CN1246932C - 各向异性导电性连接器、其制造方法以及探针构件 - Google Patents
各向异性导电性连接器、其制造方法以及探针构件 Download PDFInfo
- Publication number
- CN1246932C CN1246932C CNB028062418A CN02806241A CN1246932C CN 1246932 C CN1246932 C CN 1246932C CN B028062418 A CNB028062418 A CN B028062418A CN 02806241 A CN02806241 A CN 02806241A CN 1246932 C CN1246932 C CN 1246932C
- Authority
- CN
- China
- Prior art keywords
- anisotropic conductive
- wafer
- deckle board
- material layer
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Non-Insulated Conductors (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001033908 | 2001-02-09 | ||
| JP33908/01 | 2001-02-09 | ||
| JP33908/2001 | 2001-02-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1496597A CN1496597A (zh) | 2004-05-12 |
| CN1246932C true CN1246932C (zh) | 2006-03-22 |
Family
ID=18897592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB028062418A Expired - Fee Related CN1246932C (zh) | 2001-02-09 | 2002-02-06 | 各向异性导电性连接器、其制造方法以及探针构件 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US6969622B1 (enExample) |
| EP (1) | EP1365479B1 (enExample) |
| JP (3) | JP3788361B2 (enExample) |
| KR (1) | KR100577947B1 (enExample) |
| CN (1) | CN1246932C (enExample) |
| AT (1) | ATE494645T1 (enExample) |
| DE (1) | DE60238824D1 (enExample) |
| TW (1) | TW533624B (enExample) |
| WO (1) | WO2002065588A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107479274A (zh) * | 2017-07-11 | 2017-12-15 | 武汉华星光电半导体显示技术有限公司 | 显示面板与外接电路的邦定方法及显示装置 |
| CN108538792A (zh) * | 2018-05-16 | 2018-09-14 | 武汉华星光电半导体显示技术有限公司 | 导电物质分布状态可控的异方性导电胶及其制备方法 |
Families Citing this family (60)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1365479B1 (en) | 2001-02-09 | 2011-01-05 | JSR Corporation | Anisotropic conductive connector, its manufacture method and probe member |
| JP3573120B2 (ja) * | 2001-08-31 | 2004-10-06 | Jsr株式会社 | 異方導電性コネクターおよびその製造方法並びにその応用製品 |
| ATE367650T1 (de) * | 2002-08-09 | 2007-08-15 | Jsr Corp | Prüfverbinder mit anisotroper leitfähigkeit |
| JP3649239B2 (ja) * | 2002-10-28 | 2005-05-18 | Jsr株式会社 | シート状コネクターの製造方法 |
| CN100397711C (zh) * | 2003-01-17 | 2008-06-25 | Jsr株式会社 | 各向异性导电连接器及其生产方法和电路器件的检查设备 |
| WO2004075283A1 (ja) * | 2003-02-18 | 2004-09-02 | Jsr Corporation | 異方導電性コネクターおよびプローブ部材並びにウエハ検査装置およびウエハ検査方法 |
| US7311531B2 (en) * | 2003-03-26 | 2007-12-25 | Jsr Corporation | Anisotropic conductive connector, conductive paste composition, probe member, wafer inspection device and wafer inspection method |
| TWI239684B (en) | 2003-04-16 | 2005-09-11 | Jsr Corp | Anisotropic conductive connector and electric inspection device for circuit device |
