WO2000001862A1 - Agent de pretraitement utilise dans le placage de metal et procede d'utilisation correspondant - Google Patents

Agent de pretraitement utilise dans le placage de metal et procede d'utilisation correspondant Download PDF

Info

Publication number
WO2000001862A1
WO2000001862A1 PCT/JP1999/002180 JP9902180W WO0001862A1 WO 2000001862 A1 WO2000001862 A1 WO 2000001862A1 JP 9902180 W JP9902180 W JP 9902180W WO 0001862 A1 WO0001862 A1 WO 0001862A1
Authority
WO
WIPO (PCT)
Prior art keywords
plating
solution
minutes
electroless
powder
Prior art date
Application number
PCT/JP1999/002180
Other languages
English (en)
Japanese (ja)
Inventor
Hideyuki Mori
Masashi Kumagai
Original Assignee
Japan Energy Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Energy Corporation filed Critical Japan Energy Corporation
Priority to JP54029899A priority Critical patent/JP3277463B2/ja
Priority to TW088111492A priority patent/TW438905B/zh
Publication of WO2000001862A1 publication Critical patent/WO2000001862A1/fr
Priority to HK00108303A priority patent/HK1028907A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
    • C23C18/1831—Use of metal, e.g. activation, sensitisation with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
    • C23C18/1834—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers

