LT6070B - Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas - Google Patents
Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas Download PDFInfo
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- LT6070B LT6070B LT2012110A LT2012110A LT6070B LT 6070 B LT6070 B LT 6070B LT 2012110 A LT2012110 A LT 2012110A LT 2012110 A LT2012110 A LT 2012110A LT 6070 B LT6070 B LT 6070B
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- Prior art keywords
- solution
- etching
- chemical metallization
- plastic surface
- plastics
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- 239000004033 plastic Substances 0.000 title claims abstract description 35
- 229920003023 plastic Polymers 0.000 title claims abstract description 35
- 239000000126 substance Substances 0.000 title claims abstract description 15
- 238000001465 metallisation Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000002360 preparation method Methods 0.000 title abstract description 10
- 239000000243 solution Substances 0.000 claims abstract description 51
- 238000005530 etching Methods 0.000 claims abstract description 38
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 16
- XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical compound [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 claims abstract description 12
- 150000003682 vanadium compounds Chemical class 0.000 claims abstract description 10
- 230000004913 activation Effects 0.000 claims abstract description 6
- 239000007800 oxidant agent Substances 0.000 claims abstract description 6
- 230000001590 oxidative effect Effects 0.000 claims abstract description 6
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims abstract description 5
- 150000002940 palladium Chemical class 0.000 claims abstract description 4
- 239000012266 salt solution Substances 0.000 claims abstract description 3
- 229940005989 chlorate ion Drugs 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 24
- 238000000576 coating method Methods 0.000 abstract description 16
- 229910052759 nickel Inorganic materials 0.000 abstract description 9
- 241000575946 Ione Species 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 12
- 239000004417 polycarbonate Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- 229920001944 Plastisol Polymers 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 150000002941 palladium compounds Chemical class 0.000 description 3
- 239000004999 plastisol Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 238000005234 chemical deposition Methods 0.000 description 2
- -1 chlorate ions Chemical class 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- 206010007269 Carcinogenicity Diseases 0.000 description 1
- 101150003085 Pdcl gene Proteins 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000007670 carcinogenicity Effects 0.000 description 1
- 231100000260 carcinogenicity Toxicity 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000006223 plastic coating Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/06—Coating with compositions not containing macromolecular substances
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
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- C23C18/405—Formaldehyde
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- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
- C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
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- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
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Abstract
Išradimas priskiriamas prie plastikų paviršiaus paruošimo prieš cheminį metalizavimą ir gali būti panaudotas įvairiose pramonės srityse, kur reikalingos dekoratyvinės arba funkcinės metalų dangos ant plastikų. Siūlomo išradimo tikslas yra kokybiškas plastikų paviršiaus paruošimas prieš cheminį metalizavimą, naudojant karštą chloratinį ėsdinimo tirpalą, ir tuo išsaugant aukštas nikelio dangos sukibimo su plastiku reikšmes. Tikslas pasiekiamas tuo, kad plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas, apimantis paviršiaus ėsdinimą chlorato jonų ir papildomo oksidatoriaus turinčiame sieros rūgšties tirpale ir po jo sekantį apdorojimą šarminio metalo hidroksidų turinčiame tirpale, aktyvavimą paladžio druskos tirpale bei apdorojimą redukuojančiame arba akceleruojančiame tirpale, papildomai į ėsdinimo tirpalą įveda 0,1-8 g/l vanadžio junginio, o ėsdinimą atlieka 20-65 oC temperatūroje.
Description
Išradimas priskiriamas prie plastikų paviršiaus paruošimo prieš cheminį metalizavimą ir gali būti panaudotas įvairiose pramones srityse, kur reikalingos dekoratyvinės arba funkcinės metalų dangos ant plastikinių detalių.
Tradicinį plastikų paviršiaus paruošimo prieš cheminį metalizavimą būdą, dažniausiai cheminį nikeliavimą, sudaro ėsdinimas chromo rūgšties tirpale, po to sekantis aktyvinimas paladžio junginių joniniame arba koloidiniame tirpale ir adsorbuotų ant plastiko paviršiaus paladžio jonų arba paladžio koloidinių dalelių atitinkamai redukavimas dažniausiai natrio hipofosfito tirpale arba akceleracija rūgščiame, dažniausiai druskos rūgšties, tirpale.
