JP5499049B2 - 金属表面に対する高分子材料の接着性の改善方法 - Google Patents
金属表面に対する高分子材料の接着性の改善方法 Download PDFInfo
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- JP5499049B2 JP5499049B2 JP2011545351A JP2011545351A JP5499049B2 JP 5499049 B2 JP5499049 B2 JP 5499049B2 JP 2011545351 A JP2011545351 A JP 2011545351A JP 2011545351 A JP2011545351 A JP 2011545351A JP 5499049 B2 JP5499049 B2 JP 5499049B2
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- adhesion promoting
- promoting composition
- metal surface
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- 229910052751 metal Inorganic materials 0.000 title claims description 48
- 239000002184 metal Substances 0.000 title claims description 48
- 238000000034 method Methods 0.000 title claims description 41
- 239000000463 material Substances 0.000 title claims description 21
- 239000000203 mixture Substances 0.000 claims description 62
- 230000001737 promoting effect Effects 0.000 claims description 55
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 37
- 229910052802 copper Inorganic materials 0.000 claims description 34
- 239000010949 copper Substances 0.000 claims description 34
- 239000002253 acid Substances 0.000 claims description 24
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical group OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 20
- 238000005260 corrosion Methods 0.000 claims description 20
- 230000007797 corrosion Effects 0.000 claims description 20
- 239000003112 inhibitor Substances 0.000 claims description 20
- ZCYAYDMGVNGKJC-UHFFFAOYSA-N sulfanyl propane-1-sulfonate Chemical compound CCCS(=O)(=O)OS ZCYAYDMGVNGKJC-UHFFFAOYSA-N 0.000 claims description 20
- -1 halide ion Chemical class 0.000 claims description 19
- 239000007800 oxidant agent Substances 0.000 claims description 13
- 239000002861 polymer material Substances 0.000 claims description 11
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 10
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 9
- 239000012964 benzotriazole Substances 0.000 claims description 8
- WIYCQLLGDNXIBA-UHFFFAOYSA-L disodium;3-(3-sulfonatopropyldisulfanyl)propane-1-sulfonate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)CCCSSCCCS([O-])(=O)=O WIYCQLLGDNXIBA-UHFFFAOYSA-L 0.000 claims description 8
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 6
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 6
- 239000011707 mineral Substances 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 150000007522 mineralic acids Chemical class 0.000 claims description 5
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims description 3
- 150000003536 tetrazoles Chemical class 0.000 claims description 3
- 150000003852 triazoles Chemical group 0.000 claims description 3
- 125000003354 benzotriazolyl group Chemical group N1N=NC2=C1C=CC=C2* 0.000 claims 2
- 239000000243 solution Substances 0.000 description 23
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 18
- 239000005751 Copper oxide Substances 0.000 description 18
- 229910000431 copper oxide Inorganic materials 0.000 description 18
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 6
- 230000032798 delamination Effects 0.000 description 6