Definitions

  • the present invention relates to a method for metal plating by electroless plating on a surface of a material having low conductivity or a mirror-like object or powder, and The present invention relates to a pretreatment agent for metal plating.
  • the electroless metal plating method is one of the methods of forming a metal film on a non-conductive substrate, and as a pretreatment for electroless plating, a noble metal such as palladium is used as a catalyst to adhere to the substrate in advance.
  • a method called activation is generally used.
  • Previously, or to adsorb the P d and immersed in a P d C 1 2 aqueous solution was processed by S n C 1 2 hydrochloric acid aqueous solution,
  • the present invention provides a new metallization by electroless plating that is conventionally not applicable to electroless plating and that can be suitably applied to powder and mirror-like objects.
  • An object of the present invention is to provide a plating method and a metal plating pretreatment agent therefor.
  • the present inventor has found that the problem can be solved by selecting a specific silane coupling agent as the silane coupling agent having the ability to form a complex with the noble metal ion, and reached the present invention. That is, the present invention
  • a metal plating pretreatment agent comprising a silane coupling agent obtained by reacting an azole compound having an active functional group that forms a complex with a noble metal ion with an epoxysilane compound;
  • the present invention relates to a silane coupling agent used to support a noble metal such as Pd, which is a catalyst for electroless plating, on a surface to be covered, that is, the ability to form a complex with a noble metal. It is important to use, as the silane coupling agent having a functional group, a reaction product of an azole compound having an active functional group which forms a complex with the noble metal ion and an epoxysilane compound.
  • Examples of the azo compound include, but are not limited to, pyrrole, indole, imidazole, pyrazole, benzimidazole, indazole and the like.
  • the epoxysilane-based compound is a compound having an epoxy group and an alkoxysilyl group in a molecule, and a general one is ⁇ -glycidoxypropylpyralkoxysilane, but is not limited thereto.
  • the silane coupling agent itself obtained by the reaction of the azole compound and the epoxysilane compound is already known.
  • Japanese Patent Application Laid-Open No. Hei 6-25663 / 58 discloses that an imidazole compound and an epoxysilane are reacted to obtain an imidazole silane compound.
  • the silane coupling agent of this reaction product may be obtained in a state containing intermolecular and intramolecular condensates, but it is not necessary to separate them, and they can be used in a mixture state.
  • This silane coupling agent has characteristics such as high reactivity, the ability to adjust the concentration of the aqueous solution by adjusting the acidity of the aqueous solution, and the ability to give the dissolved solution a certain degree of viscosity. . These things Therefore, a film can be formed with a certain thickness under the substrate of the object to be coated and uniformly using the silane coupling agent.
  • electroless plating can be easily applied to various types of bases, including mirrors and powders that could not be processed without evaporating the solvent, which were difficult with conventional coupling agents represented by conventional aminosilanes.
  • the noble metal include palladium, silver, platinum, and gold that exhibit a catalytic effect when depositing a metal such as copper or nickel on the surface of an object to be plated from an electroless plating solution, with palladium being particularly preferred.
  • the properties of the adherend are not limited.
  • inorganic materials such as glass and ceramics, plastic materials such as polyester, polyamide, polyimide, and fluororesin; insulating plates such as epoxy resin reinforced with films, sheets, fibers, and, if necessary, glass substrates
  • insulators with low conductivity such as insulators such as semiconductors and semiconductors such as Si wafers
  • the objects to be coated are mirror-like objects such as transparent glass plates, Si wafers, and other semiconductor substrates.
  • the method of the present invention can be preferably applied to powders and powders.
  • Such powders include, for example, glass beads, molybdenum disulfide powder, magnesium oxide powder, graphite powder, SiC powder, zirconium oxide powder, alumina powder, gay oxide powder, mica flake, glass fiber, gay nitride Element and Teflon powder.
  • the silane coupling agent When the base to be electrolessly deposited is treated with a silane coupling agent which is a reaction product of the azole compound and the epoxysilane compound as described above, the silane coupling agent may be treated with an appropriate solvent such as water, It can be used for solutions dissolved in methyl alcohol, ethyl alcohol, 2-propanol, acetone, toluene, ethylene glycol, polyethylene glycol, or a mixture thereof.
  • a method of volatilizing the solvent after coating the surface by dipping or brushing is generally used, but the method is not limited to this, and the silane coupling is uniformly applied to the surface. Any method can be used as long as it is a method of attaching an agent.
  • the solvent is volatilized to force
  • the uniform film-forming property of the silane coupling agent allows the silane coupling agent to be adsorbed on the base surface in the re-dipping state
  • a method of filtering off the solvent and drying the wet powder is also possible.
  • the concentration of the silane coupling agent in the solution to be treated is not limited to this, but 0.001 to 10% by weight is easy to use. If the amount is less than 0.001% by weight, the amount of the coupling agent adhering to the surface of the base material tends to be low, and the effect is hardly obtained. On the other hand, if it exceeds 10% by weight, it is difficult to dry the powder due to an excessively large amount of adhesion, and it is easy to cause powder agglomeration. In order to volatilize the solvent used after surface treatment, it is sufficient if the surface can be dried by heating to a temperature higher than the volatilization temperature of this solvent. Heat drying is preferred.
