LT2012042A - Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas - Google Patents

Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas

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Publication number
LT2012042A
LT2012042A LT2012042A LT2012042A LT2012042A LT 2012042 A LT2012042 A LT 2012042A LT 2012042 A LT2012042 A LT 2012042A LT 2012042 A LT2012042 A LT 2012042A LT 2012042 A LT2012042 A LT 2012042A
Authority
LT
Lithuania
Prior art keywords
solution
oxidator
activating
treating
acceleration
Prior art date
Application number
LT2012042A
Other languages
English (en)
Other versions
LT5997B (lt
Inventor
Leonas NARUŠKEVIČIUS
Ona GYLIENĖ
TAMAŠIŪNAITĖ Loreta TAMAŠAUSKAITĖ
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Priority to LT2012042A priority Critical patent/LT5997B/lt
Priority to PCT/EP2013/061568 priority patent/WO2013182590A1/en
Priority to JP2015515506A priority patent/JP6180518B2/ja
Priority to KR1020147034195A priority patent/KR102130947B1/ko
Priority to EP13727595.4A priority patent/EP2855731B1/en
Priority to US14/399,987 priority patent/US20150129540A1/en
Priority to CN201380029727.6A priority patent/CN104364421B/zh
Priority to ES13727595.4T priority patent/ES2575001T3/es
Priority to CA2875323A priority patent/CA2875323C/en
Priority to BR112014029353-8A priority patent/BR112014029353B1/pt
Priority to PT137275954T priority patent/PT2855731E/pt
Priority to PL13727595.4T priority patent/PL2855731T3/pl
Publication of LT2012042A publication Critical patent/LT2012042A/lt
Publication of LT5997B publication Critical patent/LT5997B/lt

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/78Pretreatment of the material to be coated
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1646Characteristics of the product obtained
    • C23C18/165Multilayered product
    • C23C18/1651Two or more layers only obtained by electroless plating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073Multistep pretreatment
    • C23C18/2086Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22Roughening, e.g. by etching
    • C23C18/24Roughening, e.g. by etching using acid aqueous solutions
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/285Sensitising or activating with tin based compound or composition
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/30Activating or accelerating or sensitising with palladium or other noble metal
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • C23C18/405Formaldehyde

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

lšradimas priskiriamas prie plastikų paviršiaus paruošimo prieš cheminį metalizavimą ir gali būti panaudotas įvairiose pramonės srityse, kur reikalingos dekoratyvinės arba funkcinės metalų dangos ant plastikų. Siūlomo išradimo tikslas yra kokybiškas plastikų paviršiaus paruošimas prieš cheminį metalizavimą kuo mažesnėmis sąnaudomis, ėsdinimo tirpalo aktyvumui išliekant stabiliu ir nenaudojant kancerogeninių ir kitaip žalingų žmogui ir aplinkai medžiagų. Tikslas pasiekiamas tuo, kad plastikų paviršiaus paruošimo prieš cheminį metalizavimą būdas, apimantis plastiko ėsdinimą neorganinės rūgšties tirpalu su oksidatoriumi, aktyvavimą paladžio druskos tirpalu, bei apdorojimą redukuojančiu arba akceleruojančiu tirpalu, siūlomame būde plastiko paviršių ėsdina 0,5-5 g/l tirpaus chlorato tirpalu 50-80 tūrio% sieros rūgštyje, kambario temperatūroje, o prieš aktyvavimą paladžio junginių tirpalu bei apdorojimą redukuojančiu arba akceleruojančiu tirpalu dar apdoroja šarminių metalų hidroksidų tirpalu; papildomai į ėsdinimo tirpalą deda 2-20 g/l kito oksidatoriaus, kurio standartinis oksidacinis potencialas viršija chlorato jonų potencialą.
LT2012042A 2012-06-05 2012-06-05 Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas LT5997B (lt)

Priority Applications (12)

Application Number Priority Date Filing Date Title
LT2012042A LT5997B (lt) 2012-06-05 2012-06-05 Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas
PCT/EP2013/061568 WO2013182590A1 (en) 2012-06-05 2013-06-05 Process for metallizing nonconductive plastic surfaces
JP2015515506A JP6180518B2 (ja) 2012-06-05 2013-06-05 非導電性プラスチック表面を金属化するための方法
KR1020147034195A KR102130947B1 (ko) 2012-06-05 2013-06-05 비전도성 플라스틱 표면의 금속화 방법
EP13727595.4A EP2855731B1 (en) 2012-06-05 2013-06-05 Process for metallizing nonconductive plastic surfaces
US14/399,987 US20150129540A1 (en) 2012-06-05 2013-06-05 Process for metallizing nonconductive plastic surfaces
CN201380029727.6A CN104364421B (zh) 2012-06-05 2013-06-05 使非导电塑料表面金属化的方法
ES13727595.4T ES2575001T3 (es) 2012-06-05 2013-06-05 Procedimiento para metalizar superficies plásticas no conductoras
CA2875323A CA2875323C (en) 2012-06-05 2013-06-05 Process for metallizing nonconductive plastic surfaces
BR112014029353-8A BR112014029353B1 (pt) 2012-06-05 2013-06-05 processo para metalizar superfícies plásticas não condutoras
PT137275954T PT2855731E (pt) 2012-06-05 2013-06-05 Processo para a metalização de superfícies plásticas não condutoras
PL13727595.4T PL2855731T3 (pl) 2012-06-05 2013-06-05 Proces metalizacji nieprzewodzących powierzchni z tworzywa sztucznego