Ėsdinimas reikalingas suteikti paviršiui hidrofiliškumą, kad kitose proceso stadijose jis drėkintųsi vandeniniais tirpalais, adsorbuodamas pakankamus paladžio druskų kiekius, ir užtikrinti gerą metalo dangos sukibimą su plastiku. Aktyvavimas su po to sekančiu redukavimu arba akceleracija atliekamas tam, kad inicijuoti cheminio metalo nusėdimo ant plastiko pradžią. Po to dengimasis metalu cheminio metalizavimo tirpale jau vyksta autokatalitiškai, t.y. išsėdęs iš tirpalo metalas katalizuoja tolimesnį metalo nusėdimą.
Pagrindiniai tradicinio būdo trūkumai yra chromo rūgšties ėsdinimo tirpale kancerogeniškumas bei dažnai pasitaikantis cheminis metalo, dažniausiai nikelio, nusėdimas ant izoliuotų plastizoliu pakabos dalių, dėl ko patiriami metalų nuostoliai toliau sekančio galvaninio dangos formavimo tirpaluose. Artimiausias siūlomam išradimui yra plastikų paviršiaus paruošimo būdas (žiūr. LR išradimo paraiška 2012 042, padavimo data 2012-06-05), apimantis plastiko ėsdinimą kambario temperatūros 0,5-5 g/l tirpaus chlorato tirpale 50-80 tūrio % sieros rūgštyje ir po to sekantį apdorojimą šarminių metalų hidroksidų tirpale. Ėsdinimo tirpalas papildomai turi, be chlorato, kito oksidatoriaus, kurio standartinis oksidacinis potencialas viršija chlorato jonų potencialą. Po apdorojimo šarminių metalų hidroksidų tirpale plastikas aktyvuojamas paladžio junginių tirpale, toliau išlaikomas redukuojančiame arba akseleruojančiame tirpale ir nikeliuojamas cheminio nikeliavimo tirpale. Būdo teigiami bruožai yra didelės nikelio dangos su plastiku sukibimo reikšmės ir tai, kad plastizoliu padengta plastikų detalizavimo įranga išlieka nepasidengusi nikelio danga.
Būdo trūkumas - ėsdinimo tirpalo savybė absorbuoti iš aplinkos oro vandens garus ir tokiu būdu prasiskiedžiant, praranda efektyvaus ėsdinimo savybes. Šios problemos sprendimas būtų ėsdinimo tirpalo temperatūros didinimas iki lygio, kai oro drėgmės absorbciją kompensuoja vandens garavimas iš tirpalo. Tačiau tais atvejais, kai ėsdinimo tirpalo temperatūra viršija 30 °C, gaunamos nikelio dangos sukibimo su plastiku reikšmės yra žymiai mažesnės ir netgi gali kristi iki nulio.
Siūlomo išradimo tikslas yra kokybiškas plastikų paviršiaus paruošimas prieš cheminį metalizavimą, naudojant karštą chloratinj ėsdinimo tirpalą, ir tuo išsaugant aukštas nikelio dangos sukibimo su plastiku reikšmes.
Tikslas pasiekiamas tuo, kad plastikų paviršiaus paruošimo prieš jų cheminj metalizavimą būdas, apimantis paviršiaus ėsdinimą chlorato jonų ir papildomo oksidatoriaus turinčiame sieros rūgšties tirpale ir po jo sekantį apdorojimą šarminio metalo hidroksidų turinčiame tirpale, aktyvavimą paladžio druskos tirpale bei apdorojimą redukuojančiame arba akceleruojančiame tirpale, papildomai į ėsdinimo tirpalą įveda 0,1-8 g/l vanadžio junginio, o ėsdinimą atlieka 20-65 °C temperatūroje.
Įeinantis j ėsdinimo tirpalo sudėtj vanadžio junginys dalyvauja plastiko ėsdinimo procese tiek kaip papildomas plastiko paviršių oksiduojantis agentas, tiek kaip katalizatorius chlorato jonų oksiduojamajam veikimui. Turintį vanadžio junginio ėsdinimo tirpalą naudoja esant 20-65 °C temperatūrai, o gaunamų ant plastiko nikelio dangų adhezijos reikšmės yra ne žemesnės, negu prototipo. Be to, toks tirpalas, naudojant jį aukštesnės temperatūros, gali būti labiau praskiestas sieros rūgšties atžvilgiu ir todėl pigesnis ir saugesnis darbe.