- 229920003169 water-soluble polymer Polymers 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 229920001223 polyethylene glycol Polymers 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000002318 adhesion promoter Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- CSJDJKUYRKSIDY-UHFFFAOYSA-N 1-sulfanylpropane-1-sulfonic acid Chemical compound CCC(S)S(O)(=O)=O CSJDJKUYRKSIDY-UHFFFAOYSA-N 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000007739 conversion coating Methods 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 239000011780 sodium chloride Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000872 buffer Substances 0.000 description 2
- 239000006172 buffering agent Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 235000010755 mineral Nutrition 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- BZSXEZOLBIJVQK-UHFFFAOYSA-N 2-methylsulfonylbenzoic acid Chemical compound CS(=O)(=O)C1=CC=CC=C1C(O)=O BZSXEZOLBIJVQK-UHFFFAOYSA-N 0.000 description 1
- KKADPXVIOXHVKN-UHFFFAOYSA-N 4-hydroxyphenylpyruvic acid Chemical compound OC(=O)C(=O)CC1=CC=C(O)C=C1 KKADPXVIOXHVKN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 229910001919 chlorite Inorganic materials 0.000 description 1
- 229910052619 chlorite group Inorganic materials 0.000 description 1
- QBWCMBCROVPCKQ-UHFFFAOYSA-N chlorous acid Chemical compound OCl=O QBWCMBCROVPCKQ-UHFFFAOYSA-N 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 125000001475 halogen functional group Chemical group 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 150000005310 oxohalides Chemical class 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 229920001983 poloxamer Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000011736 potassium bicarbonate Substances 0.000 description 1
- 235000015497 potassium bicarbonate Nutrition 0.000 description 1
- 229910000028 potassium bicarbonate Inorganic materials 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 235000011181 potassium carbonates Nutrition 0.000 description 1
- VKJKEPKFPUWCAS-UHFFFAOYSA-M potassium chlorate Chemical compound [K+].[O-]Cl(=O)=O VKJKEPKFPUWCAS-UHFFFAOYSA-M 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- LHUAYJZGTZYKSW-UHFFFAOYSA-M sodium;1-sulfanylpropane-1-sulfonate Chemical class [Na+].CCC(S)S([O-])(=O)=O LHUAYJZGTZYKSW-UHFFFAOYSA-M 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- DHCDFWKWKRSZHF-UHFFFAOYSA-N sulfurothioic S-acid Chemical class OS(O)(=O)=S DHCDFWKWKRSZHF-UHFFFAOYSA-N 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 235000019798 tripotassium phosphate Nutrition 0.000 description 1
- 229910000404 tripotassium phosphate Inorganic materials 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 229910000406 trisodium phosphate Inorganic materials 0.000 description 1
- 235000019801 trisodium phosphate Nutrition 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/07—Parts immersed or impregnated in a matrix
- B32B2305/076—Prepregs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Treatment Of Metals (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- ing And Chemical Polishing (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Description
