CN1645591A - 基板的支承板以及支承板的剥离方法 - Google Patents
基板的支承板以及支承板的剥离方法 Download PDFInfo
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- CN1645591A CN1645591A CNA200410082083XA CN200410082083A CN1645591A CN 1645591 A CN1645591 A CN 1645591A CN A200410082083X A CNA200410082083X A CN A200410082083XA CN 200410082083 A CN200410082083 A CN 200410082083A CN 1645591 A CN1645591 A CN 1645591A
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- support plate
- substrate
- solvent
- plate
- adhesive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
- Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1111—Using solvent during delaminating [e.g., water dissolving adhesive at bonding face during delamination, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1111—Using solvent during delaminating [e.g., water dissolving adhesive at bonding face during delamination, etc.]
- Y10T156/1116—Using specified organic delamination solvent
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1142—Changing dimension during delaminating [e.g., crushing, expanding, warping, etc.]
- Y10T156/1147—Using shrinking or swelling agent during delaminating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1928—Differential fluid pressure delaminating means
Abstract
Description
仅含醇 | 醇1∶水1 | 醇1∶水2 | |
乙醇 | 3分30秒 | 6分 | 15分 |
甲醇 | 3分 | 6分 | 17~19分 |
Claims (14)
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003402206 | 2003-12-01 | ||
JP402206/03 | 2003-12-01 | ||
JP402206/2003 | 2003-12-01 | ||
JP2004293158 | 2004-10-06 | ||
JP293158/04 | 2004-10-06 | ||
JP293158/2004 | 2004-10-06 | ||
JP343547/04 | 2004-11-29 | ||
JP343547/2004 | 2004-11-29 | ||
JP2004343547A JP2006135272A (ja) | 2003-12-01 | 2004-11-29 | 基板のサポートプレート及びサポートプレートの剥離方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1645591A true CN1645591A (zh) | 2005-07-27 |
CN100375262C CN100375262C (zh) | 2008-03-12 |
Family
ID=34830958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200410082083XA Active CN100375262C (zh) | 2003-12-01 | 2004-12-01 | 基板的支承板以及支承板的剥离方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7211168B2 (zh) |
JP (1) | JP2006135272A (zh) |
KR (1) | KR20050053019A (zh) |
CN (1) | CN100375262C (zh) |
TW (1) | TWI377642B (zh) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101728226B (zh) * | 2008-10-23 | 2011-08-17 | 亚泰半导体设备股份有限公司 | 分离装置及分离方法 |
CN102254789A (zh) * | 2010-04-02 | 2011-11-23 | 东京应化工业株式会社 | 剥离方法及剥离液 |
CN102486992A (zh) * | 2010-12-01 | 2012-06-06 | 比亚迪股份有限公司 | 一种半导体器件的制造方法 |
CN102625951A (zh) * | 2009-08-27 | 2012-08-01 | 康宁股份有限公司 | 使用超声波使玻璃衬底从载体上脱离 |
CN103128618A (zh) * | 2011-11-21 | 2013-06-05 | 株式会社东洋质量第一 | 玻璃研磨方法以及用于该方法的层压板 |
CN103325719A (zh) * | 2012-03-22 | 2013-09-25 | 株式会社东芝 | 支撑基板、半导体装置的制造方法以及半导体装置的检查方法 |
CN103325715A (zh) * | 2009-03-18 | 2013-09-25 | Ev集团有限责任公司 | 用于从载体中分离晶片的装置和方法 |