  • the method of chemically plating the surface treated as described above is a known method. That is, it is brought into contact with a solution containing a noble metal ion such as palladium, and the noble metal is captured by the azole group of the coupling agent treated on the base surface. After washing out the solubilizing agents such as excess noble metal salts such as halides and hydrochloric acid, perform chemical plating such as electroless plating.
  • a noble metal ion such as palladium
  • solubilizing agents such as excess noble metal salts such as halides and hydrochloric acid
  • metals such as copper, nickel, 'cobalt, tin, and gold can be plated by electroless plating.
  • electroless plating solution used in the present invention are as follows. There is something.
  • Plating temperature 70 ⁇ 90 ° C 2 Typical example of low temperature electroless copper plating composition
  • a silane coupling agent which is an equimolar reaction product of imidazole and ⁇ -glycidoxyprovirtrimethoxysilane, is added to the surface of the glass plate.
  • spin coating was performed at 500 R R. Thereafter, the plate was dried at 105 ° C for 30 minutes. Furthermore, after immersing for 1 minute at room temperature in Pd activation solution CG-535A (activator I.
  • Nikko Metal Plating Co., Ltd. manufactured by Nikko Metal Plating Co., Ltd.
  • Nicom 7N electroless nickel plating solution manufactured by Nikko Metal Plating Co., Ltd.
  • the electroless nickel plating solution uniformly deposited a glossy film on the entire surface of the glass, and it was confirmed that the electroless nickel plating solution had good adhesion without peeling off with a cellophane tape.
  • a 1 mm thick slide glass plate was immersed in a mixture of fluorine and nitric acid (100 ml / L hydrofluoric acid, 100 ml / L nitric acid) at 25 ° C for 10 minutes to roughen the surface.
  • This glass plate is treated with an alkaline degreasing solution, immersed in a Pd activation treatment solution CG-535A for 1 minute at room temperature, washed with about 100 ml of deionized water, and washed at 105 ° C After drying for 30 minutes, the precious metal activation treatment was performed on the glass plate surface. Next, it was immersed in 7 N of an electroless nickel plating solution at 80 ° C for 4 minutes. Electroless nickel plating hardly precipitated on the glass plate.
  • an aminosilane coupling agent KBM-903 ( ⁇ -aminoprovir trimethoxysilane manufactured by Shin-Etsu Chemical Co., Ltd.) was added to the surface of the glass plate.
  • Spin coating was performed at 500 RPM using a 2-propanol solution containing 4% by weight. Thereafter, the plate was dried at 105 ° C. for 30 minutes.
  • Pd activation solution CG-535A for 1 minute at room temperature, washing with about 100 ml of deionized water and drying with 105 for 30 minutes, precious metal activation treatment on the glass plate surface was done. Next, it was immersed for 4 minutes at 80 ° C in 2N 7N, an electroless nickel plating solution. Electroless nickel The plating was deposited only on a part of the glass plate.
  • Example 2 To promote the hydrolysis-condensation reaction, a solution of a mixture of water and an equal amount of 2-propanol to which a trace amount of hydrochloric acid is added is added with 0.4% by weight of the aminosilane coupling agent KBM-903 and a concentration of 10%. A solution in which 4% by weight (Comparative Example 5) was dissolved was prepared, and a noble metal activation treatment was performed in the same manner as in Comparative Example 3, followed by electroless nickel plating. In all cases, electroless nickel plating was sparsely deposited on about half of the glass plate.
  • Example 2 A solution in which 4% by weight (Comparative Example 5) was dissolved was prepared, and a noble metal activation treatment was performed in the same manner as in Comparative Example 3, followed by electroless nickel plating. In all cases, electroless nickel plating was sparsely deposited on about half of the glass plate.
  • Comparative Example 5 A solution in which 4% by weight (Comparative Example 5) was dissolved was prepared, and a
  • the PET film (trade name: Diafoil) was ultrasonically cleaned in 2-propanol for 5 minutes to degrease the surface, and then dried at 105 ° C for 10 minutes.
  • this film was coated with 4 weight parts of a silane coupling agent, which is an equimolar reaction product of imidazole and ⁇ -glycidoxypropyltriethoxysilane. After immersion in a 2-propanol solution containing / 0 for 1 minute, the mixture was dried at 105 with agitation for 10 minutes.
  • a silane coupling agent which is an equimolar reaction product of imidazole and ⁇ -glycidoxypropyltriethoxysilane.
  • this laminate was immersed in Pd activation treatment solution CG-5335A for 1 minute at room temperature, washed with deionized water, dried at 105 ° C for 60 minutes, and the noble metal was placed on the laminate surface.
  • An activation process was performed.
  • this plate was immersed for 2 minutes at 80 ° C in 2N 7N, an electroless Nigel plating solution, electroless nickel plating was uniformly deposited on the laminate.
  • the same precious metal activation treatment When the laminated board was immersed in electroless copper plating solution KC-500 at 70 ° C for 30 minutes, copper was uniformly deposited on the surface.
  • Glass beads of about 1.5 mm in diameter are dissolved in a 2-propanol solution containing 0.08 g of a 2-propanol solution containing 0.4% by weight of aminosilane coupling agent K BM-903 for 1 minute. Immerse. After filtering the liquid, it is dried at 105 ° C for 30 minutes. Next, this glass bead is immersed in 50 ml of Pd activation solution CG-535A at room temperature for 1 minute, and the activation solution is filtered and further washed with 50 ml of deionized water. Dry at 30 ° C for 30 minutes and apply precious metal sexualized. This glass bead is electroless nickel plating solution
  • molybdenum disulfide powder having an average particle diameter of 50 microns was dissolved in 0.1 g of a silane coupling agent, which is an equimolar reaction product of imidazole and ⁇ -glycidoxypropyltrimethoxysilane. Stir for 10 minutes at room temperature in 0 ml of 2-propanol solution. After distilling off the solvent, 2-propanol, dry at 105 ° C for 60 minutes. Next, the molybdenum disulfide powder is stirred in 50 ml of Pd activation solution CG-5335A at room temperature for 20 minutes, and the activated solution is removed by filtration and further washed with 50 ml of deionized water.