本発明の他の目的は、銅表面に対する高分子材料の接着性を向上する処理液を提供することである。
本発明の更に他の目的は、層間剥離に耐える積層材料を提供することである。
1)金属表面を接着促進組成物と接触させる工程、その後
2)前記金属表面に前記高分子材料を接着させる工程
を含み、前記接着促進組成物は、
a)酸化剤;
b)酸;
c)腐食防止剤;
d)ハロゲン化物イオン源;及び
e)メルカプトプロパンスルホン酸、ビス−ナトリウムスルホプロピルジスルフィド、及びメルカプトプロパンスルホネートからなる群から選択される少なくとも1つの材料
を含む。
1)金属表面を接着促進組成物と接触させる工程、その後
2)前記金属表面に前記高分子材料を接着させる工程
を含み、前記接着促進組成物は、
a)酸化剤;
b)酸;
c)腐食防止剤;
d)ハロゲン化物イオン源;及び、
e)メルカプトプロパンスルネート、ビス−ナトリウムスルホプロピルジスルフィド、及びメルカプトプロパンスルホン酸からなる群から選択される少なくとも1つの材料
を含む。
以下の実施例の全てにおいて、銅被覆パネル及び銅フォイルの処理に次のサイクルを使用した。
予備浸漬溶液
50重量%過酸化水素 2%v/v
ベンゾトリアゾール 1g/L
Cl−としてNaCl 10ppm
pH 5.9
接着促進組成物
50重量%過酸化水素 3.1%v/v
硫酸 4.8重量%
ベンゾトリアゾール 5g/L
Cl−としてNaCl 10ppm
表1及び表2に示すMPS又はSPS
結果を以下に示す。表1はメルカプトプロパンスルホネート(MPS)を用いる様々な条件を示し、表2はビス−ナトリウムスルホプロピルジスルフィド(SPS)を用いる様々な条件を示す。
Claims (20)
- 金属表面に高分子材料を接着する前に、前記金属表面の処理に有用な接着促進組成物であって、
a)酸化剤、
b)無機酸、
c)腐食防止剤、
d)ハロゲン化物イオン源、並びに、
e)400ppm〜800ppmの濃度で前記接着促進組成物中に存在するメルカプトプロパンスルホネート、及び600ppm〜1,000ppmの濃度で前記接着促進組成物中に存在するビス−ナトリウムスルホプロピルジスルフィドから選択される少なくとも1つの材料を含むことを特徴とする接着促進組成物。 - 酸化剤が過酸化水素である請求項1に記載の接着促進組成物。
- 無機酸が鉱酸である請求項1に記載の接着促進組成物。
- 鉱酸が硫酸である請求項3に記載の接着促進組成物。
- 腐食防止剤がトリアゾール、ベンゾトリアゾール、テトラゾール、イミダゾール、ベンズイミダゾール及びこれらの1つ以上の組み合わせからなる群から選択される請求項1に記載の接着促進組成物。
- 腐食防止剤がベンゾトリアゾールである請求項5に記載の接着促進組成物。
- 少なくとも1つの材料がメルカプトプロパンスルホネートである請求項1に記載の接着促進組成物。
- 少なくとも1つの材料がビス−ナトリウムスルホプロピルジスルフィドである請求項1に記載の接着促進組成物。
- ハロゲン化物イオン源が、ハロゲン化物イオンの含有量として1mg/L〜12mg/Lの濃度で接着促進組成物中に存在する請求項1に記載の接着促進組成物。
- 金属表面に対する高分子材料の接着性を向上させる方法であって、
前記金属表面は銅を含み、
前記方法は、
a)前記金属表面を接着促進組成物と接触させる工程、及び
b)前記金属表面に前記高分子材料を接着させる工程
を含み、前記接着促進組成物は、
1)過酸化水素;
2)無機酸;
3)腐食防止剤;
4)ハロゲン化物イオン源;並びに
5)400ppm〜800ppmの濃度で前記接着促進組成物中に存在するメルカプトプロパンスルホネート、及び600ppm〜1,000ppmの濃度で前記接着促進組成物中に存在するビス−ナトリウムスルホプロピルジスルフィドから選択される少なくとも1つの材料を含むことを特徴とする方法。 - 酸化剤が過酸化水素である請求項10に記載の方法。
- 無機酸が鉱酸である請求項10に記載の方法。
- 鉱酸が硫酸である請求項12に記載の方法。
- 腐食防止剤が、トリアゾール、ベンゾトリアゾール、テトラゾール、イミダゾール、ベンズイミダゾール及びこれらの1つ以上の組み合わせからなる群から選択される請求項10に記載の方法。
- 腐食防止剤がベンゾトリアゾールである請求項14に記載の方法。
- 少なくとも1つの材料がメルカプトプロパンスルホネートである請求項10に記載の方法。
- 少なくとも1つの材料がビス−ナトリウムスルホプロピルジスルフィドである請求項10に記載の方法。
- ハロゲン化物イオン源が、ハロゲン化物イオンの含有量として1mg/L〜12mg/Lの濃度で接着促進組成物中に存在する請求項10に記載の方法。
- 金属表面を接着促進組成物と接触させる直前に、前記金属表面を予備浸漬溶液と接触させる請求項10に記載の方法。
- 金属表面が銅面又は銅合金面を含む請求項10に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
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PCT/US2009/065631 WO2010080227A1 (en) | 2009-01-08 | 2009-11-24 | Process for improving the adhesion of polymeric materials to metal surfaces |
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EP (1) | EP2385881B1 (ja) |
JP (1) | JP5499049B2 (ja) |
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WO2013004624A1 (en) * | 2011-07-07 | 2013-01-10 | Atotech Deutschland Gmbh | Method for providing organic resist adhesion to a copper or copper alloy surface |
KR20160056892A (ko) * | 2013-08-16 | 2016-05-20 | 엔쏜 인코포레이티드 | 인쇄 회로 기판에서의 접착 촉진 |
KR102400343B1 (ko) * | 2016-07-19 | 2022-05-23 | 동우 화인켐 주식회사 | 금속막 식각액 조성물 및 이를 사용한 표시장치용 어레이 기판의 제조방법 |
JP2022099497A (ja) * | 2020-12-23 | 2022-07-05 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
TWI795879B (zh) * | 2021-08-20 | 2023-03-11 | 柏群科技有限公司 | 表面結合劑及處理基材表面之方法 |
CN113860796B (zh) * | 2021-10-29 | 2022-09-23 | 北京金隅节能保温科技(大厂)有限公司 | 一种生态多孔纤维棉及其制备工艺 |