Svarbus siūlomo būdo bruožas, besiskiriantis nuo prototipo, yra galimybė efektyviau ėsdinti liedinimo alyvomis užterštus plastikų paviršius, kadangi aukštoje temperatūroje liedinimo alyvas chemiškai suardo (oksiduoja) ėsdinimo tirpalo komponentai ir alyvos nebetrukdo ėsdinimo procesui.
Pavyzdžiai
Plastikus ABS (akrilo-nitril-butadien-stirolo kopolimeras) ir PC/ABS (55 % akrilo-nitril-butadien-stirolo kopolimero ir 45 % polikarbonato mišinys) ėsdina 5 min 120 g/l KCIO3 ir 10 g/l papildomo oksidatoriaus KJO4 turinčioje 30-70 tūrio % sieros rūgštyje 20 °C, 40 °C ir 65 °C temperatūroje arba ėsdina tokios pat kompozicijos tirpale tomis pat sąlygomis, tačiau į tirpalą papildomai įvedus 0,1-10 g/l tirpaus vanadžio junginio. Po ėsdinimo plastikus pamerkia 2 min. j kambario temperatūros neutralizavimo tirpalą, turintį 10 g/l NaOH ir toliau aktyvuoja tikrajame (5 min esant 20 °C temperatūrai) paladžio junginių tirpale. Tikrajame tirpale PdCI2 koncentracija yra 0,1 g/l, tirpalo pH 2,7. Po aktyvacijos tikrajame Pd tirpale plastikus išlaiko 5 min, esant 60 °C temperatūrai bei turinčiame 20 g/l natrio hipofosfito, pH 9. Po to plastikus dengia cheminiu nikeliu pagal kompanijos D0W Chemicals technologiją NipositPM. Dengimosi kokybę vertina pagal dangos sukibimo su plastiku stiprumą (adheziją). Adhezijai įvertinti Ni dangos sluoksnis storinamas galvaninėje variavimo vonioje ir matuojama jėga, reikalinga atplėšti 1 cm pločio dangos juostelei nuo plastiko (kg/cm). Plastikų paruošimo metalizacijai sąlygos ir metalizacijos (cheminio nikeliavimo) rezultatai pateikti Lentelėje.
Iš pateiktų 1 ir 2 pavyzdžių matosi, kad ėsdinimo tirpalas, neturintis savo sudėtyje vanadžio junginių, ABS plastiko ėsdinimui gali būti naudojamas tik kambario temperatūroje. Esant aukštesnei ėsdinimo tirpalo temperatūrai, pavyzdžiui 40 oC, gaunamų ant ABS Ni dangų adhezija yra artima nuliui. Tuo atveju, jeigu ėsdinimo tirpale yra vanadžio junginio (3 ir 4 pavyzdžiai) Ni dangos adhezija su ABS ėsdinant aukštesnės temperatūros tirpale yra ne mažesnė negu nesant tirpale vanadžio junginio ir ėsdinant kambario temperatūroje. Iš pateiktų 5, 6 ir 7 pavyzdžių matosi, kad tie patys dėsningumai esant arba nesant ėsdinimo tirpale vanadžio junginio, pasireiškia ir ėsdinant PC/ABS plastiką. Iš 8, 9, 10 ir 11 pavyzdžių duomenų matosi, kad sieros rūgšties koncentracija ėsdinimo tirpale gali būti sumažinta iki 30 tūrio %, jeigu ėsdinama 65 °C temperatūroje. Tačiau sieros rūgšties koncentraciją mažinti labiau negu iki 30 tūrio % neverta, nes Ni dangos adhezija ant plastikų, net ir esant 30 tūrio %, pastebimai mažesnė. 12 ir 13 pavyzdžiai liudija, kad vanadžio junginio koncentraciją ėsdinimo tirpale mažinti labiau negu 0,1 g/l arba didinti labiau negu 8 g/l netikslinga, nes gaunamos pastebimai mažesnės Ni dangos adhezijos reikšmės.
Visų 13 pavyzdžių atveju plastiko pavyzdžiai Ni danga pasidengė pilnai, o Ni danga ant plastizolinių įrangos dalių nesiformavo.
