BR0210147A - Métodos para preparar um material de substrato, para preparar um substrato, para depositar um material sobre um substrato em um padrão definido pelo usuário através de uma reação catalìtica e para galvanizar metal sobre um substrato em um padrão definido pelo usuário através de um processo autocatalìtico, e, formulação de tinta - Google Patents

Métodos para preparar um material de substrato, para preparar um substrato, para depositar um material sobre um substrato em um padrão definido pelo usuário através de uma reação catalìtica e para galvanizar metal sobre um substrato em um padrão definido pelo usuário através de um processo autocatalìtico, e, formulação de tinta

Info

Publication number
BR0210147A
BR0210147A BR0210147-5A BR0210147A BR0210147A BR 0210147 A BR0210147 A BR 0210147A BR 0210147 A BR0210147 A BR 0210147A BR 0210147 A BR0210147 A BR 0210147A
Authority
BR
Brazil
Prior art keywords
substrate
preparing
user defined
defined pattern
catalytic reaction
Prior art date
Application number
BR0210147-5A
Other languages
English (en)
Inventor
Gregory Peter Wade Fixter
Daniel Robert Johnson
William Norman Damerell
Stephen George Appleton
Original Assignee
Qinetiq Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0113408A external-priority patent/GB0113408D0/en
Priority claimed from GB0128571A external-priority patent/GB0128571D0/en
Application filed by Qinetiq Ltd filed Critical Qinetiq Ltd
Publication of BR0210147A publication Critical patent/BR0210147A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Printing Methods (AREA)
  • Laminated Bodies (AREA)

Abstract

"MéTODOS PARA PREPARAR UM MATERIAL DE SUBSTRATO, PARA PREPARAR UM SUBSTRATO, PARA DEPOSITAR UM MATERIAL SOBRE UM SUBSTRATO EM UM PADRãO DEFINIDO PELO USUáRIO ATRAVéS DE UMA REAçãO CATALìTICA E PARA GALVANIZAR METAL SOBRE UM SUBSTRATO EM UM PADRãO DEFINIDO PELO USUáRIO ATRAVéS DE UM PROCESSO AUTOCATALìTICO, E, FORMULAçãO DE TINTA". Um método de preparação de um material de substrato, tal que ele seja capaz de propiciar uma reação catalítica sobre uma área predeterminada de sua superfície, que compreende revestir algum ou todo o material do substrato com um ambiente de reação catalítico, material que seja capaz, uma vez o material do substrato revestido com um ambiente de reação catalítico, de propiciar uma reação catalítica sobre as áreas revestidas do substrato, em que o material catalítico é impresso sobre o substrato através de um mecanismo de transferência de padrão.
BR0210147-5A 2001-06-04 2002-05-23 Métodos para preparar um material de substrato, para preparar um substrato, para depositar um material sobre um substrato em um padrão definido pelo usuário através de uma reação catalìtica e para galvanizar metal sobre um substrato em um padrão definido pelo usuário através de um processo autocatalìtico, e, formulação de tinta BR0210147A (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0113408A GB0113408D0 (en) 2001-06-04 2001-06-04 Autocatalytic coating method
GB0128571A GB0128571D0 (en) 2001-11-29 2001-11-29 Patterning method
PCT/GB2002/002412 WO2002099162A2 (en) 2001-06-04 2002-05-23 Patterning method

Publications (1)

Publication Number Publication Date
BR0210147A true BR0210147A (pt) 2004-06-08

Family

ID=26246144

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0210147-5A BR0210147A (pt) 2001-06-04 2002-05-23 Métodos para preparar um material de substrato, para preparar um substrato, para depositar um material sobre um substrato em um padrão definido pelo usuário através de uma reação catalìtica e para galvanizar metal sobre um substrato em um padrão definido pelo usuário através de um processo autocatalìtico, e, formulação de tinta

Country Status (13)

Country Link
US (1) US20040146647A1 (pt)
EP (1) EP1392886A2 (pt)
JP (1) JP2004527663A (pt)
KR (1) KR20040007643A (pt)
CN (1) CN1539028A (pt)
BR (1) BR0210147A (pt)
CA (1) CA2449358A1 (pt)
IL (1) IL159175A0 (pt)
NO (1) NO20035380D0 (pt)
PL (1) PL365417A1 (pt)
RU (1) RU2003135208A (pt)
TW (1) TWI226384B (pt)
WO (1) WO2002099162A2 (pt)

