270517B2 (ja) * | 2003-06-09 | 2009-06-03 | 日鉱金属株式会社 | 無電解めっき方法及び金属めっき物 |
-
2003
- 2003-08-05 WO PCT/JP2003/009968 patent/WO2004024984A1/ja active Application Filing
- 2003-08-05 DE DE60329501T patent/DE60329501D1/de not_active Expired - Lifetime
- 2003-08-05 AT AT03788697T patent/ATE444381T1/de not_active IP Right Cessation
- 2003-08-05 JP JP2004535867A patent/JP3849946B2/ja not_active Expired - Lifetime
- 2003-08-05 KR KR1020047000325A patent/KR100568386B1/ko active IP Right Grant
- 2003-08-05 EP EP03788697A patent/EP1538237B1/en not_active Expired - Lifetime
- 2003-08-05 US US10/482,092 patent/US7867564B2/en active Active
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Cited By (16)
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JP5072094B2 (ja) * | 2005-03-10 | 2012-11-14 | Jx日鉱日石金属株式会社 | 樹脂用フィラー、それを配合した樹脂基材、及び電子部品基材 |
WO2006095590A1 (ja) * | 2005-03-10 | 2006-09-14 | Nippon Mining & Metals Co., Ltd. | 樹脂用フィラー、それを配合した樹脂基材、及び電子部品基材 |
JP2007242922A (ja) * | 2006-03-09 | 2007-09-20 | Bridgestone Corp | 光透過性電磁波シールド材の製造方法、光透過性電磁波シールド材、およびディスプレイ用フィルタ |
JP2007242921A (ja) * | 2006-03-09 | 2007-09-20 | Bridgestone Corp | 光透過性電磁波シールド材の製造方法、光透過性電磁波シールド材、およびディスプレイ用フィルタ |
WO2008016142A1 (fr) * | 2006-08-03 | 2008-02-07 | Bridgestone Corporation | Procédé de production d'un matériau de blindage électromagnétique à transmission optique, matériau de blindage électromagnétique à transmission optique et filtre d'affichage |
JP2008041824A (ja) * | 2006-08-03 | 2008-02-21 | Bridgestone Corp | 光透過性電磁波シールド材の製造方法、光透過性電磁波シールド材、およびディスプレイ用フィルタ |
JP2008041823A (ja) * | 2006-08-03 | 2008-02-21 | Bridgestone Corp | 光透過性電磁波シールド材の製造方法、光透過性電磁波シールド材、およびディスプレイ用フィルタ |
JP2008060350A (ja) * | 2006-08-31 | 2008-03-13 | Bridgestone Corp | 光透過性電磁波シールド材の製造方法 |
JP2008218714A (ja) * | 2007-03-05 | 2008-09-18 | Bridgestone Corp | 光透過性電磁波シールド材及びその製造方法、並びに貴金属の極薄膜を有する微粒子及びその製造方法 |
WO2011118439A1 (ja) * | 2010-03-23 | 2011-09-29 | Jx日鉱日石金属株式会社 | 無電解めっき前処理剤、それを用いる無電解めっき方法及び無電解めっき物 |
JP5518998B2 (ja) * | 2010-03-23 | 2014-06-11 | Jx日鉱日石金属株式会社 | 無電解めっき前処理剤、それを用いる無電解めっき方法及び無電解めっき物 |
US8814997B2 (en) | 2010-03-23 | 2014-08-26 | Jx Nippon Mining & Metals Corporation | Electroless plating pretreatment agent, electroless plating method using same, and electroless plated object |
WO2018147205A1 (ja) * | 2017-02-13 | 2018-08-16 | 東洋炭素株式会社 | めっきの前処理方法、めっき方法、めっき前処理物及びめっき物 |
JPWO2018147205A1 (ja) * | 2017-02-13 | 2019-02-14 | 東洋炭素株式会社 | めっきの前処理方法、めっき方法、めっき前処理物及びめっき物 |
JP2020535322A (ja) * | 2017-09-28 | 2020-12-03 | エスアールジー グローバル リリア ソシエダッド リミターダ | 表面活性化ポリマー |
JP7263332B2 (ja) | 2017-09-28 | 2023-04-24 | エスアールジー グローバル リリア ソシエダッド リミターダ | 表面活性化ポリマー |
Also Published As
Publication number | Publication date |
---|---|
EP1538237A4 (en) | 2006-03-15 |
DE60329501D1 (de) | 2009-11-12 |
EP1538237A1 (en) | 2005-06-08 |
US20050147755A1 (en) | 2005-07-07 |
US7867564B2 (en) | 2011-01-11 |
ATE444381T1 (de) | 2009-10-15 |
JPWO2004024984A1 (ja) | 2006-01-12 |
JP3849946B2 (ja) | 2006-11-22 |
KR20040043153A (ko) | 2004-05-22 |
EP1538237B1 (en) | 2009-09-30 |
KR100568386B1 (ko) | 2006-04-05 |
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