Lentelė
| Pvz. Nr. | Plastikas | H2SO4 koncentra cija ėsdinimo tirpale, tūrio % | KCIO3 koncentra cija ėsdinimo tirpale, tūrio % | Ėsdinimo temperai ura,°C | Vanadžio junginys ir jo koncentracija ėsdinimo tirpale, g/l | Gautos adhezijos reikšmės, kg/cm |
| 1 | ABS | 66 | 2 | 20 | - | 1,0-1,3 |
| 2 | ABS | 66 | 2 | 40 | - | 0-0,1 |
| 3 | ABS | 66 | 2 | 40 | V2O5, 0,5 | 1,1-1,3 |
| 4 | ABS | 66 | 2 | 65 | V2O5, 0,5 | 1,3-1,4 |
| 5 | PC/ABS | 66 | 2 | 20 | - | 0,7-0,9 |
| 6 | PC/ABS | 66 | 2 | 65 | - | 0-0,1 |
| 7 | PC/ABS | 66 | 2 | 65 | V2O5, 0,5 | 0,9-1,1 |
| 8 | ABS | 40 | 10 | 65 | NaVO3, 1,0 | 1,0-1,2 |
| 9 | PC/ABS | 40 | 10 | 65 | NaVO3, 1,0 | 0,7-0,9 |
| 10 | ABS | 30 | 10 | 65 | NaVO3, 1,0 | 0,5-0,7 |
| 11 | PC/ABS | 30 | 10 | 65 | NaVO3, 1,0 | 0,3-0,5 |
| 12 | ABS | 66 | 2 | 65 | V2O5, 0,1 | 1,0-1,3 |
| 13 | ABS | 66 | 2 | 65 | V2O5, 8,0 | 0,8-1,0 |
Claims (1)
- IŠRADIMO APIBRĖŽTISPlastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas, apimantis paviršiaus ėsdinimą chlorato jonų ir papildomo oksidatoriaus turinčiame sieros rūgšties tirpale ir po jo sekantį apdorojimą šarminio metalo hidroksidų turinčiame tirpale, aktyvavimą paladžio druskos tirpale bei apdorojimą redukuojančiame arba akceleruojančiame tirpale, besiskiriantis tuo, kad į ėsdinimo tirpalą papildomai įveda 0,1-8 g/l vanadžio junginio, o ėsdinimą atlieka 2065 °C temperatūroje.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| LT2012110A LT6070B (lt) | 2012-12-07 | 2012-12-07 | Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas |
| KR1020177009056A KR20170039775A (ko) | 2012-12-07 | 2013-12-06 | 비전도성 플라스틱 표면들을 금속화하기 위한 방법 |
| KR1020157018064A KR20150093214A (ko) | 2012-12-07 | 2013-12-06 | 비전도성 플라스틱 표면들을 금속화하기 위한 프로세스 |
| EP13799621.1A EP2928984A1 (en) | 2012-12-07 | 2013-12-06 | Process for metallizing nonconductive plastic surfaces |
| US14/647,499 US20150307992A1 (en) | 2012-12-07 | 2013-12-06 | Process for metallizing nonconductive plastic surfaces |
| BR112015012930A BR112015012930A2 (pt) | 2012-12-07 | 2013-12-06 | processo para a metalização de superfícies plásticas não condutoras |
| JP2015546043A JP2015537122A (ja) | 2012-12-07 | 2013-12-06 | 非導電性プラスチック表面の金属化方法 |
| PCT/EP2013/075863 WO2014087004A1 (en) | 2012-12-07 | 2013-12-06 | Process for metallizing nonconductive plastic surfaces |
| CN201380063675.4A CN104854216A (zh) | 2012-12-07 | 2013-12-06 | 用于对绝缘塑料表面进行金属化的方法 |
| CA2893664A CA2893664C (en) | 2012-12-07 | 2013-12-06 | Process for metallizing nonconductive plastic surfaces |
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| LT2012110A LT6070B (lt) | 2012-12-07 | 2012-12-07 | Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas |
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| LT6070B true LT6070B (lt) | 2014-09-25 |
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| US (1) | US20150307992A1 (lt) |
| EP (1) | EP2928984A1 (lt) |
| JP (1) | JP2015537122A (lt) |
| KR (2) | KR20170039775A (lt) |
| CN (1) | CN104854216A (lt) |
| BR (1) | BR112015012930A2 (lt) |
| CA (1) | CA2893664C (lt) |
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| US20210207280A1 (en) * | 2015-05-14 | 2021-07-08 | Lacks Enterprises, Inc. | Method for creating multiple electrical current pathways on a work piece using laser ablation |
| EP3181726A1 (en) * | 2015-12-18 | 2017-06-21 | ATOTECH Deutschland GmbH | Etching solution for treating nonconductive plastic surfaces and process for etching nonconductive plastic surfaces |