| JP2005026672A (ja) * | 2003-06-09 | 2005-01-27 | Jsr Corp | 異方導電性コネクターおよびウエハ検査装置 |
| CN1806178A (zh) | 2003-06-09 | 2006-07-19 | Jsr株式会社 | 各向异性导电性连接器以及晶片检测装置 |
| CN1806368B (zh) * | 2003-06-12 | 2010-09-01 | Jsr株式会社 | 各向异性导电连接器装置及其制造方法以及电路装置的检查装置 |
| US20050046016A1 (en) * | 2003-09-03 | 2005-03-03 | Ken Gilleo | Electronic package with insert conductor array |
| KR100921268B1 (ko) * | 2003-11-17 | 2009-10-09 | 제이에스알 가부시끼가이샤 | 이방 도전성 시트, 그의 제조 방법 및 그의 응용 제품 |
| US20060177971A1 (en) * | 2004-01-13 | 2006-08-10 | Jsr Corporation | Anisotropically conductive connector, production process thereof and application product thereof |
| WO2005103730A1 (ja) * | 2004-04-27 | 2005-11-03 | Jsr Corporation | シート状プローブおよびその製造方法並びにその応用 |
| WO2005111632A1 (ja) * | 2004-05-19 | 2005-11-24 | Jsr Corporation | シート状プローブおよびその製造方法並びにその応用 |
| CN100582798C (zh) * | 2004-06-03 | 2010-01-20 | 国际整流器公司 | 包含各向异性导电膜的用于测试功率模块的测试装置 |
| KR20070046033A (ko) * | 2004-08-31 | 2007-05-02 | 제이에스알 가부시끼가이샤 | 웨이퍼 검사용 이방 도전성 커넥터 및 그의 제조 방법 및응용 |
| WO2006043631A1 (ja) * | 2004-10-22 | 2006-04-27 | Jsr Corporation | ウエハ検査用異方導電性コネクターおよびその製造方法、ウエハ検査用プローブカードおよびその製造方法並びにウエハ検査装置 |
| KR101167750B1 (ko) * | 2004-10-29 | 2012-07-23 | 제이에스알 가부시끼가이샤 | 웨이퍼 검사용 탐침 부재, 웨이퍼 검사용 프로브 카드 및웨이퍼 검사 장치 |
| WO2006051845A1 (ja) * | 2004-11-12 | 2006-05-18 | Jsr Corporation | ウエハ検査用探針部材、ウエハ検査用プローブカードおよびウエハ検査装置 |
| US20060132167A1 (en) * | 2004-12-22 | 2006-06-22 | Jian Chen | Contactless wafer level burn-in |
| JP2006216502A (ja) * | 2005-02-07 | 2006-08-17 | Jsr Corp | 異方導電性コネクター、プローブカード並びにウエハ検査装置およびウエハ検査方法 |
| JP2006349671A (ja) * | 2005-05-19 | 2006-12-28 | Jsr Corp | ウエハ検査用シート状プローブおよびその応用 |
| JP4472593B2 (ja) * | 2005-07-12 | 2010-06-02 | 東京エレクトロン株式会社 | プローブカード |
| JP4604893B2 (ja) * | 2005-07-19 | 2011-01-05 | 住友電気工業株式会社 | 複合多孔質樹脂基材及びその製造方法 |
| JP2007071699A (ja) * | 2005-09-07 | 2007-03-22 | Rika Denshi Co Ltd | 垂直型プローブカード |
| US20070054512A1 (en) * | 2005-09-08 | 2007-03-08 | International Business Machines Corporation | Topography compensating land grid array interposer |
| EP1936387A4 (en) * | 2005-10-11 | 2011-10-05 | Jsr Corp | ANISOTROPIC CONDUCTOR CONNECTOR AND CIRCUIT DEVICE INSPECTION EQUIPMENT |
| TWI403723B (zh) * | 2005-12-21 | 2013-08-01 | Jsr Corp | Manufacturing method of foreign - shaped conductive connector |
| WO2007072852A1 (ja) | 2005-12-22 | 2007-06-28 | Jsr Corporation | ウエハ検査用回路基板装置、プローブカードおよびウエハ検査装置 |
| WO2007116826A1 (ja) * | 2006-04-11 | 2007-10-18 | Jsr Corporation | 異方導電性コネクターおよび異方導電性コネクター装置 |