  • a silane coupling agent which is an equimolar reaction product of imidazole and ⁇ -glycidoxypropyltrimethoxysilane.
  • the molybdenum disulfide powder was plated at 72 ° C using an electroless copper plating solution KC-500. A 1 wt% electroless copper plating resulted in a uniform copper plating film on the powder surface and completely covered the underlying molybdenum disulfide.
  • molybdenum disulfide powder having an average particle diameter of 50 microns was stirred in 50 ml of Pd activation solution CG-535A at room temperature for 20 minutes, the activation solution was removed by filtration and another 50 ml of After washing with deionized water, the powder was dried at 105 ° C. for 60 minutes to activate the noble metal on the powder surface.
  • the molybdenum disulfide powder was plated at 72 ° C. using an electroless copper plating solution KC'-500, but almost no copper plating film was formed due to the electroless copper plating.
  • a silane coupling agent which is an equimolar reaction product of imidazole and ⁇ -glycidoxypropyltriethoxysilane
  • the surface was precious metal activated.
  • the magnesium oxide powder was plated at 72 ° C. using an electroless copper plating solution KC-500. A uniform copper plating film was formed on the powder surface by electroless copper plating of only 1 wt%, and the underlying magnesium oxide was completely covered.
  • 25 g of natural graphite powder having an average particle size of 100 microns is used as a silane coupling agent which is an equimolar reaction product of 2-ethyl-4-methylimidazole and ⁇ -glycidoxypropyltrimethoxysilane 0.1 Stir at room temperature for 10 minutes in 50 ml of ethanol solution of g dissolved. After distilling off 2-propanol as the solvent, the residue is dried at 105 ° C for 30 minutes. Next, this graphite powder was stirred at room temperature for 20 minutes in a Pd activation treatment solution CG-535A at 100 m1, and the activation treatment solution was filtered off to remove 50 ml of deionized water.
  • a silane coupling agent which is an equimolar reaction product of 2-ethyl-4-methylimidazole and ⁇ -glycidoxypropyltrimethoxysilane 0.1
  • the powder After washing with water, the powder was dried at 105 ° C for 30 minutes, and the surface of the powder was activated with a noble metal.
  • This graphite powder was plated at 72 ° C. using an electroless copper plating liquid KC-500. A uniform copper plating film was formed on the powder surface by electroless copper plating at 6 wt%.
  • the graphite powder, which has been activated with a noble metal is immersed in the electroless nickel plating solution Ncom 7 N at 80 ° C for 4 minutes, the electroless nickel plating precipitates almost uniformly on the surface and the color of the powder changes. The color changed from black to gray, and the base was completely covered with Nigel.
  • SiC powder having an average particle size of 70 microns dissolved in 0.2 g of a silane coupling agent, which is an equimolar reaction product of imidazole and ⁇ -glycidoxypropyltrimethoxysilane Is stirred at room temperature for 10 minutes. After distilling off the solvent methanol, it is dried at 105 ° C for 30 minutes. Next, the SiC powder was stirred at room temperature for 20 minutes in a Pd activation treatment solution CG-5335A100 ml, and the activation treatment solution was filtered and a further 100 ml of desiccant was removed. Washed with ionized water Thereafter, drying was performed at 105 ° C.
  • a silane coupling agent which is an equimolar reaction product of imidazole and ⁇ -glycidoxypropyltrimethoxysilane Is stirred at room temperature for 10 minutes. After distilling off the solvent methanol, it is dried at 105 ° C for 30 minutes. Next
  • the SiC powder was plated at 72 ° C using an electroless copper plating solution KC-500. With only 1 wt% of electroless copper plating, a uniform copper plating film was formed on the powder surface, resulting in a complete copper powder and complete coverage of the green SiC.
  • the activated solution is filtered. Further, the powder surface was washed with 100 ml of deionized water, dried at 105 ° C. for 30 minutes, and the surface of the powder was activated with a noble metal.
  • the SiC powder was plated at 72 ° C. using an electroless copper plating solution KC-500. Electroless copper plating was formed on the powder surface, but could not cover more than 20% of the SiC powder.
  • zirconium oxide powder having an average particle diameter of 30 microns is dissolved in 0.2 g of a silane coupling agent which is an equimolar reaction product of 2-methylimidazole and ⁇ -glycidoxypropyltriethoxysilane.
  • a silane coupling agent which is an equimolar reaction product of 2-methylimidazole and ⁇ -glycidoxypropyltriethoxysilane.
  • the mixture was stirred for 10 minutes at room temperature in a 100 ml methanol solution. After evaporating the solvent methanol, dry at 105 ° C for 30 minutes.
  • the zirconium oxide powder was stirred in 100 ml of Pd activation treatment solution CG-5335A at room temperature for 20 minutes, and the activation treatment solution was filtered, followed by further deionization of 1 ⁇ 0 m1.
  • the powder surface was dried at 105 ° C for 3 minutes, and the surface of the powder was activated with a precious metal.
  • this zirconium oxide powder was immersed in the electroless nickel plating solution 2N 7N at 80 ° C for 4 minutes, the electroless nickel plating was deposited almost uniformly on the zirconium oxide surface, and the base was completely covered.
  • a silane coupling agent which is an equimolar reaction product of imidazole and ⁇ -glycidoxypropyltrimethoxysilane.
  • a silane coupling agent which is an equimolar reaction product of imidazole and ⁇ -glycidoxypropyltrimethoxysilane.
  • the yarn was immersed in 50 ml of Pd activation treatment solution CG-135A at room temperature for 20 minutes, and the activation treatment solution was filtered and further washed with 50 ml of deionized water.
  • the yarn was dried at 05 ° C for 30 minutes to activate the noble metal on the surface of the yarn.
  • the electroless nickel plating method can be suitably applied to mirror-like objects and powders which are difficult to be applied by the conventional method. Electroless plating can be performed, and there is no restriction on the properties and shape of the object to be plated.