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US5968547A (en) 1997-02-24 1999-10-19 Euro-Celtique, S.A. Method of providing sustained analgesia with buprenorphine
GB2393736A (en) * 2002-10-01 2004-04-07 Qinetiq Ltd A Cathode for use in an Electroplating Cell
US20050006339A1 (en) 2003-07-11 2005-01-13 Peter Mardilovich Electroless deposition methods and systems
US7794629B2 (en) 2003-11-25 2010-09-14 Qinetiq Limited Composite materials
DE602004032478D1 (de) 2004-01-29 2011-06-09 Nippon Mining Co Eidung und verfahren zur stromlosen metallabscheidung unter verwendung davon
US20050241951A1 (en) * 2004-04-30 2005-11-03 Kenneth Crouse Selective catalytic activation of non-conductive substrates
US7732330B2 (en) * 2005-06-30 2010-06-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method using an ink-jet method of the same
DE102006030822A1 (de) * 2006-06-30 2008-01-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen einer metallischen Kontaktstruktur einer Solarzelle
TWI361208B (en) * 2007-08-07 2012-04-01 Univ Nat Defense Process for forming a metal pattern on a substrate
JP4507126B2 (ja) * 2007-10-29 2010-07-21 ソニー株式会社 偏光板の製造方法
JP5227570B2 (ja) * 2007-11-13 2013-07-03 セーレン株式会社 透明導電性部材の製造方法
KR100857615B1 (ko) * 2008-01-22 2008-09-09 (주)휴먼테크 Ｒｆｉｄ안테나 제조방법
TWI403239B (zh) * 2008-05-23 2013-07-21 Zhen Ding Technology Co Ltd 油墨及利用該油墨製作導電線路之方法
JP2010053435A (ja) * 2008-08-29 2010-03-11 Showa Denko Kk 無電解めっき用センシタイジング液および無電解めっき方法
TWI433957B (zh) * 2008-09-23 2014-04-11 Univ Nat Defense 基材表面及通孔的金屬化方法及其所使用的觸媒
CN106519740B (zh) 2012-10-26 2019-01-11 比亚迪股份有限公司 白色涂料组合物、绝缘基材表面选择性金属化的方法及复合制品
TWI507672B (zh) * 2013-05-29 2015-11-11 Univ Nat Yang Ming 檢測試紙的製造方法、使用方法以及用於該製造方法之藥物組合
TW201643277A (zh) * 2015-06-03 2016-12-16 Hoey Co Ltd 印刷層之電鍍方法

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US3226256A (en) * 1963-01-02 1965-12-28 Jr Frederick W Schneble Method of making printed circuits
US3745045A (en) * 1971-01-06 1973-07-10 R Brenneman Electrical contact surface using an ink containing a plating catalyst
DK153337C (da) * 1979-04-11 1988-11-14 Platonec Aps Fremgangsmaade til toer sensibilisering af en isolerende overflade
DE3006117C2 (de) * 1980-02-19 1981-11-26 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Verfahren zum Herstellen von Leiterplatten mit mindestens zwei Leiterzugebenen
US4425378A (en) * 1981-07-06 1984-01-10 Sprague Electric Company Electroless nickel plating activator composition a method for using and a ceramic capacitor made therewith
US4461785A (en) * 1982-11-19 1984-07-24 E. I. Du Pont De Nemours And Company Process for electrical terminal contact metallization
DE3326508A1 (de) * 1983-07-22 1985-02-07 Bayer Ag, 5090 Leverkusen Verfahren zum aktivieren von substratoberflaechen fuer die direkte partielle metallisierung von traegermaterialien
US4668533A (en) * 1985-05-10 1987-05-26 E. I. Du Pont De Nemours And Company Ink jet printing of printed circuit boards
DE3537161C2 (de) * 1985-10-18 1995-08-03 Bosch Gmbh Robert Verfahren zur Herstellung festhaftender, lötfähiger und strukturierbarer Metallschichten auf Aluminiumoxid-haltiger Keramik
US5318803A (en) * 1990-11-13 1994-06-07 International Business Machines Corporation Conditioning of a substrate for electroless plating thereon
DE4036592A1 (de) * 1990-11-16 1992-05-21 Bayer Ag Spritzgegossene leiterplatten durch hinterspritzen von flexiblen schaltungen mit thermoplastischen materialien
US5462897A (en) * 1993-02-01 1995-10-31 International Business Machines Corporation Method for forming a thin film layer
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US6194032B1 (en) * 1997-10-03 2001-02-27 Massachusetts Institute Of Technology Selective substrate metallization
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Also Published As

Publication number Publication date
IL159175A0 (en) 2004-06-01
NO20035380D0 (no) 2003-12-03
US20040146647A1 (en) 2004-07-29
JP2004527663A (ja) 2004-09-09
CN1539028A (zh) 2004-10-20
PL365417A1 (en) 2005-01-10
CA2449358A1 (en) 2002-12-12
WO2002099162A3 (en) 2003-07-31
KR20040007643A (ko) 2004-01-24
TWI226384B (en) 2005-01-11
RU2003135208A (ru) 2005-05-10
WO2002099162A2 (en) 2002-12-12
EP1392886A2 (en) 2004-03-03

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]