WO2012095667A3 - Improvements in coating technology - Google Patents

Improvements in coating technology Download PDF

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Publication number
WO2012095667A3
WO2012095667A3 PCT/GB2012/050057 GB2012050057W WO2012095667A3 WO 2012095667 A3 WO2012095667 A3 WO 2012095667A3 GB 2012050057 W GB2012050057 W GB 2012050057W WO 2012095667 A3 WO2012095667 A3 WO 2012095667A3
Authority
WO
WIPO (PCT)
Prior art keywords
platinum
bath
coating technology
electroplating bath
source
Prior art date
Application number
PCT/GB2012/050057
Other languages
French (fr)
Other versions
WO2012095667A2 (en
Inventor
Laura ASHFIELD
Allan Rein BERZINS
Alan Boardman
Stephen Geoffrey Warren
Original Assignee
Johnson Matthey Public Limited Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Matthey Public Limited Company filed Critical Johnson Matthey Public Limited Company
Priority to CN201280005391.5A priority Critical patent/CN103492618A/en
Priority to SG2013051248A priority patent/SG191820A1/en
Priority to EP12700726.8A priority patent/EP2663670A2/en
Priority to US13/979,448 priority patent/US20130334056A1/en
Priority to BR112013017516A priority patent/BR112013017516A2/en
Priority to MX2013008146A priority patent/MX2013008146A/en
Publication of WO2012095667A2 publication Critical patent/WO2012095667A2/en
Publication of WO2012095667A3 publication Critical patent/WO2012095667A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals

Abstract

The present invention provides an aqueous platinum electroplating bath comprising: a) a source of platinum ions; and b) a source of polyphosphate anions, and wherein the bath has a pH in the range from about 2 to about 9 when it is in use or ready for use. The aqueous platinum electroplating bath may optionally comprise one or more levellers. The invention also provides the use of the platinum electroplating bath and platinum salts suitable for use in the bath.
PCT/GB2012/050057 2011-01-12 2012-01-12 Improvements in coating technology WO2012095667A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN201280005391.5A CN103492618A (en) 2011-01-12 2012-01-12 Improvements in coating technology
SG2013051248A SG191820A1 (en) 2011-01-12 2012-01-12 Improvements in coating technology
EP12700726.8A EP2663670A2 (en) 2011-01-12 2012-01-12 Improvements in coating technology
US13/979,448 US20130334056A1 (en) 2011-01-12 2012-01-12 Coating technology
BR112013017516A BR112013017516A2 (en) 2011-01-12 2012-01-12 AQUEOUS PLATINUM GALVANIZATION BATH, PLATINUM SALT, AND, USE OF AN AQUEOUS PLATINUM GALVANIZATION BATH
MX2013008146A MX2013008146A (en) 2011-01-12 2012-01-12 Improvements in coating technology.

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB1100447.0 2011-01-12
GBGB1100447.0A GB201100447D0 (en) 2011-01-12 2011-01-12 Improvements in coating technology
US201161437281P 2011-01-28 2011-01-28
US61/437,281 2011-01-28

Publications (2)

Publication Number Publication Date
WO2012095667A2 WO2012095667A2 (en) 2012-07-19
WO2012095667A3 true WO2012095667A3 (en) 2013-10-03

Family

ID=43664099

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2012/050057 WO2012095667A2 (en) 2011-01-12 2012-01-12 Improvements in coating technology

Country Status (8)

Country Link
US (1) US20130334056A1 (en)
EP (1) EP2663670A2 (en)
CN (1) CN103492618A (en)
BR (1) BR112013017516A2 (en)
GB (1) GB201100447D0 (en)
MX (1) MX2013008146A (en)
SG (2) SG10201510015PA (en)
WO (1) WO2012095667A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104152953A (en) * 2014-08-29 2014-11-19 昆明贵金属研究所 Main salt for phosphoric acid tank electroplating platinum and synthetic method thereof
WO2016035645A1 (en) * 2014-09-04 2016-03-10 日本高純度化学株式会社 Palladium plating solution and palladium coating obtained using same
CN105132964A (en) * 2015-09-21 2015-12-09 无锡清杨机械制造有限公司 Platinum electroplating solution for phosphate system and electroplating method adopting platinum electroplating solution
CN105154931A (en) * 2015-09-21 2015-12-16 无锡清杨机械制造有限公司 Platinum electroplating solution comprising dihydrogen dinitrosulfatoplatinate and electroplating method adopting platinum electroplating solution
CN105386096A (en) * 2015-09-21 2016-03-09 无锡清杨机械制造有限公司 Alkaline plating Pt electroplating bath and electroplating method thereof
CN106435666B (en) * 2016-11-22 2018-12-18 中国科学院金属研究所 A method of high-temperature alloy surface deposition layer is prepared using neutral platinum plating solution
CN107235479B (en) * 2017-05-19 2019-08-09 王晓波 The synthetic method of four ammino platinum of hydrogen phosphate
US10612149B1 (en) * 2019-09-05 2020-04-07 Chow Sang Sang Jewellery Company Limited Platinum electrodeposition bath and uses thereof
GB202020071D0 (en) 2020-12-18 2021-02-03 Johnson Matthey Plc Electroplating solutions
CN113423194B (en) * 2021-04-27 2023-05-23 厦门理工学院 Blind hole filling method for roll-to-roll copper foil
CN114182315B (en) * 2022-02-14 2022-05-17 深圳市顺信精细化工有限公司 Corrosion-resistant combined electroplated layer and electroplating method
CN114411215B (en) * 2022-03-15 2023-12-05 深圳市顺信精细化工有限公司 Platinum electroplating solution and electroplating method