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

L'invention concerne un procédé de revêtement métallique non électrolytique pouvant être facilement appliqué sur une poudre ou un substrat tel qu'un miroir, et un agent de prétraitement destiné à être utilisé dans ce procédé. Cet agent de prétraitement comprend un agent de couplage du silane obtenu en faisant réagir avec un composé époxylane un composé de type azole possédant un groupe fonctionnel actif capable de former un complexe avec un métal noble. Le substrat devant être plaqué est soumis à une préparation de sa surface à l'aide de l'agent de prétraitement, puis est traité avec une solution contenant un ion de métal noble, et est enfin soumis à un placage non électrolytique de façon à obtenir un produit plaqué.
PCT/JP1999/002180 1998-07-07 1999-04-23 Agent de pretraitement utilise dans le placage de metal et procede d'utilisation correspondant WO2000001862A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP54029899A JP3277463B2 (ja) 1998-07-07 1999-04-23 金属めっき前処理剤、およびそれを用いる金属めっき方法
TW088111492A TW438905B (en) 1998-07-07 1999-07-07 Metal plating pertreatment agent and metal plating method using the same
HK00108303A HK1028907A1 (en) 1998-07-07 2000-12-21 Pretreating agent for metal plating, and method for metal plating using the same.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP19160198 1998-07-07
JP10/191601 1998-07-07

Publications (1)

Publication Number Publication Date
WO2000001862A1 true WO2000001862A1 (fr) 2000-01-13

Family

ID=16277362

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1999/002180 WO2000001862A1 (fr) 1998-07-07 1999-04-23 Agent de pretraitement utilise dans le placage de metal et procede d'utilisation correspondant

Country Status (6)

