DE602004032478D1 - Eidung und verfahren zur stromlosen metallabscheidung unter verwendung davon - Google Patents

Eidung und verfahren zur stromlosen metallabscheidung unter verwendung davon

Info

Publication number
DE602004032478D1
DE602004032478D1 DE602004032478T DE602004032478T DE602004032478D1 DE 602004032478 D1 DE602004032478 D1 DE 602004032478D1 DE 602004032478 T DE602004032478 T DE 602004032478T DE 602004032478 T DE602004032478 T DE 602004032478T DE 602004032478 D1 DE602004032478 D1 DE 602004032478D1
Authority
DE
Germany
Prior art keywords
treatment
electrode metal
metal separation
separation used
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004032478T
Other languages
English (en)
Inventor
Toshifumi Kawamura
Jun Suzuki
Toru Imori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mining Holdings Inc
Eneos Corp
Original Assignee
Nippon Mining and Metals Co Ltd
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining and Metals Co Ltd, Nippon Mining Co Ltd filed Critical Nippon Mining and Metals Co Ltd
Publication of DE602004032478D1 publication Critical patent/DE602004032478D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1882—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
DE602004032478T 2004-01-29 2004-11-11 Eidung und verfahren zur stromlosen metallabscheidung unter verwendung davon Active DE602004032478D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004021128 2004-01-29
PCT/JP2004/016764 WO2005073431A1 (ja) 2004-01-29 2004-11-11 無電解めっき前処理剤、それを用いる無電解めっき方法、及び無電解めっき物

Publications (1)

Publication Number Publication Date
DE602004032478D1 true DE602004032478D1 (de) 2011-06-09

Family

ID=34823782

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004032478T Active DE602004032478D1 (de) 2004-01-29 2004-11-11 Eidung und verfahren zur stromlosen metallabscheidung unter verwendung davon

Country Status (8)

Country Link
US (1) US7713340B2 (de)
EP (1) EP1760171B1 (de)
JP (1) JP4711415B2 (de)
KR (1) KR100796894B1 (de)
CN (1) CN1910305B (de)
DE (1) DE602004032478D1 (de)
TW (1) TWI306907B (de)
WO (1) WO2005073431A1 (de)

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JP4270517B2 (ja) * 2003-06-09 2009-06-03 日鉱金属株式会社 無電解めっき方法及び金属めっき物
WO2005044931A1 (ja) * 2003-11-05 2005-05-19 Nikko Materials Co., Ltd. インクジェット用インク組成物
US20070269680A1 (en) * 2004-09-10 2007-11-22 Toshifumi Kawamura Electroless Plating Pretreatment Agent and Copper-Clad Laminate for Flexible Substrate
JP2007242915A (ja) * 2006-03-09 2007-09-20 Bridgestone Corp 光透過性電磁波シールド材の製造方法、光透過性電磁波シールド材、およびディスプレイ用フィルタ
JP2007242918A (ja) * 2006-03-09 2007-09-20 Bridgestone Corp 光透過性電磁波シールド材の製造方法、光透過性電磁波シールド材、およびディスプレイ用フィルタ
JP2007242919A (ja) * 2006-03-09 2007-09-20 Bridgestone Corp 光透過性電磁波シールド材の製造方法、光透過性電磁波シールド材、およびディスプレイ用フィルタ
WO2007102577A1 (ja) * 2006-03-09 2007-09-13 Bridgestone Corporation 光透過性電磁波シールド材の製造方法、光透過性電磁波シールド材、およびディスプレイ用フィルタ
JP2008060350A (ja) * 2006-08-31 2008-03-13 Bridgestone Corp 光透過性電磁波シールド材の製造方法
JP2008218777A (ja) * 2007-03-06 2008-09-18 Bridgestone Corp 光透過性電磁波シールド材の製造方法
KR100997629B1 (ko) * 2007-06-15 2010-12-01 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 내열 에이징 특성이 우수한 금속 피복 폴리이미드 수지 기판의 제조 방법
JP5041214B2 (ja) * 2007-06-15 2012-10-03 ソニー株式会社 金属薄膜の形成方法および電子デバイスの製造方法
WO2011118439A1 (ja) * 2010-03-23 2011-09-29 Jx日鉱日石金属株式会社 無電解めっき前処理剤、それを用いる無電解めっき方法及び無電解めっき物
US8350414B2 (en) * 2010-08-11 2013-01-08 Xantrex Technology Inc. Semiconductor assisted DC load break contactor
US10280514B2 (en) * 2011-05-20 2019-05-07 S.T. Trading Company Limited Fabrication of mirror-like coatings
KR101483920B1 (ko) 2011-12-15 2015-01-16 헨켈 아이피 앤드 홀딩 게엠베하 흑연 상으로의 은의 무전해 도금 방법
TWI573687B (zh) * 2013-12-31 2017-03-11 財團法人工業技術研究院 積層板及其製作方法
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ES2646237B2 (es) 2017-09-28 2018-07-27 Avanzare Innovacion Tecnologica S.L. Formulación para el mordentado de materiales poliméricos previo al recubrimiento de los mismos
CN111455366A (zh) * 2020-04-03 2020-07-28 贵州水钢同鑫晟金属制品有限公司 一种改性无磷无硼镀膜剂及其制备方法
CN113151811A (zh) * 2021-04-13 2021-07-23 赤壁市聚茂新材料科技有限公司 一种非钯活化镀镍液、镀镍方法
CN118186380A (zh) * 2024-04-22 2024-06-14 上海瑞嗪科技有限公司 一种钢板化学镀镍的前处理方法及化学镀方法
CN118166342A (zh) * 2024-04-22 2024-06-11 上海瑞嗪科技有限公司 一种化学镀预处理液及其制备方法

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KR100893564B1 (ko) * 2001-10-05 2009-04-17 캐보트 코포레이션 저점도 전구체 조성물 및 전도성 전자 형상의 증착 방법
JP2003193245A (ja) 2001-12-21 2003-07-09 Nikko Materials Co Ltd めっき前処理剤、及びそれを用いた無電解めっき方法
CN100348775C (zh) * 2002-04-23 2007-11-14 日矿金属株式会社 无电镀敷法和在其上形成金属镀层的半导体晶片
EP1538237B1 (de) * 2002-09-10 2009-09-30 Nippon Mining & Metals Co., Ltd. Verfahren zur metallabscheidung und vorbehandlungsmittel
WO2005044931A1 (ja) * 2003-11-05 2005-05-19 Nikko Materials Co., Ltd. インクジェット用インク組成物
US20070269680A1 (en) * 2004-09-10 2007-11-22 Toshifumi Kawamura Electroless Plating Pretreatment Agent and Copper-Clad Laminate for Flexible Substrate

Also Published As

Publication number Publication date
TWI306907B (en) 2009-03-01
WO2005073431A1 (ja) 2005-08-11
KR100796894B1 (ko) 2008-01-22
JPWO2005073431A1 (ja) 2008-04-24
EP1760171A1 (de) 2007-03-07
EP1760171A4 (de) 2008-01-23
US20080014362A1 (en) 2008-01-17
JP4711415B2 (ja) 2011-06-29
KR20060114024A (ko) 2006-11-03
TW200525048A (en) 2005-08-01
CN1910305A (zh) 2007-02-07
EP1760171B1 (de) 2011-04-27
US7713340B2 (en) 2010-05-11
CN1910305B (zh) 2011-12-28

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