| JP4902867B2 (ja) * | 2006-04-19 | 2012-03-21 | パナソニック株式会社 | 電子部品の接続方法及び突起電極の形成方法、並びに電子部品実装体及び突起電極の製造装置 |
| DE102006059429A1 (de) * | 2006-12-15 | 2008-06-26 | Atg Luther & Maelzer Gmbh | Modul für eine Prüfvorrichtung zum Testen von Leiterplatten |
| JP2010133706A (ja) * | 2007-03-19 | 2010-06-17 | Jsr Corp | 異方導電性コネクターおよび導電接続構造体 |
| WO2008120654A1 (ja) * | 2007-03-30 | 2008-10-09 | Jsr Corporation | 異方導電性コネクター、プローブ部材およびウエハ検査装置 |
| DE102007017641A1 (de) * | 2007-04-13 | 2008-10-16 | Infineon Technologies Ag | Aushärtung von Schichten am Halbleitermodul mittels elektromagnetischer Felder |
| US7750651B2 (en) * | 2008-03-07 | 2010-07-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer level test probe card |
| JP5424675B2 (ja) * | 2008-03-18 | 2014-02-26 | キヤノン株式会社 | 半導体装置の製造方法及び半導体装置 |
| US20120249375A1 (en) | 2008-05-23 | 2012-10-04 | Nokia Corporation | Magnetically controlled polymer nanocomposite material and methods for applying and curing same, and nanomagnetic composite for RF applications |
| JP5650649B2 (ja) * | 2009-09-02 | 2015-01-07 | ポリマテック・ジャパン株式会社 | 異方導電体及び異方導電体の製造方法並びに異方導電体配列シート |
| US9442133B1 (en) * | 2011-08-21 | 2016-09-13 | Bruker Nano Inc. | Edge electrode for characterization of semiconductor wafers |
| US9176167B1 (en) * | 2011-08-21 | 2015-11-03 | Bruker Nano Inc. | Probe and method of manufacture for semiconductor wafer characterization |
| KR101284210B1 (ko) | 2011-09-30 | 2013-07-09 | 주식회사 아이에스시 | 검사용 커넥터, 검사용 소켓, 검사용 커넥터의 제조방법 및 검사용 소켓의 제조방법 |
| JP6079425B2 (ja) * | 2012-05-16 | 2017-02-15 | 日立化成株式会社 | 導電粒子、異方性導電接着剤フィルム及び接続構造体 |
| US9678109B2 (en) * | 2014-01-09 | 2017-06-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Probe card |
| KR101573450B1 (ko) * | 2014-07-17 | 2015-12-11 | 주식회사 아이에스시 | 테스트용 소켓 |
| TWI863031B (zh) * | 2014-11-17 | 2024-11-21 | 日商迪睿合股份有限公司 | 異向性導電膜及連接構造體 |
| KR101833009B1 (ko) | 2016-03-18 | 2018-02-27 | 주식회사 오킨스전자 | 도전성 파티클이 자화된 도전 와이어에 의하여 자성 배열되는 테스트 소켓 및 그 제조 방법 |
| JP6935702B2 (ja) * | 2016-10-24 | 2021-09-15 | デクセリアルズ株式会社 | 異方性導電フィルム |
| JP2018073577A (ja) * | 2016-10-27 | 2018-05-10 | 株式会社エンプラス | 異方導電性シート及びその製造方法 |
| KR102361639B1 (ko) * | 2017-07-10 | 2022-02-10 | 삼성전자주식회사 | 유니버설 테스트 소켓, 반도체 테스트 장비, 및 반도체 장치의 테스트 방법 |
| CN109188790B (zh) * | 2018-09-13 | 2022-04-15 | 京东方科技集团股份有限公司 | 基板及其制作方法、显示装置 |
| WO2020075810A1 (ja) * | 2018-10-11 | 2020-04-16 | 積水ポリマテック株式会社 | 電気接続シート、及び端子付きガラス板構造 |
| KR102075669B1 (ko) * | 2018-10-26 | 2020-02-10 | 오재숙 | 신호 전송 커넥터 및 그 제조방법 |
| KR102063763B1 (ko) * | 2019-01-08 | 2020-01-08 | (주)티에스이 | 신호 전송 커넥터 및 그 제조방법 |
| CN110767348A (zh) * | 2019-11-12 | 2020-02-07 | 业成科技(成都)有限公司 | 异方性导电膜及其制作方法 |