Country Link
JP (1) JP3277463B2 (fr)
KR (1) KR100367164B1 (fr)
CN (1) CN1195099C (fr)
HK (1) HK1028907A1 (fr)
TW (1) TW438905B (fr)
WO (1) WO2000001862A1 (fr)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002047573A (ja) * 2000-08-01 2002-02-15 Nikko Materials Co Ltd 銀めっき前処理剤および銀めっき方法
WO2004024984A1 (fr) * 2002-09-10 2004-03-25 Nikko Materials Co., Ltd. Procede de galvanoplastie et agent de pre-traitement
WO2006135113A1 (fr) * 2005-06-17 2006-12-21 Sumitomo Metal Mining Co., Ltd. Liquide d'enduction destiné à former une pellicule de nickel, pellicule de nickel et procédé pour la produire
KR100779334B1 (ko) 2000-11-08 2007-11-23 제이에프이 스틸 가부시키가이샤 표면 처리 주석 도금 강판 및 화성 처리액
JP2010168612A (ja) * 2009-01-21 2010-08-05 Fujitsu Ltd 無電解めっき物の製造方法
JP2012007244A (ja) * 2004-09-10 2012-01-12 Jx Nippon Mining & Metals Corp 無電解めっき前処理剤及びフレキシブル基板用銅張り積層体
US8697233B2 (en) 2006-03-07 2014-04-15 Nara Institute Of Science And Technology Metal-coated lipid bilayer vesicles and process for producing same
JP2019529710A (ja) * 2016-09-16 2019-10-17 アトテック ドイチェランド ゲーエムベーハー 基板の表面に多層コーティングを提供するための方法
JP2020023734A (ja) * 2018-08-07 2020-02-13 株式会社豊光社 めっき処理されたガラス基材の製造方法
CN111910231A (zh) * 2020-07-22 2020-11-10 东莞市百镀通五金电镀实业有限公司 一种玻纤增强塑胶粗化处理用粗化液及粗化方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4270517B2 (ja) * 2003-06-09 2009-06-03 日鉱金属株式会社 無電解めっき方法及び金属めっき物
TWI427026B (zh) * 2008-06-10 2014-02-21 Hon Hai Prec Ind Co Ltd 奈米碳管之金屬鍍層方法
US9499912B2 (en) 2014-05-26 2016-11-22 Rohm And Haas Electronic Materials Llc Copolymers of diglycidyl ether terminated polysiloxane compounds and non-aromatic polyamines
JP7457645B2 (ja) * 2018-03-09 2024-03-28 株式会社有沢製作所 積層体及びその製造方法
CN111826643B (zh) * 2020-07-14 2023-05-12 华东理工大学 一种改性金属表面活化镀铜提高镀层结合力的方法
CN113445031B (zh) * 2021-06-24 2022-07-08 广东硕成科技股份有限公司 一种金属活性剂及其制备方法
CN117385346B (zh) * 2023-12-12 2024-02-23 江苏中科智芯集成科技有限公司 一种晶圆中的铜基化学镀镍钯金的方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05239657A (ja) * 1992-02-27 1993-09-17 Mitsubishi Gas Chem Co Inc 耐湿性銅張基板の製造法
JPH07102380A (ja) * 1993-09-30 1995-04-18 Nisshinbo Ind Inc ガラス繊維のメッキ前処理方法
JPH0839728A (ja) * 1994-07-27 1996-02-13 Sumitomo Metal Mining Co Ltd 金属張積層基板の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2780373B2 (ja) * 1989-09-07 1998-07-30 三菱瓦斯化学株式会社 α―ヒドロキシカルボン酸アミドの製造法
JPH06256358A (ja) * 1993-03-01 1994-09-13 Japan Energy Corp 新規イミダゾールシラン化合物及びその製造方法並びにそれを用いる金属表面処理剤