CN104640381A (zh) * | 2013-11-14 | 2015-05-20 | 胜华科技股份有限公司 | 电子元件半成品、电子元件及其制造方法 |
TWI510300B (zh) * | 2010-04-27 | 2015-12-01 | Tokyo Ohka Kogyo Co Ltd | 剝離方法及剝離裝置 |
CN109786308A (zh) * | 2017-11-13 | 2019-05-21 | 三星电子株式会社 | 从器件基板剥离载体基板的方法和设备 |
CN110676219A (zh) * | 2019-10-31 | 2020-01-10 | 江苏汇成光电有限公司 | 一种应对真空异常的晶圆切割处理方法 |
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JP4381860B2 (ja) * | 2004-03-24 | 2009-12-09 | 日東電工株式会社 | 補強半導体ウエハに固定された補強板の分離方法およびその装置 |
JP4721828B2 (ja) * | 2005-08-31 | 2011-07-13 | 東京応化工業株式会社 | サポートプレートの剥離方法 |
JP3859682B1 (ja) * | 2005-09-08 | 2006-12-20 | 東京応化工業株式会社 | 基板の薄板化方法及び回路素子の製造方法 |
JP4795772B2 (ja) * | 2005-10-24 | 2011-10-19 | リンテック株式会社 | シート切断用テーブル及びシート貼付装置 |
JP5318324B2 (ja) * | 2005-12-06 | 2013-10-16 | 東京応化工業株式会社 | サポートプレートの貼り合わせ方法 |
DE102006000687B4 (de) | 2006-01-03 | 2010-09-09 | Thallner, Erich, Dipl.-Ing. | Kombination aus einem Träger und einem Wafer, Vorrichtung zum Trennen der Kombination und Verfahren zur Handhabung eines Trägers und eines Wafers |
US8268449B2 (en) | 2006-02-06 | 2012-09-18 | Brewer Science Inc. | Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive |
JP5008340B2 (ja) * | 2006-06-01 | 2012-08-22 | 東京応化工業株式会社 | 基板の薄板化方法、貼り合わせシステムおよび薄板化システム |
KR101243575B1 (ko) * | 2006-06-30 | 2013-03-20 | 엘지디스플레이 주식회사 | 기판탈착장치 및 이를 이용한 기판탈착방법 |
JP5074719B2 (ja) * | 2006-07-14 | 2012-11-14 | 東京応化工業株式会社 | ウエハを薄くする方法及びサポートプレート |
JP2008021929A (ja) * | 2006-07-14 | 2008-01-31 | Tokyo Ohka Kogyo Co Ltd | サポートプレート、搬送装置、剥離装置及び剥離方法 |
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- 2004-12-01 TW TW093137045A patent/TWI377642B/zh active
- 2004-12-01 KR KR1020040099726A patent/KR20050053019A/ko not_active Application Discontinuation
- 2004-12-01 CN CNB200410082083XA patent/CN100375262C/zh active Active
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CN102254789B (zh) * | 2010-04-02 | 2015-04-15 | 东京应化工业株式会社 | 剥离方法及剥离液 |
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TWI510300B (zh) * | 2010-04-27 | 2015-12-01 | Tokyo Ohka Kogyo Co Ltd | 剝離方法及剝離裝置 |
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CN103128618A (zh) * | 2011-11-21 | 2013-06-05 | 株式会社东洋质量第一 | 玻璃研磨方法以及用于该方法的层压板 |
CN103325719A (zh) * | 2012-03-22 | 2013-09-25 | 株式会社东芝 | 支撑基板、半导体装置的制造方法以及半导体装置的检查方法 |
CN104640381A (zh) * | 2013-11-14 | 2015-05-20 | 胜华科技股份有限公司 | 电子元件半成品、电子元件及其制造方法 |
CN109786308A (zh) * | 2017-11-13 | 2019-05-21 | 三星电子株式会社 | 从器件基板剥离载体基板的方法和设备 |
CN110676219A (zh) * | 2019-10-31 | 2020-01-10 | 江苏汇成光电有限公司 | 一种应对真空异常的晶圆切割处理方法 |
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TW200527579A (en) | 2005-08-16 |
US7211168B2 (en) | 2007-05-01 |
US20070151674A1 (en) | 2007-07-05 |
KR20050053019A (ko) | 2005-06-07 |
CN100375262C (zh) | 2008-03-12 |
US20050173064A1 (en) | 2005-08-11 |
TWI377642B (en) | 2012-11-21 |
JP2006135272A (ja) | 2006-05-25 |
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