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3300395A (en) * 1962-09-05 1967-01-24 Dehydag Gmbh Nickel electroplating baths and processes
GB1431548A (en) * 1972-09-21 1976-04-07 Engelhard Ind Ltd Electrodeposition of plantinum
US4009087A (en) * 1974-11-21 1977-02-22 M&T Chemicals Inc. Electrodeposition of copper
US4121982A (en) * 1978-02-03 1978-10-24 American Chemical & Refining Company Incorporated Gold alloy plating bath and method
GB2043642A (en) * 1979-03-07 1980-10-08 Engelhard Min & Chem Ethylenediamine platinum (ii)and 1,2-diaminocyclohexaneplatinum (ii) pyrophosphate complexes
US4673472A (en) * 1986-02-28 1987-06-16 Technic Inc. Method and electroplating solution for deposition of palladium or alloys thereof
EP0358375A1 (en) * 1988-09-07 1990-03-14 Johnson Matthey Public Limited Company Platinum or platinum alloy plating bath
EP0492731A1 (en) * 1990-12-24 1992-07-01 Stork Screens B.V. Method for forming a sieve material having low internal stress and sieve material so obtained
EP1069211A2 (en) * 1999-07-15 2001-01-17 The Boc Group, Inc. Electroplating solutions
US20020063063A1 (en) * 2000-10-11 2002-05-30 Ishihara Chemical Co., Ltd. Non-cyanide-type gold-tin alloy plating bath
DE102008050135A1 (en) * 2008-10-04 2010-04-08 Umicore Galvanotechnik Gmbh Process for depositing platinum rhodium layers with improved brightness

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038161A (en) * 1976-03-05 1977-07-26 R. O. Hull & Company, Inc. Acid copper plating and additive composition therefor
KR100363011B1 (en) * 2002-03-28 2002-11-30 Hanwha Chemical Corp Electrolyte composition for electrolysis of brine and electrolysis method of brine using the same

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3300395A (en) * 1962-09-05 1967-01-24 Dehydag Gmbh Nickel electroplating baths and processes
GB1431548A (en) * 1972-09-21 1976-04-07 Engelhard Ind Ltd Electrodeposition of plantinum
US4009087A (en) * 1974-11-21 1977-02-22 M&T Chemicals Inc. Electrodeposition of copper
US4121982A (en) * 1978-02-03 1978-10-24 American Chemical & Refining Company Incorporated Gold alloy plating bath and method
GB2043642A (en) * 1979-03-07 1980-10-08 Engelhard Min & Chem Ethylenediamine platinum (ii)and 1,2-diaminocyclohexaneplatinum (ii) pyrophosphate complexes
US4673472A (en) * 1986-02-28 1987-06-16 Technic Inc. Method and electroplating solution for deposition of palladium or alloys thereof
EP0358375A1 (en) * 1988-09-07 1990-03-14 Johnson Matthey Public Limited Company Platinum or platinum alloy plating bath
EP0492731A1 (en) * 1990-12-24 1992-07-01 Stork Screens B.V. Method for forming a sieve material having low internal stress and sieve material so obtained
EP1069211A2 (en) * 1999-07-15 2001-01-17 The Boc Group, Inc. Electroplating solutions
US20020063063A1 (en) * 2000-10-11 2002-05-30 Ishihara Chemical Co., Ltd. Non-cyanide-type gold-tin alloy plating bath
DE102008050135A1 (en) * 2008-10-04 2010-04-08 Umicore Galvanotechnik Gmbh Process for depositing platinum rhodium layers with improved brightness

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
J. OBERT ET AL: "Development of a bath for codeposition of copper and platinum", JOURNAL OF APPLIED ELECTROCHEMISTRY, vol. 34, no. 4, 1 April 2004 (2004-04-01), pages 397 - 401, XP055062030, ISSN: 0021-891X, DOI: 10.1023/B:JACH.0000016616.78823.2b *
ONICIU L ET AL: "Some fundamental aspects of levelling and brightening in metal electrodeposition", JOURNAL OF APPLIED ELECTROCHEMISTRY, SPRINGER, DORDRECHT, NL, vol. 21, 1 January 1991 (1991-01-01), pages 565 - 574, XP002688391, ISSN: 0021-891X *

Also Published As

Publication number Publication date
CN103492618A (en) 2014-01-01
MX2013008146A (en) 2013-12-16
SG191820A1 (en) 2013-08-30
GB201100447D0 (en) 2011-02-23
WO2012095667A2 (en) 2012-07-19
SG10201510015PA (en) 2016-01-28
EP2663670A2 (en) 2013-11-20
BR112013017516A2 (en) 2024-01-23
US20130334056A1 (en) 2013-12-19

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