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
LT2012042A LT5997B (lt) 2012-06-05 2012-06-05 Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas

Publications (2)

Publication Number Publication Date
LT2012042A true LT2012042A (lt) 2013-12-27
LT5997B LT5997B (lt) 2014-02-25

Family

ID=48577746

Family Applications (1)

Application Number Title Priority Date Filing Date
LT2012042A LT5997B (lt) 2012-06-05 2012-06-05 Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas

Country Status (12)

Country Link
US (1) US20150129540A1 (lt)
EP (1) EP2855731B1 (lt)
JP (1) JP6180518B2 (lt)
KR (1) KR102130947B1 (lt)
CN (1) CN104364421B (lt)
BR (1) BR112014029353B1 (lt)
CA (1) CA2875323C (lt)
ES (1) ES2575001T3 (lt)
LT (1) LT5997B (lt)
PL (1) PL2855731T3 (lt)
PT (1) PT2855731E (lt)
WO (1) WO2013182590A1 (lt)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014087004A1 (en) 2012-12-07 2014-06-12 Atotech Deutschland Gmbh Process for metallizing nonconductive plastic surfaces

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WO2015183304A1 (en) * 2014-05-30 2015-12-03 Uab Rekin International Chrome-free adhesion pre-treatment for plastics
US9506150B2 (en) 2014-10-13 2016-11-29 Rohm And Haas Electronic Materials Llc Metallization inhibitors for plastisol coated plating tools
EP3181726A1 (en) 2015-12-18 2017-06-21 ATOTECH Deutschland GmbH Etching solution for treating nonconductive plastic surfaces and process for etching nonconductive plastic surfaces
US20200087791A1 (en) * 2017-06-01 2020-03-19 Jcu Corporation Multi-stage resin surface etching method, and plating method on resin using same
FR3074808B1 (fr) 2017-12-13 2020-05-29 Maxence RENAUD Outillage de galvanoplastie
CN108624907A (zh) * 2018-04-26 2018-10-09 复旦大学 非金属基体高效催化电极及其制备方法

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JPS52112668A (en) * 1976-03-18 1977-09-21 Sony Corp Etching solution for plastics
US4919768A (en) * 1989-09-22 1990-04-24 Shipley Company Inc. Electroplating process
US5160600A (en) * 1990-03-05 1992-11-03 Patel Gordhanbai N Chromic acid free etching of polymers for electroless plating
US6512182B2 (en) * 2001-03-12 2003-01-28 Ngk Spark Plug Co., Ltd. Wiring circuit board and method for producing same
DE10259187B4 (de) * 2002-12-18 2008-06-19 Enthone Inc., West Haven Metallisierung von Kunststoffsubstraten und Lösung zum Beizen und Aktivieren
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LT2008082A (lt) * 2008-10-28 2010-05-25 Chemijos Institutas Poliimido ir kitų plastikų ėsdinimo būdas
JP5552269B2 (ja) * 2009-07-02 2014-07-16 トヨタ自動車株式会社 無電解めっき処理方法
CN102409320B (zh) * 2011-11-29 2015-02-25 沈阳工业大学 一种abs塑料表面电镀前处理的方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014087004A1 (en) 2012-12-07 2014-06-12 Atotech Deutschland Gmbh Process for metallizing nonconductive plastic surfaces
LT6070B (lt) 2012-12-07 2014-09-25 Atotech Deutschland Gmbh Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas

Also Published As

Publication number Publication date
CA2875323C (en) 2020-08-25
LT5997B (lt) 2014-02-25
BR112014029353A2 (pt) 2017-06-27
US20150129540A1 (en) 2015-05-14
JP6180518B2 (ja) 2017-08-16
CN104364421B (zh) 2017-07-21
JP2015518924A (ja) 2015-07-06
WO2013182590A1 (en) 2013-12-12
PL2855731T3 (pl) 2016-09-30
CA2875323A1 (en) 2013-12-12
PT2855731E (pt) 2016-06-15
EP2855731A1 (en) 2015-04-08
ES2575001T3 (es) 2016-06-23
EP2855731B1 (en) 2016-03-23
KR102130947B1 (ko) 2020-07-08
BR112014029353B1 (pt) 2021-04-20
KR20150024327A (ko) 2015-03-06
CN104364421A (zh) 2015-02-18

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