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US4409037A (en) * | 1982-04-05 | 1983-10-11 | Macdermid Incorporated | Adhesion promoter for printed circuits |
US4844981A (en) * | 1982-04-05 | 1989-07-04 | Macdermid, Incorporated | Adhesion promoter for printed circuits |
JPS61176192A (ja) * | 1985-01-31 | 1986-08-07 | 株式会社日立製作所 | 銅と樹脂との接着方法 |
US4775444A (en) * | 1987-08-26 | 1988-10-04 | Macdermid, Incorporated | Process for fabricating multilayer circuit boards |
JPH0713304B2 (ja) * | 1987-12-14 | 1995-02-15 | 日立化成工業株式会社 | 銅の表面処理法 |
JPH01246393A (ja) * | 1988-03-25 | 1989-10-02 | Fukuda Metal Foil & Powder Co Ltd | 内層用銅箔または銅張積層板の表面処理方法 |
US4997722A (en) * | 1989-07-10 | 1991-03-05 | Edward Adler | Composition and method for improving adherence of copper foil to resinous substrates |
US4997516A (en) * | 1989-07-10 | 1991-03-05 | Edward Adler | Method for improving adherence of copper foil to resinous substrates |
US5289630A (en) * | 1991-07-22 | 1994-03-01 | Macdermid, Incorporated | Process for fabricating multilayer printed circuits |
GB9425090D0 (en) | 1994-12-12 | 1995-02-08 | Alpha Metals Ltd | Copper coating |
US5869130A (en) * | 1997-06-12 | 1999-02-09 | Mac Dermid, Incorporated | Process for improving the adhesion of polymeric materials to metal surfaces |
US6544399B1 (en) * | 1999-01-11 | 2003-04-08 | Applied Materials, Inc. | Electrodeposition chemistry for filling apertures with reflective metal |
US6383272B1 (en) * | 2000-06-08 | 2002-05-07 | Donald Ferrier | Process for improving the adhesion of polymeric materials to metal surfaces |
US6419784B1 (en) * | 2000-06-21 | 2002-07-16 | Donald Ferrier | Process for improving the adhesion of polymeric materials to metal surfaces |
DE10066028C2 (de) * | 2000-07-07 | 2003-04-24 | Atotech Deutschland Gmbh | Kupfersubstrat mit aufgerauhten Oberflächen |
US6660154B2 (en) * | 2000-10-25 | 2003-12-09 | Shipley Company, L.L.C. | Seed layer |
US6716281B2 (en) * | 2002-05-10 | 2004-04-06 | Electrochemicals, Inc. | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates |
US7186305B2 (en) * | 2002-11-26 | 2007-03-06 | Donald Ferrier | Process for improving the adhesion of polymeric materials to metal surfaces |
KR20040073974A (ko) * | 2003-02-14 | 2004-08-21 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. | 전기도금 조성물 |
EP1715001B1 (de) * | 2003-02-24 | 2008-05-07 | Basf Se | Polymere enthaltend Phosphor- und/oder Phosphonsäure Gruppen zur Metalloberflächenbehandlung |
US9193880B2 (en) | 2006-12-19 | 2015-11-24 | Dow Global Technologies Llc | Adhesion promotion additives and methods for improving coating compositions |
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- 2009-11-24 ES ES09837786T patent/ES2747939T3/es active Active
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CN102271827A (zh) | 2011-12-07 |
US20100170638A1 (en) | 2010-07-08 |
WO2010080227A1 (en) | 2010-07-15 |
EP2385881A1 (en) | 2011-11-16 |
JP2012514696A (ja) | 2012-06-28 |
EP2385881A4 (en) | 2017-10-25 |
CN102271827B (zh) | 2014-04-02 |
US8088246B2 (en) | 2012-01-03 |
EP2385881B1 (en) | 2019-09-04 |
ES2747939T3 (es) | 2020-03-12 |
TW201030184A (en) | 2010-08-16 |
TWI398551B (zh) | 2013-06-11 |
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