ATE291106T1 - Verfahren zur chemischen vernickelung - Google Patents

Verfahren zur chemischen vernickelung

Info

Publication number
ATE291106T1
ATE291106T1 AT01992803T AT01992803T ATE291106T1 AT E291106 T1 ATE291106 T1 AT E291106T1 AT 01992803 T AT01992803 T AT 01992803T AT 01992803 T AT01992803 T AT 01992803T AT E291106 T1 ATE291106 T1 AT E291106T1
Authority
AT
Austria
Prior art keywords
substrates
nickel plating
treated
plating bath
electroless
Prior art date
Application number
AT01992803T
Other languages
English (en)
Inventor
Mariola Brandes
Hermann Middeke
Brigitte Dyrbusch
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Application granted granted Critical
Publication of ATE291106T1 publication Critical patent/ATE291106T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
AT01992803T 2000-11-01 2001-10-04 Verfahren zur chemischen vernickelung ATE291106T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10054544A DE10054544A1 (de) 2000-11-01 2000-11-01 Verfahren zum chemischen Metallisieren von Oberflächen
PCT/EP2001/011468 WO2002036853A1 (en) 2000-11-01 2001-10-04 Method for electroless nickel plating

Publications (1)

Publication Number Publication Date
ATE291106T1 true ATE291106T1 (de) 2005-04-15

Family

ID=7662047

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01992803T ATE291106T1 (de) 2000-11-01 2001-10-04 Verfahren zur chemischen vernickelung

Country Status (11)

Country Link
US (1) US6902765B2 (de)
EP (1) EP1343921B1 (de)
JP (1) JP3929399B2 (de)
CN (1) CN1314835C (de)
AT (1) ATE291106T1 (de)
AU (1) AU2002216953A1 (de)
CA (1) CA2425575A1 (de)
DE (2) DE10054544A1 (de)
ES (1) ES2237615T3 (de)
TW (1) TWI253481B (de)
WO (1) WO2002036853A1 (de)

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JP3881614B2 (ja) * 2002-05-20 2007-02-14 株式会社大和化成研究所 回路パターン形成方法
US7166152B2 (en) * 2002-08-23 2007-01-23 Daiwa Fine Chemicals Co., Ltd. Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method
US7407689B2 (en) 2003-06-26 2008-08-05 Atotech Deutschland Gmbh Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys
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US7410899B2 (en) * 2005-09-20 2008-08-12 Enthone, Inc. Defectivity and process control of electroless deposition in microelectronics applications
DE102005051632B4 (de) 2005-10-28 2009-02-19 Enthone Inc., West Haven Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen
US7297373B2 (en) * 2005-11-18 2007-11-20 Noble Fiber Technologies, Llc Conductive composites
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US20070235876A1 (en) * 2006-03-30 2007-10-11 Michael Goldstein Method of forming an atomic layer thin film out of the liquid phase
US8193087B2 (en) * 2006-05-18 2012-06-05 Taiwan Semiconductor Manufacturing Co., Ltd. Process for improving copper line cap formation
US20080003366A1 (en) * 2006-06-30 2008-01-03 Dubin Valery M Method of forming a conducting layer on a conducting and non-conducting substrate
US20080175986A1 (en) * 2007-01-24 2008-07-24 Kenneth Crouse Second surface metallization
KR101058635B1 (ko) * 2008-12-23 2011-08-22 와이엠티 주식회사 무전해 니켈 도금액 조성물, 연성인쇄회로기판 및 이의 제조 방법
CN102892924B (zh) * 2009-07-03 2015-02-18 恩索恩公司 包括β-氨基酸的电解质以及用于沉积金属层的方法
EP2270255A1 (de) * 2009-07-03 2011-01-05 Enthone, Inc. Beta-Aminosäure enthaltend Elektrolyt und Verfahren zur Ablagerung einer Metallschicht
FR2958944B1 (fr) * 2010-04-19 2014-11-28 Pegastech Procede de revetement d'une surface d'un substrat en materiau non metallique par une couche metallique
MY166049A (en) * 2010-09-03 2018-05-22 Omg Electronic Chemicals Llc Electroless nickel alloy plating bath and process for depositing thereof
US20120126181A1 (en) * 2010-11-22 2012-05-24 Whitcomb David R Nanowire preparation methods, compositions, and articles
US9327348B2 (en) 2010-11-22 2016-05-03 Junping Zhang Nanowire preparation methods, compositions, and articles
US8613888B2 (en) 2010-11-23 2013-12-24 Carestream Health, Inc. Nanowire preparation methods, compositions, and articles
DE102011000138A1 (de) 2011-01-14 2012-07-19 Lpkf Laser & Electronics Ag Verfahren zur selektiven Metallisierung eines Substrats sowie ein nach diesem Verfahren hergestellter Schaltungsträger
US20130084395A1 (en) * 2011-09-29 2013-04-04 Roshan V. Chapaneri Treatment of Plastic Surfaces After Etching in Nitric Acid Containing Media
EP2610365B1 (de) * 2011-12-31 2020-02-26 Rohm and Haas Electronic Materials LLC Stromloses abscheidungsverfahren
US20130209689A1 (en) * 2012-02-15 2013-08-15 Mark Wojtaszek Sulfonation of Plastic and Composite Materials
EP2657367B1 (de) 2012-04-24 2015-11-25 Enthone Inc. Vorätzzusammensetzung und Ätzverfahren für Kunststoffsubstrate
LT6070B (lt) * 2012-12-07 2014-09-25 Atotech Deutschland Gmbh Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas
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Also Published As

Publication number Publication date
EP1343921A1 (de) 2003-09-17
AU2002216953A1 (en) 2002-05-15
CA2425575A1 (en) 2002-05-10
ES2237615T3 (es) 2005-08-01
CN1473207A (zh) 2004-02-04
DE60109486D1 (de) 2005-04-21
CN1314835C (zh) 2007-05-09
JP2004513229A (ja) 2004-04-30
US20040086646A1 (en) 2004-05-06
US6902765B2 (en) 2005-06-07
WO2002036853A1 (en) 2002-05-10
DE60109486T2 (de) 2006-04-06
JP3929399B2 (ja) 2007-06-13
EP1343921B1 (de) 2005-03-16
DE10054544A1 (de) 2002-05-08
TWI253481B (en) 2006-04-21

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