| JP2021085701A (ja) | 2019-11-26 | 2021-06-03 | デクセリアルズ株式会社 | プローブシート及びプローブシートの製造方法 |
| TWI750578B (zh) * | 2020-02-04 | 2021-12-21 | 吳在淑 | 信號傳輸連接器及其製造方法 |
| KR102732569B1 (ko) * | 2022-07-13 | 2024-11-20 | 주식회사 아이에스시 | 도전성 입자, 도전성 입자의 제조방법 및 검사용 커넥터 |
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| JP3573120B2 (ja) | 2001-08-31 | 2004-10-06 | Jsr株式会社 | 異方導電性コネクターおよびその製造方法並びにその応用製品 |
-
2002
- 2002-02-06 EP EP02711328A patent/EP1365479B1/en not_active Expired - Lifetime
- 2002-02-06 AT AT02711328T patent/ATE494645T1/de not_active IP Right Cessation
- 2002-02-06 KR KR1020037010446A patent/KR100577947B1/ko not_active Expired - Lifetime
- 2002-02-06 WO PCT/JP2002/000959 patent/WO2002065588A1/ja not_active Ceased
- 2002-02-06 US US10/470,746 patent/US6969622B1/en not_active Expired - Lifetime
- 2002-02-06 DE DE60238824T patent/DE60238824D1/de not_active Expired - Lifetime
- 2002-02-06 CN CNB028062418A patent/CN1246932C/zh not_active Expired - Fee Related
- 2002-02-07 JP JP2002030621A patent/JP3788361B2/ja not_active Expired - Lifetime
- 2002-02-07 TW TW091102235A patent/TW533624B/zh not_active IP Right Cessation
- 2002-02-07 JP JP2002030620A patent/JP3804542B2/ja not_active Expired - Fee Related
-
2004
- 2004-11-04 JP JP2004320741A patent/JP3807432B2/ja not_active Expired - Fee Related
-
2005
- 2005-08-17 US US11/205,174 patent/US7323712B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107479274A (zh) * | 2017-07-11 | 2017-12-15 | 武汉华星光电半导体显示技术有限公司 | 显示面板与外接电路的邦定方法及显示装置 |
| CN108538792A (zh) * | 2018-05-16 | 2018-09-14 | 武汉华星光电半导体显示技术有限公司 | 导电物质分布状态可控的异方性导电胶及其制备方法 |
| US10957668B2 (en) | 2018-05-16 | 2021-03-23 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Anisotropic conductive film (ACF) with controllable distribution state of conductive substance and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1365479A1 (en) | 2003-11-26 |
| EP1365479B1 (en) | 2011-01-05 |
| JP2002334732A (ja) | 2002-11-22 |
| ATE494645T1 (de) | 2011-01-15 |
| JP2002324600A (ja) | 2002-11-08 |
| DE60238824D1 (de) | 2011-02-17 |
| US6969622B1 (en) | 2005-11-29 |
| KR20030083710A (ko) | 2003-10-30 |
| WO2002065588A1 (en) | 2002-08-22 |
| JP2005056860A (ja) | 2005-03-03 |
| EP1365479A4 (en) | 2007-12-26 |
| CN1496597A (zh) | 2004-05-12 |
| JP3807432B2 (ja) | 2006-08-09 |
| JP3804542B2 (ja) | 2006-08-02 |
| US7323712B2 (en) | 2008-01-29 |
| US20060033100A1 (en) | 2006-02-16 |
| KR100577947B1 (ko) | 2006-05-10 |
| JP3788361B2 (ja) | 2006-06-21 |
| TW533624B (en) | 2003-05-21 |
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