| EP3228729A1 (en) | 2016-04-04 | 2017-10-11 | COVENTYA S.p.A. | Process for metallization of an article having a plastic surface avoiding the metallization of the rack which fixes the article within the plating bath |
| MX2019007128A (es) * | 2016-12-21 | 2019-09-19 | Hso Herbert Schmidt Gmbh & Co Kg | Solucion de decapado para decapar materiales sinteticos. |
| KR102565708B1 (ko) * | 2021-03-24 | 2023-08-11 | 박일영 | 플라스틱 도금용 팔라듐 촉매제 및 이를 이용한 플라스틱 도금 방법 |
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| LT2012042A (lt) | 2012-06-05 | 2013-12-27 | Atotech Deutschland Gmbh | Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas |
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| BE756045A (fr) * | 1969-09-12 | 1971-03-11 | Macdermid Inc | Procede de regeneration de solutions de decapage a l'acide chromique |
| JPS52112668A (en) * | 1976-03-18 | 1977-09-21 | Sony Corp | Etching solution for plastics |
| US4448811A (en) * | 1981-12-30 | 1984-05-15 | Omi International Corporation | Oxidizing agent for acidic accelerator in electroless metal plating process |
| CA1203720A (en) * | 1981-12-30 | 1986-04-29 | Warren R. Doty | Oxidizing agent for acidic accelerator |
| US5160600A (en) * | 1990-03-05 | 1992-11-03 | Patel Gordhanbai N | Chromic acid free etching of polymers for electroless plating |
| WO2000029646A1 (en) * | 1998-11-13 | 2000-05-25 | Enthone-Omi, Inc. | Process for metallizing a plastic surface |
| JP2002105231A (ja) * | 2000-10-04 | 2002-04-10 | Toray Ind Inc | 表面金属化熱可塑性ポリエステル樹脂成形品 |
| DE10054544A1 (de) * | 2000-11-01 | 2002-05-08 | Atotech Deutschland Gmbh | Verfahren zum chemischen Metallisieren von Oberflächen |
| FR2823214B1 (fr) * | 2001-04-09 | 2007-05-11 | Jean Claude Portner | Pre-traitement des matieres plastiques |
| US20050199587A1 (en) | 2004-03-12 | 2005-09-15 | Jon Bengston | Non-chrome plating on plastic |
| JP2008101255A (ja) * | 2006-10-20 | 2008-05-01 | Tosoh Corp | エッチング用組成物及びエッチング方法 |
| CN101195911B (zh) * | 2006-12-08 | 2011-06-22 | 埃托特克德国有限公司 | 在具有塑料表面的基底上形成涂布金属层的预处理溶液和方法 |
| LT2008082A (lt) * | 2008-10-28 | 2010-05-25 | Chemijos Institutas | Poliimido ir kitų plastikų ėsdinimo būdas |
| JP5552269B2 (ja) * | 2009-07-02 | 2014-07-16 | トヨタ自動車株式会社 | 無電解めっき処理方法 |
| PT2360294E (pt) * | 2010-02-12 | 2013-06-28 | Atotech Deutschland Gmbh | Processo para a metalização de objectos apresentando no mínimo duas matérias plásticas diferentes à superfície |
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- 2013-12-06 EP EP13799621.1A patent/EP2928984A1/en not_active Withdrawn
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| LT2012042A (lt) | 2012-06-05 | 2013-12-27 | Atotech Deutschland Gmbh | Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas |
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| Publication number | Publication date |
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| CN104854216A (zh) | 2015-08-19 |
| BR112015012930A2 (pt) | 2017-07-11 |
| CA2893664C (en) | 2016-03-15 |
| EP2928984A1 (en) | 2015-10-14 |
| CA2893664A1 (en) | 2014-06-12 |
| LT2012110A (lt) | 2014-07-25 |
| KR20150093214A (ko) | 2015-08-17 |
| US20150307992A1 (en) | 2015-10-29 |
| KR20170039775A (ko) | 2017-04-11 |
| WO2014087004A1 (en) | 2014-06-12 |
| JP2015537122A (ja) | 2015-12-24 |
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