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05239657A (ja) * 1992-02-27 1993-09-17 Mitsubishi Gas Chem Co Inc 耐湿性銅張基板の製造法
JPH07102380A (ja) * 1993-09-30 1995-04-18 Nisshinbo Ind Inc ガラス繊維のメッキ前処理方法
JPH0839728A (ja) * 1994-07-27 1996-02-13 Sumitomo Metal Mining Co Ltd 金属張積層基板の製造方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002047573A (ja) * 2000-08-01 2002-02-15 Nikko Materials Co Ltd 銀めっき前処理剤および銀めっき方法
KR100779334B1 (ko) 2000-11-08 2007-11-23 제이에프이 스틸 가부시키가이샤 표면 처리 주석 도금 강판 및 화성 처리액
WO2004024984A1 (fr) * 2002-09-10 2004-03-25 Nikko Materials Co., Ltd. Procede de galvanoplastie et agent de pre-traitement
US7867564B2 (en) 2002-09-10 2011-01-11 Nippon Mining & Metals Co., Ltd. Metal plating method and pretreatment agent
JP2012007244A (ja) * 2004-09-10 2012-01-12 Jx Nippon Mining & Metals Corp 無電解めっき前処理剤及びフレキシブル基板用銅張り積層体
WO2006135113A1 (fr) * 2005-06-17 2006-12-21 Sumitomo Metal Mining Co., Ltd. Liquide d'enduction destiné à former une pellicule de nickel, pellicule de nickel et procédé pour la produire
US8007692B2 (en) 2005-06-17 2011-08-30 Sumitomo Metal Mining Co., Ltd. Coating liquid for nickel film formation, nickel film, and production method thereof
US8697233B2 (en) 2006-03-07 2014-04-15 Nara Institute Of Science And Technology Metal-coated lipid bilayer vesicles and process for producing same
JP2010168612A (ja) * 2009-01-21 2010-08-05 Fujitsu Ltd 無電解めっき物の製造方法
JP2019529710A (ja) * 2016-09-16 2019-10-17 アトテック ドイチェランド ゲーエムベーハー 基板の表面に多層コーティングを提供するための方法
JP2020023734A (ja) * 2018-08-07 2020-02-13 株式会社豊光社 めっき処理されたガラス基材の製造方法
CN111910231A (zh) * 2020-07-22 2020-11-10 东莞市百镀通五金电镀实业有限公司 一种玻纤增强塑胶粗化处理用粗化液及粗化方法

Also Published As

Publication number Publication date
CN1195099C (zh) 2005-03-30
TW438905B (en) 2001-06-07
JP3277463B2 (ja) 2002-04-22
CN1262711A (zh) 2000-08-09
HK1028907A1 (en) 2001-03-09
KR100367164B1 (ko) 2003-01-06

Similar Documents

Publication Publication Date Title
KR100495164B1 (ko) 도금 전처리제 및 그것을 사용한 금속도금 방법
US7867564B2 (en) Metal plating method and pretreatment agent
WO2000001862A1 (fr) Agent de pretraitement utilise dans le placage de metal et procede d'utilisation correspondant
JP3670238B2 (ja) 金属めっき方法、前処理剤、それを用いた半導体ウェハー及び半導体装置
JPWO2003091476A1 (ja) 無電解めっき方法及び金属めっき層が形成された半導体ウエハー
EP1760171B1 (fr) Agent de pretraitement pour deposition autocatalytique et methode de deposition autocatalytique utilisant le meme agent
US7045461B2 (en) Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these
JP4270517B2 (ja) 無電解めっき方法及び金属めっき物
JP2002121679A (ja) 導電性ビーズの製造方法
JP2001295058A (ja) メタライジング基板の製造方法
JP4836312B2 (ja) 銀めっき前処理剤および銀めっき方法
WO2003002780A1 (fr) Agent de traitement de surface, surface d'un article ainsi traitee et procede de nickelage a l'aide dudit agent
JPH0258356B2 (fr)
JP3105502B1 (ja) 貴金属ゾル及びその製造方法
JP2003193245A (ja) めっき前処理剤、及びそれを用いた無電解めっき方法
JP2003041374A (ja) 表面処理剤、およびそれを用いた表面処理物
JPH01222063A (ja) 金属めっきされたセラミックス成型体の製造方法

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 99800009.4

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 1019997008155

Country of ref document: KR

AK Designated states

Kind code of ref document: A1

Designated state(s): CN JP KR

WWP Wipo information: published in national office

Ref document number: 1019997008155

Country of ref document: KR

WWG Wipo information: grant in national office

Ref document number: 1019997008155

Country of ref document: KR